Mixed With Additional Polycarboxylic Acid And A Polyamine; Amino Carboxylic Acid Or Derivative; Polyamine Salt Of A Polycarboxylic Acid; Lactam; Or Polymer Derived Therefrom Patents (Class 525/432)
  • Patent number: 6136915
    Abstract: An aromatic polyamide resin composition excellent in flowability and suitability for short-cycle molding and having high heat resistance is disclosed, which is a partly aromatic polyamide resin composition comprising 50 to 95% by weight of (A) a crystalline partly aromatic copolyamide resin containing one kind of aromatic monomer units, and 5 to 50% by weight of at least one of (B) a crystalline partly aromatic copolyamide resin containing at least two kinds of aromatic monomer units and (C) a noncrystalline partly aromatic polyamide resin.
    Type: Grant
    Filed: February 1, 1999
    Date of Patent: October 24, 2000
    Assignee: UBE Industries, Ltd.
    Inventors: Shinji Ohara, Hiroaki Chakihara, Satoru Nakamoto
  • Patent number: 6136908
    Abstract: A method for producing a thermoplastic nanocomposite is disclosed. The method comprises the steps of: (a) contacting a swellable layered silicate with a polymerizable aminoaryl lactam monomer to achieve intercalation of said lactam monomer between adjacent layers of said layered silicate; and (b) admixing the intercalated layered silicate with a thermoplastic polymer, and heating the admixture to provide for flow of said polymer and polymerization of the intercalated lactam monomer to cause exfoliation of said layered silicate, thereby forming a thermoplastic nanocomposite having exfoliated silicate layers dispersed in a thermoplastic polymer matrix.
    Type: Grant
    Filed: June 17, 1999
    Date of Patent: October 24, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Chien-Shiun Liao, Wen-Faa Kuo, Li Kuei Lin
  • Patent number: 6121388
    Abstract: A polyamide resin composition comprising 100 parts by weight of a polyamide resin, from 0.01 to 100 parts by weight of a liquid-crystalline resin, and from 0.01 to 5 parts by weight of an acid anhydride all the time has good fluidity even when it is left for a relatively long period of residence time in a cylinder of a molding machine while it is molded, and has good moldability. The amount of cushion resin needed for molding the composition fluctuates little, and the failure such as cobwebbing in molding the composition is reduced. The moldings of the composition have good impact resistance and good outward appearance. The composition is most suitable to producing box-type moldings with thin-wall parts.
    Type: Grant
    Filed: April 6, 1999
    Date of Patent: September 19, 2000
    Assignee: Toray Industries, Inc.
    Inventors: Hidevuki Umetsu, Masahiro Sugimura, Yoshiki Makabe
  • Patent number: 6103806
    Abstract: A polyimide resin composition is disclosed herein which comprises 5 to 60% by weight of a polyimide [polyimide (1)] having a repeating unit represented by the chemical formula 1 and 40 to 95% by weight of a polyimide [polyimide (2)] having a repeating unit represented by the chemical formula 2.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: August 15, 2000
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hiroyasu Kido, Masaji Yoshimura, Yasunori Yoshida, Kayako Yanagihara, Hideaki Oikawa, Shoji Tamai, Tomohito Koba
  • Patent number: 6103809
    Abstract: The present invention relates to a thermoplastic composition comprising at least one crystalline water sensitive polymer and at least one amorphous water sensitive polymer. The thermoplastic composition may optionally further comprise additional ingredients such as other polymers, tackifying resins, plasticizers, waxes, and mixtures thereof. The thermoplastic compositions are useful in a variety of applications wherein water or moisture sensitive thermoplastic materials are employed such as various packaging adhesive applications including case and carton sealing, remoistenable adhesives, repulpable/recyclable adhesives and multiwall bag applications. The present invention is also useful for moisture activatable reinforcement strings and opening tapes for corrugated containers, as well as for a variety of nonwoven applications such as body fluid impermeable barriers, core stabilization adhesives, and construction adhesives.
    Type: Grant
    Filed: November 18, 1998
    Date of Patent: August 15, 2000
    Assignee: H.B. Fuller Licensing & Financing, Inc.
    Inventors: Sharf U. Ahmed, Andualem Emiru, Leslie J. Clapp, Mark S. Kroll, Greg J. VanLith
  • Patent number: 6093790
    Abstract: The present invention provides polyimides and co-polyimides that are organosoluble. The polyimides and co-polyimides are prepared from an aromatic diamine having tert-butyl group, i.e., 1,4-bis(4-aminophenoxy)-2-tert-butyl-benzene, or its mixture with other diamines, and a mixture of dianhydrides that containing DSDA or 6FDA or other diether-dianhydrides.
    Type: Grant
    Filed: August 18, 1998
    Date of Patent: July 25, 2000
    Assignee: National Science Council
    Inventors: Chin-Ping Yang, Huei-Wen Yang
  • Patent number: 6075116
    Abstract: The present invention provides a highly impact resistant polyamide composition which comprises a polyamide resin and an acid modification product of a metallocene catalyzed polyolefin elastomer. The invention also provides a less hygroscopic and highly impact resistant polyamide composition which comprises a polyamide resin, novolak phenol and an acid modification product of a metallocene catalyzed polyolefin elastomer. Used as the polyamide resin is less expensive nylon 6.
    Type: Grant
    Filed: June 30, 1998
    Date of Patent: June 13, 2000
    Assignee: Kishimoto Sangyo Co., Ltd.
    Inventors: Takeshi Moriwaki, Toshiharu Sakaguchi
  • Patent number: 6048521
    Abstract: Implantable medical devices and drug delivery implants containing polyarylate random block copolymers are disclosed, along with methods for drug delivery and for preventing the formation of adhesions between injured tissues employing the polyarylate random block copolymers.
    Type: Grant
    Filed: May 27, 1998
    Date of Patent: April 11, 2000
    Assignee: Rutgers, The State University
    Inventors: Joachim B. Kohn, Chun Yu
  • Patent number: 6048948
    Abstract: There is a provided a method to produce a polymer composite material in which the rigid polymer (R.sub.m).sup.n is dispersed uniformly at the molecular level in the flexible polymer (M), preferably by both polymerization with no solvent in the molten and mixed state and subsequent polymerization in the solid state. According to the preferred embodiment of the present invention, the polymer composite material is produced by polymerization with no solvent in the molten and mixed state. In the case that the rigid polymer is polymerized from the monomer having a slow polymerization rate, in order to prevent roughness of the rigid polymer during polymerization, the polymerization in the molten state is stopped at the polymerization degree equal to that of an oligomer and the resulting composite is subsequently polymerized in the solid state to increase the polymerization degree of the rigid polymer.
    Type: Grant
    Filed: September 19, 1997
    Date of Patent: April 11, 2000
    Assignee: Mazda Motor Corporation
    Inventor: Takahiro Tochioka
  • Patent number: 6046282
    Abstract: Reactive diluents comprise the amide and/or imidazoline reaction products of low molecular weight carboxylic acids, such as acetic acid, and polyalkyleneamines, such as 2-aminoethylpiperazine (AEP) and triethylenetetramine (TETA). The reactive diluents are prepared by condensation reaction of the carboxylic acid and the polyalkyleneamine at elevated temperature generating a mixture of unreacted polyalkyleneamine, amides and/or imidazolines. The reactive diluent reaction products are used to reduce the viscosity of high viscosity polyamidoamines prepared from fatty dimer acids and polyethyleneamines. Also disclosed is an epoxy composition comprising the epoxy curative composition of a polyamidoamine curing agent reduced in viscosity by the addition of the reactive diluent reaction product and an epoxy resin, such as the diglycidyl ether of bisphenol A.
    Type: Grant
    Filed: January 6, 1998
    Date of Patent: April 4, 2000
    Assignee: Air Products and Chemicals, Inc.
    Inventors: William Edward Starner, Richard Scott Myers, Andrea Karen Smith
  • Patent number: 6040392
    Abstract: Super-miscible blends of nylon copolymers are provided as well as multilayered film structures made therefrom. A nylon composition is a substantially uniform blend of at least one semi-crystalline copolymer I and at least one semi-crystalline copolymer II, wherein the proportion by weight of each of copolymer I and copolymer II. The nylon compositions are extremely uniform, and have only a single melting point rather than individual melting points of the component nylon copolymer parts. Coextruded films of a layer of this nylon composition with an olefin containing polymer are suitable for use as barrier films, such as aroma barrier films, which have reduced curl.
    Type: Grant
    Filed: March 10, 1998
    Date of Patent: March 21, 2000
    Assignee: AlliedSignal Inc.
    Inventors: Yash P. Khanna, Frank H. Puterbuagh, Jr., William P. Kuhn, Martin J. Schena
  • Patent number: 6037420
    Abstract: The polymer composite material is produced using no solvent and includes a rigid polymer (B) dispersed uniformly into a matrix (A) at the molecular level in a state of a copolymer (A/B and/or A'/B) thereby enhancing the interface bonding of the rigid polymer (B) to the matrix (A). The non-solvent method includes a step of polymerizing a thermoplastic polymer (A) and a monomer to form a rigid polymer (B) with no solvent in the molten and kneaded state to provide a copolymer (A/B and/or A'/B) in which the flexible molecular chains (A and/or A') are made up of the thermoplastic polymer to the rigid polymer (B) to reduce the stress concentrating sources of the rigid polymer dispersed microscopically at the molecular level in the thermoplastic polymer matrix and enhance the interface bonding between the rigid polymer (B) and the matrix (A).
    Type: Grant
    Filed: December 1, 1995
    Date of Patent: March 14, 2000
    Assignee: Mazda Motor Corporation
    Inventor: Takahiro Tochioka
  • Patent number: 6022613
    Abstract: This invention provides polyamide compositions and films made therefrom, having enhanced physical properties and a high degree of transparency. More particularly, the invention pertains to polyamide compositions having increased transparency while maintaining a high degree of crystallinity. The polyamide compositions contain a first polyamide homopolymer or copolymer having balanced amino and acid terminal group; and a second polyamide homopolymer or copolymer having an excess of terminal amino groups, wherein the first polyamide is present in an amount of from about 10 to about 95 percent by weight and the second polyamide is present in an amount from about 5 to about 90 percent by weight, based on the total weight of the first and second polyamides.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: February 8, 2000
    Assignee: AlliedSignal Inc.
    Inventor: Jie Ren
  • Patent number: 6020064
    Abstract: A nonaqueous sizing composition useful for coating glass or carbon fibers. The composition comprises one or more epoxy resins, one or more polymers, a lubricant and one or more silane coupling agents. The sizing composition reduces the volatile organic components associated with chemical treatment of glass and carbon fibers while also eliminating the need to disperse or emulsify the ingredients of the composition.
    Type: Grant
    Filed: May 13, 1997
    Date of Patent: February 1, 2000
    Assignee: Owens Corning Fiberglas Technology, Inc.
    Inventors: Martin C. Flautt, Yadi Delaviz, Gary Gao
  • Patent number: 6008288
    Abstract: Colorless, amorphous polyamides, their blends or alloys, and the molded articles with high alternate bending strengths that can be produced from them, are made available; they are preferably made up of cycloaliphatic diamines combined with aliphatic dicarboxylic acids and small amounts of aromatic dicarboxylic acids which show at the same time high strength, high rigidity, high heat distortion, and good solvent resistance.
    Type: Grant
    Filed: September 24, 1997
    Date of Patent: December 28, 1999
    Assignee: EMS-Inventa AG
    Inventor: Hans Dalla Torre
  • Patent number: 6001930
    Abstract: The present invention relates to a golf ball, comprising a cover, a core and optional intermediate layers, wherein the various ball components are formed from compositions comprising a polyamide, in the form of a homopolymer, a copolymer or mixtures thereof. The compositions include a blend of about 1 wt. % to about 99 wt. % of at least one sulfonated and/or phosphonated polymer and about 99 wt. % to about 1 wt. % of at least one polyamide polymer. The polyamides of the present invention comprise polyamides and polyamide copolymers, such as polyamide block copolymers. The sulfonated and/or phosphonated polymer preferably comprises sulfonated thermoplastic elastomers, sulfonated thermoplastic polymers, and mixtures thereof.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: December 14, 1999
    Assignee: Acushnet Company
    Inventor: Murali Rajagopalan
  • Patent number: 6001957
    Abstract: A thermoplastic resin composition that includes a polyetherimide resin and a phosphorus-containing stabilizer that exhibits a low volatility. The thermoplastic resin composition exhibits improved melt stability and improved resistance to thermal degradation.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: December 14, 1999
    Assignee: General Electric Company
    Inventors: Robert Puyenbroek, Darryl Nazareth, Robert Hayes, Yimin Jin
  • Patent number: 5998545
    Abstract: The present invention relates to a mixture of polymers (A) having polyamide blocks and copolymers (B) comprising vinylaromatic units and unsaturated carboxylic anhydride units, the quantity of (B) being sufficient for the melt index (or melt flow index, MFI) of the mixture of (A) and (B) to be less than the melt index of (A) alone.It also relates to masterbatches of (A) and (B).
    Type: Grant
    Filed: January 22, 1998
    Date of Patent: December 7, 1999
    Assignee: Elf Atochem S.A.
    Inventors: Denis Melot, Alain Bouilloux, Benoit Ernst
  • Patent number: 5994445
    Abstract: The present invention relates to a mixture consisting of60 to 98 wt. % of a partially crystalline polyamide polymerised from m-xylylene diamine and adipic acid,2 to 40 wt. % of an aliphatic polyamide containing inorganic particles with a characteristic particle diameter of less than 800 nm,wherein the proportion of organic and/or inorganic particles in the polymer mixture is less than 10 wt. %.
    Type: Grant
    Filed: July 7, 1997
    Date of Patent: November 30, 1999
    Assignee: Wolff Walsrode AG
    Inventors: Gregor Kaschel, Rudi Klein
  • Patent number: 5985389
    Abstract: The present invention is a compositional blend having a polyester, an acetaldehyde reduction compound and less than 50 ppm of an optical brightener. The blend has utility for food and beverage molded containers where improved clarity and flavor retention are important without producing a haze. The acetaldehyde reduction compound can be a low molecular weight partially aromatic polyamide, a low molecular weight aliphatic polyamides or polyesteramide. The optical brightener preferably is a bis(benzoxazolyl) stilbene. Articles, and especially beverage containers, produced from the blend have a yellowness, b*, less than about 2.5.
    Type: Grant
    Filed: June 15, 1998
    Date of Patent: November 16, 1999
    Assignee: Eastman Chemical Company
    Inventors: James Samuel Nelson Dalton, Steven Lee Stafford, John David Hewa
  • Patent number: 5986016
    Abstract: A thermoplastic resin composition containing a polyetherimide resin; a siloxane-polyetherimide copolymer; one or more resins selected from the group consisting of polycarbonate resins and copolyester-carbonate resins; and one or more component selected from glycidyl ester impact modifiers and siloxane-polycarbonate copolymers exhibits improved ductility and low temperature impact properties.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: November 16, 1999
    Assignee: General Electric Co.
    Inventors: Robert Puyenbroek, James Fishburn
  • Patent number: 5981691
    Abstract: Thermal polymerization of a salt of aspartic acid affords polyaspartate directly without hydrolyzing polysuccinimide. Copolymerization of a salt of aspartic acid with aspartic acid itself affords a copolymer of succinimide and aspartate which may be readily derivatized to produce a sulfonated, phosphonated or hydrophobized polymer.
    Type: Grant
    Filed: April 23, 1997
    Date of Patent: November 9, 1999
    Assignee: University of South Alabama
    Inventor: C. Steven Sikes
  • Patent number: 5969079
    Abstract: Thermomechanical and thermo-oxidative stabilities in resin composites across the range of aerospace "engineering thermoplastic" resins are improved by forming four crosslinks at each addition polymerization site in the backbone of the resin using crosslinking functionalities of the general formula: ##STR1## wherein Z= ##STR2## .beta.=the residue an organic radical selected from the group consisting of: ##STR3## R.sub.R =a divalent organic radical; X=halogen;Me=methylT=allyl or methallyl.G=--CH.sub.2 --,--S--, --CO--, --SO--, --O--, --CHR.sub.3 --, or --C(R.sub.3).sub.2 --;i=1 or 2;R.sub.3 =hydrogen, lower alkyl, lower alkoxy, aryl, or aryloxy; and.theta.=--C.tbd.N, --O--C.tbd.N, --S--C.tbd.N, or --CR.sub.3 .dbd.C(R.sub.3).sub.
    Type: Grant
    Filed: October 21, 1994
    Date of Patent: October 19, 1999
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5969091
    Abstract: An aromatic heterocyclic compound and an aromatic diamino compound are allowed to separately react with a dicarboxylic acid derivative in an organic solvent, thereby synthesizing two kinds of oligomers, and these two kinds of oligomers are allowed to react with each other in an organic solvent to synthesize a block copolymer precursor, or an aromatic heterocyclic compound, an aromatic diamino compound and a dicarboxylic acid derivative are allowed to react in an organic solvent, thereby synthesizing a random copolymer precursor. The block or random copolymer precursor and a matrix polymer are dissolved in an organic solvent, then, the solvent is removed from the solution, and the resulting coagulum is heated to induce a ring-closing reaction, thereby obtaining a molecular composite material in which the copolymer is dispersed finely and homogeneously in the matrix polymer.
    Type: Grant
    Filed: July 12, 1996
    Date of Patent: October 19, 1999
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Akita, Hiroto Kobayashi
  • Patent number: 5959042
    Abstract: A material is provided comprising: (a) a polyamide; (b) a polymer having PA blocks and polyether PEG blocks; (c) optionally a polyolefin; (d) a functionalized polyolefin; the various constituents being present in amounts by weight, a, b, c and d such that: a>0; b>0; c+d>0; a+b+c+d=100; with a/b>0.2; (a+b)/(c+d)>1; and b/(a+b+c+d)<0.5. A film which is non-porous but breathable, i.e. porous to water vapor but not to water, and an antistatic object obtained from this material are also provided.
    Type: Grant
    Filed: November 14, 1997
    Date of Patent: September 28, 1999
    Assignee: Elf Atochem S.A.
    Inventors: Alain Bouilloux, Patrick Alex
  • Patent number: 5952071
    Abstract: Two-component curable adhesive for blocking automotive wiring bundles, the respective components preferably amine-terminated polyamide Part A, and acrylate, anhydride or epoxy Part B, being contained in separate sheets which are inter-leaved with one another. The concentration of the reactive components in the sheets is chosen to cause the adhesive to flow on initial heating and then to cure to resist further flow at elevated temperatures in service. Apparatus, kits and method for blocking cables or wire bundles using the adhesive are also claimed.
    Type: Grant
    Filed: January 9, 1997
    Date of Patent: September 14, 1999
    Assignee: N.V. Raychem S.A.
    Inventors: Henk Rijsdijk, Noel Overbergh, Gerry De Blick, Graham Miles, Aine Kennan
  • Patent number: 5952434
    Abstract: The invention relates to synthetic yarns spun from suophuric acid anistropic solutions of rigid aromatic polyamides blended with aliphatic polyamides. Disclosed is a spinning dope composition comprising an aromatic polyamide, an aliphatic polyamide and concentrated sulphuric acid, wherein at least one of the aromatic and aliphatic plyamides is a copolymer composed of two aromatic and two aliphatic homopolymer units, respectiveyl; the aromatic copolymer having the formula: ?.paren open-st.(HN C.sub.6 H.sub.4 --HH CO C.sub.6 H.sub.4 CO.paren close-st.u.paren open-st.NH C.sub.6 H.sub.4 NH CONH C.sub.6 H.sub.4 NH CO C.sub.6 H.sub.4 CO.paren close-st.w!, wherein u=75-95 wt. % and w=5-25 wt. % and the aliphatic copolymer has the formula ?.paren open-st.HN(CH.sub.2).sub.6 --NHCO(CH.sub.2).sub.4 CO.paren close-st.n.paren open-st.HN(CH.sub.2).sub.5 CO.paren close-st.m wherein n=95-50 wt. % and m=5-50 wt. %.
    Type: Grant
    Filed: January 9, 1998
    Date of Patent: September 14, 1999
    Assignee: Vserossiisky Nauchno-Issledovatedlsky Institut Polimernykh Volokon S Opytnym Zavodom (Vniipv)
    Inventors: Tatyana Sergeevna Sokolova, Vera Dmitrievna Kalmykova, Vera Nikolaevna Sheptukhina, Ljudmila Dmitrievna Serova, Tatyana Andreevna Rozhdestvenskaya, Vladimir Nikolaevich Kiya-Oglu, Alexandra Vasilievna Volokhina, Ljubov Yakovlevna Tikanova, Georgy Ivanovich Kudryavtsev, deceased
  • Patent number: 5952448
    Abstract: This invention relates to a poly (imide amic ester) random copolymer, a precursor thereof, and a process for preparing the same. Specifically this invention relates to a novel precursor of polyimide, poly(imide amic ester) which is chemically stable and has excellent workability in either liquid or solid state, a polyimide obtained therefrom and a process for preparing the same.
    Type: Grant
    Filed: December 30, 1997
    Date of Patent: September 14, 1999
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Myung-Hun Lee, Seo-Bong Lee, Chang-Jin Lee, Eun-Kyoung Kim, Mi-Seon Ryoo
  • Patent number: 5939498
    Abstract: An intimate polyimide blend, prepared by chemical conversion, containing from 25 to 50 weight % of a first polyimide derived from 90 to 100 mole % of 3,3', 4,4'-biphenyltetracarboxylic dianhydride, 0 to 10 mole % of pyromellitic dianhydride and p-phenylenediamine and from 50 to 75 weight % of a second polyimide derived from pyromellitic dianhydride, from 20 to 50 mole % of p-phenylenediamine and from 50 to 80 mole % of 4,4'-diaminodiphenylether. The polyimide blend provides blister free films having high modulus and low thermal expansion coefficients for use in electronics applications.
    Type: Grant
    Filed: April 7, 1998
    Date of Patent: August 17, 1999
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Richard Frederich Sutton, Jr., Darrel Eugene Coverdell
  • Patent number: 5936044
    Abstract: The invention relates to films based on PA-6 or PA-6,6 and on a copolymer containing polyamide (6 or 6,6) blocks and ploytetramethylene glycol blocks. They have greater impact strengths than PA-6 or PA-6, 6 film.
    Type: Grant
    Filed: October 15, 1996
    Date of Patent: August 10, 1999
    Assignee: Elf Atochem S.A.
    Inventors: Denis Melot, Patrick Alex
  • Patent number: 5932687
    Abstract: Certain applications require polyamide powders of narrow particle size distribution and low porosity.The precipitation process of the invention incorporating a prior nucleation phase provides the desired products.
    Type: Grant
    Filed: February 17, 1998
    Date of Patent: August 3, 1999
    Assignee: Huels Aktiengesellschaft
    Inventors: Franz-Erich Baumann, Norbert Wilczok
  • Patent number: 5929178
    Abstract: There are provided a heat-aging-resistant polyamide resin composition comprising (C) a polyamide containing 10 to 100% by weight of (A) a polyamide obtained by polymerizing a monomer containing 70 mole % or more of m-xylylenediamine as a diamine component and a monomer containing 70 mole % or more of adipic acid as a dicarboxylic acid component and 90 to 0% by weight of (B) other polyamide, (D) a copper compound in an amount of 0.001 to 0.1 part by weight per 100 parts by weight of the polyamide (C), (E) a halide of a Group 1 or Group 2 metal of the Periodic Table of the Elements, an ammonium halide, or an organohalide in an amount of 0.005 to 1 part by weight per 100 parts by weight of the polyamide (C), at least one selected from among (F) hindered phenols and (G) hindered amines with the amount of each of the hindered phenols (F) and the hindered amines (G) being 0.05 to 3 parts by weight per 100 parts by weight of the polyamide (C), and (H) an organophosphorus compound in an amount of 0.
    Type: Grant
    Filed: October 7, 1997
    Date of Patent: July 27, 1999
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takatoshi Shida, Makoto Takahashi, Masahiro Harada
  • Patent number: 5922801
    Abstract: A method for binding ceramic materials in aqueous media is disclosed. The method utilizes water-soluble polyamides prepared by condensation polymerization for binding various classes of ceramic materials.
    Type: Grant
    Filed: December 3, 1997
    Date of Patent: July 13, 1999
    Assignee: Nalco Chemical Company
    Inventors: Kristy M. Bailey, Christopher P. Howland, Kevin J. Moeggenborg
  • Patent number: 5917001
    Abstract: An uncoated lens, especially for use as the lens of a fog light or a headlight for an automobile, and having particularly good resistance against the environmental effects which are inherent in this environment, is formed of a colorless, transparent copolyamide having a glass transition temperature of at least a 170.degree. C., blended with a homopolyamide, and wherein the copolyamide is formed from at least one cycloaliphatic diamine with two cyclohexane rings, and at least one aromatic dicarboxylic acid which is predominantly isophthalic acid. The copolyamide may optionally contain up to 20 mol % of a further polyamide forming monomer of at least one lactam or an omega-aminocarboxylic acid. The homopolyamide is preferably one of PA6, PA11, PA12, PA66, PA69, PA610 or PA612. The cycloaliphatic diamine of the copolyamide is preferably bis(3-methyl-4-aminocyclohexyl)-methane.
    Type: Grant
    Filed: September 6, 1996
    Date of Patent: June 29, 1999
    Assignee: EMS-Inventa AG
    Inventors: Susanne Laederach, Hans Dalla Torre
  • Patent number: 5900471
    Abstract: A composition which is a blend of at least two different polyetheramide copolymers, one having predominantly hard polyamide segments and one having predominantly soft polyether segments. When formed into a film and attached to a textile fabric, forms a laminate which is suitable for the production of surgical gowns, and the like. Such films are strong, have good moisture barrier properties while allowing the transmission of air therethrough and have a softness to which provides a clothlike feel.
    Type: Grant
    Filed: April 3, 1997
    Date of Patent: May 4, 1999
    Assignee: AlliedSignal Inc.
    Inventor: Jeffrey H. Glans
  • Patent number: 5891987
    Abstract: A copolyamide composition prepared from hexamethylene diamine and either mixtures of adipic acid and terephthalic acid, or mixtures of adipic acid, terephthalic acid and isophthalic acid, has a melting point below 320.degree. C., a glass transition temperature between 100.degree. C. and 120.degree. C. and physical properties similar to nylon 66.
    Type: Grant
    Filed: November 15, 1995
    Date of Patent: April 6, 1999
    Assignee: Industrial Technology Research Institute
    Inventors: Wu-Bin Yuo, Chien-Shiun Liao, Wen-Jeng Lin, Li-Kuei Lin, Tien-San Lee, Szu-Yuan Chan
  • Patent number: 5886087
    Abstract: Colorless, amorphous polyamides, preferably their blends or alloys, and the molded articles with high alternate bending strengths that can be produced from them, are made available; they are made up from unbranched long chain monomer units and cycloaliphatic monomer units, and have high strength, high rigidity, high heat distortion, and good solvent resistance.
    Type: Grant
    Filed: September 24, 1997
    Date of Patent: March 23, 1999
    Assignee: EMS-Inventa AG
    Inventor: Hans Dalla Torre
  • Patent number: 5885723
    Abstract: Provided is bonding film for printed circuit boards which is resistant to cracking even when bent with a small radius of curvature, has a sufficient mechanical strength even in its semi-cured state so that the handling may be facilitated, is not undesirably brittle and therefore does not produce undesired debris when cut, and is flexible and flame retardant at the same time. The bonding film may consist of (i) high polymer epoxy resin; (ii) denatured polyamide obtained by reacting epoxy resin and polyamide; (iii) polyfunctional epoxy resin; and (iv) curing agent. Preferably, the denatured polyamide includes a polyalkylene-glycol residue or a polycarbonate-diol residue. Preferably, the high polymer epoxy resin is produced by the polymerization of bifunctional epoxy resin and bifunctional phenol resin, and has a weight averaged molecular weight equal to 50,000 or higher.
    Type: Grant
    Filed: December 19, 1997
    Date of Patent: March 23, 1999
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Atsushi Takahashi, Shinji Ogi, Koji Morita, Kazunori Yamamoto, Ken Nanaumi, Kiyoshi Hirosawa, Akinari Kida, Takao Hirayama, Toshihiko Ito, Hiroaki Hirakura
  • Patent number: 5883172
    Abstract: A composition of matter useful as a hotmelt adhesive is provided. The composition is comprised of a polyamide based on dimerized fatty acid and having an amine value higher by at least two units than the acid value of said polyamide and a filler comprised of a carbonate. The filler is preferably comprised of fine particles of calcium carbonate. The adhesive is particularly useful for bonding metals, e.g. to plastics and the bonding of cables with multilayer sheaths, e.g. in optical cables and power cables.
    Type: Grant
    Filed: September 29, 1997
    Date of Patent: March 16, 1999
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Reimar Heucher, Siegfried Kopannia, Ulrike Maassen
  • Patent number: 5872175
    Abstract: This invention relates to a polyamide resin composition and more particularly, to a polyamide resin composition exhibiting better improved mechanical strength and gasoline-resisting property under thermally severe conditions, when a specifically formulated polyamide resin complex comprising a glassfiber whose surface is treated with coupling agent and organic nucleic agent in the form of phosphoric acid-metal salt, is applied to some automobile parts such as a delivery pipe, being directly contacted with gasoline, automobile fuel.
    Type: Grant
    Filed: July 8, 1997
    Date of Patent: February 16, 1999
    Assignee: Hyundai Mortor Company
    Inventor: Byung Jin Lee
  • Patent number: 5866673
    Abstract: The invention relates to polymerisable double-bond derived polyamides obtainable by reacting the polyamide in an aqueous solution with a compound which contains both a polymerisable double bond and an oxirane ring. These derived polyamides may be processed to provide graft polymers with improved properties.
    Type: Grant
    Filed: July 21, 1997
    Date of Patent: February 2, 1999
    Assignee: Merck Patent Gesellschaft mit Beschrankter Haftung
    Inventors: Egbert Muller, Anja Seiler, Roland Gensert
  • Patent number: 5861462
    Abstract: The present invention relates to a method for forming the LCP composite having LCP fibers dispersed in the matrix resin even if the LCP content may be smaller than the lower limit of the fiber formable range.The method is characterized in that a resin composite reinforced by the LCP fiber in a mixture ratio beyond the fiber formable range or the preferred fiber formable range by means of an extrusion or injection molding of a resin mixture containing a liquid crystal resin composite extruded in the fiber formable range or the preferred fiber formable range.
    Type: Grant
    Filed: September 30, 1992
    Date of Patent: January 19, 1999
    Assignee: Mazda Motor Corporation
    Inventors: Keita Sasaki, Masatoshi Shinomori
  • Patent number: 5859148
    Abstract: The invention relates to a process for the preparation of star-branched polymers by reaction in the melt of a polymer having at least one hetero atom in the chain with a compound having at least three functional groups. Suitable polymers are for instance polyamides, polyesters, polyurethanes, polyoxyalkyls, polyimines and copolymers of these. Functional groups are for instance amine, carboxyl, hydroxyl, isocyanate and imine groups. The process is very fast and requires no special purification. The process enables star-branched polymers to be prepared which are derived from so-called AABB polycondensates.
    Type: Grant
    Filed: March 15, 1995
    Date of Patent: January 12, 1999
    Assignee: DSM N.V.
    Inventors: Reinoldus J. M. Borggreve, Ellen M. M. De Brabander-Van De Berg, Guido P. C. Beusen
  • Patent number: 5854378
    Abstract: This invention an aspartic acid copolymer obtained by copolymerizing a monomer mixture comprising (1) aspartic acid, maleamic acid and/or a reaction product of maleic acid and ammonia as a main monomer, (2) fumaric acid, and (3) succinic acid and containing 0.005 to 3% by weight, based on the total monomers, of ammonia in the form of an ammonium salt and hydrolyzing the resulting copolymer partially or completely; and a process for producing the same.
    Type: Grant
    Filed: December 12, 1996
    Date of Patent: December 29, 1998
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Masayuki Tomida, Masako Yoshikawa, Takeshi Nakato
  • Patent number: 5852165
    Abstract: A crystalline terpolymer polyamide produced from: (a) an equimolar salt of hexamethylenediamine with adipic acid, (b) an equimolar salt of hexamethylenediamine with terephthalic acid, and (c) 12-aminododecanoic acid or .omega.-laurolactam; a polyamide resin composition comprising (A) the terpolymer polyamide and (B) a modified polyolefin; a polyamide resin composition comprising (A) the terpolymer polyamide, (B) the modified polyolefin, and (C) polyamide 12; a polyamide resin composition comprising (A) the terpolymer polyamide and (D) an inorganic filler and/or a flame retardant; and an automotive part comprising a molding one of these terpolymer polyamide and polyamide resin compositions.
    Type: Grant
    Filed: May 30, 1995
    Date of Patent: December 22, 1998
    Assignee: UBE Industries, Ltd.
    Inventors: Tatsuo Tsumiyama, Tadahisa Kanayama
  • Patent number: 5849826
    Abstract: The semiaromatic polyamide of the invention comprises 40 to 90% by mol of (A) recurring units derived from terephthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 50% by mol of (B) recurring units derived from isophthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 60% by mol of (C) recurring units derived from an aliphatic dicarboxylic acid of 4 to 18 carbon atoms and an aliphatic diamine of 4 to 12 carbon atoms and 0 to 50% by mol of (D) recurring units derived from a lactam or an aminocarboxylic acid of 6 to 20 carbon atoms, and has a content of boiling water-soluble components (MO components) of not more than 0.25% by weight. The semiaromatic polyamide has a low content of the MO components, so that mold contamination hardly brought about in the molding process, and also molded articles of good heat resistance can be produced.
    Type: Grant
    Filed: June 25, 1997
    Date of Patent: December 15, 1998
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Yoshimasa Ogo, Hidetatsu Murakami, Kunihiro Oouchi, Masaru Sudou, Yoshikatsu Amimoto, Satoshi Omori, Kenji Wakatsuru, Ryuichi Hayashi, Masahiro Nozaki
  • Patent number: 5837767
    Abstract: Stripping fingers for use in a copying machine formed from a resin composition comprising 50-90% by weight of a thermoplastic polyimide resin, and 10-50% by weight of titanium oxide whiskers or zinc oxide whiskers. They may be formed from a resin composition comprising 50-80% by weight of a thermoplastic polyimide resin, 10-40% by weight of titanium oxide whiskers or zinc oxide whiskers, and 2-15% by weight of aromatic polyamide resin powder.
    Type: Grant
    Filed: April 21, 1997
    Date of Patent: November 17, 1998
    Assignee: NTN Corporation
    Inventors: Takumi Shimokusuzuno, Tomomi Nakamichi, Hiroshi Niwa
  • Patent number: 5834568
    Abstract: A process for crosslinking polysuccinimide (PSI) by reacting dry PSI with an N-containing crosslinker.
    Type: Grant
    Filed: March 17, 1997
    Date of Patent: November 10, 1998
    Assignee: Solutia, Inc.
    Inventor: Yueting Chou
  • Patent number: 5780576
    Abstract: Thermoplastic molding materials containA) from 1 to 99% by weight of a partly aromatic copolyamide composed ofa.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,a.sub.2) from 6 to 25 mol % of units which are derived from isophthalic acid,a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine anda.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms,the molar percentages of components a.sub.1) to a.sub.4) together giving 100%,B) from 1 to 99% by weight of a polyetherimide,C) from 0 to 30% by weight of a polymeric component having OH groups,D) from 0 to 60% by weight of fibrous or particulate fillers or mixtures thereof,E) from 0 to 40% by weight of rubber impact modifiers andF) from 0 to 40% by weight of conventional additives and processing assistants.
    Type: Grant
    Filed: April 12, 1996
    Date of Patent: July 14, 1998
    Assignee: BASF Aktiengesellschaft
    Inventors: Martin Weber, Herbert Fisch, Gunter Pipper, Axel Gottschalk
  • Patent number: 5773509
    Abstract: A heat resistant resin composition comprising, as the main components,(A) 100 parts by weight of an organic solvent-soluble polyimide resin having a glass transition temperature of 350.degree. C. or less,(B) 5 to 100 parts by weight of an epoxy compound having at least two epoxy groups in one molecule, and(C) 0.1 to 20 parts by weight of a compound having an active hydrogen group which can react with the epoxy compound (B),a heat resistant film adhesive comprising, as the main components, the above components (A), (B) and (C), and a process for producing a heat resistant film adhesive by casting a solution of the above heat resistant resin composition on one side or both sides of a support.
    Type: Grant
    Filed: March 7, 1995
    Date of Patent: June 30, 1998
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Tatsuhiro Yoshida, Keizo Takahama, Syusaku Okamyo