Abstract: A binder system, containing a special polyol mixture as a resin component, said polyol mixture containing at least one polyester based on a fatty acid dimer, a fatty acid trimer or the alcohols derived therefrom, and at least one polyisocyanates as a resin component and/or a NCO-terminated polyurethane prepolymer. The binder system can be used as an adhesive/sealing material, in particular as an adhesive for gluing various substrates.

Abstract: A composition including at least one polymer containing silane groups, at least one epoxy resin, and at least one amine of the formula (I). The composition is low in odor, low in toxicity, and highly workable. It enables low-emission products which cure rapidly at ambient temperature to form macroscopically homogeneous films or bodies having good mechanical properties, high thermal stability and good adhesion properties, the mechanical properties being able to be adjusted from very elastic through to tough elastic. The composition is especially suitable as adhesive and/or sealant or coating.

Abstract: The disclosure describes methods and therapeutic compositions comprising polymers modified with N-alkyl-hydroxy groups comprising one or more carbon atoms. The compositions are useful for gene delivery, and exhibit broad-spectrum antiviral activity and low toxicity in vitro.

Abstract: The present invention relates to a method for manufacturing a nonmagnetic water-cooled microwave ablation needle. The manufacturing method is designed for a microwave ablation needle of a nonmagnetic material and has a proper process procedure, favorable assembly quality, and high production efficiency. The produced nonmagnetic water-cooled microwave ablation needle is applicable to microwave tumor ablation surgery in a nuclear magnetic resonance imaging environment, and helps a doctor in charge to clearly determine a position of a tumor, improve piercing precision, have preferable control on a whole surgery process, improve a success rate of the surgery, reduce damage on surrounding normal tissues as much as possible on the premise of effectively inactivating the tumor, alleviate pain of a patient, and shorten a recovery cycle.

Abstract: Disclosed are methods of lowering application viscosities of or of reducing or eliminating monomer content in electrical impregnating materials comprising or consisting of an emulsion of an unsaturated polyester or a mixture of unsaturated polyesters, water, at least one radical polymerization initiator or radical polymerization initiator/promoter mixture, at least one surfactant having an HLB-value of greater than 15, optionally at least one reactive diluent, and optionally further additives, a process for preparing zero or low VOC electrical impregnation materials, a method of impregnating electrical or electromechanical devices and a method of increasing the stability of aqueous emulsions of unsaturated polyesters.

Abstract: A two-component curable epoxy resin system having an epoxy component containing a unique combination of two or more epoxy resins with at least one of the epoxy resins being an epoxy novolac type resin. The composite made from such resin system exhibits high glass transition temperature.

Abstract: A prepreg having at least one layer of carbon fibers and a curable thermosetting resin system, the curable thermosetting resin system at least partly impregnating the at least one layer of carbon fibers, wherein the curable thermosetting resin system includes: a curable thermosetting resin including at least one epoxide group, the curable thermosetting resin having an epoxy equivalent weight of from 140 to 180 g/eq; a curing agent for curing the curable thermosetting resin, wherein the curing agent is present in the liquid phase and includes a cyanamide reactive group; and a rheology modifier for the curable thermosetting resin system, wherein the rheology modifier includes at least one of a thermoplastic resin and an inorganic particulate thickener or a mixture thereof.

Abstract: The present invention relates to a catalyst composition for curing epoxy group containing compounds comprising a base and a quaternary ammonium salt, of Formula (I): with R1, R2, R3, R4, R5, Y, A and X being as defined herein. Also encompassed are adhesive compositions containing said catalyst composition and the use of the catalyst composition.

Abstract: An acrylic ester containing resin mixture for production of reinforced composite, and the process of making and using the same.

Abstract: The present invention provides the following multilayer heat-shrinkable styrene-based film having an appropriate surface shape, together with excellent lubricity and blocking resistance, and resistance to ink skipping and like problems during the printing process: a multilayer heat-shrinkable styrene-based film having: layers (A) each containing 0.8 to 2.5 parts by weight of high impact polystyrene resin and 0.02 to 0.15 parts by weight of organic fine particles having a mean particle diameter of 0.5 to 5 ?m per 100 parts by weight of a block copolymer of 75 to 90 wt % vinyl aromatic hydrocarbon and 10 to 25 wt % conjugated diene hydrocarbon; and a layer (B1) containing a block copolymer of 70 to 85 wt % vinyl aromatic hydrocarbon and 15 to 30 wt % conjugated diene hydrocarbon; or a layer (B2) containing a resin composition containing a copolymer of 98 to 40 wt % vinyl aromatic hydrocarbon and 2 to 60 wt % aliphatic unsaturated carboxylic acid ester.

Abstract: The present invention relates to curing agents for epoxy resins, containing at least one adduct of a primary diamine and an aromatic monoepoxide, at least one primary diamine and at least one secondary diamine which is free of primary amino groups and free of hydroxyl groups. The curing agent is of low viscosity and cures, together with epoxy resins, rapidly and without blushing, even under damp, cold conditions, to form films of high hardness and low brittleness. It is particularly well suited for low-emission coatings that cure at room temperature.

Abstract: A resin composition including a thermoplastic resin, a glass fiber, a resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond, and a compatibilizer, wherein a part of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond forms a domain having a diameter of from 5 ?m to 10 ?m in a matrix of the thermoplastic resin.

Abstract: The purpose of the present invention is to provide a thermoplastic resin composition having excellent rigidity and impact strength and a method for producing the same. The thermoplastic resin composition is obtained by mixing a polyolefin resin (such as a polypropylene resin), a polyamide resin (such as nylon 11 resin), and a compatibilizer (such as maleic anhydride-modified EPR, maleic anhydride-modified EBR). The thermoplastic resin composition is characterized in having a resin phase separate structure as observed under an electron microscope, wherein the resin phase separate structure consists of a continuous phase and a disperse phase which is dispersed in the continuous phase, there is a microdisperse phase in the disperse phase, and the average diameter of the microdisperse phase is 5 to 1,200 nm.

Abstract: A powder coating composition for PC strand coating which, when used for the coating of a PC strand, can advantageously form a coating film having an even thickness at low cost without causing uneven thickness or stringness is disclosed. The powder coating composition of this invention for PC strand coating is characterized by having a melt viscosity of 3,000-15,000 poise.

Abstract: Provided are: a tire rubber composition improving fuel economy and abrasion resistance while maintaining good wet-grip performance or improving it; and a pneumatic tire including the same.

Abstract: Coalesced rubber particles having an average particle size of 5-50 microns are produced by: (1) adding simultaneously to a latex of pre-crosslinked rubber particles a solvent and an electrolyte solution to form swollen rubber aggregation particles, wherein the solvent has a lower boiling point than water and a capacity of swelling the rubber by at least 10 wt %, and the electrolyte is a solution of at least one metal salt; (2) removing the solvent under atmospheric pressure or low vacuum and at temperature greater than 80° C. to coalesce the rubber into particles having an average particle size of 5-50 50 microns; (3) filtering and washing with methanol; and (4) filtering the washed particles to remove methanol. An epoxy resin is blended with the particles and residual methanol removed, to obtain a blend containing coalesced rubber particles having an average particle size of 5-50 microns in the blended state.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized.

Abstract: A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.

Abstract: A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.

Abstract: Thermoplastic polymer particles directly cross-linked together or cross-linked via a separate and independent polymer network to form an inter-penetrating network are disclosed herein, along with methods of manufacturing and use as interleaf tougheners of pre-pregs and composite articles.

Abstract: A modified conjugated diene polymer, which can be used as a raw material of a cross-linked polymer for automobile tires, is prepared by a method including a step of polymerizing a monomer having a conjugated diene compound etc. in the presence of a compound of formula (1) or (2) and an alkali metal compound to obtain a conjugated diene polymer, and a step of reacting the polymer and a compound of formula (3). In formulae (1) and (2), R1 is hydrocarbylene; Q is —N(-A1)- etc.; A1 is hydrocarbyl without active hydrogen atom and may have substituent(s). In formula (3), E is a functional group etc. which has no active hydrogen atom and is bound to R4 by an atom of N; R2 and R3 are hydrocarbyl groups; R4 is a hydrocarbylene group; and n is an integer of 0 to 2.

Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: Crosslinker-accelerator system for the thermal crosslinking of polyacrylates with functional groups suitable for entering into linking reactions with cyclic ethers, more particularly epoxide groups or oxetane groups, comprising at least one substance containing epoxide or oxetane groups (crosslinker) and at least one substance with an accelerating action for the linking reaction at a temperature below the melting temperature of the polyacrylate (accelerator).

Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.

Abstract: Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.

Abstract: A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organophosphonium compound (D) as a thermal curing accelerator, and the content of the organophosphonium compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.

Abstract: Embodiments of the present disclosure provide a curable composition having an epoxy resin component having an epoxide equivalent weight of 75 grams/equivalent to 210 grams/equivalent, an amine component having a hydrogen equivalent weight of 18 grams/equivalent to 70 grants/equivalent, and an acrylate component having an acrylate equivalent weight of 85 grams/equivalent to 160 grams/equivalent, wherein the acrylate component is 1 part per hundred parts epoxy resin to less than 5 parts per hundred parts epoxy resin.

Abstract: The invention relates to a crosslinkable polymer powder composition redispersible in water, obtainable by means of free radical polymerization, in an aqueous medium, of one or more monomers from the group consisting of vinyl esters of straight-chain or branched alkylcarboxylic acids having 1 to 15 C atoms, methacrylates and acrylates of alcohols having 1 to 15 C atoms, vinylaromatics, olefins, dienes and vinyl halides, no epoxide-functional comonomers being copolymerized, and subsequent drying of the polymer dispersion obtained thereby, wherein, before and/or during the polymerization and/or before the drying of the polymer dispersion obtained thereby, an epoxy resin is added and, if appropriate after the drying, a curing agent crosslinking with the epoxy resin is added.

Abstract: An adhesive composition for semiconductor containing an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.

Abstract: A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning.

Abstract: A heat-curing epoxy resin composition that includes an epoxy resin, a curing agent, an accelerator, and an optional toughener. The epoxy resin compositions are suitable in particular for use as bodyshell adhesives and for preparation of structural foams. An accelerator of formula (I) results in increased impact strength the of heat-curing epoxy resin compositions.

Abstract: Disclosed is an interfacial polymer for a network used as a coupling agent in mixing of rubber-silica. More particularly, the interfacial polymer for a rubber-silica network is a block copolymer containing a copolymer of conjugated diene and vinyl aromatic monomers, in which when used as a coupling agent in the mixing of synthetic rubber and silica (an inorganic material), the polymer enhances silica dispersibility within the rubber, and improves compatibility and processability, resulting in considerable improvement in the dynamic property as well as the mechanical property of the rubber, and when used in a tire, etc., it enhances automobile braking performance and reduces rolling resistance.

Abstract: Provided are: a fiber-reinforced composite material which has mode I interlaminar fracture toughness, mode II interlaminar fracture toughness and compressive strength under heat and humidity conditions at the same time; an epoxy resin composition for obtaining the fiber-reinforced composite material; and a prepreg which is obtained using the epoxy resin composition. An epoxy resin composition for fiber-reinforced composite materials, which contains at least the following constituent elements (A), (B), (C) and (D). (A) An epoxy resin (B) Resin particles that satisfy the following conditions (b1)-(b3) and are insoluble in an epoxy resin (b1) The particle size distribution index is 1.0-1.8. (b2) The particle sphericity is 90 or more. (b3) The glass transition temperature of the particles is 80-180° C. (C) At least one elastomer component that is selected from among block copolymers containing a block having a glass transition temperature of 20° C.

Abstract: The instant invention relates to epoxy resin compositions comprising an epoxy resin, a block copolymer having at least one block predominantly composed of methyl methacrylate units or a core shell component and a hardener of the polyoxyalkyleneamine type. The epoxy materials cured from these compositions have high impact resistance.

Abstract: The present invention relates to a multicomponent resin system comprising a. a compound capable of undergoing a radical copolymerization selected from the group consisting of unsaturated polyester resins, vinyl ester resins and mixtures thereof b. an epoxide functional resin as compound capable of reacting with a primary and/or secondary aliphatic amine, c. a transition metal compound, d. a primary and/or secondary aliphatic amine characterized in that the transition metal is selected from the group consisting of Cu, Mn, Fe and mixtures thereof.

Abstract: A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: Disclosed are curable powder coating compositions that include a film-forming resin composition that includes (a) a first film-forming resin, (b) a second film-forming resin that is different from and incompatible with the first film-forming resin, and (c) a compatibilizing agent that includes a first portion that is compatible with the first film-forming resin and a second portion that is compatible with the second film-forming resin. The compatibilizing agent is present in such compositions in an amount sufficient to result in a coating composition that, when deposited onto at least a portion of a substrate and cured, produces a mid-gloss coating.

Abstract: Two part cyanoacrylate/cationically curable adhesive systems are provided, which contain vinyl ethers.

Abstract: A thermoplastic elastomer composition having a continuous phase and a dispersed phase, wherein the continuous phase comprising (A) an epoxy-modified polyamide resin, and the dispersed phase comprising (B) a halogenated isoolefin-paraalkylstyrene copolymer rubber, wherein the thermoplastic elastomer composition is obtained by melt-kneading (B) halogenated isoolefin-paraalkylstyrene copolymer rubber, (C) a polyamide resin, and (D) a polyfunctional epoxy compound having two or more epoxy groups per molecule in an amount of 0.05 parts by weight or more and less than 3 parts by weight with respect to 100 parts by weight of polyamide resin (C), at a temperature which is equal to or more than the melting point of polyamide resin (C), and epoxy-modified polyamide resin (A) is produced by the reaction of polyamide resin (C) with polyfunctional epoxy compound (D) during the melt-kneading.

Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).

Abstract: One exemplary embodiment of the invention includes grafting a thermoplastic hot melt adhesive material to a shape memory polymer surface.

Abstract: A spring with high durability has a coating film composed of an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of the coating film. A method of coating a spring with high durability comprises a coating step of making an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of a coating film adhere to a surface on which the coating film is formed, and a baking step of baking the epoxy resin powder coating containing softening agent adhered to the surface.

Abstract: A process including the polymerization of a reactive diluent, which is present in an aqueous dispersion that further includes an epoxy-amine material, is disclosed. The resulting composition is useful as a coating composition.

Abstract: Provided is an adhesive resin composition containing an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer obtained by copolymerizing a monomer having an epoxy group and an ethylenically unsaturated monomer that is copolymerizable with the monomer having an epoxy group; a thermoplastic resin; and a curing agent, wherein a copolymer having a weight-average molecular weight of 5,000 to less than 100,000 and a weight per epoxy equivalent of 3,500 g/eq or less is used as the epoxy-containing copolymer. The adhesive resin composition is capable of providing a one-part type adhesive solution that has a good compatibility of the polymer components, that has good flame retardancy and is halogen-free, and that has good storage stability. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.