Abstract: The present invention provides a multilayer film composition wherein at least two layers of the multilayer film composition are applied via electrophoretic deposition processes. In a preferred embodiment, the first layer of the multilayer film composition is a conductive film layer applied by a cationic electrodeposition process with a second layer applied directly to the conductive first layer via an anodic electrodeposition process. Preferably, the second layer of the anodic electrocoat coating composition comprises a carbamate functional anodic resin.

Abstract: A resin matrix with resistances to alkali and acid such as a fluorene-containing epoxy acrylate and/or a benzocyclobutene resin includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative composite particles have a particle diameter in the range of 1-20 micrometers.

Abstract: An epoxy resin containing group(s) of formula (1) and having a number average molecular weight of 400-10,000, an epoxy equivalent of 100-5,000 and an average number of glycidyl ether groups per molecule of 2-50 wherein A is a group (wherein R3 is a saturated aliphatic polyhydric alcohol residue having 2 to 30 carbon atoms, D is oxyalkylene group, a, b, c and d are 0-25, e and f are 0-4, e+f equals 0-4 and a+b+c×e+d×f equals 0-50), and B is (g, h are 0-18), etc. and R1 and R2 are H, glycidyl or a group of the formula wherein A and B are as defined above, and R7, R8 and R9 are H or glycidyl group; its preparation, and photo-curable and powder coating resin compositions containing the same.

Abstract: An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of 1.0-1.7, an inorganic filler, a curing catalyst, and optionally a phenolic resin, and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. A laminate film includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.

Abstract: The present invention provides a resin containing in the backbone chain a structural unit represented by the following Formula (I) or (II), as a novel phenolic resin having a high Tg, a low moisture absorption, a low molding shrinkage, high adhesive properties and high flow properties. The present invention also provides a resin composition and a molding material each containing the above resin, and an electronic component device having a device element encapsulated with it.

Abstract: The combination of powder coatings usable in a coating method comprising mixing two or more powder coatings of which each color is different, wherein each of the powder coatings fuses with each other and is heat-cured, to thereby give a coating film having a homogeneous hue. A powder coating composition comprising two or more powder coatings of which each color is different, wherein each of the powder coatings fuses with each other and is heat-cured, to thereby give a coating film having a homogeneous hue. A coating method comprising the steps of (a) applying to a substrate two or more powder coatings, of which each color is different; (b) heating to fuse with each other each of the two or more powder coatings applied in step (a); and (c) curing the resulting fused product in step (b), to give a coating film having a homogeneous hue.

Abstract: An epoxy resin composition comprises (A) a biphenyl epoxy resin, (B) a phenolic resin curing agent having a naphthalene structure, (C) a curing accelerator comprising an addition product of a triphenylphosphine and benzoquinone, and (D) an inorganic filler contained in an amount of 85 to 95% by weight based on the total amount of the composition, and a semiconductor device encapsulated by this resin composition.

Abstract: A resin composition comprising (A) an aromatic polycarbonate resin or aromatic epoxy resin and (B) a minor amount of an organosiloxane containing phenyl and alkoxy radicals is flame retardant and does not emit harmful gases when burned. It can be molded into parts having optical transparency.

Abstract: The invention relates to three-layer metal pipe coating compositions based on a powder primer, on a thermoplastic hard adhesive and on a polyolefin cladding. The powder primer contains epoxidized novolak resins, phenolic crosslinking agents and fillers based on crystalline silicic acid modifications. The invention likewise relates to a process for the exterior coating of metal pipes by a three-layer method, in which the powder primer described is applied to the metal pipe, a thermoplastic hard adhesive is applied to the powder primer, and subsequently a polyolefin cladding is applied.

Abstract: A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise the reaction product of (i) a lactone or an alkoxylating agent selected from the group consisting of alkylene oxides and alkylene carbonates, and (ii) a phenolic aralkylation polymer comprising the reaction product of a phenolic monomer having at least two free reactive positions; a styrene derivative; and a coupling agent. The previously chain-extended phenolic-based hydroxyl compound also may be chain-extended by reacting with a lactam to produce a lactam chain-extended polyester polyamide. The polyols and polyamides of the present invention provide unique combinations of hard and soft functionalities, which translates into materials exhibiting a unique combination of toughness and hardness.

Abstract: An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.

Abstract: An epoxy resin composition comprising an epoxy resin of a specific structure, a phenolic resin of a specific structure, and an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into products having improved flame retardance, reflow crack resistance and dielectric properties.

Abstract: The present invention provides a curable coating composition that includes at least three components. The coating composition includes a component (a) that includes one or both of a compound (a)(1) having at least one carbamate group or terminal urea group according to the invention and having at least two linking groups that are urethane or urea or a compound (a)(2) having at least two groups selected from carbamate groups, terminal urea groups, or combinations of the two and at least four urethane or urea linking groups. The second component (b) of the coating composition includes an acrylic polymer comprising active hydrogen-containing functional groups reactive with the third component(c). Component (c) of the coating composition is a curing agent that is reactive with the first two components. Preparation of coated articles using the compositions of the invention is also disclosed.

Abstract: A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.

Abstract: An epoxy resin composition contains (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a skeleton having a structure in which two benzene rings are conjugable to each other directly or via an aliphatic unsaturated double bond, carbon atoms having an atomic orbital of SP.sup.2 type accounting for at least 50% of the carbon number, (B) a phenolic resin having a hydroxyl equivalent of at least 160, carbon atoms having an atomic orbital of Sp.sup.2 type accounting for at least 85% of the carbon number, (C) a polyimide resin in an amount of 1-20 parts by weight per 100 parts by weight of components (A) and (B) combined, and (D) 70-85% by volume of the entire composition of an inorganic filler. The composition cures into products having flame retardancy and high-temperature reliability even though it is free of bromine compounds and antimony compounds.

Abstract: The present invention provides an adhesive resin composition including an epoxy resin, a phenolic resin and a polycarbodiimide resin, wherein the proportion of the polycarbodiimide resin is 0.5 to 20 parts by weight per 100 parts by weight of the total of the epoxy resin and the phenolic resin, and a sealing resin composition including an epoxy resin, a phenolic resin, a polycarbodiimide resin and an inorganic filler, wherein the proportion of the polycarbodiimide resin is 0.5 to 20 parts by weight per 100 parts by weight of the total of the epoxy resin and the phenolic resin and the proportion of the inorganic filler is 60 to 95 parts by weight of the total weight of the composition. The resin compositions of the present invention are superior in heat resistance and long-term stability and, moreover, have excellent adhesivity even to new materials such as Ni alloys and the like.

Abstract: A thermosetting pressure-sensitive adhesive comprising a photopolymerization product of a composition containing a) 100 parts by weight of a (meth) acrylic acid alkyl ester wherein the average carbon atom number of the alkyl group is from 2 to 14 and from 30 to 1% by weight of a monoethylenically unsaturated acid copolymerizable with the ester, b) from 0.02 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, c) from 0.01 to 4 parts by weight of a photopolymerization initiator, and d) from 5 to 30 parts by weight of an epoxy resin, and not substantially containing a curing agent for the epoxy resin, and an adhesive sheet using the thermosetting type pressure-sensitive adhesive.

Abstract: An epoxy resin encapsulating material for molding in a semiconductor chip by the use of a transfer molding device. The material has constituents of an epoxy resin, a curing agent, an inorganic filler, and a release agent. The material consists of 99 wt % or more of granules having a diameter of 0.1 to 5.0 mm and 1 wt % or less of minute particles having a diameter of less than 0.1 mm. The mass of the material exhibit an angle of slide of 20 to 40.degree., which demonstrates good flowability free from clogging a passage leading to a mold cavity in the transfer molding device, thereby assuring enhanced encapsulation quality. The material is prepared firstly by kneading the encapsulating composition having the above constituents and by solidifying the composition into a semi-cured solid body of B-stage condition. The sem-cured solid body is then pulverized into pieces having a diameter of 5.0 mm or less. The pieces are composed of granules having a diameter of 0.1 mm to 5.

Abstract: There is described a curable coating composition having at least one effect pigment which, upon cure, exhibits substantially improved orientation of the effect pigment and a corresponding improvement in appearance. The composition comprises:(A) a carbamate-functional component having a hydrophobicity equivalent to or greater than that of a carbamate-functional compound (A') which is the reaction product of:(1) a compound comprising a plurality of hydroxyl groups, at least one of which is the result of a ring-opening reaction between an epoxy group and an organic acid group, and(2) cyanic acid or a compound comprising a carbamate group, and(B) a component comprising a plurality of groups that are reactive with the carbamate functional groups on component (A), and(C) at least one effect pigment,the curable coating composition when cured having a substantially improved effect pigment orientation. Preferably, the composition further comprises particular rheology control agents.

Abstract: Present invention relates to a process for preparing a high molecular weight epoxy resin which has a weight average molecular weight value more than 40,000 and an epoxy equivalent weight less than 10,000 g/eq. This high molecular weight epoxy is prepared by a reaction of a divalent epoxy resin with a bisphenol compound in the presence of a catalyst and a solvent characterized in utilizing 1.10 to 1.03/1 of molar ratio of epoxy group/phenolic hydroxyl group.

Abstract: The present invention provides an epoxy resin composition, comprising:(A) a phenol epoxy resin represented by the following formula (I) ##STR1## wherein each R.sup.1 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups,each R.sup.2 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups, ##STR2## wherein R.sup.3 is selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups, each R.sup.

Abstract: The present invention provides a curable coating composition that includes at least three components. The coating composition includes a component (a) having at least one carbamate group or urea group and having a lactone or hydroxy carboxylic acid moiety. The second component (b) of the coating composition is one or more of three materials. First, the second component can be a polymer resin (b)(1) comprising active hydrogen-containing functional groups reactive with the third component(c). Secondly, the second component can be a compound (b)(2) having at least one carbamate group or terminal urea group according to the invention and having at least two linking groups that are urethane or urea. Finally, the second component can be a compound (b)(3) having at least two groups selected from carbamate groups, terminal urea groups, or combinations of the two and at least four urethane or urea linking groups.

Abstract: The present invention provides a curable coating composition that includes at least three components. The coating composition includes a component (a) that includes one or both of a compound (a)(1) having at least one carbamate group or terminal urea group according to the invention and having at least two linking groups that are urethane or urea or a compound (a)(2) having at least two groups selected from carbamate groups, terminal urea groups, or combinations of the two and at least four urethane or urea linking groups. The second component (b) of the coating composition includes a polymer resin comprising active hydrogen-containing functional groups reactive with the third component (c). The resins is selected from polyester, polyurethane, or polyester-polyurethane copolymers Component (c) of the coating composition is a curing agent that is reactive with the first two components. Preparation of coated articles using the compositions of the invention is also disclosed.

Abstract: The invention provides cathodic electrocoat compositions having a carbamate functional resin with a cationic salting site, a crosslinking agent reactive with the carbamate functional resin and a carbonate curing agent. The invention also provides methods of cathodically electrodepositing a coating on a substrate using the coating compositions of the invention. The compositions of the invention provide urethane crosslinking sites without the use of disadvantageous blocked isocyanates and cure at temperatures lower than prior art cathodic electrocoat compositions.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: The present invention provides an epoxy resin composition useful for casting applications, comprising a reaction product obtained by reacting (A) a bisphenol epoxy resin, and (B) bisphenol compounds, and if necessary, (C) monofunctional phenols or carboxylic acid compounds, in the presence of sodium compounds, wherein the epoxy resin composition has(a) an epoxy equivalent: 250 to 500 g/equivalent,(b) a sodium content: 20 to 200 ppm, and(c) a haze of its 40 wt % methyl ethyl ketone solution measured according to ASTM D 1003: 15% or less.

Abstract: An epoxy resin composition for semiconductor sealing, which comprises an epoxy resin, a curing agent and an inorganic filler, and has a J-value of 10 to 50, which is a maximum jetting flow value determined according to a method of evaluating jetting flow of epoxy resin composition.

Abstract: The present invention provides a curable coating composition comprising(a) a first component comprising at least two functional groups, at least one of which is a carbamate or urea group that is the reaction product of:(1) a hydroxyl group that is the result of a ring-opening reaction between an epoxy group and an organic acid group, and(2) cyanic acid or a carbamate or urea group;(b) a curing agent having a plurality of functional groups that are reactive with component (a), and(c) a second component having functional groups that are reactive with component (a) or component (b) or both components (a) and (b).

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and at least 70% by weight of an inorganic filler, at least one of the epoxy resin and the curing agent has such a molecular weight distribution as to provide an average dispersity Mw/Mn of less than 1.6, a two-nucleus compound content of less than 8% by weight and a seven- and more-nucleus compound content of less than 32% by weight. When the composition is cured at 180.degree. C. for 90 seconds into a primary product having Tg1 and the primary product postcured at 180.degree. C. for 5 hours into a secondary product having Tg2, the relationship: (Tg2-Tg1)/Tg2<0.1 is satisfied. The composition is fast-curing and effectively moldable and cures into a reliable product without a need for postcure.

Abstract: Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential component, said hardener (B) is one which contains at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, and said silica (C) contains 1-99 wt % of synthetic silica and 99-1 wt % of natural fused silica. Disclosed also herein is a semiconductor device having a semiconductor element sealed therein with said epoxy resin compound. The epoxy resin compound does not cause such troubles as short shot, resin peeling, wire breakage, stage shift, and vent clogging at the time of molding. In addition, when used as a sealing material, it yields semiconductor devices which have good reliability at high temperature and high humidity and good resistance to soldering heat.

Abstract: A copolymer is formed from reacting, within a melt, a phthalonitrile resin with an epoxy resin having at least three epoxy groups. In an alternative embodiment, a copolymer is formed by reacting a phthalonitrile resin with an epoxy resin, at least one of the epoxy and phthalonitrile resins having a perfluorinated carbon. The copolymers of the present invention have exceptional thermal stability and a low affinity for water.

Abstract: The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.

Abstract: A process for producing a highly reactive low-viscosity modified phenolic resin comprising the steps of polycondensating a petroleum heavy oil or pitch, a formaldehyde polymer, and a phenol in the presence of an acid catalyst to prepare a modified phenolic resin; and reacting the resultant modified phenolic resin with the phenols at a temperature higher than 120.degree. C. and not more than 200.degree. C. in the presence of the acid catalyst to lower the molecular weight of the modified phenolic resin. The highly reactive low-viscosity modified phenolic resin obtained according to this process has high reactivity with epoxy resins and low resin melt viscosity. In addition, this resin can be used for producing a molding material having good moldability and considerably low moisture absorption when combined with an epoxy resin.

Abstract: A substantially ester-free, acid-functional thiol-functional resin is prepared via the reaction of an epoxy compound with a thiolacetic acid in the presence of an amine catalyst and heat to form a thioacetate derivative which is hydrolyzed to yield an ester-free, .beta.-hydroxy thiol-functional resin. The .beta.-hydroxy thiol-functional resin can then be reacted with a material capable of insert a group conferring aqueous-base developability such as a cyclic anhydride.

Abstract: A curable resin blend including a multifunctional phenolic cyanate/phenolic triazine copolymer; and an epoxy resin, and articles manufactured therefrom. The cured resin blend possesses a high glass transition temperature, flexural strength, elongation, flexural modulus, compressive strength, and compressive modulus properties as well as low moisture absorption properties. The cured blend is suitable for making laminates, coatings, composites, and molds such as via resin transfer molding compression molding, and the like.

Abstract: A copper clad laminate is disclosed as being obtained by thermoforming a prepreg and a copper foil. As disclosed, the pre-preg (uncured) includes a substrate impregnated with an epoxy resin, an aryl ester compound and a curing agent. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent. It is suitable for a multilayer printed wiring board for high speed operation, especially at high-frequency region.

Abstract: A curable resin blend including a multifunctional phenolic cyanate/phenolic triazine copolymer; and an epoxy resin, and articles manufactured therefrom. The cured resin blend possesses a high glass transition temperature, flexural strength, elongation, flexural modulus, compressive strength, and compressive modulus properties as well as low moisture absorption properties. The cured blend is suitable for making laminates, coatings, composites, and molds such as via resin transfer molding, compression molding, and the like.

Abstract: The process for producing a modified epoxy resin comprises reacting (a) an epoxy resin having at least two epoxy groups per one molecule, and (b) a specific active ester group-containing compound having at least two aromatic ring-bonded active ester groups per one molecule, in proportions such that the amount of the active ester groups in the active ester group-containing compound is from about 0.05 to about 0.95 mol per mole of the epoxy group in the epoxy resin, and the modified epoxy obtained by this process, and a composition of the epoxy resin and a curing agent are encompassed.

Abstract: An electrodepositable coating composition is provided comprising (a) an active hydrogen-containing, cationic salt group-containing resin electrodepositable on a cathode; (b) a curing agent for transurethanation, transamidation or transesterification curing like at least a partially capped polyisocyanate curing agent; and (c) a catalytic mixture of bismuth and an amino acid or amino acid precursor. Optionally, an auxiliary acid may be present to increase the effectiveness of the amino acid in the mixture with bismuth.

Abstract: The epoxy resin composition which comprises both components (A) an epoxy compound having at least two epoxy groups in a molecule and (B) a polyphenol compound containing a trisphenol compound represented by general formula (I) described below ##STR1## in which R.sub.1 is a methyl group, n is an integer of 0 to 2, and Ar is a group selected from ##STR2## in which R.sub.2 and R.sub.3 are each individually selected from an alkyl group having a carbon number of 1 to 6, an alkoxy group having a carbon number of 1 to 6, or a halogen atom, and m and p are an integer of 0 to 2.

Abstract: The invention relates to a phosphorus-modified epoxy resin having an epoxide value of from 0.05 to 0.6 mol/100 g comprising structural units derived from(A) polyepoxide compounds having at least two epoxide groups per molecule and(B) phosphorus-containing dicarboxylic acids or phosphorus-containing carboxylic anhydrides,to a process for their preparation and to their use.

Abstract: Curable coating compositions are described comprising(a) a polymer resin comprising active hydrogen-containing functional groups,(b) a curing agent having groups that are reactive with said functional groups on (a), and(c) a compound comprising at least one carbamate group that is the reaction product of:(1) a hydroxyl group that is the result of a ring-opening reaction between an epoxy group and an organic acid group, and(2) cyanic acid or a compound comprising a carbamate group.

Abstract: A composition useful as a die-attach adhesive, polymer bump or encapsulant comprises from about 5-100% by weight of a base resin and from zero to 95% by weight of a particulate filler such as silver, wherein the base resin contains (a) from 10-95 parts by weight of a cycloaliphatic epoxy-functional siloxane, (b) from about 5-90 parts by weight of a non-silicon-containing polyepoxy resin, .COPYRGT. from about 0.1-3 parts by weight of an iodonium salt, (d) from zero to about 3 parts by weight of a copper compound and, optionally, a silane adhesion promotor and/or an elastomeric toughener.

Abstract: A composition useful as a powder coating comprises an epoxy resin and a novolak compound or resin having a structure obtained from the reaction of a substituted phenol such as cresol and an aldehyde to form a substituted bis(hydroxymethyl) phenol intermediate which is then reacted with a polyhydroxyphenol containing adjacent hydroxyl groups such as catechol to yield a polyhydroxyphenol-endcapped novolak compound or resin.

Abstract: This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin and 80-20 parts by weight of an aromatic O-glycidyl ether (to a total 100 parts), a curing catalyst, and optionally one or more fillers.

Abstract: There is described a curable coating composition comprising:(A) a carbamate-functional component that is the reaction product of:(1) a compound comprising a plurality of hydroxyl groups, at least one of which is the result of a ring-opening reaction between an epoxy group and an organic acid group, and(2) cyanic acid or a compound comprising a carbamate group, and(B) a component comprising a plurality of groups that are reactive with the carbamate functional groups on component (A).

Abstract: An object is to provide hardened products having excellent water resistance and mechanical strength, and an epoxy resin and an epoxy resin composition for use in the production thereof. An epoxy resin obtained by the glycidylation of a novolak type resin which is prepared by the condensation of biphenyls with phenols and naphthols, and a resin composition containing said epoxy resin and hardened products thereof.

Abstract: An epoxy resin composition of this invention is obtained by solidifying epoxy resins represented by the following general formula (1) (wherein G is glycidyl group and R.sup.1 to R.sup.8 are hydrogen atoms, halogen atoms or hydrocarbon groups with 1 to 6 carbon atoms, and n is an integer of 0 to 10) by crystallization and adding epoxy resin curing agents to the resulting solid. It shows good flow and low moisture absorption, cures with excellent heat resistance at soldering temperature and is useful for a variety of applications, in particular, for encapsulating semiconductor devices.

Abstract: A method of manufacturing phosphate-free alpha-glycol endcapped resins, and use of the resins in a coating composition, are disclosed. The alpha-glycol endcapped resins are prepared from a linear polymer terminated with phenol end groups and glycidol in the absence of phosphoric acid. The endcapped resins are incorporated into organic solvent-based coating compositions for application to metal substrates.

Abstract: A flame-resistant, UV-curable single-component reactive resin system comprises a phosphorus-containing acrylate, another unsaturated compound which can undergo free radical copolymerization with acrylates and a free radical initiator system.