Abstract: A polishing machine includes a platform assembly slidably mounted on three support columns. The platform assembly includes first and second platforms captively joined together so as to be slidably movable toward and away from each other. A lift plate is supported above the uppermost platform by a coil spring and an upper polish plate is suspended from the lift plate by a supporting element which passes through the platform assembly. Drive shafts are suspended from an overlying superstructure and engage the upper platform so as to selectively raise and lower the platform assembly and the upper polish plate. The spring allows adjustment of the pressure applied by the upper polish plate.

Abstract: In a lapping apparatus including upper and lower lapping turn tables, and disc-shaped workpiece holding fittings which are held rotatably between the upper and lower lapping turn tables and defines a plurality of receiving holes in which flat workpieces are located in the receiving holes, respectively, and the flat workpieces are lapped while the workpieces are moved together with the workpiece holding fittings relative to the upper and lower lapping turn tables, the thickness of the workpiece holding fittings is set to be thinner than a finished thickness of the workpieces with a difference between the thickness of the workpiece holding fittings and the finished thickness of the workpieces being 70 .mu.m or more.

Abstract: The present invention provides a double-side grinder capable of grinding double-sides of an aluminum disk highly efficiently and affording a ground aluminum disk free of end-face flaw and superior in both surface accuracy and dimensional accuracy while obviating the occurrence of grinding marks extending in different directions. A rough grinding mechanism having rough grinding wheels disposed opposedly to each other is mounted, a finish grinding mechanism having finish grinding wheels disposed opposedly to each other is mounted just after the rough grinding mechanism, and a belt-like carrier having a large number of pockets formed longitudinally of the carrier with aluminum disks engaged therein is passed between the rough grinding wheels and the finish grinding wheels, thereby allowing double-sides of each aluminum disk to be subjected to rough grinding and finish grinding in a continuous manner.

Abstract: A method for polishing a semiconductor wafer is provided. A semiconductor wafer is detached from a polishing pad on a side of an upper polishing plate and is kept to be supported by a lower polishing plate. A contact area between the a wafer and the upper polishing plate is set to be less than a contact area between the wafer and the lower polishing plate. As a result, the wafer is definitely detached from the polishing pad on the side of the upper polishing plate and is to be kept supported by the lower polishing plate when the upper polishing plate is lifted.

Abstract: A polishing machine comprising a frame, an upper and a lower working wheel each having opposing working surfaces, at least one of the working wheels being rotatably supported by the frame and driven by driving means, with a plurality of runner wheels being located between the working surfaces of the upper and the lower working wheel, the runner wheels having aperatures for the accommodation of work pieces and a toothing at the circumference thereof, an outer and an inner circular row of equally spaced pins, the pins being retained by a respective pin ring, the toothing of the runner wheels engaging the outer and the inner row of pins for the forward and rotating movement of the runner wheels if at least one of the row of pins is rotated, second driving means for the rotating row of pins, a source for the supply of working fluid and/or rinsing fluid between the working surfaces, interception means on the outer and the inner side of the working wheels, with the outer of the interception means being formed by a

Abstract: In a polishing machine for polishing parts between a table and an upper polishing head, the upper polishing head includes push rods to clear the workpieces after a polishing operation. A push ring engages the push rods as a polishing head is being raised, holding the workpieces in position on the table.

Abstract: In a device for microfinishing both sides of disklike workpieces with plane and/or spherical surface, two tool spindles with two tools are provided on two orbit spindles; the two tools engage the two face-end surfaces of the workpiece. The tool spindles revolve, spaced apart by a certain distance, around the axes of the two orbit spindles. In this way, excellent micrographs and excellent grinding results are attained.

Abstract: The invention provides a novel cutting tool used in wood working, which has a sufficiently thick cutting edge allowing stable cutting of a veneer from a log as well as an apparatus for and a method of grinding the cutting edge to have a favorable shape and a relatively large angle. The apparatus of the invention includes a table which an elongated cutting tool extending along a longitudinal axis of the table is mounted on, a fixing element for pressing the cutting tool upright against an upright plate, and a carriage which is reciprocatingly movable along the longitudinal axis of the table. The carriage is provided with a pair of grinding wheels which are respectively movable into and out of endwise grinding contact with an upper surface and a lower surface of the cutting edge of the upright cutting tool at desirable angles.

Abstract: A spherical member polishing apparatus has a fixed disk which is disposed in opposition to a rotating disk with a predetermined clearance. The rotating disk is rotated, and spherical members are clamped and pressurized between the rotating disk and the fixed disk for roll-polishing the spherical members. A plurality of grooves are formed along a circumferential direction of the fixed disk, and a plurality of working-fluid supply ports are randomly formed along the circumferential direction between the grooves, between the groove and an outer peripheral portion of the fixed disk, and between the groove and an inner peripheral portion of the fixed disk. The working fluid is supplied through the working-fluid supply ports to the fixed disk. A large number of spherical members are polished at a high precision, while a variation in polishing precision and the like are avoided as much as possible.

Abstract: An apparatus for enhancing the face of a masonry building block including a frame for supporting a conveyer belt, three cutting tools, rollers for constraining the building block and a water system for spraying the cutting tools and the building block. The cutting tools each have a rotatable horizontally disposed disk containing a plurality of synthetic diamond cutting segments. The disk is mounted to a vertically disposed shaft which in turn is mounted within a housing. There are threads on the outside of the housing which mate with a horizontal plate to allow the disk to be vertically positioned relative to the block. A locking nut is placed around the housing.

Abstract: A blade sharpening device (8) easily connectable to a source of rotating power, such as a battery powered hand drill (66), and having a guard member (14), a selectably locatable handle member (16/16') attached to the guard member, and hand-manipulatable means for maintaining the grinding surfaces of the sharpening device at a desired grinding angle and moving it along the length of the blade edge. The guard extends completely over the width of the rotatable sharpening members (10 & 58) and over about eighty (80.degree.) degrees or approximately a quadrant (ninety degrees) of their sides and provides an upper, curved surface (18) or a side, flat surface (19), depending on which handle location (30/28) is used, against which the user's hand can be rested for greater control and stability of the sharpener when in use on, for example, a lawn mower blade (62) which is still attached to the lawn mower drive shaft (63) at the underside of the lawn mower housing (64).