Nitrogen Reactant Contains At Least One Amino-nitrogen Atom Patents (Class 528/183)
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Patent number: 6001942Abstract: The invention relates to a silicon-containing polyimide resin comprising (I) 0.1 to 100 mole % of structural units represented by the formula: ##STR1## where Ar.sup.1 is a tetra valent organic group having at least one aromatic ring, R independently represents a monovalent hydrocarbon group free of aliphatic unsaturated bonds, X is selected from an alkyleneoxyalkylene or an alkylene group having 2 or more carbon atoms, Y is an oxygen atom, an alkyleneoxyalkylene group, or an alkylene group having 2 or more carbon atoms, l, m, n are each integers having a value of 1 to 10, p is an integer having a value of 1 to 80, and a is 0 or 1; and (II) 99.9 to 0 mole % of structural units represented by the formula: ##STR2## where Ar.sup.2 is a tetravalent organic group having at least one aromatic ring, and Ar.sup.3 is a divalent organic group having at least one aromatic group.Type: GrantFiled: December 21, 1998Date of Patent: December 14, 1999Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Masaaki Amako, Haruhiko Furukawa, Yoshitsugu Morita, Hiroshi Ueki
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Patent number: 5998572Abstract: Methods and devices for controlling the oxidation of a hydrocarbon to an acid by regulating the temperature hold-up time, and conversion in consecutive reaction zones. The temperature in the consecutive reaction zones progressively decreases, while the hold-up time increases. Preferably, the conversion also increases. One of the major advantages of the methods and devices of the present invention is that an outstanding balance between productivity and selectivity/yield of the desired acid may be achieved. In this respect high yields and selectivities may be obtained without sacrificing productivity.Type: GrantFiled: May 12, 1998Date of Patent: December 7, 1999Assignee: RPC Inc.Inventors: Ader M. Rostami, Mark W. Dassel, Eustathios Vassiliou, David C. DeCoster
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Patent number: 5990261Abstract: A low birefringent organic optical component prepared from a resin consisting essentially of one or more repetitive structural units selected from the group consisting of structures represented by general formula (1); ##STR1## wherein A is either of the groups below. ##STR2## The organic optical component can exhibit excellent transparency, heat resistance and mechanical strength as well as a low birefringence. Also provided is a novel aromatic polyamide with a low permitivity and excellent transparency, processability and thermal stability, besides excellent heat resistance inherent in an aromatic polyamide.Type: GrantFiled: August 26, 1997Date of Patent: November 23, 1999Assignee: Mitsui Chemicals, Inc.Inventors: Wataru Yamashita, Tomomi Yoshimura, Atsushi Shibuya, Yoshihiro Sakata, Hideaki Oikawa, Keisuke Takuma, Masahiro Ohta
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Patent number: 5986036Abstract: A new holographic substrate utilizing flexible, optically transparent fluorinated polyimides. Said substrates have extremely low birefringence which results in a high signal to noise ratio in subsequent holograms. Specific examples of said fluorinated polyimides include 6FDA+APB and 6FDA+4BDAF.Type: GrantFiled: June 27, 1997Date of Patent: November 16, 1999Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Paul A. Gierow, William R. Clayton, Anne K. St. Clair
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Patent number: 5973202Abstract: In a process for the preparation of poly-o-hydroxyamides and poly-o-mercaptoamides, a bis-o-aminophenol or a bis-o-aminothiophenol is reacted with a dicarboxylic acid derivative of the following structure: ##STR1## with D=O, S, or NH and where R* is the parent body of the dicarboxylic acid and at least one of the groups R.sup.1 and R.sup.2 is CN or NO.sub.2.Type: GrantFiled: August 28, 1996Date of Patent: October 26, 1999Assignee: Siemens AktiengesellschaftInventors: Recai Sezi, Hellmut Ahne, Eva Rissel, Kurt Geibel
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Patent number: 5969087Abstract: A novel polyimide having a repeating structure unit expressed by the following general formula (1), a method for manufacturing the same, a gas separation membrane using the novel polyimide and the method for manufacturing the same. The gas separation membrane using this polyimide is excellent in gas permeable performance and separation selectivity for gas, for example, carbon dioxide, methane, etc.General Formula (1) ##STR1## where R denotes a quadrivalent organic group.Type: GrantFiled: March 31, 1998Date of Patent: October 19, 1999Assignee: Nitto Denko CorporationInventor: Masatoshi Maeda
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Patent number: 5968640Abstract: The morphology of multidimensional, thermally stable oligomers is combined with the inclusion of charge carrier linkages within the polymer arms to produce thermally stable advanced composites from cured oligomers that are conductive or semiconductive if suitably doped.Type: GrantFiled: September 5, 1985Date of Patent: October 19, 1999Assignee: The Boeing CompanyInventors: Hyman R. Lubowitz, Clyde H. Sheppard, Larry P. Torre
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Patent number: 5969091Abstract: An aromatic heterocyclic compound and an aromatic diamino compound are allowed to separately react with a dicarboxylic acid derivative in an organic solvent, thereby synthesizing two kinds of oligomers, and these two kinds of oligomers are allowed to react with each other in an organic solvent to synthesize a block copolymer precursor, or an aromatic heterocyclic compound, an aromatic diamino compound and a dicarboxylic acid derivative are allowed to react in an organic solvent, thereby synthesizing a random copolymer precursor. The block or random copolymer precursor and a matrix polymer are dissolved in an organic solvent, then, the solvent is removed from the solution, and the resulting coagulum is heated to induce a ring-closing reaction, thereby obtaining a molecular composite material in which the copolymer is dispersed finely and homogeneously in the matrix polymer.Type: GrantFiled: July 12, 1996Date of Patent: October 19, 1999Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Hiroshi Akita, Hiroto Kobayashi
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Patent number: 5969079Abstract: Thermomechanical and thermo-oxidative stabilities in resin composites across the range of aerospace "engineering thermoplastic" resins are improved by forming four crosslinks at each addition polymerization site in the backbone of the resin using crosslinking functionalities of the general formula: ##STR1## wherein Z= ##STR2## .beta.=the residue an organic radical selected from the group consisting of: ##STR3## R.sub.R =a divalent organic radical; X=halogen;Me=methylT=allyl or methallyl.G=--CH.sub.2 --,--S--, --CO--, --SO--, --O--, --CHR.sub.3 --, or --C(R.sub.3).sub.2 --;i=1 or 2;R.sub.3 =hydrogen, lower alkyl, lower alkoxy, aryl, or aryloxy; and.theta.=--C.tbd.N, --O--C.tbd.N, --S--C.tbd.N, or --CR.sub.3 .dbd.C(R.sub.3).sub.Type: GrantFiled: October 21, 1994Date of Patent: October 19, 1999Assignee: The Boeing CompanyInventors: Hyman R. Lubowitz, Clyde H. Sheppard
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Patent number: 5959070Abstract: A class of rigid rod and latter polymers having light emitting capability is provided. Included in this class of polymers are those having novel repeating structural units. These rigid rod and ladder polymers are employed in light emitting diodes.Type: GrantFiled: October 24, 1997Date of Patent: September 28, 1999Assignee: University of RochesterInventors: Samson A. Jenekhe, John A. Osaheni
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Patent number: 5952448Abstract: This invention relates to a poly (imide amic ester) random copolymer, a precursor thereof, and a process for preparing the same. Specifically this invention relates to a novel precursor of polyimide, poly(imide amic ester) which is chemically stable and has excellent workability in either liquid or solid state, a polyimide obtained therefrom and a process for preparing the same.Type: GrantFiled: December 30, 1997Date of Patent: September 14, 1999Assignee: Korea Research Institute of Chemical TechnologyInventors: Myung-Hun Lee, Seo-Bong Lee, Chang-Jin Lee, Eun-Kyoung Kim, Mi-Seon Ryoo
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Patent number: 5948186Abstract: A tire includes polybenzazole (PBZ) fibers, preferably either polybenzoxazole (PBO) or polybenzothiazole (PBT) fibers which are liquid-crystalline. The PBZ fibers can be incorporated into either the carcass of the tire, the reinforcing belts, or both. Preferably the PBZ fibers have a) a tensile strength of at least 4.0 GPa; b) a tensile modulus of at least 140 GPa; and c) an average void diameter of 25 .ANG. or less.Type: GrantFiled: July 10, 1995Date of Patent: September 7, 1999Assignee: Toyobo Co., Ltd.Inventor: Kazuyuki Yabuki
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Patent number: 5948881Abstract: Curative compositions of amine terminated polyamide resins blended with a deaminated bis-(p-aminocyclohexyl)methane composition (DeAms) are useful for curing adhesive epoxy resin compositions. The polyamides comprise combinations of fatty mono-acids, dimer acids, polyethyleneamines, and piperazine ring containing polyamines which are piperazine or N-aminoalkylpiperazine, where the alkyl chain is a C2 to C6 alkyl chain, wherein the ratio of equivalents of fatty mono-acid to dimer acid can range from about 0.001:1 to about 1:1, the ratio of moles of piperazine ring containing polyamine to polyethylene amine can range from about 0.1:1 to about 1:1, and the ratio of moles of polyamine to equivalents of acid can range from about 0.6:1 to about 1.2:1. DeAms is blended at 2 to 40 wt % based on polyamide. Adhesive compositions comprising these curatives are also disclosed.Type: GrantFiled: December 4, 1997Date of Patent: September 7, 1999Assignee: Air Products and Chemicals, Inc.Inventors: Dilipkumar Nandlal Shah, William Edward Starner
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Patent number: 5939521Abstract: This invention relates the novel diamines, the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature, good mechanical properties and improved processability in the manufacture of adhesives, electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2,2',6,6'-substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides, while retaining a realatively high glass transition temperature and improved mechanical properties at useful temperature ranges.Type: GrantFiled: January 23, 1998Date of Patent: August 17, 1999Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventor: Chun-Hua K. Chuang
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Patent number: 5932688Abstract: An improved polybenzimidazole wherein the total concentration of metals other than alkali metal and alkaline earth metals is 10 ppm or less. The resulting polybenzimidazole is industrially useable in parts or components of apparatus for the manufacture of semiconductors and display devices.Type: GrantFiled: January 14, 1997Date of Patent: August 3, 1999Assignee: Hoechst Japan LimitedInventor: Makoto Murata
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Patent number: 5929201Abstract: The present invention relates to amine compositions and the preparation of polyimides. The polyimides can be used for inducing alignment of a liquid crystal medium with polarized light and liquid crystal display elements.Type: GrantFiled: May 20, 1997Date of Patent: July 27, 1999Assignee: Elsicon, Inc.Inventors: Wayne M. Gibbons, Paul J. Shannon, Shao-Tang Sun
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Patent number: 5922259Abstract: There is provided a cord of twisted polybenzazole fibers, which has a tenacity of 35 g/d or higher and an elastic modulus of 800 g/d or higher. The cord has not only remarkably improved fatigue resistance but also excellent mechanical characteristics at a high level that has not been achieved so far. Therefore, it can attain the weight reduction of composite materials, particularly in the field of reinforced rubber materials, and can also make a great contribution to the energy saving.Type: GrantFiled: July 18, 1996Date of Patent: July 13, 1999Assignee: Toyo Boseki Kabushiki KaishaInventors: Yukinari Okuyama, Hiroshi Hirahata, Kazuyuki Yabuki
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Patent number: 5919889Abstract: A melt processable poly(ester-amide) which is capable of forming an anisotropic melt phase is provided. A poly(ester-amide) of the present invention may have recurring units of: (a) 4-hydroxybenzoyl moiety, (b) 6-oxy-2-naphthoyl moiety, (c) 4,4'-biphenol moiety, (d) terephthaloyl moiety, and (e) an aromatic moiety capable of forming an amide linkage in the proportions indicated. Preferably, the moiety capable of forming an amide linkage is derived from p-aminophenol, p-phenylenediamine, N-acetyl-p-aminophenol, etc. The resulting poly(ester-amide) is capable of undergoing melt-processing in the temperature range of from about 300.degree. to about 400.degree. C.Type: GrantFiled: December 23, 1992Date of Patent: July 6, 1999Assignee: Hoechst Celanese CorporationInventors: Cherylyn Lee, Larry F. Charbonneau
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Patent number: 5916996Abstract: A process for the preparation of polyester-imide resin of the formula ##STR1## wherein n represents the number of segments present and is a number of from about 10 to about 10,000; R' is alkyl or alkylene; and R is independently an oxyalkylene or a polyoxyalkylene by the reaction of trimellitic acid, or a trimellitic anhydride, a glycol and a diamine of the formula ##STR2## wherein R represents a hydrogen or alkyl group; and n represents the number of monomer segments, and is a number of from about 1 to about 10, and which reaction is accomplished by heating the aforementioned components.Type: GrantFiled: June 23, 1994Date of Patent: June 29, 1999Assignee: Xerox CorporationInventors: Guerino G. Sacripante, Melvin D. Croucher, Stephan V. Drappel
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Patent number: 5902876Abstract: Improved process for producing a polybenzimidazole compound in solution by dissolving a fully dried polybenzimidazole of the following general formula (1) or (2) in N,N-dimethylacetamide of a sufficiently reduced water content at an elevated temperature of 260.degree. C. or higher in an inert gas atmosphere and a solution of the polybenzimidazole compound produced by the process. The solution remains useful for an extended time without using metal salts or any other stabilizers: ##STR1## where R.sup.1, R.sup.2 and R.sup.5 are tetra-, di- and trivalent aromatic groups, respectively; R.sup.3, R.sup.4 and R.sup.6 are each independently a hydrogen atom, an alkyl group or an aryl group; n is an integer of 2 or more.Type: GrantFiled: June 18, 1997Date of Patent: May 11, 1999Assignee: Hoechst Japan LimitedInventors: Makoto Murata, Toru Nakamura
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Patent number: 5891986Abstract: An aromatic polyimide precursor composition advantageously employable for the production of an amorphous aromatic polyimide film having Tg of 300.degree. C. or higher is composed of an aromatic tetracarboxylic acid component and an aromatic diamine component which are dissolved in an organic solvent, in which at least 60 mol. % of the aromatic tetracarboxylic acid component is 2,3,3',4'-bi-phenyltetracarboxylic acid, its monoester or diester of a primary alcohol, or their mixture, and at least 55 mol. % of the aromatic diamine component is 4,4'-diaminodiphenyl ether.Type: GrantFiled: October 29, 1997Date of Patent: April 6, 1999Assignee: Ube Industries, Ltd.Inventors: Hiroaki Yamaguchi, Fumio Aoki
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Patent number: 5889139Abstract: Novel polyimide copolymers containing ether linkages were prepared by the reaction of an equimolar amount of dianhydride and a combination of diamines. The polyimide copolymers described herein possess the unique features of low moisture uptake, dimensional stability, good mechanical properties, and moderate glass transition temperatures. These materials have potential application as encapsulants and interlayer dielectrics.Type: GrantFiled: February 28, 1997Date of Patent: March 30, 1999Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Catharine C. Fay, Anne K. St. Clair
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Patent number: 5889072Abstract: A process for preparing superabsorbing crosslinked polyaspartate salt by reacting crosslinked polysuccinimide having a weight average molecular weight of at least 20,000 Daltons with neat base or aqueous base wherein the ratio of water to crosslinked polysuccinimide is zero or positive up to about 10, preferably about 3.3. The resulting salt is either a solid or paste.Type: GrantFiled: February 24, 1997Date of Patent: March 30, 1999Assignee: Solutia Inc.Inventor: Yueting Chou
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Patent number: 5886130Abstract: A new class of polyarylene co-polymers include repeating units comprising one or more arylene units having the general formula (--Ar--/--Y--).sub.n, where Y is a divalent group chosen from nil, --Z--, --Z--Ph--, and --Ph--Z--Ph--, where Z is a divalent group chosen from the group consisting of --O--, --S--, --NR--, --O(CO)--, --O(CO.sub.2)--,--(CO)NH(CO)--, --NR(CO)--, phthalimide, pyromellitimide, --CO--, --SO--, --SO.sub.2 --, --P(O)R--, --CH.sub.2 --, --CF.sub.2 --, and --CRR'--; Ph is phenylene (ortho, meta or para); and n is greater than 4. The co-polymers are useful as molding resins, and composite matrix resins, and where Ar is heteroarylene as ion exchange resins.Type: GrantFiled: November 2, 1995Date of Patent: March 23, 1999Assignee: Maxdem IncorporatedInventors: Mark S. Trimmer, Ying Wang, Matthew L. Marrocco III, Virgil J. Lee
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Patent number: 5886129Abstract: A rigid, aromatic polyimide composition prepared using a solution imidization process from an aromatic tetracarboxylic dianhydride and a diamine which is greater than 60 mole % to about 85 mole % p-phenylene diamine and 15 mole % to less than 40 mole % m-phenylene diamine exhibits exceptional tensile properties and thermal oxidative stability.Type: GrantFiled: July 1, 1997Date of Patent: March 23, 1999Assignee: E. I. du Pont de Nemours and CompanyInventor: Raymond Lew DeColibus
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Patent number: 5886131Abstract: A method for synthesizing 1,4-bis(4-aminophenoxy)naphthalene and a series of polyamides, polyimides and copoly(amide-imide)s derived from the said compound is disclosed. These polymers possess excellent thermal stability and mechanical strength.Type: GrantFiled: May 30, 1997Date of Patent: March 23, 1999Assignee: China Textile InstituteInventors: Shin Chuan Yao, Jongfu Wu, Kun-Lin Cheng, Wen-Tung Chen
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Patent number: 5880252Abstract: Pyrrolidonyl-containing polyesters and polyamides I to III ##STR1## where R, X, A and Z are defined herein, are suitable as film formers and conditioners in hair-cosmetic formulations, for stabilizing hydrogen-peroxide in aqueous solution, for complexing iodine, as tablet binders and as a constituent of film coatings in pharmaceutical preparations, for enzyme and bleach stabilization in detergent formulations, as an auxiliary in the production and finishing of textiles, as a solubilizer and protective colloid in the preparation and stabilization of polymer dispersions, and as an adhesive raw material.Type: GrantFiled: March 22, 1996Date of Patent: March 9, 1999Assignee: BASF AktiengesellschaftInventors: Son Nguyen Kim, Jorg Breitenbach, Axel Sanner, Peter Hossel, Siegfried Lang
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Patent number: 5866676Abstract: Polyimide copolymers were prepared by reacting different ratios of 3,4'-oxydianiline (ODA) and 1,3-bis(3-aminophenoxy)benzene (APB) with 3,3',4,4'-biphenylcarboxylic dianhydride (BPDA) and endcapping with an effective amount of a non-reactive endcapper. Within a narrow ratio of diamines, from .sup..about. 50% ODA/50% APB to .sup..about. 95% ODA/5% APB, the copolyimides prepared with BPDA have a unique combination of properties that make them very attractive for various applications. This unique combination of properties includes low pressure processing (200 psi and below), long term melt stability (several hours at 390.degree. C.), improved toughness, improved solvent resistance, improved adhesive properties, and improved composite mechanical properties.Type: GrantFiled: February 14, 1995Date of Patent: February 2, 1999Assignee: The United States of America as represented by the United States National Aeronautics and Space AdministrationInventor: Brian J. Jensen
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Patent number: 5859181Abstract: A solvent-soluble siloxane polyimide comprising a copolymer obtained by reaction of a diamine compound mixture comprising a diaminopolysiloxane and an alicyclic diamine with an aromatic tetracarboxylic acid anhydride, followed by polyimidization reaction of the resulting polyamic acid forms a heat-resistant adhesive by adding an epoxy resin, a diamine-based curing agent and an organic solvent thereto, The formed adhesives show a distinguished heat-resistant adhesiveness when the resulting siloxane polyimide soluble in ordinary organic solvents is used as a main component of the adhesive for bonding between a base material and a copper foil of a flexible printed substrate. By further addition of a fluorinated resin to the heat-resistant adhesive, the adhesiveness can be more improved.Type: GrantFiled: December 17, 1997Date of Patent: January 12, 1999Assignee: Nippon Mektron, LimitedInventors: Dong Zhao, Hiroshi Sakuyama, Tomoko Katono, Lin-chiu Chiang, Jeng-Tain Lin
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Patent number: 5859171Abstract: A polyimide copolymer containing a block polyimide polymer component composed of a rigid aromatic diamine compound and an aromatic tetracarboxylic acid compound and a random polyimide copolymer component composed of a flexible aromatic diamine compound and at least two types of aromatic tetracarboxylic acid compounds is prepared by a two-stage polymerization process. Resin molded products prepared from the polyimide copolymer have high modulus, low thermal expansion and low water absorption and can be used as TAB base films that require higher processability and precision.Type: GrantFiled: May 21, 1997Date of Patent: January 12, 1999Assignee: DuPont TorayInventors: Kouichi Sawasaki, Michihiro Kubo, Toshikazu Matsuda
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Patent number: 5852155Abstract: Disclosed are polyesteramide resin compositions having amide units of formula (I): ##STR1## and the units of the formula (II): ##STR2## wherein the polyesteramide is substantially devoid of units derived from butane diol. The ratio of (I) to (II) in the polyesteramide is preferably less than 1:3. Preferred polyesteramides have at least 80% of units of formula (I) separated by at least one of the units of formula (II).Type: GrantFiled: March 1, 1995Date of Patent: December 22, 1998Assignee: General Electric CompanyInventors: Jan Bussink, Reinoud Jaap Gaymans, Johannes Hubertus G. M. Lohmeijer, Ilias Nicholas Mamalis, Gary F. Smith, Antoinette Cornelia Maria van Bennekom
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Patent number: 5847071Abstract: A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.Type: GrantFiled: April 17, 1997Date of Patent: December 8, 1998Assignee: Hitachi, Chemical Co., Ltd.Inventors: Hideo Hagiwara, Makoto Kaji, Hiroshi Nishizawa, Kenji Suzuki, Yasunori Kojima
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Patent number: 5844065Abstract: A new diamine, 2,2'-dimethyl-4,4'-bis(4-aminophenoxy)-biphenyl was synthesized and used to prepare high performance engineering plastics by polycondensation. The new diamine as shown in the following formula has a noncoplanar 2,2'-disubstituted biphenylene and a flexible aryl units: ##STR1## The engineering plastics disclosed in the present invention includes polyamides, polyimides and poly(amide-imide)s.Type: GrantFiled: May 14, 1997Date of Patent: December 1, 1998Assignee: National Science CouncilInventors: Der-Jang Liaw, Been-Yang Liaw
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Patent number: 5840825Abstract: Disclosed is a gas barrier coating and multilayer packaging materials made therefrom. The gas barrier coating includes a polyamine (A), a polyepoxide (B), and a filler (C). Polyamine (A) includes at least one of the following: (a) an initial polyamine, and (b) an ungelled polyamine adduct which is the reaction product of the initial polyamine and epichlorohydrin and/or a polyepoxide having a plurality of glycidyl groups linked to an aromatic member. Polyepoxide (B) includes a polyepoxide having a plurality of glycidyl groups linked to an aromatic member. Filler (C) includes a platelet-type filler with the following particle size distribution: (a) a number mean particle diameter in the range from about 5.5 to about 15 microns, and (b) a volume mean particle diameter in the range from about 8 to about 25 microns. In addition, the present invention provides glossy, multilayer packaging materials containing an oxygen barrier material layer having an oxygen permeability constant not more than 0.Type: GrantFiled: December 4, 1996Date of Patent: November 24, 1998Assignee: PPG Incustries, Inc.Inventors: Leland H. Carlblom, Jerome A. Seiner
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Patent number: 5834581Abstract: A process for making polyimide-polyamic ester copolymer composition comprisingreacting at least one diamine, a pyromellitic diacid diester compound; at least one other tetracarboxylic diacid diester compound and a selected phosphoramide in the presence of a base catalyst to form a polyimide-polyamic acid ester copolymer.Type: GrantFiled: April 15, 1997Date of Patent: November 10, 1998Assignee: Olin Microelectronic Chemicals, Inc.Inventors: Ahmad Naiini, Steve L. C. Hsu, William D. Weber, Andrew J. Blakeney
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Patent number: 5830974Abstract: Aromatic polyether polymers, illustrated by polyethersulfones, polyetherketones and polyetherimides, are prepared by a phase transfer catalyzed reaction between a salt of at least one dihydroxyaromatic compound and at least one substituted aromatic compound such as bis(4-chlorophenyl) sulfone, bis(4-chlorophenyl) ketone or 1,3-bis?N-(4-chlorophthalimido)!benzene, in a monoalkoxybenzene such as anisole as diluent and in the presence of a phase transfer catalyst, preferably a hexaalkylguanidinium salt.Type: GrantFiled: February 13, 1997Date of Patent: November 3, 1998Assignee: General Electric CompanyInventors: John Christopher Schmidhauser, Daniel Joseph Brunelle
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Patent number: 5830988Abstract: Polyetherimide polymers prepared from monomers containing indane moieties are disclosed. The high molecular weight indane polyetherimides are transparent, ductile, and exhibit high glass transition temperatures (>200.degree. C.). In addition, the polyetherimides are thermally stable at high temperatures and exhibit good optical properties making them useful in high temperature processing applications, in the fabrication of optoelectronics devices, and in optical applications.Type: GrantFiled: August 26, 1997Date of Patent: November 3, 1998Assignee: Molecular OptoElectronics CorporationInventor: Kwok Pong Chan
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Patent number: 5824763Abstract: A process is disclosed for preparing a polyamide by polymerizing a diacid and a diamine, aminocarboxylic acid or lactam in the presence of excess of either acid or amine such that the ratio of acid to amine end groups or the ratio of amine end groups to acidend groups in the polymer is at least 2.0:1.0.Type: GrantFiled: August 21, 1996Date of Patent: October 20, 1998Assignee: E. I. du Pont de Nemours and CompanyInventor: Rolando Umali Pagilagan
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Patent number: 5821319Abstract: A sliding material and a heat resistant filament which primarily comprises a liquid crystal polyimide, a liquid crystal polyamide or a liquid crystal polyamide-imide copolymer having at least one recurring structural unit selected from the formula (1) and the formula (2) and is excellent in heat resistance, mechanical characteristics and other fundamental properties of polyimides, and relates to significant improvement of heat-resistance by heat-treating the sliding material, the filament and the molded items. The liquid crystal polyamide-imide copolymer which comprises in a polymer molecule 0.05.about.0.95 mole ratio of the recurring structural units of the formula (1) and 0.95.about.0.Type: GrantFiled: April 3, 1996Date of Patent: October 13, 1998Assignee: Mitsui Chemicals, Inc.Inventors: Atsushi Shibuya, Yuichi Okawa, Shoji Tamai, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 5817741Abstract: A diamine which is useful in preparing a new flexible polyamide and polyimide with an aromatic dicarboxylic acid and a tetracarboxylic dianhydrides, respectively, has a general formula as follows: ##STR1## wherein R.sub.1 is a proton (--H) or methyl (--CH.sub.3) and n is an integer ranging from 1 to 4. These polyamide and polyimide exhibit good mechanical performance and processability.Type: GrantFiled: May 14, 1997Date of Patent: October 6, 1998Assignee: National Science CouncilInventors: Der-Jang Liaw, Been-Yang Liaw
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Patent number: 5807960Abstract: A method is provided for the preparation of polyquinoline polymers based on Friedlander condensation polymerization. The method comprises mixing monomers which, when polymerized, form a polyquinoline polymer, together with a catalyst and a solvent, wherein the catalyst comprises an alkyl phosphate.Type: GrantFiled: April 28, 1997Date of Patent: September 15, 1998Assignee: Hitachi Chemical Co., Ltd.Inventor: Matthew L. Marrocco, III
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Patent number: 5807972Abstract: The invention is directed to a hydrolytically polymerized polycaprolactam with new chain regulation, whereby the polymerization of caprolactam (I) is carried out with 0.1-0.7 weight percent of an aromatic dicarboxylic acid (II), 0.01-0.7 weight percent of an aliphatic or cycloaliphatic diamine (III) that carries a primary and a tertiary amino group, and/or 0.01-0.7 weight percent 4-amino-2,2,6,6-tetraalkyl piperidine (IV), whereby the quantities of constituents I through IV add up to 100 weight percent and the quantity of the constituents III and/or IV amounts to 0.01-0.7 weight percent.Type: GrantFiled: August 27, 1997Date of Patent: September 15, 1998Inventors: Hanns-Jorg Liedloff, Ernst Morf, Gerhard Schmidt
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Patent number: 5807961Abstract: This invention is directed to a polyimide film useful as use applications for electronic materials; a liquid crystal aligning film using the same; a liquid crystal display element provided with the liquid crystal aligning film; and a polyamic acid used as a raw material of the polyimide constituting the polyimide film.The polyimide used for preparing the above polyimide films, consists of a diamine component, the 50% by mol or more based upon the total diamine, of which is a diamine having a core structure having no polar group such as 1,2-bis(4-(4-aminobenzyl)phenyl)ethane, 1,6-bis(4-(4-aminobenzyl)phenyl)hexane, 1,1-bis(4-(4-aminobenzyl)phenyl)heptane, etc., and a tetracarboxylic acid dianhydride, and if necessary, an aminosilicon compound, is used as a liquid crystal aligning film.Type: GrantFiled: June 20, 1997Date of Patent: September 15, 1998Assignee: Chisso CorporationInventors: Toshiya Sawai, Masaaki Yazawa, Seiji Oikawa, Shizuo Murata, Masaharu Hayakawa, Etsuo Nakagawa
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Patent number: 5783656Abstract: There are provided a polyamic acid obtainable by reacting a diamine compound of the formula (1) ##STR1## wherein R.sup.1 is an alkyl group having 1 to 12 carbon atoms, a haloalkyl group having 1 to 12 carbon atoms or a halogen atom, each of X and Y is independently a divalent linking group,with a tetracarboxylic acid dianhydride; a polyimide obtainable by dehydrating and ring-closing the above polyamic acid; and a liquid crystal aligning agent containing the above polyamic acid and/or the above polyimide.Type: GrantFiled: January 31, 1997Date of Patent: July 21, 1998Assignee: Japan Synthetic Rubber Co., Ltd.Inventors: Masayuki Kimura, Tsukasa Toyoshima, Keiichi Yamamoto, Kengo Wakabayashi, Yasuo Matsuki, Kyouyu Yasuda
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Patent number: 5783655Abstract: A process for the preparation of aromatic polyamide pulp having both excellent physical properties and a high degree of polymerization by continuous polymerization and orientation by using of mixed solutions. The solutions are prepared by reacting diamine with aromatic diacid dichloride in an amide and/or urea-based polymerization solvent containing inorganic salts, or a mixture of inorganic salts and a Lewis acid compound. The process can be practiced by polymerization-orientation apparatus located on the continuous transferable polymerization-orientation means comprised of a belt and one or more stirring bars.Type: GrantFiled: June 5, 1995Date of Patent: July 21, 1998Assignee: Kolon Industries, Inc.Inventors: Du Hyun Kim, Seock Chul Ryu, Won Jun Choe, Young Hwan Park, Chang Seop Ji
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Patent number: 5780580Abstract: A crystalline polylactone is produced having reactive acrylate end groups. When incorporated into a thermosetting resin which includes reactive C.dbd.CH.sub.2 sites, the present functionalized polylactone acts as a toughener, greatly increasing the impact resistance of the final cured product. Also disclosed are carboxyl-bearing polylactones as tougheners for epoxy resin systems.Type: GrantFiled: August 15, 1997Date of Patent: July 14, 1998Assignee: Clemson UniversityInventors: Shalaby W. Shalaby, Lance A. Monroe
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Patent number: 5773559Abstract: The present invention relates to a process of producing a polyimide-type copolymer, to a thin layer forming agent, to a liquid crystal alignment layer and to processes of producing thin layer formation agents and liquid crystal alignment layers. More specifically, this invention relates to a polyamic acid block copolymer, a polyimide block copolymer, a polyimide-polyamic acid block copolymer, a thin layer forming agent comprised of a polyimide-type block copolymer, and a liquid crystal alignment layer comprised of a polyimide-type block copolymer and processes of their production.Type: GrantFiled: January 31, 1996Date of Patent: June 30, 1998Assignee: Japan Synthetic Rubber Co., Ltd.Inventors: Tsuyoshi Miyamoto, Masayuki Kimura, Kazuhiro Eguchi, Yasuo Matsuki
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Patent number: 5770676Abstract: In the process of the present invention, a non-polar, aprotic solvent is removed from an oligomer/polymer solution by freeze-drying in order to produce IPNs and semi-IPNs. By thermally quenching the solution to a solid in a short length of time, the size of the minor constituent-rich regions is greatly reduced as they are excluded along with the major constituent from the regions of crystallizing solvent. The use of this process sequence of controlling phase morphology provides IPNs and semi-IPNs with improved fracture toughness, microcracking resistance, and other physical-mechanical properties as compared to IPNs and semi-IPNs formed when the solvent is evaporated rather than sublimed.Type: GrantFiled: April 10, 1996Date of Patent: June 23, 1998Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Ruth H. Pater, Marion G. Hansen
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Patent number: 5761809Abstract: Disclosed is a process which comprises reacting a haloalkylated aromatic polymer with a material selected from the group consisting of unsaturated ester salts, alkoxide salts, alkylcarboxylate salts, and mixtures thereof, thereby forming a curable polymer having functional groups corresponding to the selected salt. Another embodiment of the present invention is directed to a process for preparing an ink jet printhead with the curable polymer thus prepared.Type: GrantFiled: August 29, 1996Date of Patent: June 9, 1998Assignee: Xerox CorporationInventors: Timothy J. Fuller, Ram S. Narang, Thomas W. Smith, David J. Luca, Raymond K. Crandall
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Patent number: 5760168Abstract: Controlled molecular weight phenylethynyl terminated imide oligomers (PETIs) have been prepared by the cyclodehydration of precursor phenylethynyl terminated amic acid oligomers. Amino terminated amic acid oligomers are prepared from the reaction of dianhydride(s) with an excess of diamine(s) and subsequently endcapped with phenylethynyl phthalic anhydride(s) (PEPA). The polymerizations are carried out in polar aprotic solvents such as N-methyl-2-pyrrolidinone or N,N-dimethylacetamide under nitrogen at room temperature. The amic acid oligomers are subsequently cyclodehydrated either thermally or chemically to the corresponding imide oligomers. Direct preparation of PETIs from the reaction of dianhydride(s) with an excess of diamine(s) and endcapped with phenylethynyl phthalic anhydride(s) has been performed in m-cresol. Phenylethynyl phthalic anhydrides are synthesized by the palladium catalyzed reaction of phenylacetylene with bromo substituted phthalic anhydrides in triethylamine.Type: GrantFiled: October 21, 1996Date of Patent: June 2, 1998Assignee: The United States of America as represented by the Administrator of the National Aeuonautics and Space AdministrationInventors: Paul M. Hergenrother, Joesph G. Smith, Jr.