Adapted To Be Secured To Conductor Formed On Printed Circuit Board Patents (Class 439/876)
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Publication number: 20100216344Abstract: An electrical connector includes an insulative housing with a plurality of passageways arranged in a matrix. A contact includes a base for securing the contact in the passageway, a spring portion and a soldering portion extending from the base. The soldering portions of the contacts laid in a row of the passageways are alternately arranged toward two opposite sides of the base to form two rows. Such array of soldering portions of the contact can improve contact density.Type: ApplicationFiled: February 9, 2010Publication date: August 26, 2010Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: CHIA-WEI FAN
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Patent number: 7758350Abstract: An electrical connector for electrically connecting a first electronic device to a second electronic device includes a housing that includes a plurality of solder retention channels that hold a plurality of solder segments in a vertical orientation such that at least a vertical surface and one end of each solder segment are exposed. The solder retention channels are formed in first and second opposing rows with an open space formed therebetween. The exposed vertical surfaces of the solder segments face one another.Type: GrantFiled: February 27, 2008Date of Patent: July 20, 2010Assignee: Teka Interconnection SystemsInventors: James R. Zanolli, Joseph S. Cachina
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Patent number: 7727033Abstract: A surface mount electrical connector for mounting to a substrate comprising a housing and a contact carried by the housing, the contact comprising a retention section held by the housing and a tine configured for mounting to a surface of the substrate wherein the tine extends from the retention section and wherein the tine lies inside an outer contour line of the housing is disclosed. A method of connecting a surface mount electrical connector to a substrate comprising the steps of providing a housing carrying a contact, the contact having a tine within a projected footprint of the housing on the substrate, attaching the housing to the substrate, inserting a jig into an opening of the housing, and bending the tine toward the substrate is disclosed.Type: GrantFiled: December 12, 2005Date of Patent: June 1, 2010Assignee: Tyco Electronics Japan G.K.Inventor: Junya Tsuji
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Patent number: 7695329Abstract: A method of attaching a solder element to a contact and the contact assembly formed thereby. The contact assembly is used in a connector. The solder element is either staked or stapled to the contact. The solder element can take a variety of shapes and disclosed herein is a tear-drop shape, a “wolf's head” shape and a circular shape. An over-stress feature is also provided for when the contact assembly is mounted to a printed wiring board.Type: GrantFiled: September 15, 2005Date of Patent: April 13, 2010Assignee: Molex IncorporatedInventors: Kirk B. Peloza, Richard A. Faje, Ronald C. Hodge, Jon S. Gould
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Publication number: 20090318036Abstract: In a connector, a fixed member is configured to be fixed to a substrate. An insertion member is arranged separate from the fixed member and configured to be insertable into an insertion part of a mating connector. Pairs of contacts are arranged on side surfaces of the insertion part of the mating connector to connect the fixed member and the insertion member to each other. Each contact includes a first fixed part fixed to the fixed member, a second fixed part fixed to the insertion member, and a contact part to contact with a contact piece of the mating connector. A cross-sectional shape of a portion of each contact between the first fixed part and the second fixed part is such that the insertion member is displaceable relative to the fixed member in an arranging direction of the pair of contacts and a direction perpendicular to the arranging direction.Type: ApplicationFiled: June 10, 2009Publication date: December 24, 2009Inventors: Yasushi Masuda, Takeshi Okuyama
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Patent number: 7632112Abstract: An electrical contact component includes a base defining an external terminal to be mounted on a surface of a wiring board with a solder and a fitting portion having a substantially tubular shaped fitting periphery. The external terminal has a first principal surface opposing the surface of the wiring board, a second principal surface substantially parallel to the first principal surface, and sides substantially perpendicular to the first and second principal surfaces and connecting the first principal surface to the second principal surface. The fitting portion is continuously provided on the second principal surface. The fitting periphery of the fitting portion is electrically connected to the second principal surface and the sides of the external terminal by metal layers formed over their respective surfaces. The metal layer contains Ni as a principal constituent and Co, and the metal layer contains Au as a principal constituent.Type: GrantFiled: November 28, 2005Date of Patent: December 15, 2009Assignee: Murata Manufacturing Co., Ltd.Inventors: Hiroki Wakamatsu, Yuichi Maruyama, Nobushige Araki
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Patent number: 7625222Abstract: According to one embodiment, a printed circuit board includes a wiring board, a through-hole mount device, and a surface mount device. The wiring board has a first surface, a second surface opposite to the first surface, and through holes. The through-hole mount device has leads. The leads are soldered inside the through holes so that the through-hole mount device is mounted on the first surface. The leads have distal ends positioned inside the through holes. An adhesive fills the region between the wiring board and the through-hole mount device. The adhesive fixes the through-hole mount device to the first surface. A surface mount device is soldered to the second surface and closes the through holes in which the leads are inserted.Type: GrantFiled: November 30, 2007Date of Patent: December 1, 2009Assignee: Kabushiki Kaisha ToshibaInventor: Minoru Takizawa
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Patent number: 7621784Abstract: A socket contact of small-size is provided for which detachment at solder from the print substrate is difficult. In the contact 1, a face in the thickness direction 120 of a front end portion of a pair of elastic arms 12a and 12b faces toward the insertion opening 21. When a blade contact 3 is inserted into an insertion opening 21, it is possible to open front end portions of a pair of elastic arms 12a and 12b in opposing directions. The configuration is such that, by providing first to third press fit fragments 111, 112, and 113 on a base unit 11, the same is securely held to the housing 2, so that only compressive stress acts on the pair of lead portions 11c and 11d, and can be made difficult to detach at solder from the print substrate 1p.Type: GrantFiled: March 2, 2009Date of Patent: November 24, 2009Assignee: J.S.T. Mfg. Co., Ltd.Inventors: Kuniaki Ichimiya, Shinichi Koga, Daichi Miyamoto
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Patent number: 7611384Abstract: A terminal connector includes a pair of spaced-apart connector units each having a connector plate, a pair of clamp arms extending from the connector plate, a clamp carried by the pair of clamp arms and a connecting cable attached to the clamp of each of the pair of connector units. A battery module and a battery system are also disclosed.Type: GrantFiled: April 4, 2007Date of Patent: November 3, 2009Assignee: Ford Global TechnologiesInventor: Pax Maguire
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Publication number: 20090264028Abstract: A joint structure of the present invention includes a conductive member containing copper as a major component thereof, an electrode member containing copper as a major component thereof, and a joint portion formed by fusion welding the conductive member and the electrode member with a brazing material containing tin as a major component thereof and containing substantially no copper, wherein the amount of copper atoms contained in the alloy in the central part of the joint portion is higher than that in the outer circumference part.Type: ApplicationFiled: September 14, 2006Publication date: October 22, 2009Inventor: Toshiaki Chuma
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Patent number: 7575488Abstract: Provided is a receptacle connector for a battery in a mobile electric device. The receptacle connector includes a contact terminal, a connection terminal, and an extension portion. The contact terminal electrically contacts a plug connector of the mobile electric device. The connection terminal is fit and soldered in a through hole of a battery PCB, and is integrally formed with the contact terminal. The extension portion is bent and extends from a front end of the connection terminal to form a solder receiving space for receiving solder flowing through the through hole of the PCB together with the connection terminal while a soldering operation is performed on the connection terminal. The extension portion together with the connection terminal is fit and soldered in the through hole of the PCB.Type: GrantFiled: February 21, 2008Date of Patent: August 18, 2009Assignee: Korea Air Electronics Co., Ltd.Inventors: Seung-Hee Lee, Sang-Hun Lee
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Publication number: 20090197435Abstract: A system for directly connecting multiple printed circuit boards (PCB) circuits without the need for peripheral connectors. Multiple PCBs are electrically and mechanically interfaced with one or more plated holes or tabs on at least one first PCB and one or more plated tabs or holes on at least one second PCB. The plated tab(s)/hole(s) from said second PCB mate with the corresponding plated tab(s)/hole(s) from said first PCB to form a mechanical and electrical interconnect.Type: ApplicationFiled: February 2, 2009Publication date: August 6, 2009Inventors: FRED JESSUP, ERIK CEGNAR, MICHAEL MAUGHAN, DAVID G. ALEXANDER
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Patent number: 7568958Abstract: A terminal for a sealed accumulator includes a single-piece body made of aluminium with at least one tinned zone for soldering to an electronic card and at least one non-tinned zone for connection to a current output terminal of the accumulator. The electrical terminal has a limited space requirement; welds well onto an accumulator container made of aluminium and allows easy assembly with an electronic card by soldering without risk of migration of tin which could cause a short circuit.Type: GrantFiled: March 4, 2008Date of Patent: August 4, 2009Assignee: Saft Groupe SAInventor: Nicolas Vigier
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Patent number: 7557593Abstract: A probe for electrical test comprises a probe body having a base end attached to a support base plate through a solder and a front end continuous with said base end and a surface layer showing a conductivity higher than that of the probe body and a solder wettability higher than that of the probe body and extending on the surface of the probe body from the base end to the front end. In the vicinity of the base end of the surface layer, a shield region having a smaller solder wettability than that of the surface layer is formed across the surface layer.Type: GrantFiled: January 26, 2007Date of Patent: July 7, 2009Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Hideki Hirakawa, Akira Souma, Takayuki Hayashizaki, Shinji Kuniyoshi
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Patent number: 7549874Abstract: A socket, adapt for electrically connecting a semiconductor package to a print circuit board, comprises an insulating housing, a plurality of contacts received in the insulating housing and a plurality of solder balls disposed on bottom ends of the contacts. The socket is mounted on the print circuit board by soldering the solder balls to the print circuit board, after that, an accessional member, which is made of epoxy resin, is displaced between the insulating housing and the print circuit board by insert-molding to surround the solder balls.Type: GrantFiled: August 27, 2007Date of Patent: June 23, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Chun-Yi Chang, Nan-Hong (Nick) Lin
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Patent number: 7537498Abstract: In one aspect, a surface mount contact is provided for attachment to a circuit board or the like. The contact includes an elongated electrically conductive pin that has a first end and an opposing second end. A pre-formed heat re-flowable material is attached to one end of the pin and a conductive locator member surrounds the pin at a location between the first and second ends thereof and adjacent the conductive locator member. In one embodiment, the locator member is in the form of a cylindrical collar that extends around the pin.Type: GrantFiled: October 31, 2007Date of Patent: May 26, 2009Assignee: Interplex Nas, Inc.Inventors: Joseph Cachina, James Zanolli, Jack Seidler
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Patent number: 7530820Abstract: A surface mount component (for example, an electrical connector) includes a connector body portion and a plurality of temperature-activated self-extending surface mount attachment structures (TASESMAS). During a reflow solder process, amounts of solder within the connector melt. Surface and interfacial tensions of structures within the connector cause the TASESMAS structures to extend away from the connector body portion and toward an object (for example, a printed circuit board) to which the surface mount component is to be surface mount soldered. Each TASESMAS may self-extend a different amount to accommodate nonplanarities in the surface to which the component is to be surface mounted. When the component cools after reflow soldering, the amounts of solder solidify thereby fixing the TASESMAS structures in their extended positions.Type: GrantFiled: May 29, 2007Date of Patent: May 12, 2009Inventor: Myoungsoo Jeon
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Publication number: 20090053943Abstract: The invention relates to a cable for bringing into contact with a contact point of a flexible strip conductor, to a contact strip for one or more cables of this type, and to a system for bringing control electronics, which are situated on a flexible printed circuit board, into contact with at least one electrical and/or electronic component. The component is, particularly, a mechatronic transmission or engine controller of a motor vehicle. A special contact with a welding boss is placed at the end of a cable. A bundle of cables of this type is fixed in a defined position by way of a contact strip. The invention enables, for the first time, one or more cables to be directly brought into contact with the contact point(s) of a flexible strip conductor. This advantageously eliminates additional contact points and parts such as mating connectors, etc. whereby leading to a distinct improvement in quality and reduction in costs.Type: ApplicationFiled: September 30, 2005Publication date: February 26, 2009Applicant: Siemens AktiengesellschaftInventors: Martin Fink, Christian Janisch, Karl Smirra
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Patent number: 7485017Abstract: A microelectronic package substrate and an electrically conductive pin. The substrates includes: a die-side surface adapted to receive a die thereon; a printed circuit board (PCB)-side surface adapted to be mechanically and electrically bonded to a PCB; an array of land pads on the PCB-side surface, the land pads defining anchoring recesses therein; an array of electrically conductive pins electrically and mechanically bonded to respective ones of the land pads, the pins having anchoring elements thereon mated with corresponding ones of the anchoring recesses of the land pads, the anchoring elements and anchoring recesses being configured such that a mating thereof inhibits a tilting of the pins on the land pads; and a plurality of pin-attach solder joints mechanically and electrically bonding the pins to corresponding ones of the land pads.Type: GrantFiled: June 5, 2007Date of Patent: February 3, 2009Assignee: Intel CorporationInventors: Mengzhi Pang, Yonggang Li
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Patent number: 7479016Abstract: A semiconductor device socket is for electrically connecting between a semiconductor device and a printed-wiring board. The semiconductor device socket includes a socket body having contacts to be electrically contacted with the semiconductor device, and a connection mechanism provided between the socket body and the printed-wiring board, and having connection members for electrically connecting between the contacts and the printed-wiring board and an alignment plate having through-holes in which the connection members are provided, wherein the connection member of the connection mechanism has a first spring portion having a first free end, a support portion having an outer diameter greater than an inner diameter of the through-hole, and a second spring portion having a second free end.Type: GrantFiled: July 25, 2006Date of Patent: January 20, 2009Assignee: Yamaichi Electronics Co., Ltd.Inventors: Katunori Takahashi, Fumiaki Otsuji
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Patent number: 7476110Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.Type: GrantFiled: January 29, 2007Date of Patent: January 13, 2009Assignee: FCI Americas Technology, Inc.Inventors: Timothy A. Lemke, Timothy W. Houtz
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Patent number: 7458828Abstract: A surface mount electrical connector includes a terminal body having a first elongate member that cooperates with a housing to secure the terminal body to the connector housing. A second elongate member of the terminal body includes a curved portion having an aperture therethrough. The curved portion includes a convex surface that facilitates automated assembly operations, and the aperture helps to overcome surface tension in liquid solder, thereby promoting a secure electrical connection.Type: GrantFiled: January 18, 2007Date of Patent: December 2, 2008Assignee: Lear CorporationInventor: Slobadan Pavlovic
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Publication number: 20080293297Abstract: An electrical contact component includes a base defining an external terminal to be mounted on a surface of a wiring board with a solder and a fitting portion having a substantially tubular shaped fitting periphery. The external terminal has a first principal surface opposing the surface of the wiring board, a second principal surface substantially parallel to the first principal surface, and sides substantially perpendicular to the first and second principal surfaces and connecting the first principal surface to the second principal surface. The fitting portion is continuously provided on the second principal surface. The fitting periphery of the fitting portion is electrically connected to the second principal surface and the sides of the external terminal by metal layers formed over their respective surfaces. The metal layer contains Ni as a principal constituent and Co, and the metal layer contains Au as a principal constituent.Type: ApplicationFiled: November 28, 2005Publication date: November 27, 2008Applicant: Murata Manufactuiring Co., Ltd.Inventors: Hiroki Wakamatsu, Yuichi Maruyama, Nobushige Araki
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Patent number: 7448923Abstract: Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board. Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board. The solder paste is reflowed and forms a rivet structure attaching the flex circuit to the rigid circuit board as well as providing an electrical connection between the conductive pads of the flex circuit and the rigid circuit board.Type: GrantFiled: November 22, 2006Date of Patent: November 11, 2008Inventor: Harshad K Uka
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Publication number: 20080261462Abstract: A connector mountable to a printed circuit board is disclosed including a nonconductive housing with a plurality of slots, each slot having an opposed first and second end walls with grooves in each end wall and a plurality of terminals (41). Each terminal has a longitudinal axis, a retaining base (42), a solder portion (44), a resilient contact arm (43) and an alignment tab (45). The retaining base (42) has opposed edges with each edge fitting into a respective groove in the end walls holding each terminal to the non-conductive housing. The solder portion (44) extends from the retaining base (42) adjacent to the first end wall of the slot for soldering to the printed circuit board. The resilient contact arm (43) has opposed first and second sides extending from the retaining base (42), the first side of the arm is located adjacent the second end wall of the slot. The contact arm (43) is adapted to engage with a terminal (21) from a mating connector.Type: ApplicationFiled: December 5, 2005Publication date: October 23, 2008Applicant: MOLEX INCORPORATEDInventor: Akinori Mizumura
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Publication number: 20080261463Abstract: The invention relates to a contact element for printed circuit boards, comprising a terminal body that has an insertion opening for the insertion of a conductor and a screw for the fastening by clamping of the conductor within the terminal body. A seating element with a seating surface is detachably fastenable by a fastening element to the contact element. The seating surface has a surface area that is greater than the cross-sectional surface area of the terminal body.Type: ApplicationFiled: January 23, 2008Publication date: October 23, 2008Inventors: Klaus Bauerle, Frank Walter, Hermann Stadler
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Patent number: 7438593Abstract: A printed circuit board component includes a housing carrying a peg that engages a printed circuit board hole. This peg has a radially projecting detent lug extending beyond the plug outer periphery. The lug is located and formed on the peg so the peg outer periphery is smaller in the area of the lug than the diameter of the hole. The outer periphery of the section of the peg projecting into the hole is such that, between the outer periphery of this section and the hole inner wall, a space having a capillarity for solder is formed over a portion of the outer periphery. During soldering, solder on the printed circuit board surface enters and fills the space by capillary action.Type: GrantFiled: July 7, 2004Date of Patent: October 21, 2008Assignee: Rosenberger Hochfrequenztechnik GmbH & Co. KGInventor: Willem Blakborn
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Publication number: 20080220667Abstract: A terminal for a sealed accumulator comprises a single-piece body made of aluminium with at least one tinned zone for soldering to an electronic card and at least one non-tinned zone for connection to a current output terminal of the accumulator. The electrical terminal has a limited space requirement; welds well onto an accumulator container made of aluminium and allows easy assembly with an electronic card by soldering without risk of migration of tin which could cause a short circuit.Type: ApplicationFiled: March 4, 2008Publication date: September 11, 2008Applicant: SAFT GROUPE SAInventor: Nicolas VIGIER
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Patent number: 7416420Abstract: Conductive adhesive bonds are used preferably where the contact bonds are subject to great temperature variations, for example, on a throttle valve controller. In order to increase the mechanical stabilization of the conductive adhesive bonds, the surface of the contacts are machined and provided with structures such as ribbing, prickles, etc. As a result of this structuring, the conductive adhesive interlocks mechanically at these points. This leads to a high contact reliability also at extreme temperature changes.Type: GrantFiled: May 16, 2003Date of Patent: August 26, 2008Assignee: Preh-Werke GmbH & Co. KGInventors: Hans-Michael Schmitt, Oswald Reuss, Annegret Suckfuell, Klaus Hemmert
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Publication number: 20080188145Abstract: In accordance with various embodiments of the present disclosure, an electrical connector is provided. The electrical connector includes an electrically conductive pin extending from a base of the connector. The electrical connector additionally includes a standoff extending from the base adjacent the pin and forming an acute angle with the pin.Type: ApplicationFiled: February 2, 2007Publication date: August 7, 2008Inventors: Alfredo Grueso, Nestor Estrada
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Publication number: 20080124988Abstract: The terminal board component is composed of a box traversed by electrical current-carrying elements (30), with an end surface (110) bearing mechanical (111) and electrical (114) connection elements allowing its attachment to a modular component of an electrical device and one end surface (150) bearing elements for connection to at least one electric power cable. The box includes at least one housing (104) for accommodating a connection element designed to be electrically connected to at least one electric power cable. The connection elements is a screwless connector (4), and the box bears a plunger (136, 137, 138) that is obtained by molding with its upper surface (13, 113) and that is movable perpendicular to the upper surface (113), positioned over each housing (104) for accommodating a screwless connector (4).Type: ApplicationFiled: October 26, 2005Publication date: May 29, 2008Applicant: PROFESSIONAL GENERAL ELECTRONIC PRODUCTS PGEPInventor: Michèle Blanchot
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Publication number: 20080113566Abstract: A board-stacking connector has surface-mounting connections to electrical contact pads or lands on two facing surfaces on two printed circuit boards that are spaced from each other a predetermined distance in two substantially parallel planes. The connector takes the form of a generally cylindrical shell of metallic material and defines an axis and a substantially uniform cross-sectional area along that axis. The shell has a wall closed on itself to define an internal cavity forming two openings, one at each of its axial ends, and this wall further defines generally flat contact surfaces normal to said axis and surrounds each of said respective openings. One of the contact surfaces is arranged to be in contact with a pad or land on one printed circuit board and the other of the contact surfaces is arranged to be in contact with a pad or land on the other spaced printed circuit board.Type: ApplicationFiled: November 10, 2006Publication date: May 15, 2008Inventor: Janos Legrady
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Patent number: 7371083Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.Type: GrantFiled: March 14, 2007Date of Patent: May 13, 2008Assignee: Antaya Technologies CorporationInventors: John Pereira, Manuel Machado, Stephen Antaya
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Publication number: 20080108255Abstract: A method of attaching a solder element to a contact and the contact assembly formed thereby. The contact assembly is used in a connector. The solder element is either staked or stapled to the contact. The solder element can take a variety of shapes and disclosed herein is a tear-drop shape, a “wolf's head” shape and a circular shape. An over-stress feature is also provided for when the contact assembly is mounted to a printed wiring board.Type: ApplicationFiled: September 15, 2005Publication date: May 8, 2008Applicant: Molex IncorporatedInventors: Kirk B. Peloza, Richard A. Faje, Ronald C. Hodge, Jos S. Gould
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Patent number: 7364460Abstract: The fixing member of the present invention can be mounted to a fixed member that is fixed to a printed circuit board and that is used for fixing the fixed member to the printed circuit board, the fixing member including: a mounting member main body fixed to the fixed member; male connector portions having at tip ends thereof lug portions that are engaged with an opening edge of an insertion opening in the printed circuit board when inserted into the inserting opening; and contact portions that contact with a soldering land formed at the printed circuit board and are joined to the soldering land by soldering when the lug portions are engaged with the opening edge, the contact portions being formed at the mounting portion main body and the male connector portions extend arm-shaped from the mounting portion main body or from the contact portions.Type: GrantFiled: January 12, 2007Date of Patent: April 29, 2008Assignee: Kabushiki Kaisha Tokai-Rika-Denki-SeisakushoInventors: Shinji Takahashi, Yoshiaki Kato, Harehide Sasaki, Kazuharu Yoshimatsu, Katsumasa Matsuoka, Masato Minakata, Hiroshi Kobayashi
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Patent number: 7357651Abstract: A single pole female connector has: a mounting base portion in which is formed a terminal insertion hole into which a male terminal can be inserted; an extending portion extending outwardly from the mounting base portion; and a terminal contacting portion which extends from a peripheral edge of the mounting base portion in a direction substantially orthogonal to a plate portion, and which is formed so as to be able to nip the male terminal. The extending portion is electrically connected by being reflow soldered to a land at a reverse surface of the substrate. It is difficult for cream solder to enter into a male terminal insertion path at an inner side of the female connector.Type: GrantFiled: November 15, 2006Date of Patent: April 15, 2008Assignees: Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho, Molex Japan Co., Ltd.Inventors: Akihiro Minoura, Toshihiro Takeuchi, Norihito Suzuki, Shuichi Inoue, Akira Kawaguchi
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Patent number: 7352593Abstract: An anchoring member and related method are disclosed for substantially parallel assembly of two additional daughter printed circuit boards (PCB) and heat sink on each side of main of mother PCB, and to retain a predetermined mating distance thereto to retain a predetermined mating distance thereto. The anchoring member comprises an elongated body extending in a longitudinal direction and having a first coupling member on one end for coupling the first daughter board in a substantially perpendicular orientation to the longitudinal direction on a first side of the mother board. The elongated body also comprises a second coupling member at the opposite end from the elongated body from the first coupling member for coupling the second daughter board in a substantially perpendicular orientation to the longitudinal direction on a second side of the mother board.Type: GrantFiled: November 14, 2006Date of Patent: April 1, 2008Assignee: Ruggedcom Inc.Inventors: Guang Zeng, Roger Moore, Clive Dias
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Patent number: 7347750Abstract: In one aspect, a surface mount contact is provided for attachment to a circuit board or the like. The contact includes an elongated electrically conductive pin that has a first end and an opposing second end. A pre-formed heat re-flowable material is attached to one end of the pin and a conductive locator member surrounds the pin at a location between the first and second ends thereof and adjacent the conductive locator member. In one embodiment, the locator member is in the form of a cylindrical collar that extends around the pin.Type: GrantFiled: August 19, 2004Date of Patent: March 25, 2008Assignee: Interplex Nas, Inc.Inventors: Joseph Cachina, James Zanolli, Jack Seidler
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Patent number: 7345247Abstract: A circuit board threadplate for connection of a component to a circuit board is provided wherein such threadplate may be mechanically mounted to a circuit board without the use of manual labor. Specifically, the threadplate is compatible with present Surface Mount Technology robotic placement machines. Such circuit board threadplate includes a hollow substantially cylindrical member forming an extruded neck having an elongated section and a substantially flat surface at a first end of the elongated section and a flange extending from a second end of the elongated section. The flange provides a substantially flat surface suitable for soldering onto a surface of a circuit board. Additionally, the threadplate includes a cylindrical cavity positioned inside the substantially cylindrical member, extending in a direction aligned with the substantially cylindrical member. The cylindrical cavity may have a thread pattern suitable for receiving a screw-type fastener.Type: GrantFiled: October 4, 2002Date of Patent: March 18, 2008Assignee: Sanmina-SCI CorporationInventor: John A. Ireland
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Publication number: 20080057799Abstract: An electrical connector including a base pad formed of aluminum and having a bottom surface. An electrical contact can be connected to the base pad. A layer of copper can be on the bottom surface of the base pad.Type: ApplicationFiled: August 8, 2007Publication date: March 6, 2008Inventor: John Pereira
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Patent number: 7338299Abstract: An exemplary surface mounted electronic component has block body including a bottom soldering surface, a top surface and a peripheral wall having a first peripheral wall portion and a second peripheral wall portion. The bottom soldering surface defines a first soldering area and a second soldering area. The first peripheral wall portion adjoins the first soldering area and has at least a first cutout defined between the first peripheral wall portion and the first soldering area. The second peripheral wall portion adjoins the second soldering area and has at least a second cutout defined between the second peripheral wall portion and the second soldering area. When the surface mounted electronic component is soldered, the melting solder can climb up the cutouts of the sidewall due to capillary effect and ‘chimney effect’, thereby avoiding ‘tombstoning’.Type: GrantFiled: December 6, 2006Date of Patent: March 4, 2008Assignee: Foxconn Advanced Technology Inc.Inventors: Wen-Chin Lee, Cheng-Hsien Lin
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Patent number: 7331832Abstract: A structure of a focusing mesh for a field emission display includes a cathode substrate and a rectangular mesh. The cathode substrate with one edge formed a cathode conductor including a joint area. The mesh includes a plurality of pores formed in matrix and a L-shaped recess formed at one side of the mesh to provide a rectangular strip as a leading wire of the mesh drooped by self weight to contact with the joint area of the cathode conductor. As such, during vacuuming to envelop the field emission display, it will not cause the crack of wire, air leakage and even make easier to be enveloped and increase the good fabrication rate of a field emission display.Type: GrantFiled: October 10, 2006Date of Patent: February 19, 2008Assignee: Teco Nanotech Co., Ltd.Inventors: Frank Yang, Yao-Zong Chen
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Publication number: 20080009203Abstract: Electrical connection jumper, in particular for terminal blocks of switchboards, comprising a conducting body extending in the longitudinal direction and a plurality of connector elements for electrical connection, which extend in the transverse direction from said conducting body, and an insulating body, integral with said conducting body, said insulating body comprising a longitudinally extending gripping part and pairs of lugs which extend therefrom in a substantially transverse direction and are able to contain partially said conducting body.Type: ApplicationFiled: July 6, 2007Publication date: January 10, 2008Inventor: Giordano Pizzi
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Publication number: 20070281557Abstract: A method of fabricating an electrical connecting structure of a circuit board is disclosed. The method includes: providing a circuit board having a plurality of first and a plurality of second conductive pads; forming on the circuit board a solder mask having a plurality of openings to thereby expose the first and the second conductive pads; forming an metal adhesive layer on the first and the second conductive pads; forming a conductive layer on the circuit board and the metal adhesive layer; forming on the conductive layer a resistive layer, wherein a plurality of openings are formed in the resistive layer to expose the conductive layer on the second conductive pads; forming a metal post by electroplating through the conductive layer on the second conductive pads; removing the resistive layer and the conductive layer covered underneath; and forming a soldering layer on the metal post. This invention discloses a method of forming different connecting elements on a circuit board.Type: ApplicationFiled: June 6, 2007Publication date: December 6, 2007Applicant: PHOENIX PRECISION TECHNOLOGY CORPORATIONInventor: Chao-Wen Shih
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Patent number: 7303409Abstract: A connector includes a base, a circuit structure and a terminal base. The base has a body and a plurality of pins, wherein a surface of the body is formed with a plurality of recesses, and the pins are respectively inserted the recesses. The circuit structure is electrically connected with the pins, and the terminal base has a plurality of terminals for electrically connecting with the circuit structure.Type: GrantFiled: July 12, 2006Date of Patent: December 4, 2007Assignee: Delta Electronics, Inc.Inventors: Ru-Kuen Huang, Yu-Yuan Tai
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Publication number: 20070270049Abstract: A method for forming electrical contacts on an electrical connector having terminals therein includes the steps of preparing a screening board on top of the electrical connector to allow each mesh to align with a center of a top face of each of the terminals of the electrical connector, the screening board having meshes defined therein. Tin paste is applied onto the screening board to allow the tin paste to fill in each of the meshes. Excessive tin paste is removed from the screen board. Then the screening board is removed to leave tin blocks on the centers of the top faces of the terminals of the electrical connector. A heating step is processed to heat the electrical connector. Then electrical contacts are formed on the top faces of the terminals of the electrical connector.Type: ApplicationFiled: May 19, 2006Publication date: November 22, 2007Inventors: Feng-Chien Hsu, An-Chyi Liou
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Patent number: 7296347Abstract: An electrical terminal includes a generally planar base pad having two opposed legs and an intermediate portion. The base pad legs have proximal and distal ends and are joined at the proximal ends to the intermediate portion. The legs are spaced apart from each other to form a gap between the legs. The base pad legs have inner edges facing each other which extend away from each other moving away from the proximal ends of the base pad legs to the distal ends. A connector arm having a neck extends upwardly from the intermediate portion of the base pad between the base pad legs and terminates in a blade connector for engaging with a mating terminal. The neck has a proximal end with a width that is less than the gap between the proximal ends of the base pad legs by about ½ mm to 3 mm. The neck has a narrowing section moving away from the proximal end of the neck.Type: GrantFiled: July 8, 2004Date of Patent: November 20, 2007Assignee: Antaya Technologies CorporationInventors: Stephen Antaya, Manuel Machado
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Patent number: 7226299Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.Type: GrantFiled: June 8, 2006Date of Patent: June 5, 2007Assignee: Antaya Technologies CorporationInventors: John Pereira, Manuel Machado, Stephen Antaya
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Patent number: 7223136Abstract: A substrate is obtained as follows. A structure is formed using a metal plate for a lead frame on which terminals and connection portions are formed; the terminals are exposed from either a front or back surface and the connection portions connect the terminals together. A resin is then used to make the structure hard. The height of a step in a central step portion is variable. The resin is one of PA6T, PPS, and LCP, all of which are resistant to heat. A step portion can be obtained which projects from a bottom surface of a circuit substrate. The circuit substrate is inexpensively obtained.Type: GrantFiled: October 28, 2005Date of Patent: May 29, 2007Assignee: Hosiden CorporationInventors: Akira Yamamoto, Yasuo Sugimori
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Patent number: 7214068Abstract: A laser ribbon bond pad array connector is disclosed for electrically connecting a RF module to an IMD circuit board in an implantable medical device. The array connector includes a connector body with a plurality of electrically isolated bonding fingers embedded in the connector body. Each bonding finger includes a solder pad that is on a first surface of the connector body and a laser ribbon bond pad that is on a second surface of the connector body. The first and second surfaces are spaced apart in angular relations thereof.Type: GrantFiled: December 3, 2004Date of Patent: May 8, 2007Assignee: Medtronic, Inc.Inventors: Christine G. Kronich, Todd H. Schaefer, Scott J. Robinson