Mixed With Additional Polycarboxylic Acid And A Polyamine; Amino Carboxylic Acid Or Derivative; Polyamine Salt Of A Polycarboxylic Acid; Lactam; Or Polymer Derived Therefrom Patents (Class 525/432)
  • Patent number: 7348046
    Abstract: The invention relates to a polymer mixture of partially crystalline aliphatic polyamides and partially aromatic polyamides, the proportion of aliphatic polyamides being more than 50% by weight and the quantitative ratio of the aliphatic carbon atoms to amide bonds in the aliphatic polyamides being in the range of 8:1 to 12:1 and the partially aromatic polyamides, which are present in deficit, having, in addition to hexamethyleneterephthalamide (6T) units, further partially aromatic and/or aliphatic amide units and being predominantly partially crystalline. The invention relates furthermore to the use of polymer mixtures of this type for various application fields, in particular for express couplings or connectors for fuel lines.
    Type: Grant
    Filed: June 16, 2005
    Date of Patent: March 25, 2008
    Assignee: EMS-Chemie AG
    Inventors: Hanns-Jörg Liedloff, Eduard Schmid, Reinhard Hans Hagen
  • Patent number: 7339009
    Abstract: A cross-linked polyimide is disclosed. The cross-linked polyimide includes a polyimide and at least one oxygenated hydrocarbon. The oxygenated hydrocarbon cross-links the polyimide. A porous cross-linked membrane is also disclosed. The porous cross-linked membrane includes a support structure and a cross-linked polyimide disposed on the support structure. The cross-linked polyimide includes a polyimide; and at least one oxygenated hydrocarbon cross-linking the polyimide. Also disclosed are methods of making the cross-linked polyimide and the porous cross-linked membrane.
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: March 4, 2008
    Assignee: General Electric Company
    Inventor: Gary William Yeager
  • Patent number: 7338715
    Abstract: The polyimides of the present invention are derived from aliphatic diamines and show advantageous arc tracking performance (i.e., low arc tracking). These polyimides can be cured at low temperatures making them suitable as coverlay compositions in electronic circuitry. In addition, these polyimides are soluble and excellent in heat resistance and adhesion properties, showing a low dielectric constant even at 10 GHz or more.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: March 4, 2008
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: Kuppusamy Kanakarajan
  • Publication number: 20080003381
    Abstract: There has been a need for an overcoat film composition that functions as an overcoat film in terms of high transparency and flatness, and that also functions as an aligning film in terms of liquid crystal molecular alignment. There has also been a need to lower the cost of manufacturing a liquid crystal display element. There is provided an overcoat film composition comprising one or more compounds selected from the group of polyester-polyamic acids (A1) obtained using at least a polyhydric hydroxy compound (a1), a diamine (a2), and a compound having two or more acid anhydride groups (a3), and polyester-polyimides (A2) that are imidization products thereof, and a polyamic acid (B).
    Type: Application
    Filed: June 28, 2007
    Publication date: January 3, 2008
    Inventors: Hiroyuki Satou, Takahiro Mori
  • Patent number: 7300986
    Abstract: The present invention provides compounds that have an amide linkage and at least two epoxy groups. The compounds are preferably aliphatic.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: November 27, 2007
    Assignee: Dow3Global Technologies Inc.
    Inventors: David J. Brennan, Jerry E. White, Jimmy D. Earls, Mary L. Dettloff
  • Patent number: 7288586
    Abstract: A solid concentrate is provided having a combination of a transition metal present in an amount ranging from 1000 to 40,000 ppm (weight by metal) and a polyester polymer present in an amount of at least 40 wt. % based on the weight of the concentrate. Concentrates made with highly modified polyester polymers are easy to compound with transition metals forming less brittle polymer upon melt extrusion. Bottle preforms and oxygen scavenging bottles can be made from these concentrates by combining solid polyester particles, solid polyamide particles, and solid these concentrate particles c into an melt processing zone, forming a melt, and forming an article directly from the melt. The b* color and the L* color and the haze levels of the preforms are improved over the preforms made with liquid carriers instead of solid concentrates.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: October 30, 2007
    Assignee: Eastman Chemical Company
    Inventors: Mark Edward Stewart, Emerson Eston Sharpe, Jr., Benjamin Bradford Gamble, Steven Lee Stafford, Robert Noah Estep, James Carl Williams, Thomas Roger Clark
  • Patent number: 7273910
    Abstract: Process for the preparation of a functionalized polymer containing an additive, in which process there is formed a compound that contains, besides at least one blocked isocyanate group, a free amino, hydroxy or carboxy group; this compound is linked to an additive via the free amino, hydroxy or carboxy group in the additive; this additive linked to the compound mentioned is contacted with a polymer that contains at least one free amino or hydroxyl group, at a temperature above the polymer's melting point and at least above 150° C., such that the blocked isocyanate group reacts with the free amino or hydroxy group of the polymer to form the functionalized polymer. The invention also relates to the intermediate products formed in the process and in the preparation thereof. Lastly, the invention relates to functionalized polymers and polymer compositions containing the functionalized polymer.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: September 25, 2007
    Assignee: DSM IP Assets B.V.
    Inventors: Jacobus Antonius Loontjens, Bartholomeus Johannes Margretha Plum, Albert Arnold Van Geenen, Weihua Ming
  • Patent number: 7265187
    Abstract: In the process of the present invention, a polyamide A1 and an organized clay B are mixed mainly by dispersive mixing, and after added with a polyamide A2, mixed mainly by distributive mixing in a corotating intermeshing twin-screw extruder so designed as to effect the dispersive mixing and the distributive mixing. The organized clay B is completely and finely dispersed and distributed throughout the resultant polyamide composite material. Shaped articles such as films and sheets made of the polyamide composite material exhibit excellent gas barrier properties and transparency with little malodor mainly attributable to the decomposed products of the organizing agent for preparing the organized clay B.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: September 4, 2007
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Jun Mitadera, Kazunobu Maruo
  • Publication number: 20070179252
    Abstract: A polyamide molding composition is described, comprising a proportion by weight of from 50 to 99% by weight of at least one transparent homopolyamide and/or copolyamide, a proportion by weight of from 1 to 50% by weight of at least one further polymer whose glass transition temperature is below 80° C., and also a proportion by weight of from 0.001 to 2.0% by weight of at least one photochromic dye. Further dyes and/or additives can optionally be present. The invention moreover encompasses articles manufactured therefrom, a particular example being photochromic ophthalmic lenses.
    Type: Application
    Filed: January 24, 2007
    Publication date: August 2, 2007
    Applicant: EMS-CHEMIE AG
    Inventors: Nikolai Lamberts, Friedrich Severin Buhler, Ralf Hala
  • Patent number: 7202298
    Abstract: A polyamide resin composition for part of an engine cooling water system contains 100 parts by weight of a polyamide resin made of(A) from 50 to 98% by weight of nylon 66, (B) from 1 to 30% by weight of an aromatic polyamide resin, and (C) from 1 to 20% by weight of nylon 12; and (D) from 5 to 150 parts by weight of an inorganic filler, with the total content of nylon 66, the aromatic polyamide resin and nylon 12 being 100% by weight.
    Type: Grant
    Filed: October 22, 2003
    Date of Patent: April 10, 2007
    Assignee: Ube Industries, Ltd.
    Inventors: Seiichi Arakawa, Tadashi Ogawa
  • Patent number: 7169878
    Abstract: A diamine compound represented by the formula (1): wherein R1 is a trivalent organic group, each of X1 and X2 is a bivalent organic group, X3 is an alkyl or fluoroalkyl group having from 1 to 22 carbon atoms, or a cyclic substituent selected from aromatic rings, aliphatic rings, heterocyclic rings and their substituted groups, and n is an integer of from 2 to 5. And, a polyimide precursor and a polyimide synthesized by using the diamine compound; and a treating agent for liquid crystal alignment containing the polyimide precursor and/or the polyimide.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: January 30, 2007
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Kazuyoshi Hosaka, Hideyuki Nawata
  • Patent number: 7166680
    Abstract: Provided herein is a poly(ester amide) (PEA) polymer blend and a polymeric coating containing the PEA polymer blend. The PEA polymer blend has a Tg above the Tg of poly(ester amide benzyl ester) (PEA-Bz) or the Tg of poly(ester amide TEMPO). The PEA polymer blend can form a coating on an implantable device, one example of which is a stent. The coating can optionally include a biobeneficial material and/or optionally with a bioactive agent. The implantable device can be used to treat or prevent a disorder such as one of atherosclerosis, thrombosis, restenosis, hemorrhage, vascular dissection or perforation, vascular aneurysm, vulnerable plaque, chronic total occlusion, claudication, anastomotic proliferation for vein and artificial grafts, bile duct obstruction, ureter obstruction, tumor obstruction, and combinations thereof.
    Type: Grant
    Filed: October 6, 2004
    Date of Patent: January 23, 2007
    Assignee: Advanced Cardiovascular Systems, Inc.
    Inventors: Jessica Renee DesNoyer, Stephen Dirk Pacetti, Lothar Kleiner
  • Patent number: 7151127
    Abstract: The present invention relates to the use of thermoplastic polyamide moulding compositions with reduced or strongly reduced formation of solid deposits and/or coverings during a thermoplastic conversion into commodity goods in discontinuous processes in particular injection moulding, and continuous processes such as the extrusion of films, fibers, tubes and jacketings containing at least 20% by weight polyamide and/or at least one copolymer with at least 20% by weight polyamide components.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: December 19, 2006
    Assignee: Ems-Chemie AG
    Inventors: Georg Stoeppelmann, Ornulf Rexin, Eduard Schmid, Ralph Kettl, Manfred Hewel
  • Patent number: 7148314
    Abstract: A method for preparation of a sulfonic and or sulfonic acid salt containing polyimide resins comprising melt reaction of a polyimide resin with an organic compound, wherein the organic compound contains at least one aliphatic primary amine functionality and at least one other functionality selected from the group consisting of sulfonic acids, sulfonic acid salts or mixtures thereof.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: December 12, 2006
    Assignee: General Electric Company
    Inventors: Robert R. Gallucci, Tara J. Smith
  • Patent number: 7147906
    Abstract: In one aspect the present invention provides a storage medium for data, the storage medium comprising: a) a substrate, a physical portion of which comprises at least one polyimide, and b) at least one data layer on the substrate. The substrate comprising a polyimide exhibits low axial displacement and beneficial damping characteristics.
    Type: Grant
    Filed: June 24, 2003
    Date of Patent: December 12, 2006
    Assignee: General Electric Company
    Inventors: Eugene David Herrmann, James Anthony Cella, John Bradford Reitz, Racid Kerboua, Irene Dris
  • Patent number: 7122233
    Abstract: The invention relates to a transparent composition comprising, by weight, the total being 100%: 5 to 40% of an amorphous polyamide (B) which results essentially from the condensation: either of at least one diamine chosen from cycloaliphatic diamines and aliphatic diamines and of at least one diacid chosen from cycloaliphatic diacids and aliphatic diacids, at least one of these diamine or diacid units being cycloaliphatic, or of a cycloaliphatic ?,?-aminocarboxylic acid, or of a combination of these two possibilities, and optionally of at least one monomer chosen from ?,?-aminocarboxylic acids or the possible corresponding lactams, aliphatic diacids and aliphatic diamines, 0 to 40% of a supple polyamide (C) chosen from copolymers containing polyamide blocks and polyether blocks and copolyamides, 0 to 20% of a compatabilizer (D) for (A) and (B), 0 to 40% of a supple modifier (M), with the condition that (C)+(D)+(M) is between 0 and 50%, the remainder to 100% being a semi-crystalline polyamide (A).
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: October 17, 2006
    Assignee: Atofina
    Inventors: Thibaut Montanari, Christelle Recoquille
  • Patent number: 7071282
    Abstract: Disclosed herein are polyetherimide compositions comprising structural units of the formula: derived from at least one benzimidazole diamine, wherein R1 and R2 are independently selected from hydrogen and C1–C6 alkyl groups; “A” comprises structural units of the formulae: or mixtures of the foregoing structural units; wherein “D” is a divalent aromatic group, R3 and R10–R12 are independently selected from hydrogen, halogen, and C1–C6 alkyl groups; “q” is an integer having a value of 1 up to the number of positions available on the aromatic ring for substitution; and “W” is a linking group; and “B” comprises substituted and unsubstituted arylene groups having from about 6 to about 25 carbon atoms. Methods for producing the polyetherimide compositions are also disclosed herein.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: July 4, 2006
    Assignee: General Electric Company
    Inventors: Havva Acar, Daniel Joseph Brunelle
  • Patent number: 7064176
    Abstract: The invention relates to novel polyhydroxyamide compounds that, in the form of their oxazoles, ane suited as a coating material, particularly for electronic components. The invention also relates to a method for producing these novel compounds and to the use thereof.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: June 20, 2006
    Assignee: Infineon Technologies AG
    Inventors: Marcus Halik, Klaus Lowack, Recai Sezi, Andreas Walter
  • Patent number: 7056975
    Abstract: A thermoplastic resin composition composed of a thermoplastic resin and a polyamide elastomer in which the polyamide elastomer contains at least 50 weight % of a polyetheramide elastomer prepared by polymerization of a tri-block polyetherdiamine compound, a polyamide-forming monomer is an aminocarboxylic acid and/or a lactam compound, and a dicarboxylic acid compound, in which the tri-block polyetherdiamine compound has the formula (1): [each of x and y is an integer of 1 to 20, and y is an integer of 4 to 50].
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: June 6, 2006
    Assignee: Ube Industries, Ltd.
    Inventors: Hideki Fujimura, Toshio Moriyama, Shinya Matsuda
  • Patent number: 7053169
    Abstract: The invention relates to new thermoplastically processible transparent polyamide molding materials based on copolyamides containing diamines and dicarboxylic acids with aromatic cores which exhibit a high index of refraction nD20 over 1.59 and a low density under 1.3 g/cm3. At the same time, a low birefringence, high hardness, and scratchresistance are achieved. The polyamide molding materials are fabricated by means of conventional pressure reactors (autoclaves) according to a modified technique. The granulate that is produced from the inventive molding materials is reshaped by thermoplastic processes like injection molding, particularly in multichamber cavity tools. The invention also relates to the utilization of the inventive molding materials for producing optical lenses.
    Type: Grant
    Filed: April 18, 2002
    Date of Patent: May 30, 2006
    Assignee: Ems-Chemie AG
    Inventor: Friedrich Severin Bühler
  • Patent number: 7053168
    Abstract: A method for preparing a polyimide includes introducing a mixture of an oligomer and a solvent to an extruder, removing solvent via at least one extruder vent, and melt kneading the oligomer to form a polyimide. The polyimide has a low residual solvent content. The method is faster than solution polymerization of polyimides, and it avoids the stoichiometric inaccuracies associated with reactive extrusion processes that use monomers as starting materials.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: May 30, 2006
    Assignee: General Electric Company
    Inventors: Norberto Silvi, Mark Howard Giammattei, Paul Edward Howson, Farid Fouad Khouri
  • Patent number: 7048712
    Abstract: A combination of polymeric components provides desired characteristics in forming medical instruments such as catheters and balloons for dilatation catheters. For example, a balloon material is formed from a blend of polymeric components, including a first crystalline polymeric component and a second softening polymeric component. Where the first two components are generally incompatible, the balloon material can also include a third compatibilizing agent to facilitate blending the first two polymeric components together.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: May 23, 2006
    Assignee: Advanced Cardiovascular Systems, Inc.
    Inventors: Ziyun Chen, Tai Cheng, Ketan Muni, Udayan Patel, Robert Saltman
  • Patent number: 7049006
    Abstract: A multilayer structure based on polyamides, comprising: a first layer (1) formed from a polyamide P1 or from a blend of a polyamide P1 and a polyolefin PO1 having a P1 polyamide matrix, optionally, a layer (2a) formed from EVOH; a layer (2) formed from a blend of PA-6/12 copolyamides, one comprising by weight more 6 than 12 and the other more 12 than 6; a layer (3) formed from a polyamide P3, it being possible for P1 and P3 to be identical or different, the layers (1), (2), (2a) and (3) being successive and adhering to one another in their respective contact regions.
    Type: Grant
    Filed: November 2, 2004
    Date of Patent: May 23, 2006
    Assignee: Arkema
    Inventor: Christophe Lacroix
  • Patent number: 7026436
    Abstract: The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16 and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C. The present invention also relates to compositions comprising the polyimide adhesive of the present invention, including polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit applications.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: April 11, 2006
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: Kuppusamy Kanakarajan
  • Patent number: 7022810
    Abstract: A new class of hybrid organic-inorganic materials, and methods of synthesis, that can be used as a proton exchange membrane in a direct methanol fuel cell. In contrast with Nafion® PEM materials, which have random sulfonation, the new class of materials have ordered sulfonation achieved through self-assembly of alternating polyimide segments of different molecular weights comprising, for example, highly sulfonated hydrophilic PDA-DASA polyimide segment alternating with an unsulfonated hydrophobic 6FDA-DAS polyimide segment. An inorganic phase, e.g., 0.5–5 wt % TEOS, can be incorporated in the sulfonated polyimide copolymer to further improve its properties. The new materials exhibit reduced swelling when exposed to water, increased thermal stability, and decreased O2 and H2 gas permeability, while retaining proton conductivities similar to Nafion®. These improved properties may allow direct methanol fuel cells to operate at higher temperatures and with higher efficiencies due to reduced methanol crossover.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: April 4, 2006
    Assignee: Sandia Corporation
    Inventor: Christopher J. Cornelius
  • Patent number: 7014919
    Abstract: A composition comprising, by weight, the total being 100%: a semi-crystalline polyamide (A); 5 to 40% of an amorphous polyamide (B) which results from the condensation: of (B1) at least one cycloaliphatic diamine or aliphatic diamine, with at least one cycloaliphatic diacid or aliphatic diacid, at least one of the diamine or diacid units being cycloaliphatic, or (B2) of a cycloaliphatic ?,?-aminocarboxylic acid, or (B3) of a combination of (B1), and (B2), and optionally at least one of (B1), (B2) and (B) being condensed with at least one monomer selected from the group consisting of a ?,?-aminocarboxylic acid or the corresponding lactam, an aliphatic diacid, and an aliphatic diamine; 0 to 40% of a supple polyamide (C) selected from the group consisting of (C1) copolymers containing polyamide blocks and polyether blocks, and (C2) copolyamides; 0 to 20% of a compatabilizer (D) for (A) and (B); 0 to 40% of a supple modifier (M); with the condition that (C)+(D)+(M) is between 0 and 50%, the remainder to 100% b
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: March 21, 2006
    Assignee: RKEMA
    Inventors: Thibaut Montanari, Christelle Recoquille
  • Patent number: 7011784
    Abstract: An industrial nylon composition comprises nylon block copolymerized or blended with poly-m-phenyleneisophthalamide (PmIA), thereby forming a block copolyamide composition or blend, comprised of molecules of nylon in stable and regular polymeric arrangement with molecules of PmIA. The subject nylon composition has industrially useful heat resistance, flexible elongation and tensile strength, while retaining many of nylon's desirable qualities.
    Type: Grant
    Filed: January 28, 2003
    Date of Patent: March 14, 2006
    Inventors: Lung-Tao Lin, Ming-Fung Lin
  • Patent number: 7009029
    Abstract: Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 ?m. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: March 7, 2006
    Assignee: Kuraray Co., Ltd.
    Inventors: Hideaki Oka, Hideharu Matsuoka, Toru Kuki
  • Patent number: 6958374
    Abstract: The present invention relates to semiaromatic semi-crystalline thermoplastic polyamide moulding materials having improved processing behavior, increased flowability, improved surface quality and improved mechanical properties, in particular, in conditioned state, the matrix of the polyamide moulding materials according to the present invention comprising at least 3 components: a semi-crystalline copolyamide (A) having the composition 66/6I/6T, a PA prepolymer (B) having the composition 6T/6I/66 or 6T/6I/6 and an amorphous copolyamide (C) having the composition 6I/6T.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: October 25, 2005
    Assignee: EMS-Chemie AG
    Inventors: Friedrich Severin Bühler, Alwin Hermann Schwitzer
  • Patent number: 6956099
    Abstract: Copolymers having linked internal polyether blocks and internal polyamide blocks have advantageous physical properties and solvent-gelling abilities. The copolymer may be prepared from a reaction mixture that contains 1,4-cyclohexane dicarboxylic acid (CHDA) and poly(alkyleneoxy) diamine (PAODA). Optionally, the reaction mixture contains no monofunctional compound reactive with either amine or carboxylic acid groups, however some of this monofunctional compound may be present. Dimer diamine and/or dimer acid may be present in the reaction mixture. A copolymer may also be prepared from a reaction mixture containing dimer acid and at least two diamine compound(s) including PAODA and short-chain aliphatic diamine having 2-6 carbons (SDA), wherein: a) the reaction mixture comprises x grams of PAODA and y grams of SDA, and x/(x+y) is 0.8-0.98; b) the reaction mixture weighs z grams, and x/z is at least 0.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: October 18, 2005
    Assignee: Arizona Chemical Company
    Inventor: Mark S. Pavlin
  • Patent number: 6956100
    Abstract: An object of the present invention is to provide a polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as vanish. The composition and vanish are characterized by comprising as essential ingredients a phenolic hydroxyl group-having aromatic polyamide resin and a cycloalkanone as a solvent and preferably further containing a curable resin.
    Type: Grant
    Filed: October 18, 2001
    Date of Patent: October 18, 2005
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masahiro Imaizumi, Toyofumi Asano, Masaki Shinmoto
  • Patent number: 6949618
    Abstract: Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multifunctional amine represented by Formula (1): (wherein A represents a tetravalent organic group, and n represents an integer of 0 to 3) and tetracarboxylic diester represented by Formula (2): (wherein B represents a tetravalent organic group having 1 to 20 carbon atoms, and R1 and R2 each represent independently an alkyl group having 1 to 5 carbon atoms).
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: September 27, 2005
    Assignee: Chisso Corporation
    Inventor: Takashi Kato
  • Patent number: 6943231
    Abstract: Transparent polyamide molding materials are provided which are characterized in that they have a melting enthalpy between 0 and 12 J/g and the polyamides are constituted of 100 mole-% of a diamine mixture having 10-70 mole-% of PACM [bis-(4-amino-cyclohexyl)-methane] with less than 50 wt.
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: September 13, 2005
    Assignee: EMS-Chemie AG
    Inventor: Friedrich Severin Bühler
  • Patent number: 6930165
    Abstract: The invention concerns polyamides modified by a multifunctional compound. Finished articles formed from said polyamides or from compositions based on said polyamides exhibit excellent mechanical properties, and a very good surface appearance. The modified polyamide is obtained by mixing in melted form a polyamide and a polyamide macromolecular compound comprising star-shaped or H-shaped macromolecular chains.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: August 16, 2005
    Assignee: Rhodia Engineering Plastics S.r.l.
    Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
  • Patent number: 6927274
    Abstract: Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below: wherein chemical structure A2 includes an alicyclic compound but not an aromatic compound such as a benzene ring so that they provide excellent light transmission over a wide wavelength range. The polyimide precursors are imidized at 7.5% or more and 36% or less so that they are less soluble in developing solutions and therefore are not dissolved in the developing solutions at unexposed parts. Thus, the resin compositions of the present invention can be used to form a resin film having a precise pattern by exposure and development.
    Type: Grant
    Filed: October 24, 2003
    Date of Patent: August 9, 2005
    Assignee: Sony Chemicals Corp.
    Inventors: Mamiko Nomura, Masatoshi Hasegawa, Junichi Ishii, Tadashi Akamatsu
  • Patent number: 6919418
    Abstract: Methods of reducing the amount of undesirable cyclic oligomer by-products in the production of polyetherimides are disclosed. The resulting polyetherimides have enhanced thermomechanical properties.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: July 19, 2005
    Inventors: Farid Fouad Khouri, Daniel Joseph Brunelle, Donald Scott Johnson
  • Patent number: 6919422
    Abstract: A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: July 19, 2005
    Assignee: General Electric Company
    Inventors: Robert R Gallucci, Roy Ray Odle, William A. Kernick, III, Mark Alan Sanner
  • Patent number: 6916517
    Abstract: A composition comprising, by weight, the total being 100%: 5 to 40% of an amorphous polyamide (B) which results from the condensation of at least one aromatic diacid and with at least one diamine said diamine being optionally cycloaliphatic, and, optionally with at least one monomer chosen from: ?,?-aminocarboxylic acids, aliphatic diacids, aliphatic diamines, 0 to 40% of a supple polyamide (C) chosen from copolymers containing polyamide blocks, polyether blocks and copolyamides, 0 to 20% of a compatibilizer (D) for (A) and (B), (C)+(D) is between 2% and 50%, with the condition that (B)+(C)+(D) is not less than 30%, and the difference to 100% is made up with a semi-crystalline polyamide (A). This composition can be molded into transparent sheets treated by a sublimation printing process at relatively low temperatures.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: July 12, 2005
    Assignee: Arkema
    Inventors: Thibaut Montanari, Christelle Recoquille
  • Patent number: 6913804
    Abstract: The present invention relates to a composition comprising, per 100 parts by weight: 99 to 60 parts of a thermoplastic polymer (D), 1 to 40 parts of (A)+(B)=(C) (A) being a copolymer comprising polyamide blocks and polyether blocks, (B) being a polymer or an oligomer which comprises, in its chain, at least one ionic functional group and is chosen from: polyamides, copolymers comprising polyamide blocks and polyether blocks, thermoplastic polyesters or polyesteramides, copolymers comprising polyester blocks and polyether blocks, polyethers, polyurethanes. The invention also relates to the blends of (A) and (B) as product.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: July 5, 2005
    Assignee: Arkema
    Inventors: Christophe Lacroix, Reinhard Linemann, Philippe Blondel, Yves Lermat
  • Patent number: 6911519
    Abstract: A series of low melting and low viscosity phenylethynyl end-capped polyimides (PETIs) possessed of long term thermal and mechanical stability useful as films, melt coatings, adhesives, matrix and RTM resins and particular as coatings for optical fibers and phenylethynyl end-capped bismides blended with PETIs are disclosed. Processes for their production including: 1) modification of PETI-5 oligomer by molecular weight adjustments by blending with reactive low melting phenylethynyl end-capped imide monomers, 2) modification of the PETI-5 backbone structure with other diamine components, and 3) modification of the PETI-5 backbone with bulky fluorinated groups are also disclosed.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: June 28, 2005
    Assignee: University of Connecticut
    Inventors: Daniel A. Scola, Christopher D. Simone
  • Patent number: 6908685
    Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4?-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: June 21, 2005
    Assignees: E. I. du Pont de Nemours and Company, DuPont-Toray Co. Ltd.
    Inventors: Kenji Uhara, Kouichi Sawasaki, Naofumi Yasuda, Brian C. Auman, John D. Summers
  • Patent number: 6906165
    Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using a multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: June 14, 2005
    Assignee: Rhodia Engineering Palstics S.R.L.
    Inventors: Giuseppe Di Silvestro, Franco Speroni, Cuiming Yuan, Haichun Zhang
  • Patent number: 6887930
    Abstract: A polyamide composition comprising 50 to 90 parts by weight of (A) semiaromatic polyamides having dicarboxylic acid units containing 60 to 100 mole % of terephthalic acid units and diamine units containing 60 to 100 mole %, in total, of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 50 to 10 parts by weight of (B) aliphatic polyamides in which the average of total carbon atoms of dicarboxylic acid units and diamine units per one amide group is 7 to 12; having excellent moldability, toughness, light-weightness, hot water and steam resistance, heat resistance, mechanical characteristics, low water absorption, chemical resistance and melt stability; and are applicable for molding at low temperature with a conventional steam-heating or a conventional hot-water-heating type mold to give molded articles having sufficient heat resistance, rigidity at high temperature and dimensional stability.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: May 3, 2005
    Assignee: Kuraray Co., Ltd.
    Inventors: Koichi Uchida, Tetsuya Hara
  • Patent number: 6884865
    Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using at least one multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are more particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: April 26, 2005
    Assignee: Rhodia Engineering Plastics S.R.L.
    Inventors: Giuseppe Di Silvestro, Franco Speroni, Cuiming Yuan, Haichun Zhang
  • Patent number: 6870011
    Abstract: A composition comprising (a) a resin composition comprising a block copolymer of the formula hydrocarbon-polyether-polyamide-polyether-hydrocarbon; and (b) a polar liquid. The block copolymer may be prepared by a process comprising reacting together reactants comprising dimer acid, diamine, and a polyether having termination at one end selected from amine, hydroxyl and carboxyl, and termination at another end selected from hydrocarbons. The polar liquid may be one or more of an aromatic liquid, a polar aprotic liquid, a ketone-containing liquid, an ester-containing liquid, an ether-containing liquid, an amide-containing liquid and a sulfoxide-containing liquid. The composition may be a gel at room temperature.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: March 22, 2005
    Assignee: Arizona Chemical Company
    Inventors: Richard C. MacQueen, Mark S. Pavlin
  • Patent number: 6864354
    Abstract: The invention relates to modified polyamides, and more particularly to polyamides containing units of the type obtained by reacting a diacid with a diamine, modified with a multifunctional compound. The finished articles shaped from these polyamides or from compositions based on these polyamides have excellent mechanical properties and also a very good surface aspect. The modified polyamide according to the invention is obtained by melt-blending polyamides of different natures, in the presence of a multifunctional compound.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: March 8, 2005
    Assignee: Rhodia Engineering Plastics S.r.l.
    Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
  • Patent number: 6864348
    Abstract: Polyetherpolyamide elastomer showing a low water absorption, a high stress relaxation, and a high elastic recovery percentage of elongation is obtainable by polymerizing an aminocarboxylic acid compound and/or a lactam compound, a triblock polyetherdiamine compound having the following formula, and a dicarboxylic acid compound: [x is a value of 1 to 20, y is a value of 4 to 50, z is a value of 1 to 20].
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: March 8, 2005
    Assignee: UBE Industries, Ltd.
    Inventors: Hiroshi Okushita, Tadao Muramatsu, Teruaki Fujii
  • Patent number: 6855755
    Abstract: The present invention relates to a polyamide resin composition comprising: 100 parts by weight of a polyamide resin mixture comprising (A) 20 to 90% by weight of a polyamide 6 resin, a polyamide 66 resin or mixture thereof and (B) 10 to 80% by weight of an aromatic polyamide resin; and (C) 0 to 300 parts by weight of an inorganic filler, said aromatic polyamide resin being having diamine units comprising 10 to 50 mol % of paraxylylenediamine units and 50 to 90 mol % of methaxylylenediamine units, and aliphatic dicarboxylic acid units.
    Type: Grant
    Filed: August 2, 2000
    Date of Patent: February 15, 2005
    Assignee: Mitsubishi Engineering-Plastics Corporation
    Inventors: Kei Morimoto, Noriyoshi Watanabe, Hiroshi Urabe, Masaki Hirono, Kazuo Yamamiya
  • Patent number: 6852829
    Abstract: A process for the simultaneous preparation of polyamide-6 with at least two different viscosities comprising prepolymerisation of ?-caprolactam and/or other polyamide-6 precursors in the presence of water, wherein at least part of the necessary water is supplied to the prepolymerisation via the gas phase and the obtained prepolymer is progressively moved and treated with an inert gas in at least two condensation reaction zones or reactors, placed in series, and the prepolymerisation and condensation are carried out in reactor(s) or reaction zones having a self-renewing interface between molten phase and gas phase with a large surface/volume ratio of the molten phase and the molten phase is relatively strong mixed.
    Type: Grant
    Filed: April 17, 2001
    Date of Patent: February 8, 2005
    Assignee: DSM N.V.
    Inventor: Wim Buijs
  • Patent number: 6849706
    Abstract: Copolyetherimides comprise phthalimide structural units comprising both 3- and 4-linkages, wherein the designations 3-linkage and 4-linkage refer to the isomeric positions on the phthalimide ring in the totality of phthalimide-comprising structural units in the copolymer. The products have excellent properties, including high glass transition and heat distortion temperatures, high ductility and good melt flow properties, and low polydispersity.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: February 1, 2005
    Assignee: General Electric Company
    Inventors: Daniel Joseph Brunelle, Havva Yagci Acar, Farid Fouad Khouri, William David Richards
  • Patent number: 4835406
    Abstract: A plug in circuit component is provided for switching headlights of vehicles such as automobiles between two positions; full beam and half beam. When the headlight is switched from low to high beam, the low beam disappears in conventional systems, however with the present invention the low beam remains illuminated even when the high beam setting is on and this is accomplished preferably by the use of a diode in the device.
    Type: Grant
    Filed: January 29, 1987
    Date of Patent: May 30, 1989
    Inventor: Sylve Ronndahl