Abstract: A composition comprising a thermoplastic polymer having incorporated therein a crosslinked phase derived from the reaction of: (A) a copolymer made from ethylene and an unsaturated epoxide, a polyolefin grafted with an unsaturated epoxide, or a product having two epoxide groups, (B) a copolymer made from ethylene and an unsaturated carboxylic acid anhydride, and (C) a copolymer made from an unsaturated carboxylic acid or an ?,?-aminocarboxylic acid.

Abstract: Production of a porous layer includes using a composition which includes a first polymer component and a second polymer component, the first polymer component being polyhydroxyamide and/or polybenzoxazole and stable at a temperature at which the second polymer component decomposes and volatilizes. If the composition is heated to the decomposition temperature of the second polymer component, the second component volatilizes and a porous layer that contains the first component remains.

Abstract: An object of the present invention is to improve the compatibility of the resin composition comprising the PAI resin and the PAS resin so as to provide a resin composition which is excellent in flowability when molten, strength, tenacity and heat resistance.

Abstract: A reinforced polyamide molding composition is disclosed. Characterized in that its viscosity at a shear velocity of 10 s−1 is greater than 1000 Pas and a shear velocity of 1000 s−1 is less than 300 Pas, at processing temperatures of 40 to 80° C. above its melting point, the composition is particularly suitable for thermoforming applications.

Abstract: A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.

Abstract: A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.

Abstract: The invention relates to a hot-melt adhesive composition for use in a textile product, in particular a tufted carpet, containing a polymer chosen from the group of polyamides, with a number-average molecular mass of 500-5000 g/mol and functional end groups. This hot-melt adhesive composition can be applied in various forms and results in a good bond of pile material to support material. The invention also relates to a process for the preparation of a textile product, in which the hot-melt adhesive composition is used, and also to the textile product thus obtained and the use thereof as floor or wall covering.

Abstract: A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s−1 after allowing to stand for 24 hours at 25° C.±1° C.

Abstract: A curable coating composition is disclosed comprising a resinous binder comprising (a) a reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups, the reaction product having reactive functional groups, and (b) a curing agent having functional groups reactive with the functional groups of (a). An electroconductive pigment is dispersed in (a) such that the weight ratio of the electroconductive pigment to (a) plus (b) is within the range of 0.5 to 9.0:1. When the curable coating composition is deposited and cured on a metal substrate, the cured coating is weldable.

Abstract: A method of joining electrically conductive materials comprises: Applying an electrically conductive adhesive to at least one electrically conductive material(s), wherein the electrically conductive adhesive is prepared from an epoxide-modified polyurethane, a cross-linking agent, an adhesion promotor and a conductive filler; and joining the electrically conductive material(s) with the applied adhesive to a substrate and curing the adhesive.

Abstract: Low-cure powder coating compositions are disclosed. The compositions comprise a polyepoxide and a material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; R2 is an organic radical having 1 to 20 carbon atoms; R3 and R4 are independently alkyl or phenyl groups having 1 to 8 carbon atoms; Z is oxygen or nitrogen, and when Z is oxygen R5 is absent and when Z is nitrogen R5 is hydrogen or is and n is 1 to 4. The material can optionally be reacted with an acidic hydrogen-containing compound. The compositions are curable without the use of crosslinking agents or accelerators. Methods for coating a substrate using these compositions, and substrates coated thereby, are also disclosed, as are additional catalysts useful for the same purpose.

Abstract: This invention relates to blends of nylon homopolymers and copolymers with poly(hydroxyamino ether) polymers. More particularly, there are provided blends of nylon 6 and its copolymers with poly(hydroxyamino ether) which form films having high miscibility, high clarity and good processability.

Abstract: Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not exceeding a durometer Shore D reading of 45 when cured with a stoichiometric amount of diethylene triamine (“DETA”); and (b) a substantially stoichiometric amount of at least one latent epoxy resin curing agent. Optionally, the adhesive composition may also incorporate one or more semi-flexible resins. Other optional components include fillers, thixotropic agents, and flexibilizers. The adhesive composition provicdes an epoxy-based adhesive composition that is storable for weeks as a single component mixture at room temperature, curable at temperatures ranging from about 100° C. to 125° C. in less than two hours, and flexible upon curing to temperatures as low as minus 50° C., exhibiting a durometer Shore A of less than about 95.

Abstract: A process for preparing a heat curable powder coating composition comprises exposing a powder comprising a carboxyl-functional polymer and a polyepoxy compound to an amine selected from the group consisting of organic amines and ammonia under mild conditions, particularly temperatures of between −30° C. and 50° C.

Abstract: By heating at above the melting point and/or glass transition point of the polycondensate and adding an aromatic dicyanate; or adding a mixture comprising an aromatic dicyanate and a polyfunctional compound selected from the class of sterically hindered hydroxyphenyl-alkyl-phosphonic esters and monoesters, diphosphonites and secondary aromatic amines; or adding a mixture comprising (i) an aromatic dicyanate, (ii) at least one polyfunctional compound selected from the class of sterically hindered hydroxyphenyl-alkyl-phosphonic esters and monoesters, diphosphonites and secondary amines, and (iii) a difunctional epoxide, it is possible to bring about an increase in the molecular weight and/or viscosity of virgin polycondensate and polycondensate recyclates.

Abstract: The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Abstract: The present invention relates to a polypropylene resin composition and more particularly, to the polypropylene resin composition comprising: (A) a propylene polymer comprising a propylene-ethylene copolymer having a certain limit viscosity alone and/or a propylene homopolymer having a certain pentad fraction (% mmmm); (B) an ethylene-&agr;-olefin copolymer rubber comprising ethylene-propylene copolymer rubber and ethylene-&agr;-olefin copolymer; (C) a styrene copolymer rubber; (D) a polypropylene modified with polar group-containing resin or a polyolefin polyol; and (E) an inorganic filler.

Abstract: The invention is a composition made by mixing a multifunctional acrylate with an aminofunctional silane and an ethylenically unsaturated acid to form a reaction product, optionally dissolved in a solvent, characterized in that the multifunctional acrylate has a molecular weight of from about 100 to about 3000. The composition can be coated on a substrate, then optionally exposed to moisture and treated to initiate a free radical reaction. The invention can be applied to a variety of substrates used in packaging applications. The reaction mixture can further be cured by heating in the presence of moisture. The free radical reaction can be initiated by electron beam irradiation, ultraviolet radiation, gamma radiation, and/or heat and chemical free radical initiators.

Abstract: The present invention provides a cationic paint composition containing as resin component a polyol-modified amino group-containing epoxy resin obtained by reacting an epoxy resin with epoxy equivalent 180-2500 with a alkyl phenol and/or a carboxylic acid; a polyol obtained by adding a caprolactone to a compound containing a plurality of active hydrogen groups and an amino group-containing compound.

Abstract: Curable mixtures based on epoxy resins and amine hardeners, if required additionally using solvents, water, plasticisers, UV stabilisers, colourants, pigments, fillers, which mixtures contain as accelerator at least one compound of general formula (I), wherein R1, R2, R3, R4 are each independently of one another H or an unbranched or branched alkyl radical containing 1 to 15 carbon atoms, and n is 0 to 10.

Abstract: A film-type adhesive for electronic components comprises a polyimide resin made up of specific repeating units and having a weight-average molecular weight of 5,000-150,000 in combination with an epoxy resin bearing at least two glycidyl groups per molecule. The adhesive has a weight ratio of the polyimide resin to the epoxy resin within a range of 50/50 to 5/95, and a film thickness of 20-150 &mgr;m. Such a film-type adhesive makes it possible to simplify and shorten the duration of assembly operations for electronic components having various types of adherend surfaces.

Abstract: Transparent thermoplastic resin compositions include a polyetherimide resin, a polyester resin, sodium benzene phosphinate, and optionally 3,4-epoxy cyclohexylmethyl-3,4-epoxy cyclohexanecarboxylate and preferably comprising a first polyester resin and a second polyester resin and sodium benzene phosphinate, wherein from 50 to 100 mole percent of the structural units of the first polyester resin include an alicyclic hydrocarbon radical as the diol residue of the structural unit, and wherein less than 50 mole percent of the structural units of the second polyester include an alicyclic hydrocarbon radical as the diol residue of the structural unit, exhibit resistance to elevated temperature and improved impact properties.

Abstract: A process of forming vias in a composition comprising (a) applying a layer of a composition containing (i) a cyanate ester, (ii) a bismaleimide, (iii) a co-curing agent having the structure R1—Ar—R2 wherein Ar is at least one aryl moiety, R1 is at least one unsaturated aliphatic moiety and R2 is at least one glycidyl moiety, (iv) an epoxy resin and, optionally, (v) a free-radical initiator; (b) covering the layer with a mask having windows through which radiation can be transmitted; (c) exposing part of the composition to radiation to at least partially cure it in the exposed areas; (d) removing the non-cured portions of the composition; and (e) completing the cure of the resin compositions.

Abstract: A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.

Abstract: An object of the present invention is to provide an epoxy modified polyimide, which is a resin capable of treating at a low processing temperature and having an excellent heat resistance; photosensitive composition; coverlay film, which is excellent in electrical insulation property, heat resistance for soldering, film-formability, flexibility, and chemical resistance; solder resist; and printed wiring board. The epoxy modified polyimide is obtained by synthesizing polyimide having a hydroxy group or carboxy group and subsequently reacting the polyimide with an epoxy compound. The photosensitive composition is obtained by adding a photoreaction initiator or the like to the epoxy modified polyimide. The coverlay film and the solder resist can be formed from the photosensitive composition. The printed wiring board is produced using the coverlay film and the solder resist.

Abstract: A liner is the product of reaction of (a) a hydrophilic prepolymer bearing isocyanate groups; and (b) a water-borne polymer dispersion, the polymer bearing groups that are reactive to isocyanate groups; wherein the dispersion has a sufficiently high solids content, and the polymer has a sufficiently high modulus and glass transition or crystalline melting temperature, that the product of reaction exhibits a 24-hour Tensile Strength of at least about 2.5 MPa.

Abstract: A capacitor with a polymeric dielectric layer, the dielectric layer having a leakage current at 85° C. and 85% relative humidity of less than 100 nA/cm2 using a 6 volt bias.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: A polymer composition comprises at least one thermoplastic polymer selected from the group formed by polyetherimides and polysulphones, at least one epoxy resin modified by at least one aromatic polyamine, and at least one other thermoplastic selected from the group consisting of a polyphenylene ether, a polyphenylene sulfide and an aromatic polyether. The epoxy resin is formed from at least one polyepoxide containing at least 2 epoxy groups in its molecule and the aromatic polyamine contains at least two primary amine groups in its molecule and preferably at least one alkyl substituent containing 1 to 12 carbon atoms located alpha to one of the amino groups. The molar ratio of the polyamine to the epoxy is such that, each amino group corresponds to 1.6 to 2.6 epoxy groups.

Abstract: The combination of powder coatings usable in a coating method comprising mixing two or more powder coatings of which each color is different, wherein each of the powder coatings fuses with each other and is heat-cured, to thereby give a coating film having a homogenous hue. A powder coating composition comprising two or more powder coatings of which each color is different, wherein each of the powder coatings fuses with each other and is heat-cured, to thereby give a coating film having a homogenous hue. A coating method comprising the steps of (a) applying to a substrate two or more powder coatings, of which each color is different; (b) heating to fuse with each other each of the two or more powder coatings applied in step (a); and (c) curing the resulting fused product in step (b), to give a coating film having a homogeneous hue.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: A thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises (A)2 thermosetting resin such as epoxy resin and a curing agent, and (B)2 compound containing one functional group which can react with thermosetting resin (A) or its curing agent, and a moiety selected from the following formulae (1) to (4) Furthermore, the present invention also relates to a prepreg formed by impregnating reinforcing fiber with the aforesaid resin composition and to carbon fiber reinforced composite materials comprising reinforcing fiber and a cured aforesaid thermosetting resin composition.

Abstract: The present invention provides a cationic coating composition capable of forming a coating film which is excellent in a corrosion resistance and an adhesive property and an electrodepositably coating property toward a rust preventive steel plate (zinc-plated steel plate). The cationic coating composition described above comprises as a vehicle component, a polyol-modified, amino group-containing epoxy resin prepared by reacting an epoxy resin (A) having an epoxy equivalent of 180 to 2500 with a polyol compound (B) obtained by adding caprolactone to a compound having plural active hydrogen groups and an amino group-containing compound (C).

Abstract: The rheological properties of a crosslinkable resin system are modified by the presence of a side chain crystalline (SCC) polymer (or a similar crystalline polymer which melts over a narrow temperature range). The polymer dissolves in the curable system at temperatures above the melting point of the crystalline polymer (Tp), but when the system is then cooled to a temperature below Tp, at least partially forms a separate phase in the curable system. Below Tp, this separate phase substantially increases the viscosity of the curable system (i.e. makes it thicker than the same system without the crystalline polymer). This is particularly valuable for sheet molding composites (SMCs) in which the increase in viscosity makes the composites less tacky, and for dry film resists (DFRs). Above Tp, the curable system containing the dissolved crystalline polymer has a viscosity which is substantially less than its viscosity below Tp.

Abstract: A curable epoxy resin formulation comprising a) 40 to 100% by weight of an epoxy group-terminated polyester of a dimerised or trimerised fatty acid and a polyhydric alcohol, and 0 to 60% by weight of a diepoxide which is not an epoxy group-terminated polyester, b) a hardener for epoxy resins consisting of 50 to 99% by weight of a polyoxyalkylene di- or triamine and 1 to 50% by weight of a hardener which is not a polyoxyalkyleneamine, and comprising as further optional components c) a curing accelerator, and d) customary modifiers for epoxy casting resins, with the proviso that the sum of the constituents in component a) as well as in component b) is in each case 100% by weight, is suitable for use as casting resin formulation for encapsulating electrical or electronic components.

Abstract: This invention relates to a process for increasing the molecular weight and/or for the modification of polycondensates during the processing in the melt, which comprises adding to the polycondensate a blend comprising a) at least one polyfunctional anhydride (polyanhydride); b) at least one polyfunctional compound, the functional groups of which can react with the anhydride groups of component a); and c) at least one phosphonate. This invention also relates to the use of an additive blend for increasing the molecular weight and for the modification of polycondensates during the processing in the melt.

Abstract: A single-application polyimidosiloxane coating material comprising a uniformly mixed solution composition of a polyimidosiloxane with an epoxy resin-reactive group in the molecule, an epoxy resin and a fine inorganic filler in a solvent. The coating material has satisfactory storage stability and printing properties, and its cured films also have satisfactory properties and allow single-application printing.

Abstract: The present invention relates to a process for preparing toughened thermosetting structural materials, more specifically, to a process for preparing toughened thermosetting materials having a morphology spectrum by regulating the rate of cure reaction of a thermosetting resin and the rate of dissolving a thermoplastic toughening agent in the thermosetting resin to form a morphology spectrum depending on the concentration gradient of the toughening agent, and toughened thermosetting structural materials prepared by the said process. In accordance with the present invention, the thermosetting materials with enhanced toughness and mechanical properties such as chemicals-resistance and heat-resistance, can be prepared by adding a soluble thermoplastic toughening agent in the thermosetting resin in a concentration of less than 20% by weight.

Abstract: An aqueous dispersion composition which comprises an ionomer resin (A) neutralized with a divalent metal, and water, sufficiently answers high level of requirement performances in various uses, and in particular, is particularly suitable as a heat sealing agent for aluminum foil, film, paper or the like, a metal coating agent, a modifier for various emulsions, a paint, an adhesive, a rust-preventive treating agent, and the like; a method which can produce the aqueous dispersion composition in high yield; a rust-preventive treating agent for a metal surface, which contains the aqueous dispersion composition, has excellent corrosion resistance, and can form a rust-preventive layer showing excellent coating adhesion to a over coat paint; a rust-preventive treatment method using the rust-preventive treating agent; and a rust-preventive treated metal product.

Abstract: In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance and low thermal expansion coefficient so that required accuracy can be obtained during circuit formation and mounting of components. Therefore, the present invention aims at providing a multilayer printed circuit board which uses an interlaminar insulating adhesive superior in heat resistance and low in thermal expansion coefficient and wherein the insulating adhesive layer has a small variation in thickness between circuit layers.

Abstract: A thermoplastic resin composition comprises a compatible resin blend of a polyester sulfonate salt ionomer and a polyamide and at least one difunctional epoxy compound having at least one cyclohexane ring moiety and two terminal epoxy functional groups, wherein at least one of the two terminal epoxy functional groups is a substituent on the at least one cyclohexane ring moiety; and, optionally, a catalyst compound or rubber impact modifier.

Abstract: A amidoamine composition containing oligomeric amidoamine compounds having the structure: 1

Abstract: A reaction between epoxy-terminated polyamide and an acid anhydride compound can yield a modified polyamide resin, into resin skeleton of which carboxy groups to react with epoxy resin are introduced. An adhesive agent having excellent heat-resistance can be provided by the use of a composition of this modified polyamide resin and epoxy resin. Furthermore, an adhesive tape for a semiconductor device having excellent properties can be produced by laminating the adhesive agent and the protective layer on one surface of an organic insulated film.

Abstract: Transparent thermoplastic resin compositions include a polyetherimide resin, a polyester resin, sodium benzene phosphinate, and optionally 3,4-epoxy cyclohexylmethyl-3,4-epoxy cyclohexanecarboxylate and preferably comprising a first polyester resin and a second polyester resin and sodium benzene phosphinate, wherein from 50 to 100 mole percent of the structural units of the first polyester resin include an alicyclic hydrocarbon radical as the diol residue of the structural unit, and wherein less than 50 mole percent of the structural units of the second polyester include an alicyclic hydrocarbon radical as the diol residue of the structural unit, exhibit resistance to elevated temperature and improved impact properties.

Abstract: A reworkable high temperature adhesive, comprising the reaction product of (a) a thermoplastic adhesive selected from the group consisting of polyetherimides, polyamide-imides, polysulfones, polyethersulfones, silicon-carbon thermosets, polyphenylene sulfides and mixtures thereof; (b) a metal acetonate; (c) an epoxy resin; (d) a crosslinker; (e) and a catalyst.

Abstract: An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and (C) a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature; wherein the adhesive composition optionally contains a liquid resin other than component (A) and/or an organic solvent and wherein the liquid resin including component (A), the organic solvent or both constitute from 10 to 55% by weight of the composition, and the use of this interlaminar adhesive composition to prepare a multilayer printed wiring board, and the process for preparing the multilayer printed wiring board are provided.

Abstract: In the present invention, an inorganic reactant is, or reactants are, localized with respect to a dendritic polymer by physical constraint within or by a non-covalent conjugation to the dendritic polymer. The localized inorganic reactant or reactants is/are subsequently transformed to form a reaction product which is immobilized with respect to the dendritic polymer. This immobilization occurs on a nanoscopic scale as a consequence of the combined effects of structural, chemical and physical changes without having covalent bonds between the product(s) and the dendritic container and results in new compositions of matter called dendritic nanocomposites. The resulting nanocomposite material can be used to produce revolutionary products such as water soluble elemental metals, with specific applications including magnetic resonance imaging, catalytic, magnetic, optical, photolytic and electroactive applications.

Abstract: An aqueous system comprises at least one epoxy resin and a reaction product with an amine equivalent weight of at least 50 prepared by the reaction of an (A) epoxy-functional amidoamine derived from at least one epoxy resin and an amidoamine obtained via the reaction of an acid-terminated polyalkylene glycol and a diamine in an active hydrogen:epoxy groups ratio of from 1:15 to 1:350, with (B) at least one polyamine in an active amine hydrogen:epoxy groups equivalent ratio of from 2:1 to 30:1, and, optionally (C) a monoepoxide in a remaining active amine hydrogen:epoxy groups equivalent ratio of from 5:1 to 20:1.

Abstract: The invention relates to curable mixtures based on epoxy resins and aminic hardeners and cure accelerators, and, optionally solvents, plasticisers, UV stabilisers, dyes, pigments and/or fillers, wherein there is used as cure accelerator from 1 to 20% by weight, based on epoxy resin, of at least one heterocyclic compound of the general formula (I) wherein R1, R2 and R3, which may be the same or different, are —(CH2)a—N—[(CH2)b—CH3]2 radicals in which a=2 or 3 and b=0 or 1.

Abstract: Compositions prepared by the glycidation of at least one (a) carboxy polyfunctional polyester and at least one (b) &agr;,&agr;-branched monocarboxylic acid containing a tertiary carbon atom and from 5 to 12 carbon atoms, or a glydicyl ester thereof, a curing agent and, optionally, a catalyst, and coating and or casting compositions containing them.