Abstract: A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.

Abstract: This invention relates to rapid curing coating compositions that are particularly useful for automotive OEM and refinish applications. The coating composition includes a crosslinkable component that contains a novel highly branched acrylic polymer, and a crosslinking component that contains conventional crosslinking agents, such as polyisocyanate and melamine. This invention is also directed to a process for producing coatings from the rapid curing coating compositions. These compositions are especially useful in providing hard highly crosslinked coatings.

Abstract: Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about ?40° C. or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine; (ii) an amine curative; and (iii) an epoxide-group containing compound. The epoxy adhesives are resistant to thermal shock and have a low shear creep. The epoxy adhesives are particularly suitable for bonding substrates having mismatched coefficients of thermal expansion.

Abstract: The present invention relates to a rubber modified thermoplastic resin composition comprising a discontinuous elastomeric phase dispersed in a rigid thermoplastic phase, wherein at least a portion of the rigid thermoplastic phase is grafted to the elastomeric phase, which is prepared by a method comprising the steps of: (a) polymerizing a mixture of monomers in a first stage in the presence of the elastomeric phase, at least one of which monomers is selected from the group consisting of vinyl aromatic monomers and at least one of which monomers is selected from the group consisting of monoethylenically unsaturated nitrile monomers, followed by (b) polymerizing one or more monomers in at least one subsequent stage in the presence of the elastomeric phase from (a), wherein the one or more monomers comprise at least one monomer selected from the group consisting of (C1-C12)alkyl- and aryl-(meth)acrylate monomers. The method is also provided.

Abstract: A cationic electro-deposition coating composition, comprises: Component (A): an amino-containing epoxy resin (A) obtained by adding an amino-containing compound (a-2) to an epoxy resin (a-1) having an epoxy equivalent of from 400 to 3000, Component (B): an amino-containing acrylic resin (B) obtained by adding an amino-containing compound (b-4) to a copolymer resin obtained by radical copolymerization of, as essential components, a polylactone-modified hydroxyl-containing radical copolymerizable monomer (b-1), which is obtained by adding a lactone to a hydroxyl-containing acrylic monomer (b), and glycidyl (meth)acrylate (b-2), and another radical copolymerizable monomer (b-3); and Component (C): a blocked polyisocyanate curing agent (C) as a curing component, the component (A), component (B) and component (C) being added in amounts of 5 to 80 wt %, 5 to 80 wt % and 10 to 40 wt %, respectively, based on the total solid content of the components (A), (B) and (C).

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: Overall, ebonite coatings or elastomeric linings are not recommended for direct immersion in sulfuric acid with higher than 65% concentration. By blending a chemical resistant epoxy resin to an ebonite coating, the resulting epoxy ebonite composition can be employed in more severe environment such as direct immersion in >65% sulfuric acid. In particular, the present invention provides a blend of an epoxy coating with an ebonite coating with a mix ratio of 95/5 to 5/95, the resulting epoxy ebonite composition of which has greatly increased adhesion to steel and excellent resistance to undercut corrosion when subjected to salt spray. The epoxy ebonite composition according to the present invention can be used as coatings, adhesives, encapsulants or sealants and is particularly useful as industrial coatings that are subject to wide temperature variations, salt contamination or chemical attack.

Abstract: In the preparation of an improved adhesive composition, an epoxy-based prepolymer is obtained by the reaction of one or more epoxy resins with amino-terminated polyethers and/or carboxyl-terminated butadiene-nitrile rubbers. In one embodiment of the invention, both a solid epoxy resin and a liquid epoxy resin, each of which is a diglycidyl ether of a polyphenol such as bisphenol A, are used. The epoxy-based prepolymer is mixed with an acrylate-terminated urethane resin (preferably, one based on a polyol having a number average molecular weight of at least about 400) and a heat-activated latent curing agent to make an adhesive composition which can be pumpable at room temperature. Curable adhesives capable of expansion to about 100% with high impact resistance after curing may be obtained by inclusion of expanding agents such as expandable microspheres.

Abstract: A process for preparing polyisobutenyl (thio)ethers by reacting a polyisobutene epoxide having at least one terminal epoxide group with itself, with other epoxides and/or with nucleophiles selected from among alcohols and thiols in the presence of a Lewis-acid compound as catalyst and/or a cationic photoinitiator with illumination is described. The side reaction of the rearrangement of the epoxide to the polyisobutenyl aldehyde is suppressed. In addition, a curable composition comprising a polyisobutene epoxide, an epoxide different therefrom and optionally a poly(thi)ol is also described.

Abstract: The present invention provides a vinyl polymer with an epoxy group terminally introduced therein and an epoxy resin composition comprising (A) an epoxy resin and (B) a vinyl polymer which has a main chain produced by living radical polymerization and has a reactive functional group at a main chain terminus. A flexible epoxy resin composition can be obtained using these compounds. The invention further provides an epoxy resin composition having an epoxy group at a main chain terminus thereof.

Abstract: Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.

Abstract: A composition comprising by weight: 70 to 96% of at least one polyamide chosen from PA-11, PA-12, aliphatic polyamides resulting from the condensation of an aliphatic diamine having from 6 to 12 carbon atoms and an aliphatic diacid having from 9 to 12 carbon atoms, and 11/12 copolyamides having either more than 90% of nylon-11 units or more than 90% of nylon-12 units; 4 to 10% of a plasticizer; 0 to 25% of an NBR or H-NBR elastomer; and the sum of the amount of plasticizer and the amount of elastomer is between 4 and 30%; can be manufactured by melt-blending the various constituents using standard techniques for thermoplastics. The composition is particularly useful for pipes used in the operation of offshore oil and gas fields. They exhibit very good ageing resistance. They are also useful for simpler pipes in motor vehicles, these compositions withstanding the ageing caused by the temperature under the bonnet of motor vehicles and the nature of the fluids transported.

Abstract: The present invention provides a diene rubber composition having excellent processability and being improved in both the balance between low rolling resistance and wet skid resistance, and strength properties. The composition according to the invention is a diene polymer rubber composition comprising (A) 100 parts by weight of a raw material rubber comprising (A-1) a diene rubbery polymer which is a conjugated diene rubbery polymer or a conjugated diene-styrene rubbery copolymer (1) containing a modified component in an amount exceeding 60 wt. %, which modified component is obtained by reacting an active end of the rubbery polymer with a polyfunctional compound having, in its molecule thereof, at least two epoxy groups, (2) having a molecular weight distribution Mw/Mn of 1.05 to 3.

Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.

Abstract: A mixture of a self-curing epoxy resin having an equivalent weight of from about 100 to about 700, a melt viscosity of from about 200 to about 2000 centipoise at 150° C. and a low temperature curing agent capable of maintaining its own domain during extrusion which is extruded as one component at a temperature below 220° F. and the extrudate is cooled and pulverized to form a low temperature curable coating powder. The powder cures at a temperature of from about 225 to about 300° F. and produces a coating having an exceptionally smooth surface with either a low or high gloss. The powder is particularly useful for coating heat sensitive substrates such as plastics, paper, cardboard and wood.

Abstract: Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compositions. The reaction products based on tricarboxylic anhydrides or tetracarboxylic anhydrides are distinguished by having on average more than one imide group and carboxyl group per molecule. The compositions may optionally also contain condensation products obtained from tri- or poly-functional polyols and/or tri- or poly-functional amino-terminated polymers and cyclic carboxylic anhydrides, wherein the latter reaction products contain on average more than one carboxyl group per molecule. These compositions additionally contain conventional rubber-modified epoxy resins together with liquid and/or solid polyepoxy resins and conventional hardeners and accelerators and optionally fillers and rheology auxiliaries.

Abstract: Disclosed are (1) a porous polymer particle comprising a polymer substrate having ester bonds connected to a group containing a quaternary ammonium structure through a spacer molecule, (2) an alkali-resistant, high-strength porous polymer particle having ester bonds connected to a group containing a quaternary ammonium structure through a spacer molecule, a part of the ester bonds being saponified and converted to a hydroxyl group(s), (3) a porous polymer particle comprising a polymer substrate having ester bonds connected to a group containing a quaternary ammonium structure through a spacer molecule, the porous polymer particles being treated with an alkaline solution to generate a hydroxyl and/or a carboxyl group on a surface of the substrate, (4) an anion exchanger comprising any one of the particles (1) to (3) above, (5) a packing material for anion chromatography comprising the anion exchanger (4) above, (6) a column for anion chromatography using the anion exchanger (4) above, and (7) a method for meas

Abstract: The invention relates to thermosetting compositions, in particular coating or molding compositions, comprising crosslinked polymer microparticles with a size ranging from 10 to 300 nm and carrying at least one reactive functional group which can react with at least one of the reactive components of the thermosetting composition. Preferably, these microparticles carry at least one second reactive functional group distinct from the first which can react with at least one other functional group of the same type carried by another microparticle and/or by a reactive component of the thermosetting composition. These microparticles are at least partially soluble, miscible and/or dispersible in the starting thermosetting composition. The preferred thermosetting compositions are based on resins of epoxy/amine type or on unsaturated polyester resins and/or on vinyl ester resins.

Abstract: A composition comprising a thermoplastic polymer having incorporated therein a crosslinked phase derived from the reaction of: (A) a copolymer made from ethylene and an unsaturated epoxide, a polyolefin grafted with an unsaturated epoxide, or a product having two epoxide groups, (B) a copolymer made from ethylene and an unsaturated carboxylic acid anhydride, and (C) a copolymer made from an unsaturated carboxylic acid or an ?,?-aminocarboxylic acid.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of ?10° C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.

Abstract: A method for making a one-component epoxy resin system comprises reacting (A) an epoxy resin and (B) an amine solidifying system present in insufficient quantities to cause gelation in the presence of a latent hardener (C) and an expanding agent (E), each of which remains unreacted under the reaction conditions for (A) and (B), to yield a product with a Kofler Heat Bank melting point of less than 55° C. and a melting point stability of at least six months at normal workshop temperatures.

Abstract: A thermosetting resin composition that is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured coated films are excellent in adhesiveness, electric insulation property, chemical resistance, thermal resistance, and the like, reduced in warp caused by cure shrinkage, and excellent in flexibility.

Abstract: A composition useful as a sealing element for electrochromic devices comprises (a) an epoxy resin component including at least two of a dicyclopentadiene epoxy resin, a naphthalene epoxy resin, a bisphenol A epoxy resin, a bisphenol F epoxy resin and a novolac epoxy resin; (b) a toughening agent; and (c) a latent curative.

Abstract: A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s−1 after allowing to stand for 24 hours at 25° C.±1° C.

Abstract: Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not exceeding a durometer Shore D reading of 45 when cured with a stoichiometric amount of diethylene triamine (“DETA”); and (b) a substantially stoichiometric amount of at least one latent epoxy resin curing agent. Optionally, the adhesive composition may also incorporate one or more semi-flexible resins. Other optional components include fillers, thixotropic agents, and flexibilizers. The adhesive composition provicdes an epoxy-based adhesive composition that is storable for weeks as a single component mixture at room temperature, curable at temperatures ranging from about 100° C. to 125° C. in less than two hours, and flexible upon curing to temperatures as low as minus 50° C., exhibiting a durometer Shore A of less than about 95.

Abstract: The present invention is directed to a low-friction coating composition, comprising: about 10 to about 30 wt % of an epoxy resin composition consisting essentially of 4-glycidyloxy-N,N′-diglycidylaniline; about 30 to about 60 wt % of an epoxide resin composition consisting essentially of bisphenol A diglycidyl ether polymer; and about 20 to about 40 wt % of an aromatic amine composition consisting essentially of 4,4′-sulfonyldianiline; wherein all weight percents are based on the total weight of the low-friction coating composition, and wherein the low-friction coating composition is substantially free of chromate. The invention is also directed to a substrate coated with the above low-friction coating composition, and methods of coating a substrate with the low-friction coating composition.

Abstract: The present invention provides an electrodeposition coating composition excellent in storage stability and capable of forming a novel multilayer structure comprising a particle A containing a resin (a) whose solubility parameter is &dgr;a, and a particle B containing a curing agent and a resin (b) whose solubility parameter is &dgr;b, wherein the value of (&dgr;b-&dgr;a) is not less than 1.0.

Abstract: Polymeric delivery agents, delivery agent compounds and compositions comprising them which are useful in the delivery of active agents are provided. Methods of administration and preparation are provided as well.

Abstract: Gel formation is prevented in the reaction between a sulfonyl-chloride-containing resin and a polyamine by first forming an adduct between the resin with an aminophenol. The prevention of gel formation enables sulfonyl-chloride containing resin to be used in admixture with acrylates and epoxy resin to form a polyamine-curable adhesive composition having excellent adhesive properties and chemical resistance.

Abstract: A hardener for an epoxy resin includes an accelerator having a tetraalkylphosphonium salt.

Abstract: A two-component epoxy-based adhesive comprising a resin component and a curing agent. The resin component comprises an epoxy resin, a polymer polyol, and fumed silica. The curing agent comprises a polyoxyalkyleneamine, an amine terminated butadiene-acrylonitrile polymer, tris(2,4,6-dimethlaminomethyl)phenol, polyamide resin, silane and fumed silica. The adhesive composition is particular useful for bonding of metals, plastics and composites and for functions such as laminating, honeycomb bonding, automotive assembly and construction assembly.

Abstract: A weldable curable coating composition with improved intercoat adhesion is disclosed comprising a resinous binder comprising a polymer (A) with functional groups and a crosslinking agent with functional groups reactive with those of polymer (A); an electroconductive pigment; and an adhesion promoting compound comprising boron containing compounds. In an alternative embodiment, the adhesion promoting compound may comprise siloxane polymer reacted with aluminates, titanates, zirconates, silicates, siloxanes, silanes, and mixtures thereof, wherein each component is different.

Abstract: An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprising this composition; and an electronic device having an encapsulating member comprising a cured product of this encapsulant.

Abstract: This invention concerns low viscosity aldimine and ketimine reactive diluents having multi-imine functionality, which are useful in automotive refinish coating compositions, including a process for making them and the coatings that contain them.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: An article comprises a substrate wherein at least a portion of its surface is provided with a thermosettable adhesive composition prepared from a polyepoxide resin, a curing agent and a plurality of microspheres. The cured composition forms a semi-structural bond with said substrate which is inseparable at the use temperature and is cleanly removable from said substrate when heated to a temperature of greater than the use temperature.

Abstract: The present invention is directed to an adhesive composition, which comprises an epoxy resin, a coupling agent, filler, and an effective amount of an amine-curing agent or curative for said epoxy resin. Advantageously, tri-functional and/or tetrafunctional epoxy resins and/or acrylate monomers will be incorporated into the adhesive composition in order to reduce open time and enhance substrate adhesion. Advantageously, a mixture of amines will be used in the curative including aliphatic amines, which have low viscosities and efficiently wet the substrate for enhancing adhesion; polyamines, which can be used to manipulate open time and allow for improved ratio tolerance of the adhesive system; and amine-terminated rubbers (ATBN), which can improve impact resistance and the toughness of the cured adhesive. Preferred coupling agents are silanes.

Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) an indene-styrene or indene-chroman-styrene copolymer having a Mn of 200-2,000 in an amount of 0.1-20 parts by weight per 100 parts by weight of components (A) and (B) combined. The indene polymer (E) is previously melt mixed with a part or all of the liquid epoxy resin (A) prior to compounding with the remaining components. A semiconductor device sealed with the cured product of the liquid epoxy resin composition remains reliable.

Abstract: The present invention provides curable coating compositions including: (a) about 55 to about 99 weight percent of an epoxy-functional polymer containing at least two epoxide groups per molecule; (b) about 1 to about 45 weight percent of a thermoplastic polymer effective to reduce shrinkage of the curable composition upon curing and which is substantially insoluble in the epoxy-functional polymer; (c) about 1 to about 70 weight percent of ground vulcanized rubber particles having an average particle size ranging from about 1 to about 300 microns; (d) a curing agent adapted to cure the epoxy-functional polymer; and, optionally, vinyl chloride polymer.

Abstract: Hetero-telechelic polymers having the formula:

Abstract: An adhesive powder for bonding flat, closed, or porous substrates, the adhesive powder being applied in the first step to a first substrate, an intermediate product that is non-adhesive at room temperature and stable in storage being produced, and the first substrate being bonded to a second substrate in a second step by applying an increased temperature and pressure, as a combination of the following components: i) a thermoplastic polymer having a proportion of 25 to 95% by weight; and ii) at least one epoxy resin that is solid at room temperature and has a proportion of 5 to 75% by weight; and, if desired, iii) at least one pre-adduct of epoxy resins and polyamines that is solid at room temperature and has a proportion of at most 25% by weight, a physical bonding taking place when the adhesive powder is applied to the first substrate in the first step, and the two substrates being bonded in the second step by the powder components being chemically cross-linked or post-cross-linked among one another, and bei

Abstract: A thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises (A)2 thermosetting resin such as epoxy resin and a curing agent, and (B)2 compound containing one functional group which can react with thermosetting resin (A) or its curing agent, and a moiety selected from the following formulae (1) to (4) Furthermore, the present invention also relates to a prepreg formed by impregnating reinforcing fiber with the aforesaid resin composition and to carbon fiber reinforced composite materials comprising reinforcing fiber and a cured aforesaid thermosetting resin composition.

Abstract: A mixture of a self-curing epoxy resin having an equivalent weight of from about 100 to about 700, a melt viscosity of from about 200 to about 2000 centipoise at 150° C. and a low temperature curing agent is extruded as one component at a temperature below 220° F. and the extrudate is cooled and pulverized to form a low temperature curable coating powder. The powder cures at a temperature of from about 225 to about 300° F. and produces a coating having a smooth surface with either a low or high gloss. The powder is particulary useful for coating heat-sensitive substrates such as plastics, paper, cardboard and wood.

Abstract: A rubber composition having high adhesiveness to a metal, high modulus, high set resistance and high heat resistance, comprising raw material rubber, 2,4-dimercapto-6-substituted-1,3,5-triazine and a polymer having epoxy groups crosslinkable with the raw material rubber; a process for producing the rubber composition exhibiting adhesion stability, by controlling temperature of mixing step when crosslinking the rubber composition with an organic crosslinking agent; and a hose having excellent heat resistance and sufficient modulus and compression set resistance, wherein an inner tube and/or outer cover comprise the rubber composition and a reinforcing layer comprises brass-plated steel wires.

Abstract: A sealant composition comprising a curable epoxy-containing material, a thermoplastic polyamide component having a melting point lower than a curing temperature of the epoxy-containing material, and a curative for the epoxy-containing material. After curing of the epoxy-containing material, the sealant composition exhibits an elongation at −20° C. of at least 2. The sealant composition is capable of effectively sealing discontinuities while maintaining enough flexibility to absorb applied stress, thereby preventing the formation of defects in the sealant which permit the intrusion of dirt, moisture, and other undesirable substances.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: A resin composition including from about 1 to about 100 weight percent of a thermoplastic oxazolidone ring-containing compound having a molecular weight of at least 5000, which is the reaction product of: a) from about 20 to about 43 weight percent, based on the polyepoxide and polyisocyanate reactants, of a polyisocyanate having an isocyanate-functionality of from about 1.8 to about 2.2; b) from about 80 to about 57 weight percent, based on the polyepoxide and polyisocyanate reactants, of a polyepoxide having an epoxide functionality of from about 1.8 to about 2.2; and optionally, c) a chain extender. The resin composition is used as an adhesive to adhere a copper foil to a prepreg or a laminate, with improved peel strength and Tg.

Abstract: A thermoplastic molding composition comprising a grafted acrylate rubber (ASA) and a gloss reducing agent and a process for making the same are disclosed. The gloss reducing agent is the reaction product of (i) a compound having two or more epoxy groups per molecule and (ii) a compound having two or more amine groups per molecule, with the proviso that the total of epoxy groups of (i) and amine groups of (ii) per molecule is greater than 4. The gloss reducing agent may be either incorporated in ASA as the reaction product of (i) and (ii) or, in the alternative, formed upon the reaction of (i) with (ii) in the course of the thermal processing of the a blend containing ASA, (i) and (ii).

Abstract: The present invention relates to thermoset epoxy resin waterproofing membranes for structures such as roofs comprising: (a) one or more epoxy resin(s) having an average of at least 1.5 epoxy groups per molecule; (b) a liquid amine terminated polyamide prepared by reacting at least one C18-50 dicarboxylic acid and an aminoalkylpiperazine in a ratio of moles of aminoalkylpiperazine to equivalents of carboxyl group in the acid of greater than 0.75:1; (c) one or more optional polyamine(s); (d) one or more optional filler(s); and (e) one or more optional modifying resin(s) wherein the tensile modulus of the thermoset epoxy waterproofing membranes is less than 200,000 psi and the tensile elongation of the thermoset epoxy waterproofing membranes is greater than 20%.