Abstract: An improved method for lapping the opposed major surfaces of a wafer is provided. In this regard, a multi-step lapping process is provided in which lapping continues while transitioning from a first slurry having larger abrasive particles to a second slurry having smaller abrasive particles so as to reduce the overall length of the lapping process. In addition, the multi-step lapping process is optimized so as to remove no more than about 90 microns in total thickness from the opposed major surfaces of the wafer. By completing the lapping with slurry having smaller abrasive particles, subsequent etching of the wafers produces shallower surface pitting. As such, the wafers generally require less polishing than required by conventional processes.

Abstract: A double side grinding apparatus comprises a pair of grinding wheels (4), work rotating device (1) and moving device (2).

Abstract: A refining apparatus having magnetically responsive refining elements that can be smaller than the workpiece being refined are disclosed. The refining apparatus can supply a parallel refining motion to the refining element(s) through magnetic coupling forces. The refining apparatus can supply multiple different parallel refining motions to multiple different refining elements solely through magnetic coupling forces to improve refining quality and versatility. New refining methods, refining apparatus, and refining elements disclosed. Methods of refining using frictional refining, chemical refining, tribocbemical refining, and electrochemical refining and combinations thereof are disclosed. A refining chamber can be used. New methods of control are refining disclosed. The new magnetic refining methods, apparatus, and magnetically responsive refining elements can help improve yield and lower the cost of manufacture for refining of workpieces having extremely close tolerances such as semiconductor wafers.

Abstract: In a vertical type of double disc surface grinding machine, an object of this invention is to enable simple adjustment of a parallelism between a grinding surface of a lower grinding wheel and a work end face clamped by a clamping jig of a rotary table, even when a grinding wheel spindle axis is disordered. The vertical type of double disc surface grinding machine is equipped with a pair of grinding wheels 2 & 3 opposing each other in vertical direction and fixed to a pair of vertical grinding wheels 4 & 5 and a rotary table 15 holding a work W and supplying it to a grinding position A1 located between the grinding wheels 2 & 3, and provided on the rotary table 15 with a work clamping jig 17 including a rotary shaft 63 which clamps the work W at a specified position and makes it spin itself.

Abstract: The polishing machine is capable of evenly applying a pressing force from an upper polishing plate to work pieces accommodated in through-holes of carriers. The polishing machine comprises: a plurality of the carriers provided around a center of gravity of an upper polishing plate and sandwiched between the polishing plates. Circular motion of the carriers, without revolving, are performed independently. Centers of gravity of the work pieces, which are held by the carriers, are simultaneously moved close to a center of gravity of the upper polishing plate and simultaneously moved away therefrom, and moving distances of the centers of gravity of the work pieces are equal.

Abstract: A vertical type of double disc surface grinding machine of the present invention comprises a clamp device which can clamps and holds a work like a brake disc at a correct clamping position under a stable state even when a configuration of a work upper surface is complicated. This machine is equipped with a pair of upper and lower grinding wheels, a work holding jig which is self rotatable, and said clamp device. The clamp device is equipped with a clamp unit freely rotatable through a bearing onto a clamp rod of an elevator actuator. The clamp unit is equipped with a steel ball contacting with a central concave portion of a work upper surface.

Abstract: In a double side simultaneous grinding machine, in which a plate-like workpiece is held and ground simultaneously on both a front surface and a back surface using a pair of grinding stones provided oppositely at both sides of the workpiece, a relative position between at least one of the center of thickness of the plate-like workpiece and the center of the holding means for holding the workpiece, and the center between stone surfaces of the pair of grinding stones is controlled during grinding. In a double side simultaneous grinding method, the generation of warpage of the plate-like workpiece is suppressed and degradation of warpage is prevented. Thereby, the plate-like workpiece can be processed to have high flatness on both sides. Further, the plate-like workpiece can be ground while a degree of warpage is controlled so that the workpiece is processed to have a warpage of a desired degree.

Abstract: Method for abrading a work piece with a fixed load including a first abrading process in which pressure of a cylinder chamber of a cylinder unit suspending an upper abrasive plate is adjusted in order to apply first pressure to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate and a second abrading process in which the pressure of the cylinder chamber is readjusted in order to to apply second pressure which is higher than the first pressure to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate.

Abstract: An abrading machine and abrading method are provided which permit a workpiece to be abraded without damage even in the case of heavy stock removal. A work holding member for mechanical abrasion includes a first holding member with a hole for receiving a workpiece and which transmits external drive force to the workpiece, and a second holding member placed on the first holding member and also having a hole for receiving the workpiece. The second holding member is removed after a predetermined volume of stock is abraded away; the workpiece is then abraded to a target thickness while being held by the first holding member alone. Thicknesses t1 and t2 of the first and second holding members are given by T1>t1+t2 and (½)T2≦t1, where T1 and T2 represent the workpiece thickness before and after abrasion, respectively.

Abstract: An adjustable grinding machine for grinding a plurality of first articles, wherein each first article has two substantially opposite surfaces, and a plurality of second articles, wherein each second article has two substantially opposite surfaces. The adjustable grinding machine includes a structural support member, and a first grinder assembly supported from the structural support member, wherein the first grinder is adapted to grind the two surfaces of the first article simultaneously. The adjustable grinding machine further including a second grinder assembly supported from the structural support member, wherein the second grinder is adapted to grind the two surfaces of the second article simultaneously.

Abstract: This invention features a disc refacing system, comprising a rotatable platter for holding a disc thereon, a grinding pad assembly, and a polishing pad assembly. Each pad assembly can be rotated at high speed. Each pad assembly can be alternately engaged with the disc on the platter. The platter and a pad assembly can be alternately engaged and disengaged, to allow a disc to be loaded and unloaded from the platter. There is a source of grinding compound, which can be applied to the grinding pad assembly.

Abstract: A finishing apparatus having magnetically responsive finishing elements that can be smaller than the workpiece being finished are disclosed. The finishing apparatus supplies a parallel finishing motion to finishing elements solely through magnetic coupling forces. The finishing apparatus can supply multiple different parallel finishing motions to multiple different finishing elements solely through magnetic coupling forces to improve finishing quality and versatility. The new magnetic finishing methods, apparatus, and magnetically responsive finishing elements can help improve yield and lower the cost of manufacture for finishing of workpieces having extremely close tolerances such as semiconductor wafers.

Abstract: An abrading machine and abrading method are provided which permit a workpiece to be abraded without damage even in the case of heavy stock removal. A work holding member for mechanical abrasion includes a first holding member with a hole for receiving a workpiece and which transmits external drive force to the workpiece, and a second holding member placed on the first holding member and also having a hole for receiving the workpiece. The second holding member is removed after a predetermined volume of stock is abraded away; the workpiece is then abraded to a target thickness while being held by the first holding member alone. Thicknesses t1 and t2 of the first and second holding members are given by T1>t1+t2 and (½)T2≦t1, where T1 and T2 represent the workpiece thickness before and after abrasion, respectively.

Abstract: A process is for producing a semiconductor wafer with a front surface and a back surface, in which the semiconductor wafer is subjected to two-sided polishing. The process includes the following: (a) producing a hydrophobic surface on the semiconductor wafer by treating the semiconductor wafer with an aqueous HF solution; (b) simultaneous polishing of the front surface and the back surface of the semiconductor wafer with a surface which has been rendered hydrophobic, with an alkaline polishing abrasive being continuously supplied between two rotating upper and lower polishing plates, which are both covered with a polishing cloth, the pH of the polishing abrasive being from pH 8.5 to pH 12.5; (c) after an intended polishing abrasion has been reached, supplying a stopping agent to the semiconductor wafer; and (d) removing the semiconductor wafer from the polishing plates.

Abstract: A conditioning disk including a unitary thermoplastic polymer sheet material cut a unitary circular plate formed with gear teeth along its circular edge, and formed with block form protrusions that are impelled in a sweeping motion by rotation of the unitary plate as a planetary gear in meshed engagement with a sun gear and a ring gear of a polishing apparatus.

Abstract: The abrasive system of the present invention is capable of automatically and efficiently feeding and discharging work pieces. In the abrasive system, an upper abrasive plate and a lower abrasive plate pinch the work pieces, which are provided in through-holes of a carrier and abrade both faces of each work piece. A carrier driving mechanism moves the carrier, along a circular orbit, without spinning, together with the work pieces. Stopping means stops the movement of the carrier at a predetermined position. The feeding-and-discharging means includes: an arm robot having a work holding unit, which is provided to a front end and capable of holding and releasing the work piece; and an image processing unit for recognizing shapes and positions of the through-holes of the carrier and the work pieces.

Abstract: A method and apparatus for cleaning a surface of a microelectronic substrate. In one embodiment, the apparatus can include a support member having a manifold in fluid communication with a source of liquid and in fluid communication with at least one exit aperture. A porous brush member can be coupled to the support member such that a contact portion of the brush is positioned against the exit aperture to receive liquid directly from the exit aperture. The liquid can flow from the exit aperture through the contact member and to the surface of the microelectronic substrate to keep the contact portion moist. The contact portion can be moistened as it cleans the microelectronic substrate or between cleaning cycles. The liquid can also be supplied to the contact portion at a rate sufficient to remove particulates and other contaminants from a porous outer surface of the contact portion.

Abstract: A tool for use in an abrading or resurfacing machine includes a head portion, a shank portion and a base portion, the shank portion joining the head and base portions and having a shape that tapers outwardly from a narrow neck where it joins the head portion to the base portion. The tool is inserted into a pocket in an abrading wheel having the same shape as the tool. Because of the irregular shape, centrifugal force will not cause the tool to become dislodged. The tapered neck serves to distribute torsional forces imparted by an adjustment screw which alleviates metal fatigue.

Abstract: Grinding wheels are fabricated with outwardly extending circular peripheral rims having a continuous rim surface to which separate abrasive pieces, preferably of a superabrasive such as CBN, are secured by suitable adhesive. The superabrasive pieces are preferably circular and of a diameter corresponding to the width of the rim and are secured to the rim surface so as to either be adjacent and touch one another or to be spaced one from the other around the circle of the rim surface so that a predetermined amount but not all of the rim surface is covered with abrasive pieces. That rim surface coverage optimize grinding efficiency while providing space for fluid flow for purposes of cooling and carrying away particles from the grinding process.

Abstract: A double-disk polishing machine, particularly for tooling semiconductor wafers, comprising a machine housing, an upper and a lower working disk, carrier disks for the lower and upper working disks either of which is connected to a vertical driving shaft which, in turn, are rotatably supported in the machine housing by means of roller bearings and are adapted to be driven by a motor via a gear mechanism wherein cooling channels to which a coolant is fed are formed in each carrier disk, characterized in that each of the carrier disks is mounted with the aid of fastening means on a circumferential ring of a wheel-shaped basic carrier which, in turn, is connected to the driving shaft, the radius on which said fastening means lie which connect said basic carrier to said carrier disk is approximately on half the width of the ring-shaped working disk and said basic carrier for the upper working disk is connected to the shaft or to carrier disk in such a way that the inclination of the upper working disk automaticall

Abstract: The abrasive machine of the present invention is capable of smoothly adjust the pressing force of an upper plate. The abrasive machine includes a plate supporting mechanism, which supports the upper polishing plate and is capable of adjusting a pressing force. The plate supporting mechanism comprises: a base frame; a cylinder unit being provided to an upper part of the base frame,; a rotary plate being rotatably attached to a lower end of a piston rod of the cylinder unit; a plurality of connecting rods being pierced through the rotary plate, lower ends of the connecting rods being connected to the upper plate so as to rotate the upper plate together with the rotary plate; and a plurality of elastic members being provided between the stopper sections of the connecting rods and the rotary plate, whereby the pressing force of the upper plate is adjusted by adjusting a lifting force of the cylinder unit, which suspends the upper plate.

Abstract: The abrasive machine of the present invention is capable of smoothly adjust the pressing force of an upper plate. The abrasive machine includes a plate supporting mechanism, which supports the upper polishing plate and is capable of adjusting a pressing force. The plate supporting mechanism comprises: a base frame; a cylinder unit being provided to an upper part of the base frame, ; a rotary plate being rotatably attached to a lower end of a piston rod of the cylinder unit; a plurality of connecting rods being pierced through the rotary plate, lower ends of the connecting rods being connected to the upper plate so as to rotate the upper plate together with the rotary plate; and a plurality of elastic members being provided between the stopper sections of the connecting rods and the rotary plate, whereby the pressing force of the upper plate is adjusted by adjusting a lifting force of the cylinder unit, which suspends the upper plate.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.

Abstract: A sharpening tool for a veneer knife has a primary stone and a secondary stone driven by a power head. The secondary stone is inclined at an angle to the primary stone corresponding to the angle of the defined faces of the veneer knife cutting edge. Outrigger supports are provided as gauge and guide members for the sharpening tool. The primary stone engages one face of the cutting edge and the secondary stone engages the other face of the cutting edge. The secondary stone is forcibly engaged with the primary stone and is rotatably driven by the primary stone.

Abstract: A system for enhancing the surfaces of building blocks by cutting or grinding away material from the surface to be enhanced. A building block is placed on a conveyer belt which moves the block passed three rotating cutting apparatus each of which is independently powered. Each of the cutting apparatus is independently adjustable in the vertical direction and all three cutting apparatus may be adjusted simultaneously. The system may also be pivoted to allow an enhanced beveled surface to be formed on the building blocks. Also included is a water system for cooling the cutting apparatus and the building block, and an oil system for lubricating the cutting apparatus.

Abstract: A metal bond grinding wheel 12 having a horizontal working surface 12a, a holding and rotating means 14 for a workpiece having a horizontal supporting surface 14a opposite to said working surface 12a, a voltage applying means 16 having the metal bond grinding wheels and an electrode 16a installed oppositely to the working surfaces in an uncontacted state and applying a pulsed voltage between them, a grinding fluid feeding means 18 for feeding an electroconductive grinding fluid to the working surfaces are installed.

Abstract: Grinding wheels are fabricated with outwardly extending circular peripheral rims having a continuous rim surface to which separate abrasive pieces, preferably of a super abrasive such as CBN, are secured by suitable adhesive. The superabrasive pieces are preferably circular and of a diameter corresponding to the width of the rim and are secured to the rim surface so as to either be adjacent and touch one another or to be spaced one from the other around the circle of the rim surface so that a predetermined amount but not all of the rim surface is covered with abrasive pieces. That rim surface coverage optimize grinding efficiency while providing space for fluid flow for purposes of cooling and carrying away particles from the grinding process.

Abstract: A lapping assembly for lapping a group of workpieces including a pair of lapping discs and a cassette for positioning the workpieces between the lapping discs. The lapping discs are provided with two-component translational oscillations at the appropriate cutting speed, parallel to their working planes. This motion is effected using crank pins rotating about a coaxially positioned axis and elastic members (or swivel-supporting) members coupled to the body of the lapping machine to prevent the lapping discs from rotating. The cassette has an opening having a curvilinear shape for holding the workpieces, and protrusions which extend into the opening. The cassette is mounted on a support element and equipped with a drive to rotate it about a stationary axis. Alternatively, the cassette can be fixed during treatment and the lapping discs can be rotated at a speed less than the cutting speed.

Abstract: A planetry-gear-type parallel-surface processing machine of the present invention improves the ability of an upper surface plate to follow matrials to be processed. A rotation preventing pin projects from the upper surface of the upper surface plate at a position near the outer periphery thereof, the rotation of the upper surface plate is prevented by abutting a stopper supported by a bracket disposed on a machine main body against a side of the rotation preventing pin, plural pulleys are disposed in a ring mounted to the upper surface plate and suspension plate, and an endless wire cable is stretched between the pulleys so as to support the vertical load of the upper surface plate.

Abstract: A dresser for a grinder having at least one rotatable platen and at least one grinding stone includes a frame and at least one abrasive block for contacting the grinding stone. The grinding stone is mounted to the platen which rotates about a vertical axis. The abrasive block extends across the grinding stone. The frame of the dresser is mounted proximate the platen and remains stationary while the grinding stone rotates. The abrasive block contacts the rotating grinding stone, thereby dressing the grinding stone.

Abstract: A pair of ring-shaped lapping plates 13, 23 are faced to both surfaces of a wafer 1. Each lapping plate 13, 23 has an outer diameter approximately equal to a radius of the wafer 1 and a lapping surface 14, 24 sliding in contact with the wafer 1. Each lapping plate 13, 23 is rotated along a direction reverse from the other, while an abrasion slurry A is fed into cavities 15, 25 of the lapping plates 13, 23 and discharged together with dusts separated from the wafer 1 through grooves engraved in the lapping surfaces 14, 24 and gaps between the wafer 1 and the lapping surfaces 14, 24. The lapping plate 23 is carried toward the stationary lapping plate 13 at a rate corresponding to abrasion of the lapping surfaces 14, 24. During lapping, the wafer 1 is rotated by drive rollers 31 and supported by guide rollers 32. In this way, both surfaces of the wafer 1 are simultaneously lapped.

Abstract: A double face abrading machine for simultaneous removal of material from two plane-parallel surfaces of a work piece, and incorporating a first and a second tool (1, 2) forming between them a machining gap (3), the first tool (1) being attached to a first shaft (5) and the second tool (2) being attached to a second shaft (7), means (11) for rotating at least one of said first and second shafts (5, 7) and displacement means (13, 14) for individual axial displacement of said first and second shafts (5, 7) for varying the axial size and/or position of the machining gap (3), and means provided for feeding work pieces into the machining gap, wherein the first shaft (5) is designed as a tubular shaft, supporting at one end the said first tool (1), which is designed with an opening (1a) having a diameter at least corresponding to the diameter of the tubular shaft (5), whereas the second shaft (7) is arranged to extend through the tubular first shaft (5) and through the opening (1a) in the first tool, and to project

Abstract: A ball grinding machine for grinding ceramic bearing balls and the method thereto employing a non-rotating upper circular plate and a rotating lower circular plate to perform precision grinding of ceramic balls. The grinding mechanism according to the present invention comprises two or more separate concentric fixed rings, adjacent annular recesses into the lower surface of the upper circular plate, and corresponding two or more concentric hydraulic pressure rings inserted into said recesses, each with a slanted bottom surface towards the adjacent fixed ring for supplying pressure to the ceramic bearing balls on top of the lower circular plate at a sloped angle. The inner surface of the fixed ring, the slanted bottom surface of the pressure ring, and the grinding surface of a diamond grinding wheel installed on top of the rotating lower circular plate together form a grinding track.

Abstract: A set of supports are advantageously disposed on a top plate having a polishing surface useful for polishing workpieces, thereby applying substantially uniform pressure to the top plate. In a preferred embodiment, the supports are non-isosceles triangular elements distributed evenly at 45 degree increments around a ring-shaped top plate. This structure effectively compensates for radial stress variations arising from non-optimum positioning of support points with respect to the inner and outer diameters of the polishing surface.

Abstract: A double side grinding apparatus and a double side polishing apparatus, with a narrow tolerance range, reduces pitching errors, and ensures a sufficient level of rigidity against the force of reaction to machining, while enhancing positioning accuracy. The double side grinding apparatus or a double side polishing apparatus includes a plurality of guideways for supporting and shifting main spindles, and these plural guideways on end define a geometric center matched with the center of gravity of the main spindles. The number of the guideways is preferably three in order not to obstruct the mounting and removal of a workpiece.

Abstract: A method of machining flat parts, includes the use of two permanent magnets which are located opposite to and spaced from one another so as to form a magnetic field with a magnetic flux extending perpendicular to the magnets, placing a flat part in the magnetic field between the magnets so that the magnetic flux extends through the flat part, supplying a magnetic-abrasive powder to the flat part in the magnetic field, and performing a relative movement between at least one of the magnets and the flat part so as to remove a material from a surface of the flat part.

Abstract: The present invention provides a work unloading means capable of unloading polished works safely and promptly from a processing section. This means uses an upper and a lower surface plates 5 and 6 to polish works 4 held by a plurality of carriers 3 that engage a sun gear 1 and an internal gear 2, allows the works 4 to be sucked by the bottom surface of the upper surface plate 5 to lift them together with the plate 5, and then intermittently rotates the lifted upper surface plate 5 by a specified angle increment to transfer the works 4 to an unloading position A, where the works are released from the upper surface plate 5 for unloading.

Abstract: In a polishing machine for simultaneous double-sided polishing of workpieces between upper and lower polish tables, the upper polish table has a hollow center telescopically receiving in a drive hub supported from below. The upper polish plate is suspended by a lifting rod from a double-ended main lifting cylinder having upper and lower ends secured to a frame extending from the lower polish table.

Abstract: A sphere grinding apparatus (1) for grinding spheres by two discs consisting of a rotational disc (5) and a stationary disc (6), the sphere grinding apparatus (1) incorporating: a central shaft (3) slidable in an axial direction; and a housing (4) for rotatively supporting the central shaft (3), wherein the rotational disc (5) is joined to the central shaft (3) and the stationary disc (6) is joined to the housing (4). Accordingly, it is possible to provide a sphere grinding apparatus which is capable of improving a machining accuracy and which has a simple structure and the cost of which can be reduced.

Abstract: An improved gear or pin cleaning assembly for polishing or grinding machines having a rotating plate is presented. One or more nozzle members are positioned within the rotating plate and a source of fluid, such as deionized water, is connected to the nozzle or nozzles to emit a pressurized stream of fluid which rinses off the gear assembly as the plate rotates. The rotating plate may contain a channel for delivering the fluid from the exterior or interior of the plate to the nozzle(s).

Abstract: A process for lapping a surface and providing a very smooth surface in short periods of time comprises:a) providing a work piece to be lapped, having at least one surface to be lapped,b) providing a rotating platen havingi) a back surface andii) a flat surface which can be adjusted to a position parallel to said at least one surface of said work piece,c) providing a sheet of abrasive material having an abrasive face and a back side, said back side being on said flat surface of said platen with the abrasive face of said sheet facing said at least one surface to be lapped,d) securing said sheet of abrasive material to said flat surface of said platen,e) rotating said platen at a rotational speed of at least 500 revolutions per minute, and a surface speed at an outside edge of said sheet of abrasive material of at least 1500 surface feet per minute, andf) contacting said abrasive face and said at least one surface of said workpiece to be lapped.

Abstract: The invention relates to a sheet feeding type wafer polishing machine which processes both surfaces of the wafer and outermost periphery of the wafer (edge part) in series, having two platens which are adhered to a polishing pad or a grinding stone and holding a wafer therebetween. The surface of the wafer is processed by rotating at least one of the two platens and wafer, wherein the diameters of the platens are bigger than the radius of the wafer and smaller than the diameter of the wafer, and the wafer is supported by at least three guide rollers which contact to the outermost periphery of the wafer. The present invention also provides an edge polishing and a surface polishing method which are carried out by the wafer processing machine.

Abstract: There is provided a polishing apparatus and a polishing method for use with the apparatus. The apparatus includes a lower turn table having a polishing surface on its upper surface, an upper turn table having a polishing surface on its lower surface, and in addition, an intermediate turn table having polishing surfaces on its upper and lower surfaces and interposed between the lower turn table and the upper turn table. The apparatus further includes a carrier rotating mechanism adaptable to rotate a disk-like carrier rotating on its axis while revolve the disk-like carrier around the rotational axis of the turn tables, and a table rotating mechanism for rotating the turn tables. The carriers can be prepared not only on the lower turn table but the intermediate turn table, and works can be loaded on the carriers prepared on the lower and intermediate turn tables. The works polished at a unit of machine operation is so many that productivity is improved.

Abstract: A polishing amount control system and method for same which can quickly feed back the results of measurement of a coating layer of a workpiece to the next polishing work so as to improve the productivity of the workpieces and further enable high precision polishing work. The thicknesses of the plating layers of the two surfaces of a magnetic disk W polished by a double-side polishing apparatus 1 are measured by an X-ray thickness meter 2. The rotational speeds of the drive motors 15 and 18 of the double-side polishing apparatus 1 are controlled in accordance with the results of the measurement. Specifically, the polishing amounts of the plating layers of the upper surface and lower surface of the magnetic disk W polished next become within 1.8 .mu.m to 2.2 .mu.m by controlling the rotational speeds of the upper platen 13 and the lower platen 11. The thickness difference of the upper and lower surfaces of the same magnetic disk W become within -0.15 .mu.m to +0.15 .mu.

Abstract: In a polishing machine for simultaneous double-sided polishing of workpieces between upper and lower polish tables, the upper polish table has a hollow center telescopically receiving in a drive hub supported from below. The drive hub is slotted and the upper polish plate has drive latches received in the slots. Lateral dislocations of the upper polish plate with respect to the drive hub are limited by providing stops on the drive latches which engage the outer surface of the drive hub. Additionally, the upper polish plate is suspended by a lifting rod from a double-ended main lifting cylinder.

Abstract: An ultrasonic vibration composite grinding tool is disclosed wherein a plurality of small-sized grinding wheels are arranged for carrying out grinding of a ground material while applying vibration to the ground material, to thereby ensure stable operation of the grinding tool to accomplish efficient grinding of the ground material even when the ground material is large-sized. A grinding structure and a vibration structure are arranged. The grinding structure includes a rotatable base having a rotation axis and a plurality of grinding wheels formed into the same configuration and each including a micro-cutting surface. The grinding wheels are arranged on one surface of the base in a manner to be spaced from each other at predetermined intervals in a circumferential direction of the base about the rotation axis of the base. The vibration structure functions to vibrate the grinding wheels.

Abstract: A plate stabilizing apparatus is provided which comprises a lateral support structure conflgured to adjust plate alignment which engages vertical rails secured to a polishing machine housing. thus effectively stabilizing the polishing plate while allowing vertical movement of the plate assembly. In a preferred embodiment, a plate stabilizing apparatus includes an alignment plate secured to a subcylinder close to and axially aligned with the polishing plate universal joint. Adjustment screws are provided for lateral adjustment of the polishing plate which is secured to a substantially rigid lateral support structure. The lateral support structure rides within vertical rails secured to the inner housing walls of the polishing apparatus thus allowing vertical movement of the polishing plate during operation.

Abstract: A pair of ring-shaped lapping plates 13, 23 are faced to both surfaces of a wafer 1. Each lapping plate 13, 23 has an outer diameter approximately equal to a radius of the wafer 1 and a lapping surface 14, 24 sliding in contact with the wafer 1. Each lapping plate 13, 23 is rotated along a direction reverse from the other, while an abrasion slurry A is fed into cavities 15, 25 of the lapping plates 13, 23 and discharged together with dusts separated from the wafer 1 through grooves engraved in the lapping surfaces 14, 24 and gaps between the wafer 1 and the lapping surfaces 14, 24. The lapping plate 23 is carried toward the stationary lapping plate 13 at a rate corresponding to abrasion of the lapping surfaces 14, 24. During lapping, the wafer 1 is rotated by drive rollers 31 and supported by guide rollers 32. In this way, both surfaces of the wafer 1 are simultaneously lapped.

Abstract: An improved process for lapping a surface according to the present invention comprises:a) providing a work piece with two surfaces to be lapped,b) providing two rotatable platens, each having i) a back surface and ii) a front surface,c) providing a sheet of abrasive material having an abrasive face and a back side, the back side being on the front surface of each of the two rotatable platens with the abrasive faces of each sheet facing the other sheet,d) placing the work piece with two surfaces to be lapped between the two rotatable platens, so that each abrasive face faces only one of the two surfaces to be lapped,e) rotating the two platens at a rotational speed of at least 500 revolutions per minute,f) contacting each of the abrasive faces with the only one of the two surfaces to be lapped, andg) lapping said two surfaces of said work piece simultaneously.

Abstract: An apparatus for polishing one or more planar substrates, such as magnetic disks, between rotating polishing plates is described. The apparatus is designed to optimize uniformity and flatness of the substrates by maintaining a substantially constant parallel and coaxial alignment between the rotating polishing plates.