Abstract: A marine vehicle component wherein the component is a partition or a light cover, and wherein the marine vehicle component is molded or formed from a thermoplastic polymer composition comprising a siloxane-containing copolymer in an amount effective to provide a total of 0.2 to 6.5 wt % of siloxane units based on the total weight of the polymers in the thermoplastic polymer composition, a bromine-containing polymer in an amount effective to provide 9 to 13 wt % of bromine, based on the total weight of the polymers in the thermoplastic polymer composition, and optionally a third polymer, wherein the wt % of the siloxane-containing copolymer, the bromine-containing polymer, and the optional third polymer, sum to 100 wt %, and 0.05 to 10 wt % of a light diffuser additive, based on the total weight of polymers in the thermoplastic polymer composition.

Abstract: The invention relates to an antireflective coating composition comprising a crosslinker and a crosslinkable polymer capable of being crosslinked by the crosslinker, where the crosslinkable polymer comprises a unit represented by structure (1): [-A-B-C-]??(1) where A is a fused aromatic ring, B has a structure (2), and C is a hydroxybiphenyl of structure (3) where R1 is C1-C4alkyl and R2 is C1-C4alkyl. The invention further relates to a process for forming an image using the composition.

Abstract: The invention relates to: a polycarbonate resin composition which is a polycarbonate resin composition (X) including a polycarbonate resin (A) and an aromatic polycarbonate resin (B), the polycarbonate resin (A) containing structural units (a) derived from a dihydroxy compound having the portion represented by the following general formula (1) as part of the structure thereof and further containing a dihydroxy compound (b) of an alicyclic hydrocarbon, and in which the content of the dihydroxy compound (b) of an alicyclic hydrocarbon in the polycarbonate resin (A) is 35 mol % or higher; and a molded article obtained from the composition. [Chem. 1] ?CH2—O???(1) (The case where the portion represented by the general formula (1) is part of —CH2—O—H is excluded.

Abstract: The invention relates to: a polycarbonate resin composition which is a polycarbonate resin composition (X) including a polycarbonate resin (A) that contains structural units (a) derived from a dihydroxy compound having the portion represented by the following general formula (1) as part of the structure thereof and an aromatic polycarbonate resin (B), and in which the content of the aromatic polycarbonate resin (B) is 30% by weight or higher based on the polycarbonate resin composition (X); and a molded article obtained from the composition. [Chem. 1] ?CH2—O???(1) (The case where the portion represented by the general formula (1) is part of —CH2—O—H is excluded.

Abstract: An ink set includes a first ink that contains a white material and a first resin; and a second ink that contains a color material other than the white material and a second resin, wherein the first resin includes a component (A) causing cracks when resin of 0.5 g is dropped onto a slide glass and is dried at a temperature of 50° C. and a humidity of 0% RH for 10 minutes, and wherein the second resin includes a component (B) of at least one of polyolefin wax and ethylene vinyl acetate resin.

Abstract: The invention is to provide a polycarbonate resin composition having excellent weatherability, transparency, hue, heat resistance, thermal stability, moldability, and mechanical strength and a molded article obtained therefrom. The invention relates to: a polycarbonate resin composition which includes a polycarbonate resin (A) containing constituent units derived from a dihydroxy compound (a) having the portion represented by a general formula (1) as part of the structure thereof and constituent units derived from a dihydroxy compound (b) of an alicyclic hydrocarbon having up to 11 carbon atoms and an aromatic polycarbonate resin (B) represented by a general formula (2); and a molded article obtained from the composition. The above general formulae (1) and (2) are described in the specification of the present application.

Abstract: The invention relates to an underlayer coating composition comprising a polymer, where the polymer comprises at least one hydroxyaromatic unit in the backbone of the polymer phenol which has a pendant group comprising a fluoro or iodo moiety, and at least one unit comprising an aminoplast. The invention further relates to a process for forming an image using the composition, especially for EUV.

Abstract: One or more embodiments contained herein disclose an adhesive layer for printed circuit board (PCB) applications. The improved adhesive film layer may comprise a benzoxazine resin and a phenoxy resin. According to some embodiments, the improved adhesive film layer may be coated onto a polyester release sheet.

Abstract: A non-stick coating composition comprising a waterborne phenoxy resin, a crosslinker, a silicone compound, and a Fluoropolymer. An article, such as aluminum, may be coated with the composition. The composition may be multi-layers, but only the layers other than the first layer includes the silicone compound. The invention includes the method for applying the coating or coatings.

Abstract: Compositions (including coatings) for food or beverage containers and medical devices, comprising a hydrogenated bisphenol-A-based polymer. Food or beverage containers and medical devices coated with hydrogenated bisphenol-A-based polymers. Food or beverage containers and medical devices made from hydrogenated bisphenol-A-based polymers.

Abstract: Phenolic resin binder systems for sand molds, used in metal casting, which improve the quality of thermally reclaimed sand, are described. The substantial or complete elimination of calcium compounds (e.g., calcium stearate and calcium hydroxide, conventionally employed as a mold lubricant and a resin curing catalyst, respectively) allows the thermally reclaimed sand to be reused over multiple thermal reclamation cycles without the adverse effects previously encountered.

Abstract: Ink composition for continuous deflected jet printing, that is liquid at ambient temperature, comprising a solvent containing less than 0.5% by weight of water and less than 0.5% by weight of alcohols relative to the total weight of the ink composition; one or more dye(s) and/or pigment(s) that is (are) insoluble in water, and in mixtures of water and of at least one alcohol; and a binder, comprising at least 50% by weight, relative to the total weight of the binder, of at least one binder resin capable of being obtained by reaction between at least one alkoxysilane and at least one hydroxyaromatic resin.

Abstract: An adhesive composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler, (E) particles of a thermoplastic resin which is solid at 25° C., and (F) silicone powder having a particle size at cumulative 50% (d50), measured by a laser light diffraction method, of from 1 to 50 ?m. The composition is particularly suitable to be applied by screen printing on a substrate or a silicon wafer.

Abstract: The present invention relates to the use of an adhesive compound, in particular a pressure-sensitive adhesive compound, based on silylated polyurethanes for bonding optical components, in particular optical films, wherein the adhesive compound has a transmission according to ASTM D 1003 of greater than 86% and a haze according to ASTM D 1003 of less than 5%.

Abstract: Fibers sized with a coating of amorphous polyetherketoneketone are useful in the preparation of reinforced polymers having improved properties, wherein the amorphous polyetherketoneketone can improve the compatibility of the fibers with the polymeric matrix.

Abstract: The present invention relates to thermoplastic molding compositions composed of the following components: (A) at least one polyarylene ether (A1) having an average of at most 0.1 phenolic end groups per polymer chain, and at least one polyarylene ether (A2) having an average of at least 1.5 phenolic end groups per polymer chain, (B) at least one fibrous or particulate filler, and (C) optionally further additives and/or processing aids. The present invention further relates to a process for producing the thermoplastic molding compositions of the invention, the use of these for producing moldings, fibers, foams, or films, and to the resultant moldings, fibers, foams, and films.

Abstract: Curative fibre components comprise one or more fibres for filaments of curative suitable to cure curable resins such as thermoset resin. In curative fibre components comprising a plurality of fibres of curative, the fibres can be commingled, such as twisting, to form a thread or yarn. Curative fibre components can be used to form a material in the form of a sheet, fabric, layer, textile or mat of woven or non-woven curative fibres. Curative fibre components can be used to produce composite materials such as fibre reinforced resinous composite materials. The curative fibre components can be commingled, including interwoven, stitched and layered with other fibres or fibrous materials, such as fibrous reinforcement, fibrous curable resin, fibrous thermoplastic, other non-reinforcing fibres to form composite materials, prepregs, preforms and articles.

Abstract: This invention relates to a low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); or the mixture of (B) and (C), and (D) Flame retardant agent, curing agent and accelerating agent solutions. Because all of component (A) DCPD-PN, component (B) DCPD-PNE and component (C) DCPD-BX in this resin varnish composition contain a saturated multi-cyclic structure of dicyclopentadiene, the resin varnish shows lower dipole, dielectric constant (Dk), dissipation factor (Df) and moisture absorption; and via adding a brominated or phosphorus flame retardant, the composition exhibits high thermal stability characteristic.

Abstract: The present invention relates to a resin composition for electronic component encapsulation including: A: a cyanate ester resin; B: at least one selected from the group consisting of a phenol resin, a melamine compound and an epoxy resin; and C: an inorganic filler.

Abstract: The present invention relates to thermoplastic molding compositions comprising the following components: (A) at least one polyarylene ether (A1) having an average of at most 0.1 phenolic end group per polymer chain and at least one polyarylene ether (A2) having an average of at least 1.5 phenolic end groups per polymer chain, (B) at least one polyarylene sulfide, (C) at least one functionalized polyarylene ether comprising carboxy groups, (D) at least one fibrous or particulate filler, and (E) optionally further additives and/or processing aids. The present invention further relates to a process for producing the thermoplastic molding compositions of the invention, to the use of these for producing moldings, fibers, foams, or films, and to the resultant moldings, fibers, foams, and films.

Abstract: A curable resin which exhibits excellent heat resistance while including an extremely smaller amount of volatile component is disclosed, and an electronic component device having excellent reliability in heat resistance and the like which contains the above curable resin is provided. A curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with a phenol compound (b), comprising a remaining volatile component in an amount of 10 wt % or less with respect to the total weight of the curable resin is used as a curing agent.

Abstract: The present invention relates to branched polyarylene ethers (A) comprising branching sites of the formula (I): The present invention further relates to a process for preparing the branched polyarylene ethers (A) and to thermoplastic molding materials comprising the branched polyarylene ethers (A) and further thermoplastic polymers (B). The present invention finally relates to the use of the thermoplastic molding materials for producing moldings, and to moldings obtainable from the aforementioned thermoplastic molding materials.

Abstract: A method for preparation of a colored ink that includes: preparing a white formulation that comprises sub-micron inorganic pigment; preparing a colored formulation that comprises sub-micron organic pigment; and mixing and grinding the white ink formulation and the colored ink formulation to provide a colored ink formulation suitable for jet ink applications. A colored ink that includes white sub-micron inorganic pigment and colored sub-micron organic pigment; wherein the colored ink is characterized by a high (color) hiding power and color density, and can meet the requirements of the PCB industry.

Abstract: A composition, having an improved resistance to yellowing under heat aging, comprising at least 20 weight % of at least one polycondensation polymer having a heat deflection temperature of above 80° C. under a load of 1.82 MPa when measured according to ASTM D648, from 0 to 5 weight % of at least one polymer having a heat deflection temperature of at most 80° C. under a load of 1.82 MPa when measured according to ASTM D648, a white pigment; and a black pigment provides resistance to heat aging induced yellowing. The polycondensation polymers are advantageously selected from the group consisting of polyarylethersulfones, at least partially aromatic polyamides, polyamideimides, liquid crystalline polymers, polyimides, polyetherimides, polyaryletherketones, and polyphenylene sulfides. The polymer composition can be molded to form a variety of articles, including LED components, such as reflectors, reflector cups, and scramblers.

Abstract: Compounds VB of the formula (I) or (II), said compounds being particularly suitable as curing agents for epoxide resins. The compounds can be produced easily and rapidly. They can be used in the form of aqueous curing agents and form stabile aqueous emulsions in particular. This facilitates the formulation of ECC compounds for use primarily as coatings.

Abstract: A radical-polymerizable acrylic insulating adhesive for NCF-bonding an electronic part to a circuit board includes a (meth)acrylate monomer, a film-forming resin, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. The amount of the inorganic filler is 70 to 160 parts by mass with respect to a total of 100 parts by mass of the (meth)acrylate monomer and the film-forming resin. A radical polymerization cured product of the acrylic insulating adhesive exhibits a glass transition temperature of 150 to 185° C., a linear expansion coefficient (?1) of 30 to 35 ppm in a temperature range that is lower than the glass transition temperature, and a linear expansion coefficient (?2) of 105 to 125 ppm in a temperature range that is equal to or higher than the glass transition temperature. Further, ?2/?1 is greater than or equal to 3.4.

Abstract: The present invention relates to a composition containing polycarbonate and 0.01 wt. % to less than 0.30 wt. % of polyol, polyether polyol, or combinations thereof.

Abstract: A hard disk drive inner part formed of a resin which exhibits well-balanced low outgassing properties, ultrasonic cleaning resistance, low ionic contamination properties, low particulate contamination properties, repeated removability, heat resistance, specific gravity, and water-absorbing properties. The hard disk drive inner part includes a resin composition which includes a polyphenylene ether resin (A).

Abstract: A polyaryletherketone polymeric material, for example polyetheretherketone and composite materials comprising said polymeric material are described. The polymeric material has a melt viscosity (MV) in the range 0.05 to 0.12 kNsm?2 preferably in the range 0.085 to 0.095 kNsm?2.

Abstract: The present invention relates to novel polycarbonate-polyorganosiloxane and/or polyurethane-polyorganosiloxane compounds, methods for their production, their use, functional formulations containing them, precursors for their production, as well as reactive compositions containing the aforementioned precursors.

Abstract: A silicone coating composition is provided comprising (A) a hydrolytic condensate obtained by (co)hydrolytic condensation of an alkoxysilane, (B) colloidal silica, (C) a urethane-modified vinyl polymer, (D) a curing catalyst, and (E) a solvent, the solid content of component (C) being 1 to 30% by weight based on the total solid content of components (A) and (B). The silicone coating composition can be coated and cured to an organic resin substrate without a need for primer, and the cured coating is abrasion resistant and transparent to visible light.

Abstract: The invention relates to a method of making a coating composition for coating glass. The method includes the steps of combining an epoxy resin component, a methacrylate component, a silane coupling agent, an epoxy curing agent, and an initiator agent.

Abstract: The present invention discloses a thermosetting resin for expediting a thermosetting process. The thermosetting resin is composed of 100 parts of primary resin formed by mixing a brominized epoxy resin, a tetrafunctional epoxy resin and an epoxy resin with a high bromine content, and other materials including 35 parts of phenolic resin curing agent, 30 parts of tetrabromobisphenol A curing agent, 0.1 part of 2-ethyl-4-methylimidazole, 0.8 part Lewis acid, and 50˜70 parts of solvent, calculated based on every 100 parts of the primary resin by weight. The invention can expedite a thermosetting process and enhance the Tg of prepregs and clad laminates.

Abstract: The present invention provides an insulating sheet which is used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer. The handleability of the insulating sheet is excellent when it is uncured, and a cured product of the insulating sheet has higher adhesion, heat resistance, dielectric breakdown characteristics, and thermal conductivity.

Abstract: A composition for controlling a temperature elevation of an electronic component when soldering the electronic component on a substrate, includes a first resin for providing the composition with adhesion to the electronic component, a curing agent for curing the first resin by heat treatment for soldering, and a second resin for facilitating removal of the composition from the electronic component.

Abstract: The invention relates to a composition comprising at least one (poly)isocyanate and at least one surfactant comprising an amino acid and a mixture of compounds of formulae (I) and (II) wherein i and j independently represent 0 or 1; and R1 et R2 are identical or different and independently represent a hydrocarbonated chain. Said mixture of compounds of formulae (I) and (II) is characterised in that the molar ratio between compound (II) and compound (I) is higher than 1.

Abstract: The present invention discloses a thermosetting resin composition including: a bi-functional or multi-functional epoxy resin, a SMA uses as a curing agent, an allyl phenol such as diallyl bisphenol A used as a co-curing agent and a toughening agent a low-bromine or high-bromine BPA epoxy resin or tetrabromobispheno A (TBBPA or TBBA) uses as a flame retardant agent, and an appropriate solvent. After the resin composition of the invention is cured, the resin composition has lower dielectric property and better thermal reliability and tenacity. A copper clad laminate made of an enhanced material such as glass fiber has lower dielectric constant (Dk) and loss tangent (Df), high Tg, high thermal decomposition temperature (Td), better tenacity and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs or applied as a molding resin material for contraction, automobile and air navigation.

Abstract: A curable epoxy resin composition comprising: (I) an epoxy resin; (II) a curing agent for the epoxy-resin; (III) cross linked silicone particles characterized by having secondary amino groups represented by the following general formula: R1NH—R2— (where R designates an aryl group or an aralkyl group, and R designates a bivalent organic group) and bonded to silicon atoms that form the cross-linked silicone particles {the aforementioned cross-linked silicon particles being used in the amount of 0.1 to 100 parts by weight per 100 parts by weight of the sum of components (I) and (II)}, has excellent flowability in molding and can produce a cured body having low modulus of elasticity.

Abstract: A high temperature polyamide coating and a fastener coated with a composition that includes from about 60 wt. % to about 80 wt. % of an aliphatic polyamide having a repeating unit. The composition also includes from about 3 wt. % to about 9 wt. % of an epoxy based resin having a molecular weight in the range from about 525 to about 585, from about 4 wt. % to about 10 wt. % of a ceramic microsphere material and from about 2 wt. % to about 5 wt. % of a thermoplastic methacrylate binder, from about 4 wt. % to about 12 wt. % of crushed glass, from about 0.1 wt. % to about 1 wt. % of a polyamide with a secondary amino group as a curing agent, and the balance of an epoxy based curing agent.

Abstract: [Constitution] A coatings composition having vibration-damping of two-components type and coating type which can be cured at the normal temperature comprising: a combination of not less than two kinds of an epoxy resins which can be provided with a curing compounds having each different glass transition temperature and a curing agent for an epoxy resin, and a filler. [Effect] The coatings composition having vibration-damping of two-components type and coating type which can be cured at normal temperature can be provided. Specially, said coatings composition which a drying oven for baking such as conventional example is not necessary because its composition can be cured at the normal temperature in a short time can be provided.

Abstract: Provided is a process for producing a thermosetting resin varnish from which a printed circuit board can be produced wherein the printed circuit board has excellent dielectric properties in a high frequency band and can significantly reduce the transmission loss, and exhibits excellent heat resistance after moisture absorption and excellent thermal expansion properties and satisfies the metallic foil peeling strength.

Abstract: Disclosed is a thermoplastic composition including at least one semi-aromatic polyamide having a glass transition equal to or greater than 100° C. and a melting point of equal to or greater than 280° C., at least one hyperbranched aromatic polyamide having terminal alkylcarboxamide groups, and, optionally a thermally conductive filler; and molded articles made therefrom.

Abstract: The disclosure provides a melt processible theromoplastic composition, comprising a major proportion of a base polymer comprising a first melt processible thermoplastic polymer having a first Fedor's solubility parameter and a first viscosity; and a combination of a carrier polymer and a surface modifying additive, the carrier polymer comprising a second melt processible thermoplastic polymer which has a second Fedor's solubility parameter that is at least about 2.5 (J/cm3)1/2 lower than the first Fedor's solubility parameter, and a second viscosity, the carrier polymer being adhered to the surface modifying additive, and wherein the first viscosity is at least about 10 times the second viscosity.

Abstract: A composition, having an improved resistance to yellowing under heat aging, comprising at least 20 weight % of at least one polycondensation polymer having a heat deflection temperature of above 80° C. under a load of 1.82 MPa when measured according to ASTM D648, from 0 to 5 weight % of at least one polymer having a heat deflection temperature of at most 80° C. under a load of 1.82 MPa when measured according to ASTM D648, a white pigment; and a black pigment provides resistance to heat aging induced yellowing. The polycondensation polymers are advantageously selected from the group consisting of polyarylethersulfones, at least partially aromatic polyamides, polyamideimides, liquid crystalline polymers, polyimides, polyetherimides, polyaryletherketones, and polyphenylene sulfides. The polymer composition can be molded to form a variety of articles, including LED components, such as reflectors, reflector cups, and scramblers.

Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X- wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

Abstract: A thermosetting resin material is provided with: (A) a thermosetting resin having a dihydrobenzoxazine ring; and (B) a condensed polycyclic aromatic hydrocarbon resin is described.

Abstract: A method for producing a PC copolymer with improved productivity is provided. The PC copolymer has a specific structure and the method uses a diester diol-containing monomer as a raw material. The polycarbonate copolymer is produced by reacting a diester diol-containing monomer, a divalent phenol, and a carbonate precursor by interfacial polymerization, wherein the diester diol-containing monomer is a product of reaction between a hydroxybenzoic acid or an esterified product thereof and a polyalkylene glycol, wherein the esterification degree of hydroxyl groups of the polyalkylene glycol is 50 to 90 mol %.

Abstract: A polyaryletherketone polymeric material, for example polyetheretherketone and composite materials comprising said polymeric material are described. The polymeric material has a melt viscosity (MV) in the range 0.05 to 0.12 kNsm?2 preferably in the range 0.085 to 0.095 kNsm?2.

Abstract: This invention relates to method of printing an ink jet image using an ink jet ink set comprising a colored aqueous ink and a substantially colorless aqueous ink, wherein the colored ink comprises a cationic coloring agent and the colorless ink comprises an anionic polymer or oligomer.

Abstract: Disclosed is an epoxy resin composition that cures with high thermal conductivity and low thermal expansion and is capable of dissipating heat efficiently and displaying good dimensional stability when applied to encapsulation of semiconductor devices or to printed wiring boards. The epoxy resin composition is formulated from epoxy resins 50 wt % or more of which is a diphenyl ether type epoxy resin represented by the following general formula (1) (wherein n is a number of ?0 and m is an integer of 1-3) and curing agents 20 wt % or more of which is a diphenyl ether type phenolic resin represented by the following general formula (2) (wherein n is a number of ?0 and m is an integer of 1-3).