Abstract: The present invention provides curing agent compositions comprising benzylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: The present invention provides curing agent compositions comprising benzylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: The present invention provides curing agent compositions comprising the reaction product of alkylated polyalkyleneamine compounds and polyalkylene polyether polyol modified polyepoxide resins. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: Derivatized solid epoxy resins of the formula (I), which are outstandingly suitable as impact modifiers; and compositions which include such derivatized solid epoxy resins and are outstandingly suitable as one-component heat-curable adhesives, and as structural foams which have a high impact resistance and high mechanical stability.

Abstract: Disclosed is a fiber-reinforced composite material that is high in heat resistance and strength while being low in the content of volatile matter that volatilizes during curing. Also disclosed are an epoxy resin composition for production thereof, and a prepreg produced from the epoxy resin composition. Specifically the invention provides an epoxy resin composition comprising: [A] an epoxy resin comprising two or more ring structures each consisting of four or more members, and at least one amine type or ether type glycidyl group directly connected to the ring structures, [B] a tri—or more—functional epoxy resin, and [C] a curing agent, and also provides a prepreg produced by impregnating reinforcing fiber with the epoxy resin composition and a fiber-reinforced composite material produced by curing the prepreg.

Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

Abstract: The shape memory polymers disclosed are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic-hydrogen with at least one multifunctional cross linking reagent which contains at least three or more active amino- or phenolic-hydrogen or is a reagent containing at least three glycidyl ether moieties which is then further mixed with at least one diglycidyl ether reagent whereupon the resulting mixture is cured and has a glass transition temperature higher than 00 C. This reaction creates crosslinking between the monomers and polymers such that during polymerization they form a crosslinked thermoset network.

Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.

Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

Abstract: Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature, at least one terminally blocked polyurethane prepolymer of formula (I) and at least one epoxide-terminated polyurethane prepolymer of formula (II). The epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.

Abstract: The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (1), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives.

Abstract: Disclosed herein is a curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct. Additionally disclosed is a process comprising agitating a solution of an amine, an epoxy resin, and an elastomer-epoxy adduct as a dispersant at an elevated temperature in an organic medium.

Abstract: An object of the present invention is to provide a coating composition that has excellent electrodeposition coating applicability onto hot dip galvanized steel sheets, and that provides a cationic electrodeposition coating film having a superior finish and excellent anti-corrosion properties. The present invention provides a cationic electrodeposition coating composition having: amino group-containing modified epoxy resin (A), phenolic hydroxy group-containing resin (B), and blocked polyisocyanate curing agent (C), the components (A), (B), and (C) being contained in amounts of 5 to 50 mass %, 20 to 75 mass %, and 10 to 40 mass %, respectively, based on the total solids mass of the components (A), (B), and (C).

Abstract: The invention relates to novel polyalkylene glycol compounds and methods of using them. In particular, compounds comprising a novel polyethylene glycol conjugate are used alone, or in combination with antiviral agents to treat a viral infection, such as chronic hepatitis C.

Abstract: A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.

Abstract: A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.

Abstract: A composite material comprising at least one polymeric resin and optionally at least one fibrous reinforcement, where the polymeric resin comprises; at least one difunctional epoxy resin; and at least one epoxy resin with a functionality greater than two having at least one meta-substituted phenyl ring in its backbone.

Abstract: Pre-impregnated composite material (prepreg) is provided that can be molded to form composite parts that have high levels of both strength and damage tolerance without causing any substantial negative impact upon the physical or chemical characteristics of the uncured prepreg or cured part. This is achieved by including in the matrix resin a substantial amount of a multifunctional aromatic epoxy resin that has at least one phenyl group that is meta-substituted.

Abstract: Embodiments relate to viscosifiers that are terminated polymers that have functional terminal groups. The polymers being pre-extended by polyepoxides and being reacted to give polymers that are terminated by other functional groups. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions and considerably reduce or even exclude the formation of high-molecular addition products so that the products obtained have low viscosity and good storage stability.

Abstract: A two-component epoxy adhesive composition comprises a) a first component comprising a first epoxy resin and a second epoxy resin being flexibilized by an elastomer, and b) a second component comprising at least one amine compound with one or more primary and/or secondary amino groups having a molecular weight of less than 450 g/mole. The ratio of the total number of amino groups of the amine compound to the total number of epoxy groups of the epoxy resins is from 0.01:1 to 0.5:1. The mixing of components a) and b) results in a wash-off resistant composition upon heat-curing in a crash-stable structural adhesive.

Abstract: A method for making a pre-impregnated composite material (prepreg) is provided. The prepreg can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.

Abstract: A process of forming a solid epoxy-imidazole catalyst, the process including: contacting an imidazole, an amine, and one or more epoxy resins, in the absence of added solvent, to form a solid epoxy-imidazole catalyst. In other aspects, embodiments disclosed herein relate to an epoxy-imidazole catalyst, as well as curable compositions, processes for forming curable compositions, and processes for forming a thermoset resin using the epoxy-imidazole catalyst formed in the absence of added solvent.

Abstract: A circuit-connecting material for interposing between circuit electrodes facing each other and electrically connecting the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material. The circuit-connecting material features the following essential components: (1) a curing agent capable of generating free radicals upon heating, (2) a phenoxy resin having a weight average molecular weight of 10,000 or more, and that is chemically modified by a carboxyl-group-containing elastomer, and (3) a radical-polymerizable substance.

Abstract: It is an object of the present invention to provide a fiber reinforced composite material combining good properties such as toughness and impact resistance and to provide an epoxy resin composition to obtain this. This object is achieved by the an epoxy resin composition comprising the following [A], [B], [C], and [D]: [A] a diglycidyl ether-type epoxy resin having a molecular weight of 1,500 or more; [B] an epoxy resin in which an SP value of a structural unit thereof is greater by 1.5 to 6.5 than an SP value of a structural unit of [A]; [C] a diglycidyl ether-type epoxy resin having a molecular weight of 500 to 1,200; and [D] an epoxy resin curing agent, in a ratio that satisfies the following formulas (1) to (4): 0.2?A/(A+B+C+E)?0.6;??(1), 0.2?B/(A+B+C+E)?0.6;??(2), 0.15?C/(A+B+C+E)?0.4; and??(3), 0?E/(A+B+C+E)?0.2,??(4) wherein A, B, and C represent weights of [A], [B], and [C], respectively, and E represents a weight of an epoxy resin other than [A], [B], and [C].

Abstract: The present invention relates to a two-component epoxy adhesive composition comprising a) a first component comprising a first epoxy resin and a second epoxy resin, the second epoxy resin being flexibilized by an elastomer, and b) a second component comprising at least one amine compound with one or more primary and/or secondary amino groups, said amine compound having a molecular weight of less than 450 g/mol. The ratio of the total number of amino groups of the amine compound to the total number of epoxy groups of the epoxy resins is 0.01:1 to 0.5:1. The mixing of the two components a) and b) results in a wash-off resistant composition. Said wash-off resistant composition results upon heat-curing in a crash-stable structural adhesive.

Abstract: A composition for conductive materials comprises a compound represented by the following general formula (A1): wherein: R1 is the same or different and each independently represents a C2-C8 straight-chain alkyl group; R2 is the same or different and each independently represents a hydrogen atom, a methyl group or an ethyl group; Y represents a group containing at least one substituted or unsubstituted aromatic hydrocarbon ring, or substituted or unsubstituted heterocyle; and X1 is the same or different and each represents a substituent represented by the following general formula (A2): wherein n1 is an integer of from 2 to 8.

Abstract: An amine hardener for epoxy resins which comprises an amine adduct (A) and a low-molecular amine compound (B) as major components, wherein the molecular weight distribution of the amine adduct (A), which is defined by the ratio of the weight-average molecular weight to the number-average molecular weight, is 3 or lower and the low-molecular amine compound (B) is contained in an amount of 0.001 to 1 part by mass per 100 parts by mass of the amine adduct (A).

Abstract: A liquid epoxy resin composition of an epoxy resin, a curing agent, and a curing accelerator, where the epoxy resin is an alicyclic epoxy compound present in an amount from 100 to 30% by weight. The alicyclic epoxy compound is preferably produced by using a percarboxylic acid having a water content of 2% by weight. The curing agent is preferably a liquid acid anhydride.

Abstract: An alicyclic diepoxy compound (A) represented by formula (I) is produced in high purity and high yield at low cost, by epoxidizing the corresponding alicyclic diolefin compound with an organic percarboxylic acid. The curable epoxy resin composition has high reactivity for various curing agents, low viscosity, and excellent workability. A cured product thereof shows useful physical properties for uses in coatings, inks, adhesives, sealants, and encapsulants, etc. It is of extremely high quality as an epoxy resin composition for the encapsulation of electronic parts. A stabilizer for an electrical insulating oil (the alicyclic diepoxy compound or an electrical insulting oil containing the compound) is low in acid value, and the stabilizer improves the properties of the insulating oil. A cured product obtained by curing a casting epoxy resin composition for electrical insulation has excellent properties such as high bending strength, high Tg, and low permittivity.

Abstract: A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.

Abstract: The present invention provides methods and compositions for the treatment of ion imbalances. In particular, the invention provides polymeric and pharmaceutical compositions comprising crosslinked amine polymers. Methods of use of the polymeric and pharmaceutical compositions for therapeutic and/or prophylactic benefits are disclosed herein. Examples of these methods include the treatment of renal diseases and hyperphosphatemia.

Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.

Abstract: The present invention relates to an epoxy resin varnish composition with high glass transition temperature for laminate plate, wherein the resin composition comprises: (A) a new dihydrobenzoxazine thermosetting resin obtained by reacting compounds: (a) phenolic products from reaction of di- or multifunctional epoxy resin and di-functional phenolic compounds; (b) mono- or di-functional primary amines; (c) di-functional phenols; and (d) formaldehyde or paraformaldehyde, (B) one or more epoxy resins, (C) novolac resin curing agents, and (D) curing promoters. For the epoxy resin varnish composition, crosslinking density of resin is increased due to using modified dihydrobenzoxazine thermosetting resin with multiple functional groups, so that mechanical strength and heat resistance of the obtained substrate are remarkably improved, and solubility problem of dihydrobenzoxazine in solvent is solved to greatly elevate production efficiency.

Abstract: Anion-binding polymers are described. The anion-binding polymers in some cases are low swelling anion-binding polymers. In some cases, the anion-binding polymers have a pore volume distribution such that a fraction of the polymer is not available for non-interacting solutes above a certain percentage of the MW of the target ion for the polymer. In some cases, the anion-binding polymers are characterized by low ion-binding interference, where the interference is measured in, for example, a gastrointestinal simulant, relative to non-interfering buffer. Pharmaceutical composition, methods of use, and kits are also described.

Abstract: Disclosed is a flame-retardant epoxy resin composition characterized by containing (A) an epoxy resin containing 0.5-10 equivalent/kg of oxazolidone rings, (B) an epoxy group-containing phosphazene compound, (C) at least one compound selected from the group consisting of phosphates, condensed phosphates, quinone derivatives of phosphine compounds, and polyphenylene ethers, and (D) at least one curing agent selected from the group consisting of guanidine derivatives, phenol novolacs, bisphenol A novolacs, cresol novolacs and naphthol novolacs.

Abstract: The present invention provides N,N?-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions comprising N,N?-dimethyl secondary diamine polymers are also disclosed.

Abstract: The present invention relates to curable compositions of benzoxazines, a combination of adducts one of which is prepared from hydroxy-containing compounds, isocyanate-containing compounds and phenolic compounds and the second of which is prepared from the first adduct and epoxy-containing compounds and phenolic compounds, epoxy resins and optionally tougheners.

Abstract: The present invention relates to a curing agent for epoxy resins comprising (A) an epoxy adduct of isophoronediamine, (B) an epoxy adduct of 1,3-bis(aminomethyl) cyclohexane, (C) isophoronediamine and (D) 1,3-bis (aminomethyl) cyclohexane wherein the weight ratio of (D) to (C) (=(D)/(C)) in said curing agent is in the range of 0.04 to 0.22, which can provide an epoxy resin composition with excellent curing performances such as curability under the condition of low temperature, excellent performances of epoxy resin cured coating films, excellent chemical resistance of epoxy resin cured coating films and excellent physical properties of epoxy resin cured products.

Abstract: Anion-binding polymers are described. The anion-binding polymers in some cases are low swelling anion-binding polymers. In some cases, the anion-binding polymers have a pore volume distribution such that a fraction of the polymer is not available for non-interacting solutes above a certain percentage of the MW of the target ion for the polymer. In some cases, the anion-binding polymers are characterized by low ion-binding interference, where the interference is measured in, for example, a gastrointestinal simulant, relative to non-interfering buffer. Pharmaceutical composition, methods of use, and kits are also described.

Abstract: The present invention relates to a two-component epoxy adhesive composition comprising a) a first component comprising a first epoxy resin and a second epoxy resin, the second epoxy resin being flexibilized by an elastomer, and b) a second component comprising at least one amine compound with one or more primary and/or secondary amino groups, said amine compound having a molecular weight of less than 450 g/mol. The ratio of the total number of amino groups of the amine compound to the total number of epoxy groups of the epoxy resins is 0.01:1 to 0.5:1. The mixing of the two components a) and b) results in a wash-off resistant composition. Said wash-off resistant composition results upon heat-curing in a crash-stable structural adhesive.

Abstract: The invention comprises a polymeric demulsifier, methods of producing the demulsifier and methods of using the demulsifier. The demulsifier is the reaction product of at least one amine-containing group, and optionally a second amine-containing group which includes a tertiary amine group, with a diepoxy- or diglycidyl compound and an additional amine compound subsequently reacted with unreacted epoxy groups. This polymeric composition is subsequently reacted with N-alkylating agent containing compounds to produce novel demulsifiers useful to demulsify oil bearing formations.

Abstract: A one-component heat curable epoxide composition which have an excellent storage stability and can be cured in a short period of time at a relatively low temperature, and in particular, have a property of generating outgas in a smaller amount, and providing cured product with an excellent heat resistance, is provided. The composition comprises 100 parts by weight of (A) an epoxide having more than one epoxy group on average in the molecule, and 1 to 40 parts by weight of (B) a curing compound which is prepared by reacting with heating (a) aminoalkylimidazole of the general formula: (b) an amine having two nitrogen atoms with one or two active hydrogen atoms and having at least one cyclic structure group in the molecule therein, (c) urea, and (d) a diepoxide having two epoxy groups on average in the molecule.

Abstract: A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED or optical sensor. The molding compound includes a partially-cured epoxy composition, a linear polyol, a dye that absorbs in the region of above 700 nm to about 1200 nm and substantially transmits light from about 400 nm to about 700 nm, and an optional antioxidant material substantially uniformly distributed throughout the epoxy composition. The dye can be dissolved within the epoxy composition by heating a portion of the epoxy composition prior to B-staging of the molding compound. The cured epoxy composition has at least 40% transmittance at 600 nm, less than 10% transmittance at 900 nm, less than 10% transmittance at 1100 nm.

Abstract: The present invention provides methods and compositions for the treatment of ion imbalances. In particular, the invention provides polymeric and pharmaceutical compositions comprising crosslinked amine polymers. Methods of use of the polymeric and pharmaceutical compositions for therapeutic and/or prophylactic benefits are disclosed herein. Examples of these methods include the treatment of renal diseases and hyperphosphatemia.

Abstract: The present invention provides an adhesive for laminates containing, as a main component, an epoxy resin composition comprising an epoxy resin and an epoxy resin-curing agent, the epoxy resin composition being formed into an epoxy resin cured product containing a skeleton structure represented by the formula (1): in an amount of at least 40% by weight. Since the adhesive of the present invention reveals not only a suitable adhesion to various film materials but also a high gas-barrier property, only a single layer formed therefrom can realize both an excellent gas-barrier property and an excellent adhesion property in combination, so that it is possible to produce a high gas-barrier laminated film for a packaging material without forming a separate gas-barrier layer therein.

Abstract: The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) acrylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.

Abstract: The present invention provides methods and compositions for the treatment of ion imbalances. In particular, the invention provides polymeric and pharmaceutical compositions comprising crosslinked amine polymers. Methods of use of the polymeric and pharmaceutical compositions for therapeutic and/or prophylactic benefits are disclosed herein. Examples of these methods include the treatment of renal diseases and hyperphosphatemia.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: The present invention provides methods and compositions for the treatment of ion imbalances. In particular, the invention provides polymeric and pharmaceutical compositions comprising crosslinked amine polymers. Methods of use of the polymeric and pharmaceutical compositions for therapeutic and/or prophylactic benefits are disclosed herein. Examples of these methods include the treatment of renal diseases and hyperphosphatemia.