Two Or More Polycarboxylic Acids Or Derivatives Or Mixtures Thereof Patents (Class 528/189)
  • Patent number: 10854525
    Abstract: A method for densifying thermoplastics, particularly polyimides, for use in conjunction with electronic circuits while producing improved physical properties and a high degree of crystallinity, involves variable frequency microwave (VFM) processing at temperatures typically 100° C. below the glass transition temperature or lower, for times of about 50 to 100 minutes. It is particularly applicable to polymers based on BPDA-PPD, but may also be generally applied to other intentionally designed polyimide structures with the same features. The invention enables the creation of layered structures involving integrated circuits with small feature sizes and overcoatings of polymers with high Tg and other desirable properties.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: December 1, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Robert L. Hubbard
  • Publication number: 20140135447
    Abstract: Reactive extrusion can be used in a continuous, solvent-less preparation of imide oligomers involving two competing reactions among three ingredients, the first reaction between a dianhydride and a diamine and the second reaction between an endcap and the diamine. The imide oligomer can form a composite via conventional production methods or via formation of a film from imide oligomer re-melted in an extruder before being impregnated into tape or fabric.
    Type: Application
    Filed: July 3, 2012
    Publication date: May 15, 2014
    Applicant: POLYONE CORPORATION
    Inventors: Joseph C. Golba, Thomas W. Hughes, Roger W. Avakian
  • Patent number: 7989578
    Abstract: The present invention relates to a negative photosensitive polyimide polymer having a repeating unit of formula (1) as a polymerized unit: wherein G, Q and P* are as defined in the specification. The polyimide polymer of the present invention is developable in an aqueous alkaline solution, and has the properties associated with an insulating layer and photoresist.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: August 2, 2011
    Assignee: Eternal Chemical Co., Ltd.
    Inventor: Chung-Jen Wu
  • Publication number: 20100305295
    Abstract: Disclosed is a process for producing a polyamic acid solution by reacting a diamine component consisting essentially of 20 mol % to 80 mol % of p-phenylenediamine and 80 mol % to 20 mol % of diaminodiphenyl ether with a tetracarboxylic acid component consisting essentially of 10 mol % to 60 mol % of 2,3,3?,4?-biphenyltetracarboxylic dianhydride and 90 mol % to 40 mol % of 3,3?,4,4?-biphenyltetracarboxylic dianhydride in a solvent, comprising: a first step in which a diamine component is reacted with a molar excess of a tetracarboxylic acid component in a solvent containing more than ? mole of water per mole of the tetracarboxylic acid component, whereby preparing a polyamic acid solution; and a second step in which a diamine component, or a diamine component and a tetracarboxylic acid component are added to the polyamic acid solution obtained in the first step so that the molar amount of the diamine component is substantially equal to the molar amount of the tetracarboxylic acid component, and then the diamin
    Type: Application
    Filed: December 1, 2008
    Publication date: December 2, 2010
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Takeshige Nakayama, Seiichirou Takabayashi, Tooru Murakami
  • Patent number: 7794706
    Abstract: The present invention provides wound dressings, optionally surgically implantable, containing biodegradable, polymers and hydrogels having allogenic or autologous precursor cells, such as stem cells and progenitor cells dispersed within. Alternatively, the wound dressings can have conditioned medium obtained from the precursor cells dispersed within. The wound dressings promote tissue restoration processes at a site of application or implantation. Additional bioactive agents can also be dispersed within the polymer/hydrogel matrix, which can be formulated to biodegrade at a controlled rate by adjusting the composition. Methods are also provided for using such biodegradable wound dressings as a delivery device or carrier for the precursor cells, conditioned medium and bioactive agents, or as coatings on implantable medical devices, to promote tissue restoration at a lesion site.
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: September 14, 2010
    Assignee: Medivas, LLC
    Inventors: Kenneth W. Carpenter, William G. Turnell, Kristin M. DeFife, Kathryn A. Grako, Ramaz Katsarava
  • Patent number: 7408018
    Abstract: The invention provides elastomeric copolyester amides, elastomeric copolyester urethanes, and methods for making the same. The polymers are based on ?-amino acids and possess physical, chemical and biodegradation properties that render them suitable for use in the human body. The polymers are useful as carriers of drugs or other bioactive substances. The polymers can also be linked, intermixed, or a combination thereof, to one or more drugs. Additionally, the polymers can be used to coat stents, for example, to suppress restenosis. Furthermore, the biodegradation of the copolyester amides and copolyester urethanes allows for the delivery of essential ?-amino acids to sites in the body, for example, to facilitate wound repair of injured tissues.
    Type: Grant
    Filed: October 5, 2006
    Date of Patent: August 5, 2008
    Assignee: Cornell Research Foundation, Inc.
    Inventors: Chih-Chang Chu, Ramaz Katsarava
  • Patent number: 7304122
    Abstract: The present invention provides elastomeric copolyester amides, elastomeric copolyester urethanes, and methods for making the same. The polymers that are based on ?-amino acids and possess suitable physical, chemical and biodegradation properties. The polymers are useful as carriers of drugs or other bioactive substances. The polymers can be linked, intermixed, or a combination thereof, to one or more drugs.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: December 4, 2007
    Assignee: Cornell Research Foundation, Inc.
    Inventors: Chih-Chang Chu, Ramaz Katsarava
  • Patent number: 6984711
    Abstract: A method of production of a cyclic polysulfide having the formula (I): wherein x is an integer of 2 to 6, n is an integer of 1 to 15, and R indicates a substituted or unsubstituted C2 to C18 alkylene group or a substituted or unsubstituted C2 to C18 alkylene group including an oxyalkylene group comprising: reacting a dihalogen compound of the formula X—R—X wherein, X independently indicates a halogen atom, and R indicates a substituted or unsubstituted C2 to C18 alkylene group or a substituted or unsubstituted C2 to C18 alkylene group including an oxyalkylene group and an alkali metal polysulfide of the formula M2Sx wherein, M is an alkali metal and x is an integer of 2 to 6, by a two-phase system in an incompatible mixed solvent of a hydrophilic and lypophilic solvent.
    Type: Grant
    Filed: November 27, 2001
    Date of Patent: January 10, 2006
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Choi Wonmun, Kazunori Ishikawa
  • Patent number: 6864348
    Abstract: Polyetherpolyamide elastomer showing a low water absorption, a high stress relaxation, and a high elastic recovery percentage of elongation is obtainable by polymerizing an aminocarboxylic acid compound and/or a lactam compound, a triblock polyetherdiamine compound having the following formula, and a dicarboxylic acid compound: [x is a value of 1 to 20, y is a value of 4 to 50, z is a value of 1 to 20].
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: March 8, 2005
    Assignee: UBE Industries, Ltd.
    Inventors: Hiroshi Okushita, Tadao Muramatsu, Teruaki Fujii
  • Patent number: 6828408
    Abstract: An aromatic polyimide ester having a small coefficient of linear expansion, small water absorbing property, and excellent heat resistance. The aromatic polyimide ester comprising: a repeating unit represented by a following formula (I), a repeating unit represented by a following formula (II), (n represents 0 or 1) a repeating unit represented by a following formula (III), and a repeating unit represented by a following formula (IV), (-A- represents —O— or —CO—, and is located in para-position or meta position to imido group, and X represents direct coupling, —O—, —S—, or —SO2—) and the repeating units are mutually bonded with each other through ester-bonds.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: December 7, 2004
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Satoshi Okamoto, Manabu Hirakawa
  • Patent number: 6762277
    Abstract: A method of manufacturing a new N-carboxyamino acid anhydride and polyamino acid using a simple process operation. The method for manufacturing N-carboxyamino acid anhydride comprising reacting &agr;-amino acid with di-tert-butyltricarbonate. The method for manufacturing polyamino acid comprising decarboxylating the N-carboxyamino acid anhydride obtained by reacting &agr;-amino acid with di-tert-butyltricarbonate.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: July 13, 2004
    Assignee: JSR Corporation
    Inventors: Hiroto Kudoh, Takeshi Endoh
  • Patent number: 6649730
    Abstract: The object of the present invention is to provide an aromatic polyester amide which has improved mechanical strength and high elastic modulus after being molded into a thin wall article as well as exhibits excellent heat stability and moldability. The present invention provides an aromatic polyester amide comprising the following repeating units (a)-(d): [wherein n in (c) represents 0 or 1] wherein (a) is from 2 to 20 mole %, (b) is from 30 to 65 mole %, (c) is from 15 to 35 mole % and (d) is from 15 to 30 mole % provided that the sum of (a) to (d) is 100 mole %.
    Type: Grant
    Filed: September 23, 2002
    Date of Patent: November 18, 2003
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Satoshi Okamoto, Tomohiro Sato, Manabu Hirakawa
  • Patent number: 6610815
    Abstract: Disclosed is a polyamide ester which comprises a plurality of specific amide ester recurring units including, in a specific ratio, recurring units containing a tetravalent benzene group and recurring units containing a tetravalent diphenyl ether group, and which is adapted to be converted to a polyimide in a coating form by heat-curing, wherein the polyimide coating exhibits a residual stress of 33 MPa or less as measured with respect to a 10 &mgr;m-thick polyimide coating formed on a silicon substrate. Also disclosed is a polyamide ester composition comprising a plurality of different polyamide esters, wherein the plurality of different polyamide esters collectively contain, in a specific ratio, the recurring units containing a tetravalent benzene group and the recurring units containing a tetravalent diphenyl ether group.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: August 26, 2003
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Keiko Hata, Yoko Tanizaki, Yoshio Matsuoka
  • Patent number: 6586555
    Abstract: This invention provides processes of the preparation of polyamides, polyimides, and polyamideimides, which are easy to purify after reactions, from polycarboxylic acids and polyamines in high yield without side reactions such as a change of color to black by direct polycondensation reaction with heat, especially processes of preparing aromatic polyamides (aramids), aromatic polyimides, and aromatic polyamideimides, which are difficult to synthesize in direct polycondensation reaction. Polyamides, polymides, and polyamideimides are prepared in high yield by the polycondensation of aromatic dicarboxylic acids, aromatic tetracarboxylic acids or aromatic tricarboxylic acids and aromatic diamines, using arylboric acids such as 3,4,5-trifluorophenylboric acids as polycondensation catalysts, in a mixed solvent of pentamethylbenzene and N-methylpyrrolidinone or a mixed solvent of m-terphenyl and N-butylpyrrolidinone.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: July 1, 2003
    Assignee: Japan Science and Technology Corporation
    Inventors: Kazuaki Ishihara, Hisashi Yamamoto
  • Patent number: 6586561
    Abstract: Sulfonated polyimide polymers incorporating bulky monomers are disclosed. The polymers have a liquid crystalline structure and exhibit high conductivity, high water uptake and water stability over a range of relative humidities and temperatures. The polymers are particularly adapted for use as a polymer electrolyte membrane in fuel cells.
    Type: Grant
    Filed: February 18, 2000
    Date of Patent: July 1, 2003
    Assignee: Case Western Reserve University
    Inventors: Morton H. Litt, Robert F. Savinell, Jesse S. Wainright, Yue Zhang
  • Patent number: 6503538
    Abstract: The present invention provides elastomeric copolyester amides, elastomeric copolyester urethanes, and methods for making the same. The polymers that are based on &agr;-amino acids and possess suitable physical, chemical and biodegradation properties. The polymers are useful as carriers of drugs or other bioactive substances.
    Type: Grant
    Filed: August 30, 2000
    Date of Patent: January 7, 2003
    Assignee: Cornell Research Foundation, Inc.
    Inventors: Chih-Chang Chu, Ramaz Katsarava
  • Patent number: 6498226
    Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.
    Type: Grant
    Filed: May 3, 2001
    Date of Patent: December 24, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Kung-Lung Cheng, Shu-Chen Lin, Wen-Ling Lui, Chih-Hsiang Lin, Wei-Ling Lin, Woan-Shiow Tzeng
  • Publication number: 20020188095
    Abstract: A method of manufacturing a new N-carboxyamino acid anhydride and polyamino acid using a simple process operation.
    Type: Application
    Filed: April 26, 2002
    Publication date: December 12, 2002
    Applicant: JSR CORPORATION
    Inventors: Hiroto Kudoh, Takeshi Endoh
  • Publication number: 20020037992
    Abstract: Bush 1 comprises back metal layer 2 made from a steel plate and porous sintered metal layer 4 made from copper, provided on the surface of back metal layer 2 through copper plating layer 3 and impregnated and coated with sliding material 5 within and on the surface of porous sintered metal layer 4, where sliding material 5 comprises PTFE as the main component (not less than 50 vol. % of the entire material), 3-40 vol. % of Bi particles and/or Bi alloy particles, 1-40 vol. % of injection moldable fluororesin such as PFA, etc., 0.1-20 vol. % of hard particles such a W, Al2O3, etc., and 0.1-20 vol. % of a solid lubricant such as graphite, etc. The sliding material based on PTFE as the main component is free from lead and can further improve the wear resistance, while maintaining good sliding characteristics.
    Type: Application
    Filed: July 27, 2001
    Publication date: March 28, 2002
    Applicant: DAIDO METAL COMPANY
    Inventors: Takahiro Niwa, Hideki Iwata, Nobutaka Hiramatsu, Takayuki Shibayama
  • Patent number: 6291122
    Abstract: A branched polyester resin of the Formula wherein n and m represent randomly repeating segments, and the number of n and m segments in the polymer backbone are each of from about 10 to about 10,000; X is an alkylene group, an olefinic group, or an arylene; Y is an organic dioxy group or radical of I, II, or mixtures thereof; Z is an organic trioxy radical of III, IV, or mixtures thereof; and wherein R and R1 is a hydrogen atom or an alkyl group; G is an alkylene or arylene group, and a is 0 or 1.
    Type: Grant
    Filed: September 14, 2000
    Date of Patent: September 18, 2001
    Assignee: Xerox Corporation
    Inventors: Guerino G. Sacripante, Alan E. J. Toth, Marko D. Saban
  • Patent number: 6180747
    Abstract: A branched polyester resin of the Formula wherein n and m represent randomly repeating segments, and the number of n and m segments in the polymer backbone are each of from about 10 to about 10,000; X is an alkylene group, an olefinic group, or an arylene; Y is an organic dioxy group or radical of I, II, or mixtures thereof; Z is an organic trioxy radical of III, IV, or mixtures thereof; and wherein R and R1 is a hydrogen atom or an alkyl group; G is an alkylene or arylene group, and a is 0 or 1.
    Type: Grant
    Filed: February 28, 2000
    Date of Patent: January 30, 2001
    Assignee: Xerox Corporation
    Inventors: Guerino G. Sacripante, Alan E. J. Toth, Marko D. Saban
  • Patent number: 6132884
    Abstract: Process for producing highly stretchable, amorphous anisotropic melt-forming polymers having recurring units derived from p-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, at least one aromatic diacid and an aromatic diol and/or hydroxyamine component, at least a portion of which is 4,4'-biphenol, which comprises incorporating into such polymers recurring units derived from resorcinol and at least one additional monomer that provides the resulting polymer with selected meta linkages, wherein each of said recurring units is present in the polymer in specified amounts.
    Type: Grant
    Filed: January 14, 2000
    Date of Patent: October 17, 2000
    Assignee: Ticona LLC
    Inventors: H. Clay Linstid, III, Dominick L. Cangiano, Ronald N. DeMartino, James E. Kuder, Vincent J. Provino
  • Patent number: 6063465
    Abstract: A polyester container made from a polymer having ethylene glycol moieties, isosorbide moieties and terepthaloyl moieties, and the method of making the container is described. The polyester container is suitable for holding liquids and solids, and may be hot-filled or cold-filled. In particular, wide-mouth jars and narrow-necked bottles may be formed. The polyester has an inherent viscosity of at least 0.35 dL/g when measured as a 1% (weight/volume) solution of the polyester in o-chlorophenol at a temperature of 25.degree. C.
    Type: Grant
    Filed: April 23, 1998
    Date of Patent: May 16, 2000
    Assignee: HNA Holdings, Inc.
    Inventors: Larry F. Charbonneau, Robert E. Johnson
  • Patent number: 5948881
    Abstract: Curative compositions of amine terminated polyamide resins blended with a deaminated bis-(p-aminocyclohexyl)methane composition (DeAms) are useful for curing adhesive epoxy resin compositions. The polyamides comprise combinations of fatty mono-acids, dimer acids, polyethyleneamines, and piperazine ring containing polyamines which are piperazine or N-aminoalkylpiperazine, where the alkyl chain is a C2 to C6 alkyl chain, wherein the ratio of equivalents of fatty mono-acid to dimer acid can range from about 0.001:1 to about 1:1, the ratio of moles of piperazine ring containing polyamine to polyethylene amine can range from about 0.1:1 to about 1:1, and the ratio of moles of polyamine to equivalents of acid can range from about 0.6:1 to about 1.2:1. DeAms is blended at 2 to 40 wt % based on polyamide. Adhesive compositions comprising these curatives are also disclosed.
    Type: Grant
    Filed: December 4, 1997
    Date of Patent: September 7, 1999
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Dilipkumar Nandlal Shah, William Edward Starner
  • Patent number: 5783655
    Abstract: A process for the preparation of aromatic polyamide pulp having both excellent physical properties and a high degree of polymerization by continuous polymerization and orientation by using of mixed solutions. The solutions are prepared by reacting diamine with aromatic diacid dichloride in an amide and/or urea-based polymerization solvent containing inorganic salts, or a mixture of inorganic salts and a Lewis acid compound. The process can be practiced by polymerization-orientation apparatus located on the continuous transferable polymerization-orientation means comprised of a belt and one or more stirring bars.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: July 21, 1998
    Assignee: Kolon Industries, Inc.
    Inventors: Du Hyun Kim, Seock Chul Ryu, Won Jun Choe, Young Hwan Park, Chang Seop Ji
  • Patent number: 5780556
    Abstract: The present invention provides an amino curable polyester oligomer composition having low viscosity and a narrow molecular weight distribution comprising one or a mixture of oligomers (a) and (b): ##STR1## wherein R is the residue of at least one aliphatic, cycloaliphatic or mixed aliphatic/aromatic polycarboxylic-acid having from 2 to about 20 carbon atoms, R.sub.1 is the residue of at least one aliphatic, cycloaliphatic or mixed aliphatic/cycloaliphatic polyol having from 2 to about 20 carbon atoms, A is a radical of the formula: ##STR2## B is a radical of the formula: ##STR3## wherein R.sub.4 is H, OH, halogen or an organic radical containing 1 to 4 carbon atoms, R.sub.5 is a direct bond or an organic radical containing 1 to 20 carbon atoms and R.sub.6 is an organic radical containing 2 to 20 carbon atoms, n is a number averaging from greater than 0 up to less than 2 and p is a number averaging from about 0.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: July 14, 1998
    Assignee: Exxon Chemical Patents Inc
    Inventors: Albert Ilya Yezrielev, Konstantinos R. Rigopoulos, Vijay Swarup
  • Patent number: 5714572
    Abstract: The present invention provides a polyimide resin composition comprising:(a) a polyamide resin comprising a repeating unit represented by the general formula (1): ##STR1## wherein X represents a tetravalent organic group represented by the formula (2): ##STR2## Y represents a divalent organic group comprising a divalent siloxane residual group represented by the formula (3): ##STR3## wherein m is an integer of 60 to 120; and a divalent aromatic group represented by the formula (4): ##STR4## wherein R.sup.1 represents a hydrogen atom or a fluorine atom; and (B) cyclohexanone. From this composition, polyimide resin films can be obtained by heating at a lower temperature for a short time, and the films obtained show good adhesion under moisture-resistant conditions.
    Type: Grant
    Filed: October 23, 1996
    Date of Patent: February 3, 1998
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Hideto Kato
  • Patent number: 5569738
    Abstract: This invention relates to melt processable copolymer of etherimideimide/etherimide herein-after identified as PEII/PEI copolymer of following structural formula(I). ##STR1## wherein, R and R' are independently selected from the groups of ##STR2## Ar and Ar' are independently selected from the groups of ##STR3## (wherein, R1 is H or C1-C6 alkyl group,R2 is II or C1-C4 alkyl group, andR3 is --O--, --CO--, --SO--, --SO2--.); andn and m are independently an integer between 5 and 500.
    Type: Grant
    Filed: March 14, 1995
    Date of Patent: October 29, 1996
    Assignees: Korea Research Institute of Chemical Technology, Cheil Industries, Inc.
    Inventors: Kil Y. Choi, Jong C. Won, Young T. Hong, Sang S. Woo, Youn S. Don
  • Patent number: 5494964
    Abstract: Polyester resins suitable as binders for electrophotographic toners and for acceptor layers for the thermal diffusion printing process based on hydroxyl-containing prepolymers of olefinically unsaturated monomers obtained by(1) polymerization of a mixture of(a) from 60 to 90% by weight of styrene or of a styrene derivative,(b) from 0 to 40% by weight of one or more C.sub.1 -C.sub.
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: February 27, 1996
    Assignee: BASF Aktiengesellschaft
    Inventors: Georg Meichsner, Thomas Wuensch, Rainer Dyllick-Brenzinger
  • Patent number: 5405695
    Abstract: Disclosed herein are poly(phenylene sulfide) fibers having a tensile strength of at least 3.5 g/d, a knot tenacity of at least 2 g/d, a loop tenacity of at least 3.5 g/d, the number of abrasion cycles until breaking in a flexing abrasion test of at least 3,000 times, and the number of repeated flexings until breaking in a flexural fatigue test of at least 150 times. A process for the production of poly(phenylene sulfide) fibers, which comprises melt-spinning a poly(phenylene sulfide), stretching the resultant unstretched filaments at a draw ratio of 2:1 to 7:1 within a temperature range of 80.degree.-260.degree. C., and heat-treating the stretched filaments for 0.1-30 seconds under conditions of a take-up ratio of 0.8:1 to 1.35:1 in a dry heat atmosphere exceeding 285.degree. C., but not exceeding 385.degree. C. is also disclosed.
    Type: Grant
    Filed: October 20, 1992
    Date of Patent: April 11, 1995
    Assignee: Kureha Kagaku Kogyo K.K.
    Inventors: Masamichi Akatsu, Eisho Nakano, Hiroyuki Endo, Keiji Sonoda
  • Patent number: 5380590
    Abstract: A water-dispersible aromatic polyester comprising a dicarboxylic acid component and a glycol component, wherein (A) at least 95 mol% of the dicarboxylic acid component is composed of an aromatic dicarboxylic acid component containing 30 to 99.5 mol% of a 2,6-naphthalenedicarboxylic acid component and at least 0.005 mol% to less than 5 mol% of an aromatic dicarboxylic acid component having a sulfonic acid salt group, and (B) at least 95 mol% of the glycol component is composed of an ethylene glycol component and a component from a propylene oxide adduce of bisphenol A, the molar ratio of the ethylene glycol component:the component of a propylene oxide adduct of bisphenol A being 40-99:60-1; and a fast-adhesion polyester film comprising a polyester film and a coating which contains the above water-dispersible aromatic polyester and is formed on at least one surface of the polyester film.
    Type: Grant
    Filed: March 4, 1994
    Date of Patent: January 10, 1995
    Assignee: Teijin Limited
    Inventors: Tomoki Nakamura, Tetsuo Ichihashi, Masayuki Fukuda
  • Patent number: 5304626
    Abstract: A chemical resistant copolymer useful in electronic applications, said copolymer is a polyimide containing a 3,3',4,4'-tetracarboxybiphenyl dianhydride (BPDA) moiety, at least one other dianhydride moiety, and at least one diamine.
    Type: Grant
    Filed: September 13, 1991
    Date of Patent: April 19, 1994
    Assignee: Amoco Corporation
    Inventors: Marvin J. Burgess, Douglas E. Fjare, Herbert J. Neuhaus
  • Patent number: 5290909
    Abstract: A polyimide composition for use in making polyimide/copper foil laminate that does not require an adhesive layer between the polyimide substrate and the copper foil. A polyimide precursor is first prepared from a monomer composition, which comprises a dianhydride and an imidazole-containing or benzimidazole-containing compound, or mixture thereof The polyimide precursor is then coated onto a copper foil and subsequently subject to an imidization reaction to form a polyimide/copper foil laminate, which exhibits excellent peel strength and flatness while retaining all the advantageous properties that are characteristic of polyimide resins, such as excellent mechanical strength and heat and chemical resistance. Because the polyimide/copper foil laminates disclosed in the present invention are made without the need to apply an adhesive layer, the process of manufacturing the same is greatly simplified and the cost of production therefor can be substantially reduced.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: March 1, 1994
    Assignee: Industrial Technology Research Institute
    Inventors: Han L. Chen, Syh-Ming Ho, Tsung H. Wang, Jing-Pin Pan
  • Patent number: 5250652
    Abstract: The invention is concerned with novel water-dispersible copolymers which contain at least one UVA light-absorbing monomer, one UVB light-absorbing monomer, one hydrophilic monomer, and optionally one hydrophobic monomer component. The UVA light-absorbing monomer absorbs at .lambda.max ultraviolet light in the 320-400 nm range. The UVB light-absorbing monomer absorbs at max ultraviolet light in the 290-320 nm range. Because of the R.sub.3 group used in the invention, the copolymers of the invention permit higher loading of UV monomers than previously obtainable.
    Type: Grant
    Filed: July 30, 1992
    Date of Patent: October 5, 1993
    Assignee: Lever Brothers Company, Division of Conopco, Inc.
    Inventors: Matthew E. Langer, Ferial Khorshahi
  • Patent number: 5248760
    Abstract: The invention comprises curing polyamic acid solutions into polyimide solutions by adding a hydrophilic reagent to a polyamic acid solution. The hydrophilic reagent is selected to have little or no reactivity with amines or carboxylic acids, and is of the type that will react with water to form by-products that shift the equilibrium between polyamic acid as a reactant and polyimide and water as products toward the production of polyimide.
    Type: Grant
    Filed: January 25, 1991
    Date of Patent: September 28, 1993
    Assignees: UNC at Charlotte, MCNC
    Inventors: Thomas D. DuBois, Farid M. Tranjan, Stephen M. Bobbio
  • Patent number: 5239049
    Abstract: Poly(dianhydride) compounds having formulae (I) and (II): ##STR1## where m is 0 to 50. ##STR2## wherein n is 0 to 20 and X is bond junction, oxygen atom, sulfur atom, SO.sub.2, C(CF.sub.3), CO, C(CH.sub.3).sub.2, CF.sub.2 --O--CF.sub.2, CH.sub.2, and CHOH.
    Type: Grant
    Filed: November 23, 1992
    Date of Patent: August 24, 1993
    Assignee: Olin Corporation
    Inventors: Bruce A. Marien, Keith O. Wilbourn
  • Patent number: 5233018
    Abstract: A perfluorinated polyimide comprising a repeating unit represented by general formula (1): ##STR1## and a perfluorinated poly(amic acid) comprising a repeating unit represented by general formula (6): ##STR2## wherein R.sub.1 is a tetravalent organic group; and R.sub.2 is a divalent organic group, provided that chemical bonds between carbon atoms and monovalent elements contained in R.sub.1 and R.sub.2 are exclusively carbon-to-fluorine bonds; methods for preparing them; and optical material including the perfluorinated polyimide. 1,4-Bis(3,4-dicarboxytrifluorophenoxy)tetrafluorobenzene dianhydride, 1,4-difluoropyromellitic anhydride, 1,4-bis(3,4-dicarboxytrifluorophenoxy)tetrafluorobenzene, 1,4-difluoropyromellitic acid, and 1,4-bis(3,4-dicyanotrifluorophenoxy)tetrafluorobenzene as well as methods preparing them. The perfluorinated polyimide has a thermal stability and has a low optical loss in an optical communication wavelength region (0.8 to 1.7 .mu.m).
    Type: Grant
    Filed: September 26, 1991
    Date of Patent: August 3, 1993
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Shinji Ando, Toru Matsuura, Shigekuni Sasaki, Fumio Yamamoto
  • Patent number: 5218076
    Abstract: The invention is a process for making novel branched polybenzazole polymers and the polymers formed thereby. Novel compounds are also disclosed that are useful as branching agents in making the branched polybenzazole polymers. The branched polymers synthesized by the process can be formed into strong, light articles such as fibers and films.
    Type: Grant
    Filed: March 11, 1992
    Date of Patent: June 8, 1993
    Assignee: The Dow Chemical Company
    Inventors: Norman L. Madison, William J. Harris
  • Patent number: 5212277
    Abstract: The present invention relates to new polyetherimideimides having imideimide group with the following structural formula(I) and inherent viscosity of 0.27.about.0.71 dl/g, which can be made by effecting reaction between an aromatic bis(ether anhydride) and an organic diamine or an aromatic bis(nitro imideimide) and a metal salt of diol.
    Type: Grant
    Filed: January 10, 1991
    Date of Patent: May 18, 1993
    Assignees: Korea Research Institute of Chemical Technology, Cheil Industries, Inc.
    Inventors: Kwang-Sup Lee, Kil-Yeong Choi, Jong C. Won, Byoung K. Park, In-Tae Lee
  • Patent number: 5112942
    Abstract: Copolyimides and their precursors are disclosed comprising units represented by the formula ##STR1## where R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are the same or different and are hydrogen or C.sub.1 to C.sub.6 linear or branched alkyl, with the proviso that R.sub.1, R.sub.2, R.sub.3 and R.sub.4 cannot simultaneously be hydrogen and where Z is a chemical bond, ##STR2## Ar is the tetravalent residue of a tetracarboxylic acid or acid dianhydride or di- or tetraester thereof, where x and y are integers from about 100 to about 1,000, and the ratio of x to y is from about 1:99 to about 49:51, and z is 0-5.These copolymers have improved resistance to stress cracking. They may also be used in applications such as coatings, or adhesives.
    Type: Grant
    Filed: September 26, 1990
    Date of Patent: May 12, 1992
    Assignee: Ethyl Corporation
    Inventor: Wesley C. Blocker
  • Patent number: 5109107
    Abstract: The present invention provides for a novel heat stable class of polyamide-imide polymers having excellent flow properties and hydrolytic stability which are prepared by forming the polycondensation product of one or more aromatic or aliphatic diamines, one or more additional comonomers selected from the group consisting of a tetrafunctional aromatic dianhydride, an aromatic or aliphatic dicarboxylic acid (or acid derivative thereof) and mixtures thereof, and a comonomer comprising a tri- or hexafluoro-substituted tricarboxylic acid anhydride (or acid derivative thereof) having the structure: ##STR1## wherein Z is CF.sub.3 or a phenyl radical.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: April 28, 1992
    Assignee: Hoecht Celanese Corp.
    Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr.
  • Patent number: 5096998
    Abstract: A reactive oligoimide, which may serve as an adhesive for bonding at least one layer or film to another layer, preferably a flexible metallic layer to a flexible layer of a polyimide, in order to form a flexible multilayer metal-clad laminate.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: March 17, 1992
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Philip Manos
  • Patent number: 5077382
    Abstract: A co-polyimide based upon a mixture of 4,4'-oxydiphthalic dianhydride (ODPA) and 3,4,3',4'-biphenyltetracarboxylic dianhydride (BPDA) as the dianhydride component and either 4,4'-oxydianiline (ODA) or paraphenylene diamine as the amine component is disclosed. The molar ratio between the ODPA and BPDA ranges from 3:1 to 1:3. The co-polyimide may either be formed as a random copolymer, or as a block copolymer where the blocks are based upon blocks of polymer containing ODPA and blocks of polymer containing BPDA provided that the molar ratios of ODPA and BPDA are in the ratio of 3:1 to 1:3.
    Type: Grant
    Filed: October 26, 1989
    Date of Patent: December 31, 1991
    Assignee: Occidental Chemical Corporation
    Inventors: Timothy A. Meterko, Rudolph F. Mundhenke, Willis T. Schwartz
  • Patent number: 5068307
    Abstract: A polyamideimide having an inherent viscosity of above 0.48 which comprises a unit of the following formula (II) ##STR1## and a unit of the following formula (IV) ##STR2## as main units forming the molecular chains of the polyamideimide, and an intimate mixture of the polyamideimide and a plasticising material for the polyamideimide.
    Type: Grant
    Filed: November 8, 1989
    Date of Patent: November 26, 1991
    Assignee: Teijin Limited
    Inventors: Shigeyoshi Hara, Hiroo Inata, Shunichi Matsumura
  • Patent number: 5032667
    Abstract: Described herein are amide and/or imide containing polymers based on novel monomers that contain isoalkylidene bridges. These polymers have excellent toughness combined with high temperature stability, low water absorption, and good melt-fabricability.
    Type: Grant
    Filed: December 20, 1989
    Date of Patent: July 16, 1991
    Assignee: Amoco Corporation
    Inventors: James E. Harris, Abe Berger, Vilas M. Chopdekar, Markus Matzner, James Spanswick
  • Patent number: 4994544
    Abstract: A process for the production of polyimide fibers and polyimide fibers obtained by the process. The process includes thermal or chemical imidation of a polyamic acid which has been obtained by reacting a specific diamine and a particular tetracarboxylic dianhydride in the presence of a dicarboxylic anhydride represented by the following formula: ##STR1## wherein Z represents a divalent group selected from the group consisting of monocyclic aromatic groups, fused polycyclic aromatic groups and non-fused polycyclic aromatic groups with aromatic rings bonded together directly or via a crosslinking member.
    Type: Grant
    Filed: November 6, 1989
    Date of Patent: February 19, 1991
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Taizo Nagahiro, Masahiro Ohta, Shuichi Morikawa, Nubohito Koga, Shoji Tamai
  • Patent number: 4987197
    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide.
    Type: Grant
    Filed: April 24, 1989
    Date of Patent: January 22, 1991
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi
  • Patent number: 4977235
    Abstract: Novel polyarylate polymers comprise alternating moieties derived from an aromatic dicarboxylic acid halide, with moieties derived from a hydroxyaryl-substituted 1,6-diaza [4.4] spirodilactam compound and, optionally, with moieties derived from a di(hydroxyphenyl) compound. The polyarylate polymers are thermoplastic polymers characterized by relatively high glass transition temperatures.
    Type: Grant
    Filed: December 21, 1989
    Date of Patent: December 11, 1990
    Assignee: Shell Oil Company
    Inventor: Pen-Chung Wang
  • Patent number: 4963647
    Abstract: The present invention provides novel heat stable polyamide-imide polymers having excellent flow properties which render them more readily processible into fibers, films, sheets and other molded articles. The polymers are prepared by forming the polycondensation product of one or more aromatic diamines and one or more trifunctional acid anhydride monomers, wherein at least one of said diamine monomers is a 12F-Diamine or 12F-Oxydiamine containing at least two CF.sub.3 ##STR1## R groups linking two aromatic moieties, wherein R is CF.sub.3 or phenyl. In addition to improved flow properties, the polyamide-imide polymers of this invention also exhibit improved solubility properties in most organic solvents, improved resistance to attack by chlorinated solvents such as trichloroethylene as compared with polyimides, improved hydrophobic properties as well as excellent thermal properties including resistance to thermooxidative degredation.
    Type: Grant
    Filed: February 27, 1989
    Date of Patent: October 16, 1990
    Assignee: Hoechst Celanese Corp.
    Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr., Jeffrey S. Devolve
  • Patent number: 4959447
    Abstract: A copoly(imidine-imide) consisting of a copolymer of polyimidines and polyimides having, in the basic chain structure of the polymer, imidine structures represented by formula (I) and the imide structures represented by formula (II): ##STR1##
    Type: Grant
    Filed: September 2, 1988
    Date of Patent: September 25, 1990
    Assignee: Nippon Steel Corporation
    Inventors: Mitsuru Arai, Patrick E. Cassidy, James M. Farley