Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

Abstract: A press-fit contact (1) for an electrical connector includes a retention portion (3), with a mating portion (2) and a tail portion (4) respectively extending from opposite ends of there retention portion. The tail portion is adapted to be inserted into a through hole (51) in a printed circuit board (5). The tail portion includes abase section (41) and a pair of arced engaging sections (42) extending from respective opposite side edges of the base section toward each other. Each engaging section defines a cutout (421) therein for providing resiliency.

Abstract: The present invention provides for an improved printed circuit board assembly. The connector is straddle mounted to an edge of a printed circuit board with first connector leads configured for abutment with a primary surface of the printed circuit board (PCB) and second connector leads configured for abutment with a secondary surface of the PCB. Holes are provided in the PCB between the first connector leads. The second connector leads are arranged to abut the PCB directly where the holes open on the secondary surface. Solder is deposited on only the primary surface of the PCB directly on the locations where bond formation is desired between the first connector leads and the PCB, that is, on first contact pads. Solder is deposited in the same process on the primary surface, directly above the locations where bond formation is desired between the second connector leads and the PCB, that is, directly above the second contact pads on the other surface of the PCB.

Abstract: An apparatus which aligns a ball grid array (BGA) device over a substrate. The apparatus preferably includes a cup-shaped member for cupping and holding the solder balls of the BGA device, and an elongate member attached to the cup-shaped member. The cup-shaped member is attached between the BGA device and the substrate at two or more different positions so that the solder balls of the BGA device become aligned over the terminals of the substrate by operation of gravity.

Abstract: An electrical adapter assembly (1) comprises an adapter plate (16), and first and second electrical connectors (12, 14) mounted onto opposite first and second surfaces (165, 166) of the adapter plate. The first and second connectors comprise first and second conductive contact tail portions (1232, 1432), respectively, projecting beyond the second and first surfaces, respectively. A method of encapsulating the electrical adapter assembly comprises the following steps. First, trimming the first and second tail portions for facilitating subsequent formation of smooth soldered dots (21). Second, soldering the first and second tail portions to the adapter plate, forming the smooth soldered dots. Third, placing insulative layers (23, 24) over the soldered dots. Fourth, placing shielding layers (25, 25′, 26, 26′) over the insulative layers. Fifth, soldering edges of the shielding layers to the adapter plate with soldering tin (27).

Abstract: A method for manufacturing a SIL hybrid circuit is presented. A lead frame is provided which includes side bands and clip members between the side bands configured to connectively receive a hybrid circuit. The lead frame further includes foot members between the side bands configured to be surface-mounted to a base substrate. Each foot member has tabs at the ends thereof and support members extending straight from the tabs to connect the tabs to the side bands. Corresponding contact areas of the hybrid circuit are attached to the clip members. At least one foot member and associated support members are selected to remain in the lead frame to support the SIL hybrid circuit during positioning on the base substrate and surface mounting thereto. Excess parts are removed from the lead frame based on the selecting. As such, SIL hybrid circuits may be efficiently used to achieve high packaging densities.

Abstract: An electrical connector of the present invention comprises an insulative housing defining a plurality of contact receiving holes for receiving corresponding contacts. The housing forms a protrusion laterally extending into each contact receiving hole from a bottom of an inner wall thereof. Each contact includes an upper contacting section for engaging with a mating lead pin of a chip, a middle fixing section located below the upper contacting section for having an interferential fit with the housing, and a lower inserting section for being soldered to a printed circuit board. The fixing section has an embossment for engaging with the protrusion of the housing to sealingly separate the lower inserting section from the upper contacting section so that solder and flux is prevented from wicking upward to contaminate the upper contacting section when soldering the lower inserting section to the printed circuit board.

Abstract: A bus bar structure includes: a bus bar stored in an electric junction box; and a tab terminal electrically connected to a pattern portion of the bus bar. The tab terminal is separately formed with the bus bar. The pattern portion is welded with the tab terminal by using a laser beam.

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract: An electric plug-in connection between a printed circuit board and a stator winding of an electric motor having a socket wired to the winding, the plug-in connection having a single elongated metal strip having one end engaged in the socket and an opposite end formed with first and second spaced-apart contact portions each making a solder connection with the printed circuit board, and a bent portion of the strip forming a flexible connection between the second contact portion and the one end.

Abstract: An electronic socket adapter includes an insulative carrier and an array of a plurality of surface mount contacts carried on the base. The pins may be floatably mounted on the carrier. A plurality of relatively large openings are formed in the carrier between adjacent contacts in the array. The openings provide improved heat flow in the region of the surface mount portions of the contacts and also provide for visualization of the surface mount portions of the contacts during and after soldering.

Abstract: A one piece electrical connector includes a base pad having a substantially round perimeter as well as top and bottom surfaces. A layer of solder covers the bottom surface of the base pad. An arm integral with the base pad is bent from the perimeter of the base pad. The arm extends over the top surface of the base pad and terminates in a terminal. The arm has a first portion bent to lie on the top surface of the base pad and a second portion extending from the first portion and bent to extend away from the base pad. The arm may be gripped by a rotatable chuck for spin soldering the base pad to pad to a glass substrate.

Abstract: A bus bar structure includes: a bus bar stored in an electric junction box; and a tab terminal electrically connected to a pattern portion of the bus bar. The tab terminal is separately formed with the bus bar. The pattern portion is welded with the tab terminal by using a laser beam.

Abstract: A double sided edge clip terminal for forming soldered connections with opposed contact pads on the edge of a substrate includes a pair of solder contacts each having spaced metal arms and cold extruded solder masses in the interior of the contacts between the arms. Openings are formed in the contacts between the arms to prevent wicking of molten solder along the terminal and away from the contact pads. The terminals are manufactured by extruding the solder masses through the openings and into the space between the arms and beyond the arms, without solder waste.

Abstract: An electronic assembly comprising an electronic substrate and a plurality of conductive interconnection elements. The substrate has a first side having a plurality of terminals. Each interconnection element has a base secured to a respective one of the terminals, a contact region distant from the electronic substrate, and an elongate freestanding section which can bend when pressure is applied to the contact region.

Abstract: An electrical contact includes a main body having a contact arm (11) extending from a lower portion thereof, a tail (13) extending from an upper portion thereof, and a retainer (13) projecting from the main body between the contact arm and the tail. A cutout (133) is defined in a surface of the tail opposite a surface designed to engages with a PCB. A guiding slot (132) is defined in the main body of the contact between the tail and the contact arm opposite the retainer. When the tail is soldered to the PCB, any excess solder will flow along the contact. The cutout provides an obstruction and the guiding slot provides a surface area for the solder to solidify on the contact without covering a portion of the contact arm and hindering signal transmission.

Abstract: A novel electrical connection device for surface-mounting on a circuit board. The electrical connection device includes at least two terminal members. Each terminal member includes a retaining surface serving as a point of electrical contact between the terminal member and the circuit board and as a point of solder-anchoring for securely mounting the electrical connection device to the PCB. Further, each terminal member includes a contact portion providing for the mounting of an electrical component onto the circuit board, as well as serving as a point of electrical contact between the circuit board and the electrical component. The terminal members are mounted on a strip of insulating material that holds them in the proper spacial relationship until they have been secured to the circuit board. The strip reduces pin-misalignment that can cause difficulties in engaging a mating electrical component on the electrical connection device.

Abstract: An electronic assembly. The electronic assembly includes a first substrate which has a first set of contact pads and a second substrate which has a second set of contact pads. A plurality of elongate, springable interconnection elements are located between the first substrate and the second substrate. Each of the plurality of elongate, springable interconnect elements is free standing and has a portion permanently attached to a respective contact pad of the first set of contact pads and has a second portion contacting a respective contact pad of the second set of contact pads. The first and the second substrates are brought into a fixed relationship relative to one another.

Abstract: A press-fit terminal comprises a pin-like terminal body (2) having a support section (5) and a spring contact element (3). The spring contact element has a tubular body with an opening groove (3A) and is flexible in the radial direction. Also, it has an outer contact portion (6) at an utmost outer position and inner contact portions (7, 8) at an utmost inner position. The outer contact portion lies outside of the diameter of the conductive section (P1) of a through-hole but when the spring contact element is press-fitted in the conductive section and compressed, the outer and inner contact portions are brought into resilient contact with the conductive section and the support section, respectively.

Abstract: The present invention relates to a method for adjusting differential thermal expansion between an electrical socket and a circuit board by means of secure and accurate interconnection of an adjusting device therebetween before a heating step. The adjusting device is made of an adhesive fusible material and fixed to the housing for absorbing most of the fracture stress exerted on the solder balls and for eliminating a misalignment between the electrical socket and the circuit board during the heating step. The adjusting device can be designed according to practical requirements to be a number of adjusting posts, an adjusting frame, or an adjusting chip.

Abstract: A connector comprising: at least one contact, said contact being formed by a first and a second part, said first part being made of material adapted to be metallized, such that said contact forms soldering surfaces for termination purposes, and wherein between surfaces of the first part, which can be metallized, insulating material is provided by means of said second part so as to achieve an extension of the creeping paths.

Abstract: A hybrid connector with an audio jack comprises an elongate dielectric housing defining a number of grooves for receiving a number of terminals and a mating hole for accommodating a contact assembly. The contact assembly includes a first contact and a second contact for electrical connection with a complementary connector. The contact assembly further includes a third contact having a base, a pair of resilient engaging fingers depending forwardly from lateral edges of the base, a securing leg extending forwardly from a lower edge of the base and embedded in the housing for securing the third contact in the housing, and a soldering arm bending rearwardly from a top edge of the base for surface mounting the connector on a circuit board.

Abstract: A method and arrangement are disclosed for attaching one or more electrical bayonet-type blades to a circuit board. The arrangement comprises a circuit board with at least one opening adapted to receive one blade. A solder pad disposed on at least one surface of board surrounds the opening. A plurality of vias surround the opening. The vias are disposed such that they pass through the solder pad. Solder is applied around the electrically conducting bayonet on one surface of the circuit board, through the vias, and around the electrically conducting bayonet of the surface of the circuit board opposite to the solder pad.

Abstract: A connector is formed of printed circuit board (PCB) modules (10). The PCB modules are provided at a mounting interface with surface engaging terminals (22) for interconnecting traces (16) on the PCBs (12) with traces on the mounting substrate. The terminals may comprise compressible or deformable elements formed of conductive elastomeric rods or solder balls fitted into recesses (36) in the board edges. A shield terminal (28) functions as a hold down that is alternately convertible from a through-hole mounting position to a surface mounting position by bending the terminal.

Abstract: An electrical contact that is mounted on a printed circuit board to provide an electrical connection to the printed circuit board. The contact has the structural integrity of a through-hole component with the capability of being soldered to the circuit board using a surface mount reflow process. The contact includes a pair of elongated, conductive pins with a base disposed therebetween, and a solder preform supported on one of the conductive pins adjacent the base. The pin supporting the solder preform is insertable into a plated-through hole on the circuit board so that the solder preform can be reflowed into the hole along the pin to form a solder joint between the contact and the hole. The contact may include a retainer to secure the solder preform to the pin and the end of the base adjacent the pin may be beveled to facilitate gas ventilation from the hole during the soldering process. The base may be configured so that it can be grasped with a test instrument or support a wire connection to the contact.

Abstract: A contact element of an electrical connector includes an anchoring section having barbs for securing the contact element in a bore defined in a connector and a pin engaging section connected to the anchoring section by a reduced connection section. An elongate projection is formed on the connection section and substantially extends therealong for blocking a wicking path between the anchoring section and the pin engaging section thereby suppressing wicking of solder and/or gold coating through the connection section. The projection may be simply formed by pressing the connection section. The projection may be replaced by an elongate opening.

Abstract: A robust connection is made from contact pad metallization on a substrate of a modular circuit to a connection pin by solder bonding. The connection includes a flexible copper strap with an aperture at one end which is sized to fit over the connection pin. The opposite end of the strap is solder bonded to an end of the connection pin. The connection thus made avoids application of stress from pin flexure to the solder bonds to avoid cracking while providing a connection having a low profile and minimal protrusion above the modular circuit substrate.

Abstract: A terminal mounting structure for a printed circuit board according to the present invention comprises a printed circuit board having a wiring pattern and a slit formed in an end face of the board and a terminal connected to the wiring pattern on the board, the terminal being provided with a holding portion having first and second clamp pieces and a connection piece for connection between both clamp pieces, the connection piece being inserted into the slit formed in the printed circuit board to position the terminal with respect to the printed circuit board, and the first and second clamp pieces being connected to the wiring pattern.

Abstract: A method and apparatus for engaging electrical components to a circuit board. The body of the component has at least one fastener integrally formed therewith. The at least one fastener includes a neck portion engaged to the body of the component and extending to a hook portion. The fastener is configured to reside substantially within a through-hole formed in a circuit board. The through-hole in the circuit board has a solder lining, and the fastener is placed into the through-hole. The solder is reflowed via known soldering techniques so that the hook portion of the fastener is engaged by the reflowed solder, thus engaging the component to the circuit board.

Abstract: An electrical connector is adapted for mounting on a printed circuit board having mounting holes with corresponding solder pads on a surface of the printed circuit board. The electrical connector includes a dielectric body and two conductive members mounted on the dielectric body. The dielectric body has top and bottom faces, two receiving holes extending from the top face to the bottom face, and two hollow protrusions formed respectively on the bottom face of the dielectric body in communication with the receiving holes and adapted to extend respectively into the mounting holes of the printed circuit board for preventing solder material from wicking into the receiving holes.

Abstract: An electric component unit capable of keeping an operator from feeling a difference in force required for inserting a connection conductor into an electric component unit during insertion of plural connection conductors different in diameter. A terminal fitment includes a conductor holding section provided with four holding elements. Two of the holding elements are so arranged that distal portions thereof are opposite to each other with an end of the connection conductor being interposed therebetween and contacted with the end of the connection conductor. The remaining two of the holding elements are so arranged that distal portions thereof are positioned forwardly or rearwardly in a longitudinal direction of the connection conductor based on a position at which the two holding elements are contacted with the end of the connection conductor while being contacted with the end of the connection conductor and interposing the end of the connection conductor therebetween.

Abstract: Metallic circuit traces disposed on a substrate of a panel and terminated in a high-density in-line array. Each termination comprises a terminal portion of a circuit trace disposed on and extending along a beam defined by the panel, a portion of a resilient compressible electrical conductor disposed in overlying relation to at least an associated part of the terminal portion, and a cradle assembly including a cradle member and a cap ultrasonically welded together in assembly generally within a common plane of joinder spaced from the substrate. The cradle assembly surround portions of the beam, the terminal portion, and the conductor and maintains the conductor under compression and in electrical contacting engagement with the terminal portion to form an electrical termination.

Abstract: A semiconductor package and method for fabricating the package are provided. The package includes a housing having individual channels, each adapted to retain a semiconductor die in electrical communication with electrical connectors. The dice can include solder bumps, formed on electrodes, using electroless deposition and wave soldering. For fabricating the package, the dice can be inserted into the channels, with the electrical connectors on the housing proximate to the solder bumps on the dice. The solder bumps can then be reflowed to form bonded connections with the electrical connectors. In an alternate embodiment, conductive adhesive bumps, rather than solder bumps, are formed on the dice to provide compliant connections with the electrical connectors on the housing. In addition, the conductive adhesive bumps can be cured while in contact with the electrical connectors to form bonded connections.

Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

Abstract: A system for detachable mounting a component onto a printed circuit board comprises a printed circuit board having a through-hole, a compression spring constructed from, or coated with, an electrically conductive material, and a component having an electrical contact thereon. The compression spring having a first end of a diameter larger than the diameter of the through-hole, and a second end smaller than the diameter of the through-hole. The second end of the compression spring passes through the through-hole and is secured at its first end to the first side of the printed circuit board. The second end of the compression spring protrudes beyond the second side of the printed circuit board. When the component is placed against the second side of the printed circuit board, the compression spring is compressed and the desired electrical connection is formed.

Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side of the into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the housing, thereby reducing warpage. Solder resist areas are formed on central portions of the contacts to promote uniformity of solder volume.

Abstract: A contact strip includes a plurality of terminals (10) joined together by a material band (50). Each terminal (10) includes a connection portion (11) having a first contact portion (13) extending from one end thereof for reception in a receptacle connector (80) and a second contact portion (14) extending from another end thereof for engagement with a PCB. A pair of opposite cutting cutouts (30) is defined in each end of the connection portion (11) adjacent to the adjoining material band (50) for facilitating the separation of the terminals (10) from the contact strip by means of a cutter (90) cutting along a straight line "C".

Abstract: An electrical distribution center including a printed circuit board having electronic components thereon and a first and second through hole formed in the print circuit board. A terminal is provided which may be a female tuning fork, male blade or blank for insertion in the first through hole. A solderable spring tab is stamped, bent and formed from the body the terminal. The solderable spring tab is inserted in the second through hole. The solderable spring tab compensates for movement of components due to the difference in thermal expansion of the printed circuit board, solder joint, and terminal material.

Abstract: An electrical connector includes an insulative housing and a number of compound terminals for connecting a CPU to a circuit board. Each terminal has an arcuate engaging section whereby a solder ball can be easily positioned within the engaging section. Thus, assembly is expedited and proper signal transmission is ensured.

Abstract: An electrical receptacle mountable on and positionable within a substrate has an electrically conductive element that includes a conductive member with deformable electrical leads extending therefrom. The deformable electrical leads have first and second portions with the first portion extending outward from the conductive member and the second portion being adjacent to and approximately parallel with the conductive member. A body of electrically insulating material encapsulates the conductive member about the exterior surface of the conductor with the electrically insulating material having an exterior surface on which is formed support ribs and alignment ribs with the support ribs providing initial support for the electrical receptacle over an aperture formed in the substrate and the alignment ribs providing positioning alignment of the electrical receptacle within the aperture of the substrate.

Abstract: Press-fitting sections (54) of contacts (50) of a circuit board mounted connector (10) have a plurality of conical recesses (60) formed in both surfaces (59a,59b). In each recess (60), central portion (61) of the recess (60) is located at a lower position than the plate surface (59a, 59b), while a circumferential rim portion (63) of each recess (60) is located at a higher position than the surface (59a, 59b), thus forming a substantially annular protruding portion. Inside surfaces of cavities (23) of housing (20) that is softened as a result of heat conduction during soldering performed after the contacts (50) have been press-fitted in the cavities (23) of the housing (20) flows inside and outside the recesses (60) and is hardened so that a complementary shape is formed in the recesses (60) and around the rim portions (63). Accordingly, the contacts (50) can be firmly held in the cavities (23) even after soldering has been performed.

Abstract: A circuit board electrical connector for a circuit board having an attachment opening, which comprises a housing; an attachment leg having a metallic surface and projecting downwardly from the housing into the attachment opening; and a solder retention area in the attachment leg so that solder flows into an upper portion of the attaching opening.

Abstract: A fastener for an electrical connector. The fastener (10) includes a fastener body (12) having an opening (16) therethrough for receiving a pin (21). The fastener body (12) includes a plurality of gripping elements (14) protruding into the hole (16) for securing the fastener (10) to the pin (21) when disposed therebetween. The fastener (10) is then soldered to the pin (21) and to a mounting surface (34), such as a printed circuit board, by known soldering techniques.

Abstract: A continuous stamping of plated metal components, with carrier links between their ends, for surface mount soldering. A strip of components is formed which can be individually easily separated at severance regions between the adjacent components. The severance regions are located in the carrier links between the components. Preferably, the carrier links are offset upwardly from a solderable surface (20) of the components, or alternatively may be coplanar with such surface (FIG. 17). The carrier regions (21) that remain after severance may also serve as an overtravel stop during insertion of the component into a support. In a two-row embodiment (FIG. 10), the carrier regions (50, 52) are formed to be asymmetrical in order to increase spacing between pins. Advantages include: less material required, lower cost for selective plating, adjustable pin length in the die, flat stamping, tip plating for better electrical contact, and scrapless end product.

Abstract: An electronic part, particularly a microstructure contact having an overall length of the order of 5 mm for an electrical connector or the like is provided with a nickel oxide layer portion having a nickel oxide layer of the order of 50 to 5000 .ANG. in thickness formed by anode oxidizing process using a solution mainly consisting of an alkaline solution. The nickel oxide layer portion is located between a terminal portion of the electronic part to be soldered as in a surface mounting process and a contact portion continuous to and extending from the terminal portion. The nickel oxide layer has a width of the order of 0.2 to 1 mm in the longitudinal direction of the contact and has a performance preventing the flowing of molten solder, thereby effectively preventing the flowing and wicking due to wetting of solder of the solder-plated portion toward the other portions as in the surface mounting process.

Abstract: A socket connector for a chip is disclosed. The socket connector for a chip comprises an insulating housing defining a mating surface and a soldering surface, including a plurality of through cavities communicating the mating surface and the soldering surface; a plurality of conductive contacts received in the through cavities, including a soldering section, a fixing section and a contacting section; and anti-wicking means including at least one attaching portion for attaching to the housing and a shielding portion for sealing up the bottom of the cavities to prevent entrance of contaminants therefrom.

Abstract: A conductive contact for an electrical connector is disclosed. The conductive contact comprises a lower inserting section for inserting into an external circuit board, an upper contacting section for engaging a mating lead pin of a chip, a middle fixing section for fixing onto a cooperating housing for an electrical connector, and anti-wicking means for prevention of wicking during wave soldering procedure. The anti-wicking means can be an inverted V-shaped groove formed on the fixing section or a horizontal plate stamped from the fixing section. The conductive contact can be formed by stamping and bending.

Abstract: A circuit board is provided with blind connection vias which are filled with solder. The end portions of the pins of an electronic component are inserted into the connection vias, and are connected to the connection vias by solder. The electronic component is surface mounted on the circuit board with the major portions of the pins exposed.

Abstract: An electronic stack module is disclosed comprising two or more substrates having upper and lower surfaces with one or more electronic components disposed on the surfaces and electrically connected to connector pads disposed in a predetermined pattern at the substrate edges. A plurality of clip leads are electrically attached to the connector pads, where each clip lead comprises a clip section, a standoff section of specified length, and a mounting section, the clip section configured to frictionally engage both upper and lower substrate surfaces. Stacking of substrates is accomplished by aligning and bonding clip sections of one substrate to corresponding mating sections of the adjacent substrate.

Abstract: There is disclosed herein an electrically conductive coupling for connecting an electrical element to a conductive circuit trace on a printed circuit board, comprising: (1) a finger extending outward from an edge of a rigid printed circuit board, wherein the circuit trace terminates on a first surface of the finger; (2) an electrical connector formed from a metal stamping and comprising: a substantially rectotubular barrel portion being dimensioned so as to provide an interference fit with the finger when the finger is inserted therein; an engaging portion being removably connectable with the electrical element; and a transition portion integral with the barrel portion and engaging portion; wherein the finger is connectably inserted into the barrel portion; and (3) a solidified joint of electrically conductive bonding material disposed on the first surface of the finger, such that the joint electrically couples the circuit trace with the barrel portion of the electrical connector.