Contains Nitrogen Atom Patents (Class 525/526)
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Patent number: 7230052Abstract: A composition useful as a matrix for fiber-reinforced composites possesses a viscosity at 25° C. of no more than 1000 mPa·s and provides a cured product displaying a breaking elongation of at least 5%. The composition comprises (A) at least one of a bisphenol epoxy resin (A1) and a phenol novolak epoxy resin (A2), a polyvalent epoxy resin formed from a mononuclear aromatic backbone (B), an aromatic amine curing agent (C), and a rubber (D).Type: GrantFiled: December 21, 2004Date of Patent: June 12, 2007Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Takashi Kaneko, Kazutami Mitani
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Patent number: 7150902Abstract: Articles are coated by applying a coating composition of a high Tg phenoxy-type material having a Tg of at least about 75° C. to at least a portion of a surface of an article, and forming a dried/cured coating of the high Tg phenoxy-type material on the article surface, where the coating has the high Tg phenoxy-type material and a PHAE; or the article surface comprises a coating includes a PHAE; or the coating has the high Tg phenoxy-type material and a PHAE, and the article surface includes a coating layer of a PHAE.Type: GrantFiled: April 7, 2004Date of Patent: December 19, 2006Assignee: Pepsico, Inc.Inventor: Said Farha
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Patent number: 7108806Abstract: A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group/amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a curing agent/catalyst; and e) optionally other additives such as organic solvents, flow additives, adhesion promoters and rheology modifiers. The reaction of epoxy and aliphatic amine with excess epoxy functionality results in a flexible resin with remaining active epoxy groups. The compositions exhibit improved electrical stability and impact resistance over other conductive adhesive compositions that do not comprise the admixture.Type: GrantFiled: February 28, 2003Date of Patent: September 19, 2006Assignee: National Starch and Chemical Investment Holding CorporationInventors: Yue Xiao, Sun Hee Lehmann, Chih-Min Cheng, Gunther Dreezen
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Patent number: 7012120Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.Type: GrantFiled: March 27, 2001Date of Patent: March 14, 2006Assignee: Henkel CorporationInventors: Philp T. Klemarczyk, Andrew D. Messana, Afranio Torres-Filho, Erin K. Yaeger, Takahisa Doba
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Patent number: 7008555Abstract: A curing agent for epoxy agent having N-phenyl-p-phenylenediamine(4-aminodiphenylamine). An epoxy resin combination having a main agent and a curing agent. The main agent has an epoxy resin. The curing agent has a N-phenyl-p-phenylenediamine(4-aminodiphenylamine).Type: GrantFiled: May 22, 2003Date of Patent: March 7, 2006Assignee: Applied Poleramic Inc.Inventors: Brian S. Hayes, Richard Moulton, Doyle Dixon, Leonid Vorobyev
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Patent number: 6977279Abstract: The present invention relates to novel solventless reactive systems curable at room temperature, based on blocked polyisocyanates, primary amines, compounds with oxirane groups, and 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine, and to processes for the preparation of these solventless reactive systems curable at room temperature.Type: GrantFiled: July 17, 2000Date of Patent: December 20, 2005Assignee: Bayer AktiengesellschaftInventors: Jörg Tillack, Wolfgang Puetz, Lutz Schmalstieg
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Patent number: 6977274Abstract: The present invention relates to a novel epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, characterized by exhibiting no shrinkage of volume or inducing an expansion of volume during the curing reaction of the epoxy resin. By the use of the epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, it is possible to inhibit the shrinkage of volume or to induce the expansion of volume during the curing reaction of the epoxy resin. The development of such curing systems made it possible to improve the dimensional stability and to remove the residual stress, which has caused problems for decades in the production of various molded articles. Furthermore, the curing systems according to the present invention have excellent adhesive properties, thereby making it possible to develop adhesives for accurate spatial infiltration.Type: GrantFiled: January 28, 2000Date of Patent: December 20, 2005Assignee: Korea Research Institute of Chemical TechnologyInventors: Jae-Rock Lee, Soo-Jin Park, Geun Ho Kwak
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Patent number: 6916890Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl carboxylic acid, the epoxidized reaction product having two or more thermally labile alpha-alkoxy ester linkages; and (b) a curing agent for the epoxy component. The epoxy composition, when cured, provides a composition which is thermally reworkable, the weak ?-alkoxy ester linkages providing for the reworkable aspect of the invention.Type: GrantFiled: July 25, 2002Date of Patent: July 12, 2005Assignee: Henkel CorporationInventors: John G. Woods, Susanne D. Morrill
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Patent number: 6890999Abstract: A mixture of a self-curing epoxy resin having an equivalent weight of from about 100 to about 700, a melt viscosity of from about 200 to about 2000 centipoise at 150° C. and a low temperature curing agent capable of maintaining its own domain during extrusion which is extruded as one component at a temperature below 220° F. and the extrudate is cooled and pulverized to form a low temperature curable coating powder. The powder cures at a temperature of from about 225 to about 300° F. and produces a coating having an exceptionally smooth surface with either a low or high gloss. The powder is particularly useful for coating heat sensitive substrates such as plastics, paper, cardboard and wood.Type: GrantFiled: October 24, 2002Date of Patent: May 10, 2005Assignee: Rohm and Haas CompanyInventors: Jeno Muthiah, Jeremiah J. Teti, Jacquelyn M. Schlessman, William G. Ruth, Carryll A. Seelig
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Patent number: 6884854Abstract: Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compositions. The reaction products based on tricarboxylic anhydrides or tetracarboxylic anhydrides are distinguished by having on average more than one imide group and carboxyl group per molecule. The compositions may optionally also contain condensation products obtained from tri- or poly-functional polyols and/or tri- or poly-functional amino-terminated polymers and cyclic carboxylic anhydrides, wherein the latter reaction products contain on average more than one carboxyl group per molecule. These compositions additionally contain conventional rubber-modified epoxy resins together with liquid and/or solid polyepoxy resins and conventional hardeners and accelerators and optionally fillers and rheology auxiliaries.Type: GrantFiled: March 31, 2001Date of Patent: April 26, 2005Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Rainer Schoenfeld, Hubert Schenkel, Harald Kuester
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Patent number: 6875825Abstract: A composition useful as a matrix for fiber-reinforced composites possesses a viscosity at 25° C. of no more than 1000 mPa's, and provides a cured product displays a breaking elongation of at least 5%. The composition comprises (A) at least one of a bisphenol epoxy resin (A1) and a phenol novolak type epoxy resin (A2), a polyvalent epoxy resin formed from a mononuclear aromatic backbone (B), and an aromatic amine curing agent (C).Type: GrantFiled: December 13, 2000Date of Patent: April 5, 2005Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Takashi Kaneko, Kazutami Mitani
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Patent number: 6855738Abstract: A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups of the organic resin with a compound containing thermolabile groups; then thermally degrading the thermolabile groups grafted on the organic resin to form a nanoporous laminate. Advantageously, the nanoporous electrical laminate has a low dielectric constant (Dk) because of the nanopores present in the laminate matrix.Type: GrantFiled: June 6, 2003Date of Patent: February 15, 2005Assignee: Dow Global Technologies Inc.Inventors: Ludovic L. Valette, Catherine Marestin, Regis Mercier
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Patent number: 6849337Abstract: A powder coating composition contains solid particulates of a mixture of a solid material having at least two epoxide groups, each beta to a urethane or urea group, and a solid crosslinker reactive with epoxide groups.Type: GrantFiled: October 4, 2002Date of Patent: February 1, 2005Assignee: BASF CorporationInventors: Walter H. Ohrbom, Timothy S. December
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Patent number: 6825315Abstract: A method of making a thermally-removable adhesive is provided where a bismaleimide compound, a monomeric furan compound, containing an oxirane group an amine curative are mixed together at an elevated temperature of greater than approximately 90° C. to form a homogeneous solution, which, when cooled to less than approximately 70° C., simultaneously initiates a Diels-Alder reaction between the furan and the bismaleimide and a epoxy curing reaction between the amine curative and the oxirane group to form a thermally-removable adhesive. Subsequent heating to a temperature greater than approximately 100° C. causes the adhesive to melt and allows separation of adhered pieces.Type: GrantFiled: December 21, 2001Date of Patent: November 30, 2004Assignee: Sandia CorporationInventor: James H. Aubert
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Patent number: 6812299Abstract: The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) arcylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.Type: GrantFiled: July 8, 2002Date of Patent: November 2, 2004Assignee: San-ei Kagaku Co., Ltd.Inventors: Kiyoshi Sato, Kazunori Kitamura
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Publication number: 20040210011Abstract: A modified polyoxyalkylene polyamine obtained by addition reaction of a polyoxyalkylene polyamine and an alkenyl group-containing compound has a low viscosity and it provides, when used as a curing agent for epoxy resin, an epoxy resin composition which can provide an epoxy resin cured product having excellent chemical resistance.Type: ApplicationFiled: January 30, 2004Publication date: October 21, 2004Inventors: Masatoshi Echigo, Hisayuki Kuwahara, Takeshi Koyama
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Publication number: 20040171770Abstract: The epoxy resin curing agent of the present invention comprises a polyamino compound obtainable by addition reaction of aliphatic diamine represented by the formula (1) and styrene and a curing accelerator comprising an organic compound having at least one carboxyl group and at least one hydroxyl group within the molecule, which can achieve a low viscosity without containing environmental harmful substances such as phenol and solvents. In addition, the epoxy resin composition using said epoxy resin curing agent shows an excellent curability at low temperature and it provides a cured coating film having excellent appearance.Type: ApplicationFiled: February 9, 2004Publication date: September 2, 2004Inventors: Hisayuki Kuwahara, Masatoshi Echigo, Takeshi Koyama
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Patent number: 6770965Abstract: A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s−1 after allowing to stand for 24 hours at 25° C.±1° C.Type: GrantFiled: December 27, 2001Date of Patent: August 3, 2004Assignee: NGK Spark Plug Co., Ltd.Inventors: Hiroki Takeuchi, Toshifumi Kojima, Kazushige Ohbayashi, Hisahito Kashima
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Publication number: 20040122164Abstract: The present invention provides novel monofunctional polyethylene glycol aldehydes for the pegylation of therapeutically active proteins. The pegylated protein conjugates that are produced, retain a substantial portion of their therapeutic activity and are less immunogenic than the protein from which the conjugate is derived. New syntheses for preparing such aldehydes are described.Type: ApplicationFiled: September 12, 2003Publication date: June 24, 2004Inventors: Perry Rosen, Kwang H. Nho
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Publication number: 20040121967Abstract: Therapeutic 5-aminosalicylic acid derivative compositions having general formula (I), wherein R is a 1-deoxy sugar residue or a poly(ethylene glycol) chain-containing residue, are provided. The compositions enable topical delivery of 5-aminosalicylic acid to the gastrointestinal tract following oral administration in pharmaceutical preparations. According to the invention, the compositions stabilize pharmaceutical compositions containing therapeutic 5-aminosalicylic acid derivatives in a manner that enhances the retention of said compositions in the intestine, decreases the cellular absorption thereof, and decreases the transfer of said compositions or the 5-aminosalicylic acid derived therefrom to the systemic circulation.Type: ApplicationFiled: October 18, 2003Publication date: June 24, 2004Inventor: Deanna Jean Nelson
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Patent number: 6750301Abstract: Adhesive compositions containing a base compound or resin and an epoxy compound or resin with allyl or vinyl functionality show enhanced adhesive strength. The compositions can be used in microelectronic applications.Type: GrantFiled: July 7, 2000Date of Patent: June 15, 2004Assignee: National Starch and Chemical Investment Holding CorporationInventors: Mark R. Bonneau, Yun K. Shin, Gina Hoang, Martin Sobczak
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Patent number: 6749927Abstract: A dielectric resin composition comprising at least one type of epoxy resin and at least one type of cyanate ester which would react with said epoxy resin, together with a metal ion catalyst system, the ratio of the epoxy functional groups of said epoxy resin to the cyanate groups of said cyanate ester being in the range of from 1:0.8 to 1:1.4. Alternatively, a dielectric resin composition according to the invention may comprise a polyimide resin with side chain epoxy groups, a cyanate ester with two or more cyanate groups in the molecule, and a metal ion catalyst system. A multilayer circuit board having a multilayer structure comprising a core substrate and a required number of dielectric layers and wiring layers stacked alternately, wherein at least one of the dielectric layers is formed from a dielectric resin composition of the invention, is also disclosed.Type: GrantFiled: January 11, 2002Date of Patent: June 15, 2004Assignee: Fujitsu LimitedInventor: Nawalage Florence Cooray
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Patent number: 6743375Abstract: An epoxy resin hardener having a cure temperature of between about 60° C. and 100° C. comprises a mixture of: a) an imidazole or a trihydric compound having methylol groups at the 2- and 6-positions formed by reacting a 4-alkylphenol with 2 moles of formaldehyde, b) trimethylopropane, and c) tetramethylguanidine or a tetramethylguanidine derived from the reaction of a monepoxide, a diepoxide, a phenol and formaldehyde, or a dihydric phenol and formaldehyde.Type: GrantFiled: March 8, 2002Date of Patent: June 1, 2004Assignee: Ardes Enterprises, Inc.Inventor: Richard D. Schile
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Patent number: 6727325Abstract: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.Type: GrantFiled: June 23, 1999Date of Patent: April 27, 2004Assignee: Nippon Soda Co. Ltd.Inventors: Hiroshi Suzuki, Satoru Abe, Izuo Aoki
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Publication number: 20040077802Abstract: The present invention relates to adducts obtainable by reaction of: A) an amine compound containing 2 or more than 2 amino groups: with B) a polyalkylene glycol monoglycidyl ether of general formula (I), in which R independently of one another (for n>1), is an —H or —CH, radical, and n=1 to 50, characterized in that the reaction ratio of components A) and B) is selected in such a way that the resultant adduct contains 2 or more than 2 amine hydrogen groups: to curable compositions based on these adducts with epoxy resins, and to the use of these curable compositions as casting resin, adhesive, matrix resin, tooling resin or as coating composition, in particular for self-flowing coatings.Type: ApplicationFiled: September 15, 2003Publication date: April 22, 2004Inventors: Wolfgang Scherzer, Jorg Volle, Doris Fitzek
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Patent number: 6713571Abstract: A process for producing an epoxy resin composition for photosemiconductor element encapsulation which, even when a filler or the like is not contained therein, can have a viscosity necessary for molding and hence be satisfactorily molded to give a cured resin less apt to have defects such as burrs or bubbles. The process, which is for producing an epoxy resin composition for photosemiconductor element encapsulation comprising an epoxy resin, a hardener and a hardening accelerator as constituent ingredients, comprises: a first step of melt-mixing the ingredients together; and a second step of regulating viscosity of the molten mixture obtained in the first step at a given temperature.Type: GrantFiled: December 13, 2001Date of Patent: March 30, 2004Assignee: Nitto Denki CorporationInventor: Katsumi Shimada
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Patent number: 6713535Abstract: The present invention is directed to a low-friction coating composition, comprising: about 10 to about 30 wt % of an epoxy resin composition consisting essentially of 4-glycidyloxy-N,N′-diglycidylaniline; about 30 to about 60 wt % of an epoxide resin composition consisting essentially of bisphenol A diglycidyl ether polymer; and about 20 to about 40 wt % of an aromatic amine composition consisting essentially of 4,4′-sulfonyldianiline; wherein all weight percents are based on the total weight of the low-friction coating composition, and wherein the low-friction coating composition is substantially free of chromate. The invention is also directed to a substrate coated with the above low-friction coating composition, and methods of coating a substrate with the low-friction coating composition.Type: GrantFiled: February 28, 2002Date of Patent: March 30, 2004Assignee: Turbine Controls, Inc.Inventors: Stanley Orkin, Glenn Greenberg
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Patent number: 6703070Abstract: A mixture of a self-curing epoxy resin having an equivalent weight of from about 100 to about 700, a melt viscosity of from out 200 to about 3000 centipoise at 150° C. and a low temperature curing agent is extruded or otherwise mixed in the molten state as one component at a temperature below 230° F. and the extrudate is cooled and pulverized to form a low temperature curable coating powder. The powder cures at a temperature of from about 225 to about 300° F. and produces a coating having an exceptionally smooth surface with either a low or high gloss. The powder is particulary useful for coating heat sensitive substrates such as plastic parts for automobiles, paper, cardboard and wood. Fiberboard having a pattern such as a simulated wood grain printed on its surface and a powder coating of this invention over said pattern has the appearance of natural wood.Type: GrantFiled: May 21, 1999Date of Patent: March 9, 2004Assignee: Morton International, Inc.Inventors: Jeno Muthiah, Jeremiah J. Teti, Jacquelyn M. Schlessman, William G. Ruth, Carryll A. Seelig
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Patent number: 6670041Abstract: Water-dilutable binders which are self-crosslinking at room temperature, comprising reaction products ABF with epoxy-amine adducts A and formaldehyde resin formers B selected from phenols B1, (substituted) ureas B2, melamine B3, guanamines B4, and mixtures of said resin formers, with formaldehyde F or compounds which give off formaldehyde under the reaction conditions, may be formulated, following at least partial neutralization, to give aqueous coating materials which give coatings affording outstanding corrosion protection.Type: GrantFiled: November 2, 2001Date of Patent: December 30, 2003Assignee: Solutia Austria GmbHInventors: Willibald Paar, Roland Feola, Johann Gmoser, Michael Gobec
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Patent number: 6670425Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.Type: GrantFiled: June 5, 2001Date of Patent: December 30, 2003Assignee: Brewer Science, Inc.Inventors: Rama Puligadda, James E. Lamb, III, Tony D. Flaim, Runhui Huang, Xie Shao
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Patent number: 6663916Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.Type: GrantFiled: June 18, 2002Date of Patent: December 16, 2003Assignee: Brewer Science, Inc.Inventors: Rama Puligadda, James E. Lamb, III, Tony D. Flaim, Runhui Huang, Xie Shao
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Patent number: 6653371Abstract: This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to 9.0, such as less than or equal to about 7.5.Type: GrantFiled: July 13, 2000Date of Patent: November 25, 2003Inventors: Barry E. Burns, Harry Woolfson, Paul Malone, Jonathan Wigham
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Patent number: 6653369Abstract: Water dilutable amine curing agents for aqueous epoxy resin dispersions, comprising a combination of an epoxide-amine adduct with an emulsifier, the epoxide-amine adduct being obtainable by reacting a polyepoxide with a reaction product of an amine and an epoxide component or an amine and subsequent reaction with an epoxide component, the amount of amine being chosen such that the number of nitrogen-attached hydrogen atoms the number of epoxide groups by a factor of from 2 to 10, and the emulsifier being obtainable by reacting diepoxides or polyepoxides with compounds that are at least difunctional with respect to epoxides, optionally with compounds D that are monofunctional with respect to epoxides, and with amines G which contain at least one tertiary and at least one primary or at least two secondary amino group(s).Type: GrantFiled: May 6, 2002Date of Patent: November 25, 2003Assignee: Solutia Austria GmbHInventors: Martin Gerlitz, Thomas Fischer, Andreas Gollner, Manfred Gogg, Elfriede Prucher, Heike Schneeberger, Josef Wenzl
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Patent number: 6653370Abstract: Water-dilutable, cationically stabilized epoxy resins ZYX are obtained by reacting, in the first stage, aromatic or aliphatic epoxide compounds Z with aliphatic amines Y to form epoxy-amine adducts ZY which are neutralized and then in aqueous dispersion are reacted in a second stage with a further epoxy resin X. The resins ZYX may be formulated without additional curatives to give aqueous coating materials which exhibit a good corrosion protection effect.Type: GrantFiled: November 2, 2001Date of Patent: November 25, 2003Assignee: Solutia Austria GmbHInventors: Willibald Paar, Roland Feola, Johann Gmoser, Maximilian Friedl
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Patent number: 6653412Abstract: A curing agent for epoxy resins comprises: a) a reaction product of at least one polyalkylene polyether monoamine and/or polyamine with a polyepoxide and optionally, a monoepoxide to obtain an epoxide group-containing precursor, the precursor further reacted with a primary monoamine and/or a primary or secondary polyamine in at least a 10% molar excess relative to the epoxide groups of the precursor, the reaction product being substantially free of non-reacted amines; b) an amine-terminated adduct of an epoxy resin and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines; and c) an amine-terminated adduct of an epoxide group-containing reactive thinning agent and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines, wherein the epoxy resin of component b) and epoxide group-containing reactive thinning agent of c) are added to the epoxide group-containing precursor of component a) before the reactionType: GrantFiled: February 11, 2002Date of Patent: November 25, 2003Assignee: Bakelite AGInventors: Markus Schrötz, Martin Fulgraff, Peter Martischewski, Jurgen Schillgalies, Rolf Herzog
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Patent number: 6645631Abstract: A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including: (I) a non-halogenated epoxy resin material selected from: (A) a non-halogenated phosphorus element-containing epoxy resin; (B) a mixture of: (1) a non-halogenated, non-phosphorus element-containing epoxy resin, and (2) a phosphorus element-containing compound; or (C) the reaction product of: (1) a non-halogenated epoxy resin; and (2) a phosphorus element-containing compound; or (D) a combination of two or more of components (A) to (C); and (II) (A) a multi-functional phenolic crosslinking agent having a hydroxy functionality of at least 2; (B) a material which forms a multifunctional phenolic crosslinking agent having a hydroxy functionality of at least 2, upon heating or (C) a mixture of components (A) and (B); in an amount of from about 50% to about 150% of the stoichiometric amount needed to cure the epoxy resin.Type: GrantFiled: December 11, 2000Date of Patent: November 11, 2003Assignee: Dow Global Technologies Inc.Inventors: Joseph Gan, Alan Goodson
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Patent number: 6646065Abstract: A curing agent for epoxy resins comprises: a) a reaction product of at least one polyalkylene polyether monoamine and/or polyamine with a polyepoxide and optionally, a monoepoxide to obtain an epoxide group-containing precursor, the precursor further reacted with a primary monoamine and/or a primary or secondary polyamine in at least a 10% molar excess relative to the epoxide groups of the precursor, the reaction product being substantially free of non-reacted amines; b) an amine-terminated adduct of an epoxy resin and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines; and c) an amine-terminated adduct of an epoxide group-containing reactive thinning agent and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines, and up to 50 mol % relative to the amino groups of a reactive thinning agent containing one or more epoxide groups per molecule.Type: GrantFiled: February 11, 2002Date of Patent: November 11, 2003Assignee: Bakelite AGInventors: Markus Schrötz, Martin Fulgraff, Peter Martischewski, Jürgen Schillgalies, Rolf Herzog
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Patent number: 6617028Abstract: The present invention discloses a phosphorus- and nitrogen-containing resin hardener, which has a structure represented by the following formula: wherein R2 represents a hydrogen atom or a group represented by the following formula: wherein n is an integer of from 0 to 20, and R represents phenylene, naphthylene or a group represented by the following formula: wherein A represents —O—, —S—, —SO2—, —CO—, —CH2—, —C(CH3)2— or a group represented by the following formula: provided that at least one R2 is not a hydrogen atom; and R1 represents NHR2, C1-6alkyl or phenyl; in the above groups represented by R and A, the aromatic group can be substituted by one or more substituents selected from the group consisting of hydroxy, amino, carboxy and C1-6alkyl. The present invention also discloses a flame retarding composition containing said hardener.Type: GrantFiled: July 19, 2000Date of Patent: September 9, 2003Assignee: Chang Chun Plastics Co., Ltd.Inventors: Kuen Yuan Hwang, Hong Hsing Chen, An Pang Tu
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Patent number: 6616979Abstract: Provided are low temperature curing thermosetting epoxy powder coating compositions comprising at least one non-crystalline epoxy resin, at least one crystalline epoxy resin, a curing agent, and a cure catalyst. Coatings made from such powder compositions exhibit a substantial reduction in bubble entrapment, enough to prevent a visible haze from forming in the coating, when cured at low temperatures demanded by brass substrates.Type: GrantFiled: August 13, 2001Date of Patent: September 9, 2003Assignee: Rohm and Haas CompanyInventors: William G. Ruth, Stacy L. Greth, Carryll A. Seelig, Dean A. Schreffler
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Patent number: 6613849Abstract: The terminal glydidyl groups of a diglycidyl ether of a hydroxyaliphatic bisphenol is optionally reacted with (meth)acrylic acid to obtain a vinyl ester. The internal hydroxyaliphatic groups are reacted with (meth)acrylic acid or cyanoacrylic acid to prepare a diglycidyl and/or (meth)acrylate-terminated (meth)acrylate or urethane acrylate.Type: GrantFiled: November 16, 2001Date of Patent: September 2, 2003Assignee: The Dow Chemical CompanyInventors: Louis L. Walker, Robert E. Hefner, Jr., Katherine S. Clement
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Patent number: 6569959Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.Type: GrantFiled: October 19, 1999Date of Patent: May 27, 2003Assignee: Tohto Kasei Co., Ltd.Inventors: Shuya Shinohara, Nobuhisa Saitoh, Yasuyuki Takeda, Masayoshi Hanafusa, Hidenori Nozawa
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Patent number: 6534181Abstract: A resin blend that includes a copolymer of styrene and maleic anhydride (SMA), an epoxy resin (brominated, phosphonated, or bromine-free), and a multifunctional amine cross-linking agent is disclosed. The cross-linking agent generally contains at least two primary amino groups to promote formation of imide functionalities upon reaction with the anhydride moieties of the SMA copolymer. Particularly useful cross-linking agents include triazine-centered diamino and triamino compounds such as benzoguanamine, acetoguanamine, and melamine. The disclosed resin blend finds use as a polymer matrix in composite materials and as an impregnating resin in laminates. Compared to conventional SMA copolymer/epoxy resin blends, the disclosed resin exhibits lower dielectric constant and dissipation factor, as well as higher thermal and moisture resistance, making it especially useful in high-speed, low-loss printed wire board applications.Type: GrantFiled: March 27, 2001Date of Patent: March 18, 2003Assignee: Neltec, Inc.Inventor: David K. Luttrull
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Publication number: 20030036608Abstract: Heat sensitive substrates, as well as others such as metal or glass, are electrostatically coated with a thermosetting coating powder comprising a melt-mixed, chilled, chipped, and powdered blend of an epoxy resin and a catalyst therefore, and a powdered low temperature curing agent along with conventional additives. The coating powder is deposited on the substrate and heated to fuse, flow and cure. The mixture of resin and catalyst does not cure within the extruder but it is made to cure at low temperatures on the desired substrate by the separate addition of the curing agent to the powdered melt-mixed blend. A small amount of the low temperature curing agent, insufficient to cause substantial curing in the molten stage may be used in place of the catalyst.Type: ApplicationFiled: June 4, 1999Publication date: February 20, 2003Inventors: ANDREW T. DALY, GLENN D. CORRELL, JENO MUTHIAH, JOSEPH J. KOZLOWSKI, RICHARD P. HALEY, PAUL R. HORINKA, EUGENE P. REINHEIMER
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Patent number: 6518331Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.Type: GrantFiled: December 5, 2000Date of Patent: February 11, 2003Assignee: Taiyo Ink Manufacturing Co., Ltd.Inventors: Akio Sekimoto, Shinichi Yamada
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Patent number: 6509413Abstract: A mixture of a self-curing epoxy resin having an equivalent weight of from about 100 to about 700, a melt viscosity of from about 200 to about 2000 centipoise at 150° C. and a low temperature curing agent is extruded as one component at a temperature below 220° F. and the extrudate is cooled and pulverized to form a low temperature curable coating powder. The powder cures at a temperature of from about 225 to about 300° F. and produces a coating having a smooth surface with either a low or high gloss. The powder is particulary useful for coating heat-sensitive substrates such as plastics, paper, cardboard and wood.Type: GrantFiled: November 3, 2000Date of Patent: January 21, 2003Assignee: Rohm and Haas CompanyInventors: Jeno Muthiah, Jeremiah J. Teti, Jacquelyn M. Schlessman, William G. Ruth, Carryll A. Seelig
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Patent number: 6492027Abstract: The present invention provides a cationic resin composition capable of forming a cationically electrodepositable coating film which is excellent in corrosion resistance, an aptitude for the cationic electrodepositable coating of a rust preventive steel plate and in adhesion to substrate, which cationic resin composition is characterized by comprising the following components: (A) an amino group-containing epoxy resin which is prepared by adding an amino group-containing compound to an epoxy resin having an epoxy equivalent of 400 to 3000, (B) a polyol-modified amino group-containing epoxy resin which is prepared by making an epoxy resin having an epoxy equivalent of 180 to 2500 react with an amino group-containing compound and with a polyol compound obtained by adding caprolactone to a compound having plural active hydrogen groups, and (C) a blocked polyisocyanate curing agent, component (A) being 40 to 70% by weight, component (B) being 4 to 40% by weight, and component (C) being 10 to 40% by weight, baseType: GrantFiled: May 31, 2001Date of Patent: December 10, 2002Assignee: Kansai Paint Co., Ltd.Inventors: Shigeo Nishiguchi, Koji Kamikado, Tadayoshi Hiraki, Akira Tominaga
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Patent number: 6482899Abstract: A latent curing agent is disclosed for epoxy resin, comprising a reaction product obtainable by allowing (A) an epoxy compound having more than one epoxy groups on the average in the molecule and (B) a compound having in the molecule both a tertiary amino group and at least one functional group selected from the group consisting of OH group, SH group, NH group, NH2 group, COOH group and CONHNH2 group, to react on each other in the presence of 0.05-5.0 equivalents of water per 1 equivalent of the epoxy group of Compound (A); and a curable epoxy resin composition comprising such curing agent and an epoxy compound having more than one epoxy group on the average in the molecule.Type: GrantFiled: April 16, 1999Date of Patent: November 19, 2002Assignee: Ajinomoto Co., Inc.Inventors: Junji Ohashi, Tetsuo Hinoma
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Patent number: 6476160Abstract: A composition comprising an epoxy resin and a ketimine compound, wherein the epoxy resin is either (1) an epoxy resin having a content of an epoxy resin having no hydroxyl group in the molecule in a range of more than 90 mol % to 100 mol % or less, (2) an epoxy resin wherein hydroxyl groups are capped with an isocyanate group-containing compound, (3) an epoxy resin wherein hydroxyl groups are capped with an alkoxysilyl group-containing compound, or (4) an epoxy resin containing an alkoxysilyl group-containing compound which is capable of capping hydroxyl groups of the epoxy resin. When either of the those epoxy resins is used and also the ketimine compound having high steric hindrance is used, a one-pack epoxy resin composition having good curing property and particularly excellent storage stability can be provided.Type: GrantFiled: July 16, 1999Date of Patent: November 5, 2002Assignee: The Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi
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Patent number: 6468659Abstract: The resin system comprises at least two components which can be stored separately and crosslinked with one another at room temperature, preferably without curing accelerators. The first component comprises at least one compound of the formula (I) where A is an unsubstituted or substituted aromatic radical. The second component comprises at least one cyclic anhydride of an organic acid.Type: GrantFiled: February 9, 2001Date of Patent: October 22, 2002Assignee: ABB Schweiz AGInventors: Friedrich Vohwinkel, Stefan Foerster, Jens Rocks
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Publication number: 20020119256Abstract: A more controllable fibrous acoustic ceiling patch or textured material in the form of a sprayable composition includes a base, a filler, an adhesive binder, an anti-foaming agent, a suspension agent, and fibrous materials. The more controllable acoustic ceiling patch is storable and dispensable from a pressurized dispenser having a delivery nozzle. An aerosol system with a spray nozzle is included on the container for selective discharge of the textured material onto a prepared patch area, which may be on a drywall or support panel so as to match and blend with the surrounding acoustic ceiling surface area in order to provide a continuous and unbroken coextensive surface texture of mechanically and visually matched material.Type: ApplicationFiled: February 22, 2002Publication date: August 29, 2002Applicant: Spraytex, Inc.Inventor: John R. Woods