Abstract: A method for the synthesis of high molecular weight poly(imide)s comprising coupling poly(imide) precursors having complementary functional groups and a weight average molecular weight of less than about 50,000 Daltons to form high molecular weight poly (imides)s having a weight average molecular weight greater than 50,000 Daltons.

Abstract: The present invention provides a polymer in which coumarin, a photo-reactive molecule, is grafted onto a polyimide for preparing liquid crystal alignment layer which has a superior alignment property and an excellent thermal stability in photo-alignment, a process for preparing the said grafted polymer, a process for preparing liquid crystal alignment layer by employing the said grafted polymer, and a liquid crystal alignment layer prepared by the process. The polymer of the invention is prepared by mixing a coumarin compound with a polyimide, dissolving the mixture in an organic solvent, adding a catalyst, and stirring under an environment of N2 gas. The polymer of the invention is superior in terms of the thermal stability, which makes possible its universal application for the development of a novel liquid crystal display(LCD).

Abstract: An invented method for the surface modification of a molded plastic treats a molded plastic with an oxygen-atom-containing gas such as oxygen, carbon monoxide, a nitrogen oxide, or a sulfur oxide in the presence of N-hydroxyphthalimide or another imide compound represented by the following formula (1): wherein R1 and R2 are each, identical to or different from each other, a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a cycloalkyl group, a hydroxyl group, an alkoxy group, a carboxyl group, an alkoxycarbonyl group, or an acyl group, or R1 and R2 may be combined to form a double bond or an aromatic or non-aromatic ring; X is an oxygen atom or a hydroxyl group. An invented method for modifying a polymer treats a polymer with an oxygen-atom-containing gas such as oxygen, carbon monoxide, a nitrogen oxide, or a sulfur oxide in the presence of the imide compound represented by the formula (1).

Abstract: The invention relates to a transparent composition comprising, by weight, the total being 100%:

Abstract: Iodinated and/or brominated derivatives of aromatic dihydroxy monomers are prepared and polymerized to form radio-opaque polymers. The monomers may also be copolymerized with other dihydroxy monomers. The iodinated and brominated aromatic dihydroxy monomers can be employed as radio-opacifying, biocompatible non-toxic additives for other polymeric biomaterials. Radio-opaque medical implants and drug delivery devices for implantation prepared from the polymers of the present invention are also disclosed.

Abstract: The present invention relates to a poly(imide-siloxane) compound useful as passivation layer for packaging tapeless LOC, which is produced by reacting in a polar solvent a diaminosiloxane compound of the formula(1) wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, and R10 are independently an aromatic group, aliphatic group or halogenated hydrocarbon, hydroxy, or ether group, and m and n are integers such that m+n is an integer of 0˜1000; and a diamine compound of the formula(2) H2N—R—NH2   (2) wherein R is at least one selected from the below groups: with an aromatic tetracarboxylic dianhydride of the formula (3) wherein A is at least one selected from the below groups: wherein the number of moles of the compound (3) is the same as the total number of moles of compounds (1) and (2).

Abstract: Polyamide compositions for welding are provided, having excellent weldability, heat resistance, and hydrolysis resistance. Compositions of (A) an aromatic polyamide in which the molar fraction of aromatic monomers among the monomer components making up the polyamide is at least 0.2, and (B) an aliphatic polyamide, wherein the weight ratio of (A) and (B) is from 99:1 to 5:95 are described.

Abstract: Polyamide-based thermoplastic compositions comprising by weight:

Abstract: The polyamide resin composition comprises a copolyamide resin, a nucleating agent for crystallization, and optionally an inorganic filler. The copolyamide resin is produced by polycondensing a carboxylic acid component mainly comprising adipic acid with a diamine component containing trans-1,4-bis(aminomethyl)cyclohexane, cis- 1,4-bis(aminomethyl)cyclohexane, and optionally another diamine. The nucleating agent for crystallization is selected from an organic nucleating agent and an inorganic nucleating agent. The polyamide resin composition exhibits a good molding cycle and provides a shaped article excellent in the retention of rigidity at a high temperature condition, the durability under a high temperature condition, and the retention of mechanical properties after water-absorption. Therefore, the polyamide resin composition is useful as a metal replacement in various applications such as automobile parts, mechanical parts and electric or electronic parts.

Abstract: Segmented, melt-processible, semicrystalline copolyimides are disclosed herein. These polymers are comprised of an amorphous or semicrystalline A segment (soft segment) and a semicrystalline B segment (hard segment), wherein the level of semicrystallinity in the A segment is less than that in the B segment. These copolyimides are semicrystalline and exhibit melting points in the range from about 330-395° C. In preferred embodiments, these copolyimides are end-capped and are crystallizable from their melts (i.e., they exhibit recoverable semicrystallinity). These copolyimides either inherently have suitably low melt visocosities to be melt-processible or can be made to have suitably low melt viscosities to be melt-processible by addition of certain additives. Tailoring of the melting points and glass transition temperatures of these copolyimides can be effected by changing their molecular architecture.

Abstract: The invention relates to a polyamide composition for the production of electrical and electronic components that are suitable for the conditions of the surface mounting technology. In particular, the composition exhibits a high resistance to blistering during the reflow soldering process. The composition according to the invention comprises (a) a polyamide having a melting point higher than 280° C., (b) a polymer having a melting point lower than 230° C., (c) a halogen-containing compound, (d) optionally a synergist for the flame-retardant properties (e) reinforcing material (f) optionally other additives. A particularly good resistance to blistering is achieved if (f) contains at least a compound with acid imide groups.

Abstract: A process for the continuous preparation of a thermoplastic molding composition with narrow scatter of the melt flow index, which comprises mixing two or more chemically identical starting materials of different melt flow index in a pelletizing extruder fitted with an on-line melt flow index meter and adjustable metering systems.

Abstract: A fiber-forming polyamide composition including a combination of a fiber-forming polyamide with a concentrate having one or more sulfonated aromatic acid reagents in a thermoplastic carrier resin. The concentrate preferably comprises an alkali metal salt of 5-sulfoisophthalic acid, preferably carried in a matrix comprising one or more thermoplastic polyesters or polyamides.

Abstract: The objects of the present invention can be achieved by a biaxially oriented polyester film, comprising a polyester (A) mainly composed of ethylene terephthalate and a polyether imide (B), having a single glass transition temperature, and having a refractive index of 1.60 to 1.80 at least in either the machine direction or the transverse direction.

Abstract: The invention relates to nylon compositions having improved surface aesthetics while maintaining its physical properties and to a method for preparing molded articles of from such nylon compositions. The nylon composition is composed of a substantially uniform blend of nylon 6,6,6 copolymer of from about 65 to about 75 parts by weight of caprolactam and from about 25 to about 35 parts by weight of hexamethylenediamine and adipic acid in a 1:1 ratio; together with a second polyamide which is nylon 6 homopolymer. The first polyamide is present in the overall composition in an amount of from about 7 to about 20 weight percent and said second polyamide is present in the overall composition in an amount of from about 80 to about 83 weight percent. The nylon compositions are useful to create injection molded articles having a good surface appearance and good performance at a low cost.

Abstract: Transparent molding compositions are prepared by blending from 50 to 99 parts by weight of a transparent polyamide, and from 1 to 50 parts by weight of a graft copolymer, such that the sum of the parts by weight of the transparent polyamide and the graft copolymer is 100. The graft copolymer is prepared by reacting from 0.5 to 25% by weight, based on the graft copolymer, of a branched polyamine having at least 4 nitrogen atoms and having a number average molecular weight Mn of at least 146 g/mol, with polyamide-forming monomers selected from the group consisting of lactams, &ohgr;-aminocarboxylic acids, equimolar combinations of diamine and dicarboxylic acid, and combinations thereof.

Abstract: A block copolymer of the formula hydrocarbon-polyether-polyamide-polyether-hydrocarbon is described. The copolymer may be prepared by reacting together reactants that include dimer acid, diamine, and a polyether having both hydrocarbon termination and termination selected from one of amine, hydroxyl and carboxyl. The copolymer may be combined with a solvent to form a gel, where the gel may be transparent and may be incorporated into household and consumer products including antiperspirants.

Abstract: A thermoresistance adhesive which does not dissolve in the sealer-composing resins at the sealer molding temperature and is capable of providing a semiconductor chip/lead frame adhesive strength under shear of 1 N/4 mm2 or greater, and including, for example, amide, imide, ester or ether linkage is suited for use in producing thermoresistance adhesive solutions and thermoresistance resin pastes, and the semiconductor chips, lead frames, films, etc., made by using such an adhesive are suited for providing low-cost semiconductor devices.

Abstract: The polyamide resin composition comprises a copolyamide resin, a nucleating agent for crystallization, and optionally an inorganic filler. The copolyamide resin is produced by polycondensing a carboxylic acid component mainly comprising adipic acid with a diamine component containing trans-1,4-bis (aminomethyl)cyclohexane, cis-1,4-bis(aminomethyl) cyclohexane, and optionally another diamine. The nucleating agent for crystallization is selected from an organic nucleating agent and an inorganic nucleating agent. The polyamide resin composition exhibits a good molding cycle and provides a shaped article excellent in the retention of rigidity at a high temperature condition, the durability under a high temperature condition, and the retention of mechanical properties after water-absorption. Therefore, the polyamide resin composition is useful as a metal replacement in various applications such as automobile parts, mechanical parts and electric or electronic parts.

Abstract: Polymeric micelles for encapsulation of hydrophobic molecules are provided. Methods and formulations for delivering hydrophobic molecules to a host via these micelles are also provided. Methods of stabilizing liposomes or lipid based formulations by addition of polymeric micelles are also provided.

Abstract: A thermoplastic elastomer composition dynamically vulcanized to a gelation rate of 50 to 95% which is superior in heat resistance and durability while maintaining flexibility and superior in air permeation preventive property which can be efficiently used as, for example, a pneumatic tire as an air permeation preventive layer. In particular, a thermoplastic elastomer composition having a reduced particle size of the domain rubber is produced by a material having a high rubber ratio by mixing a composition (C) mixed under conditions of a ratio of melt viscosities of the rubber composition (A)/resin (B) of 0.8 to 1.2 and the formula (&phgr;A/&phgr;B)×(&eegr;B/&eegr;A)<1.0 under conditions of a ratio of melt viscosities of the rubber composition (D)/composition (C) of 0.8 to 1.2 and the formula (&phgr;D/&phgr;C)×(&eegr;C/&eegr;D)<1.

Abstract: The process for producing polymer blends by reacting at least one aminonitrile with water in the presence of thermoplastic polymers and optionally further polyamide-forming monomers comprises the following steps: (1) reacting at least one aminonitrile with water at a temperature from 90 to 400° C. and a pressure from 0.1 to 35×106 Pa to obtain a reaction mixture, (2) further reacting the reaction mixture at a temperature from 150 to 400° C.

Abstract: A polyamide resin composition is provided, which has an excellent flowability upon molding and shows a high strength when subjected to various welding methods. The resin composition for use in molding comprises (A) 96 to 99.9% by weight of a crystalline polyamide resin and (B) 0.1 to 4% by weight of a non-crystalline, partially aromatic copolymerized polyamide resin containing at least two kinds of aromatic monomer components, with the total content of (A) and (B) being 100% by weight, or comprises (A), (B) and (C) 5 to 200 parts by weight of an inorganic filler per 100 parts by weight of sum of (A) and (B). The polyamide resin compositions show an excellent weld strength.

Abstract: Biodegradable polyesteramides as defined in the specification are obtained by reacting a mixture consisting essentially of a1) a mixture consisting essentially of 35 to 95 mol % of adipic acid or ester-forming derivatives thereof, 5 to 65 mol % of terephthalic acid or ester-forming derivatives thereof, and 0 to 5 mol % of a compound containing sulfonate groups, a2) a mixture consisting essentially of 95.5 to 0.5 mol % of a dihydroxy compound, 0.5 to 99.5 mol % of an amino-C2-C12-alkanol or an amino-C5-C10-cycloalkanol, 0 to 50 mol % of a diamino-C1-C8-alkane, and 0 to 50 mol % of a 2,2′-bisoxazoline of the formula I  wherein R1 is as set forth in the specification, and a3) 0 to 5 mol %, based on a1), of a compound D as set forth in the specification; and other biodegradable polymers and thermoplastic molding compositions, their manufacture and their use for producing biodegradable moldings, adhesives, foams, and coatings.

Abstract: The present invention provides a card base which is degradable by microbes in natural environment. The card base is excellent in properties necessary for card bases, such as tensile strength, impact strength, flex temperature, heat resistance, resistance to thermal expansion and contraction, blocking resistance and humidity resistance, and has rigidity, bending resistance and durability. The card base contains, as essential components, a 3-hydroxybutylate/3-hydroxyvalerate copolymer and a lactic acid polymer, and, where necessary, a polycaprolactone or a high-molecular aliphatic polyester. The card base has a single-layer structure, or a sandwich structure further having overlay layers comprising a composition containing, as essential components, a lactic acid polymer and either or both of a polycaprolactone and a high-molecular alphatic polyester.

Abstract: A process of increasing the melt processing of synthetic polyamides, in particular pigmented and/or filled synthetic polyamide, by adding thereto an additive having the formula (I) wherein R1 represents a methyl group as such or in the form of a stabilizer masterbatch composition. The invention also relates to modified synthetic polyamides obtainable by this process having improved properties due to the stabilization effect of the compound of the above formula (I).

Abstract: Polyether ester amides having high water vapor permeability are disclosed. The amides which are prepared simply and reliably, crystallize quickly, are biodegradable and/or compostable, and are suitable in the manufacture of films by extrusion.

Abstract: A pipe whose at least interior wall structural component is comprised of:

Abstract: Implantable medical devices and drug delivery implants containing polyarylate random block copolymers are disclosed, along with methods for drug delivery and for preventing the formation of adhesions between injured tissues employing the polyarylate random block copolymers.

Abstract: The invention relates to wire enamels comprising as binders polyesterimide and/or polyamideimide, the binders comprising as monomeric building blocks polyoxyalkylenediamine having terminal amino groups. The polyoxyalkylenediamines are preferably selected from the group polyoxyethylenediamine, polyoxypropylenediamine and polyoxyethylenepropylenediamine. The invention also encompasses the use of the novel wire enamels for coating copper wires, especially thick round wires or profiled wires.

Abstract: The present invention relates to a golf ball comprising a core layer, at least one intermediate layer, and a cover layer, wherein the core layer or the at least one intermediate layer are formed from compositions comprising a polyamide, in the form of a homopolymer, a copolymer, or mixtures thereof. The compositions comprise about 1 to about 99 weight percent of at least one nonionomer polymer and about 99 to about 1 weight percent of at least one polyamide polymer. The polyamides of the present invention comprise polyamides and polyamide copolymers, such as nylons, nylon copolymers, and nylon block copolymers. The nonionomer polymer comprises a nonionomer thermoplastic elastomer or a nonionomer thermoplastic.

Abstract: The invention relates to a process for preparing a high-molecular polyamide or polyester by melt-mixing polyamide or polyester having a lower molecular weight with a carbonyl bislactam having formula 1, in which n=an integer of between 3 and 15.

Abstract: Colorless, amorphous, transparent copolyamides, their blends or alloys, and molded articles with high alternate bending strengths that can be produced from them. The copolyamides are preferably made of cycloaliphatic diamines combined with aliphatic dicarboxylic acids and small amounts of aromatic dicarboxylic acids. The copolyamides exhibit high strength, high rigidity, high heat distortion, and good solvent resistance.

Abstract: Disclosed in the present invention is a process for modifying a polyamide polymer comprising contacting a reactive modifier with diamine/diacid salt and/or an amino-acid of a hydrolyzed lactam or lactam to form a modified polyamide. A second embodiment of the present invention is a process for modifying a polyamide polymer comprising contacting a reactive modifier with diamine then contacting the resulting modified diamine with diacid and/or lactam to form a modified polyamide.

Abstract: Disclosed is a process for modifying polyamide polymers by attaching a substituted or unsubstituted 2-hydroxy-ethyl modifying group to the amide nitrogen atoms and the modified product formed. The process comprises contacting an epoxy containing molecule with diamine/diacid salt and/or an amino-acid of a hydrolyzed lactam or lactam to form a modified polyamide.

Abstract: A heat resisting adhesive composition for electronic parts and adhesive tapes of the present invention comprises a resin mixture of (A) 100 parts by weight of a polyimide comprising 100-30% by mol of at least one of the repeating units represented by the following formulas (1a) and (1b) and 0-70% by mol of at least one of the repeating unit represented by the following formulas (2a) and (2b) and (B) 5-150 parts by weight of a polyimide consisting of the repeating unit represented by the following formula (2a): wherein Ar represents a specified divalent group containing aromatic rings: wherein R is C1-C10 alkylene group or —CH2OC6H4—, the methylene group of which attaches to Si, and n is integer of 1-20.

Abstract: The invention relates to sulphonated polyimides, notably of formula (I) The invention also relates to an ion exchange membrane that includes such a polyimide and a fuel cell that includes such a membrane. The membranes of the invention have excellent durability and low cost and the fuel cells can be used, in particular, in electric vehicles.

Abstract: The present invention involves the preparation and use of polyester blend containing at least one acid terminated polyamide which give the improved color as compared to the prior art. The present invention comprises polyester blend composition having improved color comprising: (A) about 99.98 to about 95 weight percent of a polyester which comprises (1) a dicarboxylic acid component comprising repeat units from at least 85 mole percent terephthalic acid, and (2) a diol component repeat units from at least 85 mole percent ethylene glycol, based on 100 mole percent dicarboxlic acid and 100 mole percent diol; and (B) acid terminated polyamide.

Abstract: A resin matrix with resistances to alkali and acid such as a fluorene-containing epoxy acrylate and/or a benzocyclobutene resin includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative composite particles have a particle diameter in the range of 1-20 micrometers.

Abstract: 1. Synthetic polyamide comprising one or more of the following compounds: a) a compound having at least one sterically hindered amino group, [hereinafter referred to as compounds a)]; or b) a trimesinic acid trialkylamide, at least one alkyl group of which bears at least one free amino and/or alkylamino group [hereinafter referred to as compounds b)]; or c) a trialkylamino-substituted triazine, at least one alkyl group of which carries a free amino and/or alkylamino group [hereinafter referred to as compounds c)]; or d) a dyestuff that is free of sulphonic acid groups and contains at least one group that is reactive to a hydroxy and/or amino group [hereinafter referred to as compounds d)]; or e) a synthetic polyamide containing at least one group that is reactive with a hydroxy and/or amino group [hereinafter referred to as compounds e)].

Abstract: The present invention relates to water-dispersible materials (e.g. fibers or films) and to a method of producing same. The materials of the invention comprise a water soluble component, for example, a sulfonated polycondensate thermoplastic, and a modifying auxiliary component, for example, a low melt temperature thermoplastic.

Abstract: The invention relates to the use of polyamide moulding compounds, their alloys or blends, which contain at least one homopolyamide, which has been obtained from long-chained aliphatic monomer blocks with cycloaliphatic monomer blocks, in order to manufacture moulded members for optical or electro-optical applications.

Abstract: The invention provides an adhesive for electronic parts, which satisfies both points of heat resistance and the ability to form an adhesive layer, and of low-temperature adhesive property, and an adhesive tape for electronic parts making use of such an adhesive. The adhesive comprises, as a resin component, two polyimide resins different in glass transition temperature by at least 20° C. from each other, and an epoxy resin.

Abstract: Car part made from a polyamide composition wherein the polyamide substantially consists of 60-99 wt. % units derived from aliphatic dicarboxylic acids and diamines and the remaining chain units are derived from cycloaliphatic dicarboxylic acid(s) and an aliphatic diamine or cycloaliphatic diamine(s) and an aliphatic dicarboxylic acid.

Abstract: A polyamide resin composition comprising 100 parts by weight of a polyamide resin and 0.005 to 1.0 part by weight of at least one compound selected from the group consisting of a metal salt of a fatty acid, a diamide compound and a diester compound. The polyamide resin is obtained by solid phase-polymerizing a polyamide resin prepared by melt-polymerizing a diamine component containing 70 mol % or more of metaxylylenediamine and a dicarboxylic acid component containing 70 mol % or more of adipic acid, and preferably has a relative viscosity of 2.3 to 4.2 when measured at 25.degree. C. using a solution of 1 g polyamide resin in 100 ml of 96% sulfuric acid.

Abstract: This invention relates to a process for the production of masterbatches which contain short fibres or pulps and which may be used for the production of polymer compositions or rubber compositions.

Abstract: A method for producing polyamides, and to a method for producing primary polycondensates which are intermediates for polyamide production. More precisely, the invention relates to a method for producing primary polycondensates, which comprises a step of polycondensing a dicarboxylic acid component having a terephthalic acid content of from 60 to 100 mol % and a diamine component in which the amount of 1,9-nonanediamine and/or 2-methyl-1,8-octanediamine falls between 60 and 100 mol %, in the presence of water of being from 15 to 35% by weight, at a reaction temperature falling between 250.degree. C. and 280.degree. C. and under a reaction pressure (P) that satisfies the following formula (1):P.sub.0 .gtoreq.P.gtoreq.0.7 P.sub.0 (1)where P.sub.

Abstract: A highly polymerizable N-vinylcarboxylic acid amide having an N-1,3-butadienylcarboxylic acid amide content of 30 ppm or less, a process for producing the same, and a process for producing a homopolymer of N-vinylcarboxylic acid amide or a copolymer thereof with another copolymerizable monomer using the same. Also, a highly polymerizable N-vinyl-carboxylic acid amide is produced by thermal cracking or catalytic cracking of N-(1-alkoxyethyl)carboxylic acid amide or ethylidenebiscarboxylic acid amide, wherein the N-vinyl-carboxylic acid amide content of the N-(1-alkoxyethyl)-carboxylic acid amide or ethylenebiscarboxylic acid amide is 10 wt % or less.

Abstract: A treating agent for liquid crystal alignment, which comprises a polyimide precursor containing repeating units of the formula (1) and having a polymerization degree of from 0.05 to 5.0 dl/g as calculated as the reduced viscosity (in N-methylpyrrolidone at a temperature of 30.degree. C. at a concentration of 0.5 g/dl), and a solvent-soluble polyimide containing repeating units of the formula (2) and having a polymerization degree of from 0.05 to 5.0 dl/g as calculated as the reduced viscosity (in N-methylpyrrolidone at a temperature of 30.degree. C. at a concentration of 0.5 g/dl): ##STR1## wherein each of R.sup.1 and R.sup.3 is a tetravalent organic group constituting a tetracarboxylic acid or its derivative, R.sup.2 is a bivalent organic group constituting a diamine, R.sup.4 is a bivalent organic group constituting a diamine having no fluorine-containing alkyl group or no long chain alkyl group having at least 6 carbon atoms, and each of m and n is a positive integer.

Abstract: A method of producing an injection moldable polyimide resin composition, which is characterized by the fact that at least one aromatic acid anhydride and at least one aromatic diamine are directly combined with at least one polymer that can be melt molded at a temperature lower than 400.degree. C. Furthermore, the resulting product can be heat treated.