Abstract: Cleaning systems and methods for semiconductor fabrication use rotatable and optionally translatable chuck assemblies that incorporate magnetic levitation and rotation functionality to cause chuck rotation. The rotating chuck components do not physically contact other chuck components when levitated and rotating. This eliminates corresponding components whose friction or lubricants might generate contamination. The low friction chuck functionality of the present invention is useful in any fabrication tool in which a workpiece is supported on a rotating support during a treatment. The chuck is particularly useful in cryogenic cleaning treatments. By avoiding the use of lubricants for this rotating interface, process chambers can be evacuated and/or vented up to higher pressures much faster. This significantly reduces cycle time for cryogenic treatments.

Abstract: A caloric heat pump system includes a pump is operable to circulate a working fluid through a stage. The pump includes a motor. A cam is coupled to the motor such that the cam is rotatable by the motor. The cam has a non-circular outer profile surface. Each piston of a pair of pistons has a cam follower positioned on the non-circular outer profile surface of the cam.

Abstract: A device for fine processing of optically effective surfaces on workpieces has a workpiece spindle which protrudes into a working space and by which a workpiece to be polished can be rotationally driven about a workpiece axis of rotation. Two tool spindles are associated with the workpiece spindle and protrude into the working space oppositely to the workpiece spindle. On each tool spindle, a polishing tool can be rotationally driven about a tool axis of rotation and is retained so that the polishing tool can be axially advanced along the tool axis of rotation. Furthermore, the tool spindles can be moved together in relation to the workpiece spindle along a linear axis extending substantially perpendicularly to the workpiece axis of rotation and can be pivoted about different pivoting adjustment axes, which extend substantially perpendicularly to the workpiece axis of rotation and substantially perpendicularly to the linear axis.

Abstract: A manufacturing method of a slider includes steps of: (a) providing a row bar with a plurality of slider elements connecting together; (b) lapping surfaces of the row bar so as to obtain a predetermined requirement; (c) lowering the temperature of the surfaces lapped in the step (b) before and/or during lapping; and (d) cutting the row bar into a plurality of sliders. The present invention can prevent a local high temperature generated on the magnetic head during lapping so that the performance of the magnetic head is improved.

Abstract: An elevator brake disk assembly is provided. The elevator brake disk assembly includes a brake disk which is keyed to and rotatable with a shaft of an elevator machine, a machine frame and dampers. The dampers are respectively anchored to the machine frame and biased to symmetrically hold the brake disk during rotations thereof.

Abstract: The present invention relates to a method and an arrangement for grinding spherical products (12), such as e.g. bowling balls, in particular. Such an arrangement comprises at least one grinding machine (1) having a spherically oscillating grinding movement. A fastening plate (6) fitted on the grinding machine has a spherically shaped bearing surface (7) and a grinding product (9) fitted on this, which through its slits (13) adopts a position with accuracy of shape on the spherically shaped surface. The grinding product (9) will form a contact surface (17) in the interface, in which the grinding product cooperates with the spherical product. This contact surface then adopts a radius of curvature arranged to substantially correspond to the radius (r) of the spherical product (12). The grinding is performed with a spherically oscillating grinding movement, which is adapted to the radius of the spherical product and simultaneously coincides with the radius of curvature of the contact surface.

Abstract: A double-side polishing apparatus for a work according to the present invention includes one or more work thickness measuring devices and a control unit. The double-side polishing method for a work includes the steps of: first polishing for polishing both surfaces of the work; first measurement for measuring the thickness of the work; in the first measurement step, when the thickness of the work is found to reach the predetermined thickness, terminating the orbital motion of the carrier plate; second polishing both surfaces of the work while the carrier plate performs only rotational motion; second measurement for measuring the thickness of the work at predetermined position(s); and determining a time for terminating polishing based on the result of the measurement of the thickness of the work in the second measurement step.

Abstract: Disclosed is a slurry supply device including a nozzle configured to eject slurry, a slurry supply unit configured to receive the slurry from the nozzle and to discharge the slurry through at least one slurry hole, a receiving unit configured to allow the slurry supply unit to be mounted, inserted, seated, coupled, supported, or placed therein so as to enable discharge of the slurry from the slurry supply unit, the receiving unit being configured to receive a flowing material around the slurry supply unit and a slurry protection unit configured to enclose a space for passage of the slurry from an exit of the nozzle to an entrance of the slurry supply unit in conjunction with the flowing material.

Abstract: Implementations disclosed herein allow a printed circuit board (PCB) to be removeably secured to a lapping carrier. The lapping carrier may include a clamping mechanism and one or more alignment pins that thread through corresponding holes in the PCB. In other implementations, the lapping carrier includes insulation that prevents current leakage or short-circuiting of electrical paths on the PCB during contact with the clamping mechanism.

Abstract: A green ball grinding method includes the step of supplying a green ball between a first surface of a first member and a second surface of a second member constituting a grinding apparatus, and the step of grinding the green ball between the first surface and the second surface while the green ball rotates around its own axis and in orbital motion. In the step of grinding the green ball, the step of causing the green ball grinding to proceed while applying load between the green ball and each of the first surface and the second surface, and the step of modifying the rotation axis of the green ball by reducing the load lower than in the step of causing the green ball grinding to proceed are executed alternately.

Abstract: A trimming apparatus for trimming two working layers, including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpieces includes a trimming disk, a plurality of trimming bodies and an outer toothing, where the trimming bodies are configured to release abrasive substances upon contract with the working layers so as to effect material removal from the working layers. At least 80% of the area of the trimming bodies configured to come into contact with the working layers is arranged within a ring-shaped region on the trimming disk. The width of the ring-shaped region is between 1-25% of the diameter of the trimming disk and the area of the trimming bodies which comes into contact with the working layers occupies 20-90% of the total area of the ring-shaped region.

Abstract: The invention relates to an apparatus for the double-sided, grinding machining of flat workpieces with an upper and a lower work disk, each of which has a work surface with a grinding layer, wherein the work surfaces form a work gap amongst themselves, in which workpieces can be ground, wherein at least one of the work disks is rotatably drivable by means of a driving mechanism, and further having a device for guiding the workpieces in the work gap. It is provided according to the invention that debarring means are arranged on at least one of the work disks, which are designed to deburr the workpieces during their machining in the apparatus.

Abstract: A double-side polishing apparatus for a work according to the present invention includes one or more work thickness measuring devices and a control unit. The double-side polishing method for a work includes the steps of: first polishing for polishing both surfaces of the work; first measurement for measuring the thickness of the work; in the first measurement step, when the thickness of the work is found to reach the predetermined thickness, terminating the orbital motion of the carrier plate; second polishing both surfaces of the work while the carrier plate performs only rotational motion; second measurement for measuring the thickness of the work at predetermined position(s); and determining a time for terminating polishing based on the result of the measurement of the thickness of the work in the second measurement step.

Abstract: The system for machining the bottom of skis comprises a machine frame, in which a ski is stationary supported by roller carriers. The machining is performed by machining tools on a carriage, which extends throughout under the ski. During the machining, the carrier rollers that are alternately arranged behind each other, take over the support of the ski. There are always so many carrier rollers directly under the ski that its bottom remains in a stationary position.

Abstract: A blade sharpener including a main frame casing having a grip and a grinding chamber and a grinder assembly detachably installed in the grinding chamber in which the grinder assembly is formed by a pair of shaft supports facing each other, a supporting window provided in each of the shaft supports, a rotary shaft supported at both end portions thereof by the vertical shaft supports, an abrasive wheel provided on the rotary shaft at substantially its axial center, and a pair of lateral coil springs each provided on either side of the abrasive wheel. The rotary shaft can be supported by a pair of longitudinal coil springs installed in the shaft supports.

Abstract: An object of the present invention is to provide a method of polishing silicon wafers, capable of suppressing generation of undesired sounds from carriers and reducing the thickness variation of the wafers after polished. The method is a wafer polishing method in which wafers 20 are polished by supplying a polishing solution to surfaces 30a of a pair of polishing pads 30 positioned above and below carriers 10 each having a circular hole 11 for retaining the wafers 20, the carriers 10 being thinner than the wafers 20; and sliding the polishing pads 30 relatively to the carriers 10, thereby simultaneously polishing both surfaces of the wafers 20 retained in the carriers 10. The method is characterized in that information sourced from the carriers 10 when a difference between the thickness of the carriers 10 and the thickness of the wafers 20 reaches a predetermined value is detected to calculate the thickness of the wafers 20, thereby terminating polishing.

Abstract: In the double-side polishing apparatus, one end part of a slurry supply hole has a female-tapered face whose inner diameter is gradually increased toward a polishing face of a polishing plate. A pad hole, which corresponds to the slurry supply hole, is formed in a polishing pad covering the slurry supply hole. An edge of the pad hole is located in the slurry supply hole. A fixation pipe, in which a flange section facing the female-tapered face is formed at one end part, is fixed in the slurry supply hole. The edge of the pad hole is sandwiched and held between the female-tapered face of the slurry supply hole and the flange section of the fixation pipe.

Abstract: To propose a method for realizing appropriate delivering of works to carriers in the conventional transfer process. Specifically, in a polishing method for polishing a work retained in a carrier, at least one carrier for retaining a work to be polished is placed between an upper plate and a lower plate; the work is fit in a hole of the carrier; the carrier and the work are inserted between the upper plate and the lower plate; and at least one of the upper plate and the lower plate is rotated while supplying a polishing agent to a space between the upper plate and the lower plate. In fitting the work in the hole of the carrier, an end portion of the work is held and the work is carried to a position above the lower plate; the work is positioned with respect to the hole of the carrier on the lower plate; and the work is released from the hold and guided by a guide to be slowly carried down toward the hole.

Abstract: An apparatus for grinding a cam having an outer surface with outwardly convex and outwardly concave portions has a frame and a main drive on the frame for holding the cam and rotating it about a main axis. A pair of drive motors having respective output axes generally diametrally flank the main axis. Respective carriages carrying the drive motors are shiftable on the frame radially of the main axis. One of the motors is shiftable into an inner position in which the main axis extends through the one drive motor. Respective grinding wheels are rotatable by the motors about the respective axes, and the wheel of the one motor is of substantially smaller diameter than the wheel of the other motor.

Abstract: A method for simultaneous double-side material-removing processing of at least three workpieces includes disposing the workpieces in a working gap between rotating upper and lower working disks of a double-side processing apparatus. The workpieces lie in freely movable fashion in respective openings in a guide cage and are moved under pressure in the working gap using the guide cage. Upon attaining a preselected target thickness of the workpieces, a deceleration process is initiated that includes reducing an angular velocity ?i(t) of a respective drive i of each of the upper working disk, lower working disk and guide cage to a standstill. The reducing is carried out such that ratios of the angular velocities ?i(t) with respect to one another as a function of time t deviate by no more than 10% from initial ratios of the angular velocities ?i(t) corresponding to when the preselected target thickness was attained.

Abstract: A double-side polishing apparatus including at least: upper and lower turn tables each having a polishing pad attached thereto; a carrier having a holding hole formed therein for holding a wafer between the upper and lower turn tables; a sensor for detecting a thickness of the wafer during polishing, the sensor being disposed in a through-hole provided at the upper turn table in a direction of an upper-turn-table rotation axis; and a sensor holder for holding the sensor, wherein a material of the sensor holder is quartz. As a result, there is provided a double-side polishing apparatus that can polish a wafer while the difference from the target wafer thickness is reduced by surely inhibiting deformation of the sensor holder due to the influence of heat generated during the polishing of the wafer.

Abstract: A wafer unloading system and wafer processing equipment (system) including the same are disclosed. The wafer unloading system includes a fluid supply tube for supplying a fluid, a nozzle for injecting the supplied fluid, and an injection hole defined in a plate to allow the injected fluid to reach a space between a polishing pad and a wafer.

Abstract: A complex geographical edge finishing system includes a fixture that holds an external part having a complex three-dimensional edge, a track disposed around the fixture and surrounding the edge of the part held in the fixture, and one or more finishing apparatuses that can sand, polish, buff, paint and/or apply coatings to the complex three-dimensional edge. The finishing apparatuses move about the track such that the three-dimensional edge of the part can be polished. The path of the track can substantially match, mimic or otherwise correspond to the path of the three-dimensional edge, such that special requirements for the finishing apparatuses are not required.

Abstract: Disclosed is a semiconductor wafer polishing method for polishing the surfaces to be polished of semiconductor wafers by use of polishing pads (16, 17) provided on fixing plates by relative movement of the polishing pads and the semiconductor wafers held by carriers. The shaping surfaces (25) of a polishing pad shaping jig (21) are shaped by inverting, with respect to ideal shapes, the shapes of the surfaces to be polished of each semiconductor wafer when the surfaces are polished by use of the polishing pads (16, 17) before shaping, and the shapes of the shaping surfaces of the polishing pad shaping jig are transferred to the pad surfaces (16A and 17A) of the respective polishing pads (16, 17). The surfaces to be polished of each semiconductor wafer are polished by use of the pad surfaces.

Abstract: A workpiece feeder is capable of feeding a roller to a roller end face processing machine in a stable posture, a roller end face processing machine, and a roller for a rolling bearing processed by such a roller end face processing machine are provided. The workpiece feeder for roller end face processing includes: a carrier ring having a plurality of recesses arranged in a radially-inner surface thereof at a predetermined pitch along a circumferential direction; a regulating wheel fitted into the carrier ring to form roller fitting cavities between a radially-outer surface of the regulating wheel and the plurality of recesses; a carrier support for supporting the carrier ring on a radially-outer side with respect to the plurality of recesses; and rotational force applying means for applying a rotational force to the carrier ring on the radially-outer side with respect to the plurality of recesses.

Abstract: A double-disc grinding apparatus having at least: a rotatable ring-shaped holder for supporting a sheet-like wafer having a notch for indicating a crystal orientation from an outer circumference side along a radial direction, the holder having a protruding portion to be engaged with the crystal-orientation-indicating notch; and a pair of grindstones for simultaneously grinding both surfaces of the wafer supported by the holder, in which the holder is provided with at least one protruding portion separately from the protruding portion to be engaged with the crystal-orientation-indicating notch, and the both surfaces of the wafer are simultaneously ground by the pair of the grindstones while the wafer is supported and rotated with the at least one protruding portion being engaged with a wafer-supporting notch formed on the wafer.

Abstract: A tool sharpening assembly (100) suitable for sharpening cutting tools (140,350,366,546,562). In some embodiments, a wedge-shaped port is formed between a rotational first abrasive surface (160,262) and a stationary second abrasive surface (162,264) to sharpen a distal cutting edge (146) of a cutting tool (140,230,546). In other embodiments, a cooling mechanism (136,326,330,334,338) actively draws heat generated during a sharpening operation from a tool (140) and through a tool support structure (170,234,328,332) contactingly supporting the tool, in further embodiments, a rotatable abrasive slotted disc (364) comprises at least one inspection aperture (372) formed from an interior sidewall (390) with upper and lower leading and trailing edges (396,398,400,402) of non-uniform separation distance. In other embodiments, a cylindrical drum abrasive member (572) is provided with an associated stationary support plate (574).

Abstract: The double-side polishing apparatus is capable of uniformly polishing a wafer and highly preventing an outer edge of the wafer from being damaged. The apparatus comprises: a lower polishing plate and an upper polishing plate for polishing both sides of the wafer; a carrier having a main body part, in which a through-hole for holding the wafer is formed. Edges of the through-hole in an upper face and a lower face of the carrier are coated with coating layers, which are composed of an abrasion-resistant material and which have a prescribed width and a prescribed thickness. A resin cushion ring, which has a prescribed width and whose thickness is equal to that of the main body part of the carrier, is provided to an inner circumferential face of the thorough-hole. The wafer is held in the resin cushion ring.

Abstract: The system for machining the bottom of skis comprises a machine frame, in which a ski is stationary supported by roller carriers. The machining is performed by machining tools on a carriage, which extends throughout under the ski. During the machining, the carrier rollers that are alternately arranged behind each other, take over the support of the ski. There are always so many carrier rollers directly under the ski that its bottom remains in a stationary position.

Abstract: Short and/or rod-shaped workpieces are completely machined by grinding two parallel end faces and the longitudinal sides of the workpiece with very short cycle times. The grinding machine includes two grinding spindles that are arranged in a tandem arrangement with parallel rotational axes on a shared grinding headstock and that are jointly moved in the X direction. In cooperation with a special holding and transport device for the workpieces, two workpieces are each ground, at least partly concurrently, the end faces of the one workpiece being ground in one machining position and the final non-circular grinding of the exterior contour of a second workpiece occurring in a second machining station, the end faces of the second workpiece having already been ground.

Abstract: Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.

Abstract: A double side polishing apparatus comprises an upper polishing plate and a lower polishing plate for polishing both sides of a wafer; a plurality of carriers, each including a center plate and a circumferential plate, the center plate having a mounting hole where the wafer is mounted, the circumferential plate having a fitting hole where the center plate is fitted and a gear part formed along the outer periphery thereof, the center of the mounting hole being eccentric from the center of the center plate, the center of the fitting hole being eccentric from the center of the circumferential plate; and a sun gear and an internal gear engaged with the gear part to transmit a rotational force to the plurality of carriers, wherein a fitting direction of a center plate into a fitting hole is adjustable for at least two carriers among the plurality of carriers.

Abstract: A semiconductor wafer processed on both sides simultaneously, the wafer lying in freely movable fashion in a cutout in one of a plurality of carriers that rotate by means of a rolling apparatus, and one thereby being moved on a cycloidal trajectory, the semiconductor wafer being processed in material-removing fashion between two rotating ring-shaped working disks, wherein each working disk comprises a working layer comprising abrasive material, and wherein an alkaline medium comprising no abrasive material is supplied during the processing.

Abstract: A double-side polishing apparatus including at least: upper and lower turn tables each having a polishing pad attached thereto; a carrier having a holding hole formed therein for holding a wafer between the upper and lower turn tables; a sensor for detecting a thickness of the wafer during polishing, the sensor being disposed in a through-hole provided at the upper turn table in a direction of an upper-turn-table rotation axis; and a sensor holder for holding the sensor, wherein a material of the sensor holder is quartz. As a result, there is provided a double-side polishing apparatus that can polish a wafer while the difference from the target wafer thickness is reduced by surely inhibiting deformation of the sensor holder due to the influence of heat generated during the polishing of the wafer.

Abstract: A brake disk braking surface processing device 1 includes a rotation driving device 11 that rotates a brake disk 2, a processing section 12 that processes braking surfaces 4 and 5 of the brake disk 2, and pressing rollers 13 and 14 that press the braking surfaces 4 and 5 of the brake disk 2. The brake disk braking surface processing device 1 includes the pressing rollers 13 and 14 that press the braking surfaces 4 and 5 of the brake disk 2. Therefore, even when tools are pressed against the braking surfaces 4 and 5 in a direction perpendicular to the braking surfaces 4 and 5, deformation of the braking surfaces 4 and 5 of the brake disk 2 can be suppressed with certainty. As a result, processing accuracy of the braking surfaces 4 and 5 of the brake disk 2 can be enhanced.

Abstract: A grinding assembly is described, for a grinding head for a grinding machine of glass slabs, comprising: a first (and possibly a second) grinding wheel adapted to tangentially work on the glass edge and whose rotation axis A is parallel to the glass edge to be ground; and a handling system for the grinding wheel for adjusting the removal of glass in an oscillating way or in parallel with the plane of the slab to be ground. A grinding head equipped with the above grinding assembly is further described.

Abstract: In order to be able to economically carry out machining of a turbine rotor having blades consisting of different materials, by a high-speed grinding machine, a magazine for the grinding wheels and an automatically operating grinding wheel changer are provided. A plurality of different grinding wheels to be held are made available, which different grinding wheels are adapted to the respective blade materials. A flat-construction coupling is developed in order to be able to couple the grinding wheels with the receiving devices in the grinding wheel changer.

Abstract: In order to grind bar-shaped workpieces which have a non-circular cross-section and flat faces which are parallel to each other, two partial operations are performed consecutively. First, the bar-shaped workpiece is rough ground and finished on the faces by way of double-disk face grinding. The bar-shaped workpiece is clamped on the longitudinal sides in the first clamping position thereof, and the bar-shaped workpiece is transported between two clamping jaws, which clamp the workpiece in the second clamping position thereof on the faces. The first clamping position is then released, and the bar-shaped workpiece is rotated by the clamping jaws. A CNC-controlled peripheral grinding step is performed based on CX interpolation principles. This rough grinds and finishes the longitudinal sides of the bar-shaped workpiece. Transport from the first to the second clamping position is effected by a clamping station, which concomitantly forms the holder for the face grinding operation.

Abstract: A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a carrier having a hole configured to house the work, and a fixing member that contacts and fixes the work located in the hole.

Abstract: A floor edger and grinding device 10 has a deck 20 pivotably mounted to a rear frame 18 with a handle 16. The deck has a motor 22 mounted thereon that drives two grinder discs 24 in opposite rotational directions. The deck has a skirt 26 and a notch 28 extending along the front edge 27 of the skirt. The discs 24 protrude into the notch 28. A case 50 surrounds the drive gears 38 for protection against dust created by the discs 24.

Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.

Abstract: A method of grinding semiconductor wafers including simultaneously grinding both surfaces of multiple semiconductor wafers by rotating the wafers between a pair of upper and lower rotating surface plates in a state where the wafers are held on a carrier so that centers of the wafers are positioned on a circumference of a single circle, wherein a ratio of an area of a circle passing through the centers of the wafers to an area of one of the wafers is greater than or equal to 1.33 but less than 2.0; surfaces of the fixed abrasive grains comprised in the surface plates are comprised of pellets disposed in a grid-like fashion, with the pellets provided in a center portion and pellets provided in a peripheral portion being larger in size than the pellets provided in an intermediate portion.

Abstract: A hydrostatic pad for use in holding a semiconductor wafer during grinding of the wafer by grinding wheels. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.

Abstract: In the method of precisely polishing a work, torque of a sun gear and an internal gear are kept constant and a load applied to a carrier is reduced and maintained. The method comprises the steps of: changing a rotational speed of at least one of the sun gear, the internal gear, an upper polishing plate and a lower polishing plate; measuring rotation torque of a driving motor of at least one of the sun gear and the internal gear; detecting the minimum rotation torque measured in the measuring step; and adjusting the rotational speed of at least one of the sun gear, the internal gear, the upper polishing plate and the lower polishing plate so as to make the rotation torque thereof equal to the minimum rotation torque or running rotation torque, the running rotation torque being greater by a prescribed value than the minimum rotation torque.

Abstract: To provide a technique for rotating a plurality of carriers 500 between an upper and a lower rotary surface plates to simultaneously polish both surfaces of a plurality of works 400. The work 400 is merged with the carrier 500 outside a polishing apparatus main body 110. The work 400 is supplied onto a lower rotary surface plate 111 of the polishing apparatus main body 110 while remaining merged with the carrier 500. The present invention enables the work 400 on the lower rotary surface plate 111 to be perfectly automatically supplied. After double side polishing has been completed and when an upper rotary surface plate, a liquid such as a water is injected from the upper rotary surface plate to hold the plurality of works 400 to have both surfaces thereof polished, on the lower rotary surface plate 111. The present invention enables the works 400 to be automatically ejected from the lower rotary surface plate 111.

Abstract: A spherical body polishing apparatus capable of reducing polishing costs includes a rotating disk having a rotating disk polishing surface and a fixed disk having a fixed disk polishing surface opposed to the rotating disk polishing surface. The rotating disk polishing surface is capable of relative rotation while keeping being opposed to the fixed disk polishing surface. The rotating disk polishing surface has a groove portion formed therein and extending circumferentially along the rotation. The rotating disk having the groove portion therein includes an abrasive grain layer having a higher hardness than that of a material ball which is a spherical body and a holding layer formed on the abrasive grain layer and having a lower hardness than that of the abrasive grain layer. The groove portion is formed to penetrate the holding layer in a depth direction and to reach the abrasive grain layer.

Abstract: A carrier for a double-side polishing apparatus, including at least: a carrier base placed between upper and lower turn tables, the carrier base having a holding hole therein, the holding hole holds the wafer sandwiched between the upper and lower turn tables. A ring-shaped resin ring disposed along an inner circumference of the holding hole, the resin ring protecting a chamfered portion by making contact with the chamfered portion of the held wafer, wherein the resin ring has a concave groove on an inner circumference thereof, upper and lower tapered surfaces are formed in the concave groove. A double-side polishing apparatus using the carrier and a double-side polishing method that can reduce the generation of taper in a polished surface and improve the flatness while suppressing the generation of an outer peripheral sag of the wafer.

Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.

Abstract: The invention relates to a process for producing a semiconductor wafer by double-side grinding of the semiconductor wafer, in which the semiconductor wafer is simultaneously ground on both sides, first by rough-grinding and then by finish-grinding, using a grinding tool. The semiconductor wafer, between the rough-grinding and the finish-grinding, remains positioned in the grinding machine, and the grinding tool continues to apply a substantially constant load during the transition from rough-grinding to finish-grinding. The invention also relates to an apparatus for carrying out the process and to a semiconductor wafer having a local flatness value on a front surface of less than 16 nm in a measurement window of 2 mm×2 mm area and of less than 40 nm in a measurement window of 10 mm×10 mm area.

Abstract: A knife sharpener comprises a base, a motor, a grinding wheel assembly, a rotary shaft and a spring. The working channel between the edge of the grinding disc and the grinding awl is automatically adjustable to accommodate different blade of different thickness. When the knife sharpener performs grinding operation, the grinding wheel assembly can simultaneously grind both cutting sides of the knife. In addition, the knife can be clamped firmly through the three contacting points of the grinding disc, the grinding awl, and the cutting edge, so that the operation of knife grinding can be successfully performed.