Abstract: There has been a need for an overcoat film composition that functions as an overcoat film in terms of high transparency and flatness, and that also functions as an aligning film in terms of liquid crystal molecular alignment. There has also been a need to lower the cost of manufacturing a liquid crystal display element. There is provided an overcoat film composition comprising one or more compounds selected from the group of polyester-polyamic acids (A1) obtained using at least a polyhydric hydroxy compound (a1), a diamine (a2), and a compound having two or more acid anhydride groups (a3), and polyester-polyimides (A2) that are imidization products thereof, and a polyamic acid (B).

Abstract: A solvent-free polyimide silicone resin composition, and a cured product thereof, includes (A) a polyimide silicone resin having recurring units having a specific type of structure and having a weight average molecular weight of 5,000 to 150,000, (B) an epoxy resin, and (C) an epoxy resin curing agent wherein the resin composition having a fluidity at 25° C. and is free of a solvent.

Abstract: A composite material comprising at least one polymeric resin and optionally at least one fibrous reinforcement where the polymeric resin comprises at least one difunctional epoxy resin and at least one epoxy resin with a functionality greater than two having at least one meta-substituted phenyl ring in its backbone.

Abstract: Epoxy resin compositions that generate reduced levels of sulfur dioxide and which unexpectedly have reduced self-extinguishing times. The epoxy resins are composed of from 50 to 70 weight percent of an epoxy resin component. The epoxy resin composition also includes from 15 to 35 weight percent of a thermoplastic blend that is composed of polyetherimide and polyamideimide. The epoxy resin composition further includes from 5 to 25 weight percent of a curative agent.

Abstract: Epoxy resins and composite materials that generate reduced levels of sulfur dioxide and which unexpectedly have reduced self-extinguishing times. The epoxy resins are composed of from 50 to 70 weight percent of an epoxy resin component. The epoxy resin composition also includes from 20 to 35 weight percent of a thermoplastic blend that is composed of polyetherimide and polyamideimide. The epoxy resin composition further includes from 5 to 25 weight percent of a curative agent. The composite materials may be used for primary structures in aircraft and other load-bearing structures.

Abstract: A conjugated or partially conjugated polymer including a structural unit of Formula (I); where T is an aryl or heteroaryl group that may be substituted or unsubstituted, or a C1-C24 alkyl group; R1 is alkyl, alkoxy, aryl group, cyano, or F; and a and b are independently selected from 1, 2 or 3. In addition, a composition of Formula (IV); wherein X is a halogen or a boronate group.

Abstract: A breathable film includes at least one polymer (a) taken from the group comprising an ethylene/alkyl (meth)acrylate copolymer (a1), an optionally neutralized ethylene/ (meth)acrylic acid copolymer (a2), an ethylene/vinyl monomer copolymer (a3), the (a1)/(a2) blend, the (a1)/(a3) blend, the (a2)/(a3) blend and the (a1)/(a2)/(a3) blend, and/or includes at least one functionalized polyethylene (b); and at least one copolymer (c) having copolyamide blocks or polyester blocks and polyether blocks.

Abstract: Diamine compounds, which in particular are useful as precursors for the production of liquid crystal alignment layers, are represented by the general formula I: wherein A1 represents an organic group of 1 to 40 carbon atoms; A2 represents a hydrogen atom or an organic group of 1 to 40 carbon atoms.

Abstract: Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C.

Abstract: A biaxially oriented polyphenylene sulfide film contains polyphenylene sulfide and polyether imide, wherein the contents of the polyphenylene sulfide and the polyether imide are 70 to 99 parts by weight and 1 to 30 parts by weight respectively when the total amount of the polyphenylene sulfide and the polyether imide is taken as 100 parts by weight, and further contains a compound having one or more groups selected from an epoxy group, an amino group and an isocyanate group as a compatibilizing agent in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the polyphenylene sulfide and polyether imide in total, and the polyether imide forms a dispersed phase with an average particle diameter of 10 to 500 nm and the biaxially oriented polyphenylene sulfide film exhibits a tensile elongation at break of 110 to 250% in both the longitudinal direction and width direction.

Abstract: Fiber reinforced composites fabricated using a low-temperature, solution-based growth of nanowires such as ZnO nanowires on the surface of the reinforcing fibers such as carbon fibers and functionalized aramid fibers. The composites with nanowire interphase may have an enhanced fiber/matrix interface strength and a comparable in-plane strength, as compared to similar composites without such nanowire interphase.

Abstract: Provided are a thermosetting resin composition suitable for forming a composite material that has excellent mechanical characteristics, such as wet heat resistance and toughness, and also a prepreg using the same. The thermosetting resin composition includes at least a component [A] including thermoplastic resin particles and a thermosetting resin [B]. The component [A] includes a melt blend of at least the components [A-1] and [A-2] given below. In the particles, the component [A-1] and the component [A-2] may be in a non-compatibilized state or a compatibilized state.

Abstract: Provided is a polyamide resin composition superior in mechanical properties such as strength and elastic modulus and also in toughness, durability, frictional abrasion resistance, and water absorption resistance, wherein the polyamide resin composition contains 0.1 to 4 parts by mass of an aliphatic epoxy compound (B) having three glycidyl groups in the molecule, formulated to 100 parts by mass of a polyamide resin (A) with silicate layers of swellable lamellar silicate dispersed therein. The epoxy equivalence of the aliphatic epoxy compound (B) is preferably 180 g/eq or less, and the aliphatic epoxy compound (B) preferably has trimethylolpropane and/or glycerol as a skeleton.

Abstract: A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: By completing curing in a short period of time even at low temperatures and using an epoxy resin composition as a matrix resin of a prepreg, it is possible to obtain a fiber-reinforced composite plastic product such as a fiber-reinforced tubular composite with excellent mechanical properties and, more particularly, excellent impact resistance. The epoxy resin composition includes A component, B component, C component, D component and E component, where the content rate of sulfur atoms is equal to or more than 0.2 wt % and equal to or less than 7 wt %, and the content rate of the C component is equal to or more than 1 wt % and equal to or less than 15 wt %. A component: epoxy resins, B component: reactive products of the epoxy resins and an amine compounds including the sulfur atom in a molecule (the unreacted epoxy resins and/or the amine compounds may be included), C component: polyamide compounds soluble in the A component, D component: urea compounds, and E component: dicyandiamide.

Abstract: An adhesive formulation comprising i) an adduct of an epoxy resin and an elastomer, ii) a phenoxy resin; a core/shell polymer; iv) a curing agent which provides a structural adhesive with improved low temperature impact strength particularly useful for bonding metal especially in the automotive industry.

Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

Abstract: Use of a resin system for making a composite material in a liquid moulding process. The resin system comprises an epoxy component and at least one curing agent, and at least 35 wt. % of the epoxy component is one or more naphthalene based epoxy resin. There is also provided a cured composite material, and a method of making the cured composite material in a liquid moulding process which comprises placing fibre reinforcement and the resin system in a mould and curing. The resin system and the methods of making a cured composite material are particularly applicable to liquid moulding processed such as resin trans moulding (RTM), vacuum assisted resin transfer moulding (VARTM), Seeman composite resin infusion moulding (SCRIMP), resin infusion under flexible tooling (RIFT), and liquid resin infusion (LRI).

Abstract: Epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4?-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.

Abstract: A polyamide resin composition which can improve heat resistance and water absorbency while suppressing the deterioration of processability is provided. Provided is a polyamide resin composition having an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, wherein the content of the epoxy group-containing phenoxy resin is 30 to 50% by mass.

Abstract: To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis (hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.

Abstract: The invention relates to the use of hyperbranched polymers or oligomers comprising terminal primary and/or secondary amino groups as curing agents for epoxy resins. The invention further relates to a composition containing such polymers or oligomers, an uncured or only partially cured epoxy resin, and at least one optional curing agent for epoxy resins, as well as a cured epoxy resin that can be obtained by curing said components. The invention finally relates to a method for curing epoxy resins. In said method, an uncured or only partially cured epoxy resin is brought to a temperature of 5 to 150° C. or is exposed to microwave radiation along with at least one polymer or oligomer according to the definition above and at least one optional conventional curing agent for epoxy resins.

Abstract: Aqueous dispersions and coatings comprising modified epoxy resins comprising the reaction product of rosin and a dienophile, further reacted with an epoxy resin, are disclosed.

Abstract: A novel flame-retardant thermoplastic polyhydroxy polyether resin obtained by reacting at least one epoxy resin (A) selected from glycidyl esters of divalent aliphatic carboxylic acids having 15 to 64 carbon atoms or glycidyl ethers of divalent aliphatic alcohols having 15 to 64 carbon atoms with a phosphorus atom-containing divalent phenol compound (B) as essential components, wherein the component (A) accounts for 2 to 52 mol % with respect to the whole resin, the weight average molecular weight thereof is 10,000 to 200,000, and the phosphorus content thereof is 1 to 5 wt %.

Abstract: The present invention relates to heat-curing epoxy resin compositions, which are used in particular as body shell adhesives for vehicle construction, in that they have improved wash-out resistance, especially also at temperatures around 60° C., and the viscosity of which at room temperature enables an application at room temperature.

Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.

Abstract: A thermosetting resin composition contains a polyimide resin component (A) containing at least one polyimide resin, an amine component (B) containing at least one amine, an epoxy resin component (C) containing at least one epoxy resin, and an imidazole component (D) containing at least one imidazole.

Abstract: A heat-curable resin composition, comprising (A) a polyimide silicone resin having a phenolic hydroxyl group and a radically polymerizable group bonded to a silicon atom, (B) an epoxy resin in such an amount that a molar ratio of the epoxy groups of the epoxy resin to the phenolic hydroxyl groups of the polyimide silicone resin (A) ranges from 0.2 to 10, and a catalytic amount of (C) an organic peroxide.

Abstract: The present invention relates to a curing composition comprising a polyarylate having epoxy group and a cyanate ester resin, and a cured product prepared by using the same. The curing composition according to the present invention is used to provide a cured product which is excellent in terms of heat resistance and toughness.

Abstract: Diamine compounds, which in particular are useful as precursors for the production of liquid crystal alignment layers, are represented by the general formula I: wherein A1 represents an organic group of 1 to 40 carbon atoms; A2 represents a hydrogen atom or an organic group of 1 to 40 carbon atoms.

Abstract: Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.

Abstract: Star polymers prepared by reacting a highly branched polymer and either a lactone or lactam are disclosed. These star polymers find particular application as additives for powder coating compositions, to improve various performance properties thereof. Powder coating composition comprising the described star polymers are also disclosed.

Abstract: An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins.

Abstract: Polymer compositions capable of a high degree of curing at relatively low temperatures, and prepregs, adhesives, films and composites formed therefrom are discussed. The polymer compositions include epoxy resin systems and a dual curing system including one or more curing agents containing one or more hydrazine-based curing agents having hydrazine functional groups and one or more amine-based curing agents containing one or more amine functional groups. The hydrazine-amine curing systems enable the polymer composition to achieve elevated levels of gelation or degree of cure at lower temperatures than are achievable with amine functional curing agents alone.

Abstract: The present invention is a cyanate-epoxy composite resin composition comprised of a cyanate ester resin (A), an epoxy resin (B), and a latent curing agent (C), characterized in that the latent curing agent (C) is composed of a modified polyamine (c1), a phenol resin (c2) and one or more kind of polycarboxylic acid (c3). The above modified polyamine (c1) is a modified polyamine, which is obtained by the reaction of polyamine compound (c1-1) with epoxy compound (c1-2), containing one or more amino group having an active hydrogen within a molecule.

Abstract: A spring with high durability has a coating film composed of an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of the coating film. A method of coating a spring with high durability comprises a coating step of making an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of a coating film adhere to a surface on which the coating film is formed, and a baking step of baking the epoxy resin powder coating containing softening agent adhered to the surface.

Abstract: The epoxy resin composition of the present invention is characterized in that a polyamide compound having a moiety derived from a hydroxyl substituted aromatic amine having a phenolic hydroxyl group adjacent to an amino group is used as an epoxy resin hardener.

Abstract: A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole.

Abstract: Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.

Abstract: An epoxy adhesive composition of an epoxy resin, an epoxy terminated liquid rubber, filler, and an amine curing package for said epoxy resin is disclosed. Advantageously, a short chain diol will be incorporated into the adhesive in order to enhance reactivity and strength build. Advantageously, a mixture of amines will be used in the curative including multifunctional aliphatic amines that improve adhesion and strength build; tertiary amines which are used to enhance adhesion and strength build, polyamides which can be used to provide flexibility; and amine-terminated rubbers (ATBN) which can improve toughness and impact resistance to the cured system. The preferred short chain diol is glycerin. Surfaces of adherends are joined with the dried residue of the epoxy adhesive composition by applying the epoxy resin composition to one or both surfaces, joining the surfaces, and applying pressure, optionally with heating.

Abstract: By heating, allowing to stand at normal temperature, or irradiating in the presence of a photo-polymerization initiator, a curable resin composition which contains (A) a resin material having a radical polymerizable unsaturated group and an epoxy group, (C) a radical polymerization initiator, (D) an amine compound and/or a mercaptan compound containing one or more of active hydrogen in one molecule, and (E) a compound, which is an adduct in which the (D) amine compound and/or a mercaptan compound, is reacted with the radical polymerizable unsaturated group of the (A) resin material, thereby a cured product can be obtained.

Abstract: A method is provided in which PGN is end-modified in a process using a single solvent. The resulting end-modified PGN may be stably crosslinked using aliphatic polyisocyanates. Further provided are methods of producing energetic compositions comprising PGN which has been end-modified in a process using a single solvent. Such energetic compositions may be stably crosslinked using aliphatic polyisocyanates.

Abstract: The invention is based on the discovery that the compounds and compositions described herein are useful as film-forming adhesives for use in a variety of applications, including, for example, adhesive tapes for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways with or without a catalyst.

Abstract: The present invention provides an epoxy resin composition for a fiber reinforced composite material comprising an epoxy resin (A) comprising an epoxy resin (a1) having a weight average molecular weight of up to 1,000 and an epoxy resin (a2) having a weight average molecular weight of 10,000 to 100,000 which contains at least 20% by weight of the basic skeleton of the epoxy resin (a1), a thermoplastic resin (B), and a curing agent (C). The cured composition has a co-continuous phase of the epoxy resin (A) and the thermoplastic resin (B) and/or a continuous phase of the thermoplastic resin (B). A cured product having a high toughness can be obtained from this epoxy resin composition.

Abstract: A solvent-free polyimide silicone resin composition, and a cured product thereof, includes (A) a polyimide silicone resin having recurring units having a specific type of structure and having a weight average molecular weight of 5,000 to 150,000, (B) an epoxy resin, and (C) an epoxy resin curing agent wherein the resin composition having a fluidity at 25° C. and is free of a solvent.

Abstract: The present invention provides N,N?-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions comprising N,N?-dimethyl secondary diamine polymers are also disclosed.

Abstract: The present invention provides polyamide curing agent compositions comprising the reaction products of (1) multifunctional amines of structure 1 where R1 is CH2CH2CH2NH2; R2, R3 and R4 independently are H or CH2CH2CH2NH2, and X is CH2CH2 or CH2CH2CH2 with (2) dimer fatty acids, optionally in combination with monofunctional fatty acids, the reaction product preferably comprising at least 15 wt % tetrahydropyrimidine-containing components. The curing agent compositions are useful for crosslinking epoxy resins to produce coatings, adhesives, floorings, composites and other articles.

Abstract: The invention relates to an epoxy resin composition containing (a) an epoxy resin and (b) a phenolic hydroxy group-containing polyamide resin having the structure represented by Formula (1), a method of curing the composition, a varnish, prepreg, or sheet using the composition, and an epoxy resin composition having the polyamide resin represented by Formula (1) as the active component. Cured products of the epoxy resin composition according to the present invention have a sufficient high flexibility when formed into a thin film, have a flame resistance even though the cured compositions do not contain a halogen flame retardant, an antimony compound, or the like and are superior in heat resistance and adhesiveness, and thus are extremely useful in a wide range of applications, for example, as molded materials, cast materials, laminate materials, paints, adhesives, resists, and the like. (wherein, l and m are averages, satisfying the formula: m/(l+m)=0.01; and l+m is a positive number of 2 to 200.