Abstract: Novel high molecular weight resins, useful for electrically insulating conductors, are prepared by polycondensing a mixture of anhydrides, and a diisocyanate and/or a diamine in an inert organic solvent, preferably in the presence of a catalytic amount of 2-methylimidazole.
Abstract: Novel copolymers and terpolymers of the amide-imide type are prepared from tricarboxylic acid anhydride compounds, N,N'-diacylated diamines, N-acylated diamines, and primary diamines. These copolymers and terpolymers are useful for preparing injection molded articles of superior properties. A novel process for the manufacture of amide-imide copolymers and terpolymers is disclosed wherein the imide, imide-imide, amide, and amide-amide moieties incorporated into the polymer backbone can be controlled by acylating the amine functionality which is to form the amide and amide-amide moieties while reacting directly those diamines with a tricarboxylic anhydride compound which are intended to form the imide and imide-imide moieties.
Abstract: Injection moldable copolymers are prepared from fully or partially acylated aromatic diamines and aromatic tricarboxylic anhydride compounds or mixtures of tricarboxylic anhydrides and dicarboxylic acids. These copolymers are useful for the preparation of injection molded articles and fibers.
Abstract: Novel tailor made copolymers and terpolymers of the amide-imide type are prepared from tricarboxylic acid anhydride compounds, N,N'-diacylated diamines, N-acylated diamines, and primary diamines. These copolymers and terpolymers are useful for preparing injection molded articles of superior properties. A novel process for the manufacture of amide-imide copolymers and terpolymers is disclosed wherein the imide, imide-imide, amide, and amide-imide moieties incorporated into the polymer backbone are controlled by acylating the amine functionality which is to form the amide and amide-amide moieties while reacting directly those diamines with a tricarboxylic anhydride compound which are intended to form the imide and imide-imide moieties.
Abstract: An essentially linear polymer having a plurality of amide, imide and ester groups therein, which is the condensation product of (1) at least one polycarboxylic acid imide-forming reactant, (2) at least one ethylenically unsaturated polycarboxylic acid carboxypyrrolidone-forming reactant, (3) at least one polycarboxylic acid ester-forming reactant, (4) at least one glycoly, (5) at least one other polyfunctional hydroxyl compound, and (6) at least one polyfunctional amino compound having at least one primary amine group thereon. The equivalent molar ratio of the functional hydroxyl groups of the glycols and hydroxyl compounds to the functional ester-forming carboxyl groups of the acid reactants is from about 1.0 to 1 to about 3.0 to 1.
Abstract: High molecular weight aromatic enyne polyimide thermoplastics are prepared by reacting an aromatic dianhydride with (E)-3,3'-(1-buten-3-ynylene) dianiline alone or in admixture with an aromatic diamine. Because of the presence of the enyne moiety in the polymer backbone, the polymers can be lightly crosslinked to provide solvent-resistant thermoplastics. The polymers are particularly useful in fabricating graphite-reinforced, thermoplastic composites for structural applications.
Type:
Grant
Filed:
April 24, 1979
Date of Patent:
September 2, 1980
Assignee:
The United States of America as represented by the Secretary of the Air Force
Abstract: Amide-imide polymers formable in deep section and prepared by the condensation reaction of at least one of a diacid halide or a polyanhydride or equivalent, and a diamine containing at least one imide linkage. Soluble amide-imide polymers having the general formula: ##STR1## where n is an integer greater than 10 and preferably greater than 20.
Abstract: New and useful polyamideimide polyamines are disclosed which are used to prepare polyamideimide amic acids and polyamideimideimides useful as films, coatings and adhesives.
Abstract: Polyester imide resin having ester groups of acid and alcohol moieties in the chain, and also in the chain a content of 5-membered imide rings of the general formula: ##STR1## The resin is soluble in cresol solvent and can be combined with such solvents to form a lacquer suitable for enameling of wire.
Type:
Grant
Filed:
May 4, 1976
Date of Patent:
March 20, 1979
Assignee:
Dr. Beck & Co., A.G.
Inventors:
Karl Schmidt, Ferdinand Hansch, Hans-Malte Rombrecht, Hans-Joachim Beck
Abstract: An improved process for preparing amide-imide polymers which at a percent solids of 98.+-.2% have a melt flow in the range of about 1 to about 200 g/10 min. by the addition of an effective amount of trimellitic acid anhydride to 4-trimellitoyl anhydride halide (4-TMAH) and one or more aromatic diamines during reaction in an organic solvent.