From At Least Two Organic Polyamines Patents (Class 528/340)
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Patent number: 6355770Abstract: Compositions comprising: (a) from about 51% to about 99.9% by weight of a polyamide resin component; and (b) from about 0. 1% to about 49% by weight of a wax component, wherein the polyamide resin component comprises a reaction product obtained by reaction of a dimerized fatty acid reactant, a carboxylic acid reactant and a diamine reactant, are disclosed for use in thermographic printing. The polyamide resin/wax component compositions disclosed herein exhibit decreased bloom and enhanced scratch/scuff resistance.Type: GrantFiled: March 30, 2000Date of Patent: March 12, 2002Assignee: Cognis CorporationInventors: Timothy C. Vogel, Sobhy El-Hefnawi
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Patent number: 6348562Abstract: A process of increasing the melt processing of synthetic polyamides, in particular pigmented and/or filled synthetic polyamide, by adding thereto an additive having the formula (I) wherein R1 represents a methyl group as such or in the form of a stabilizer masterbatch composition. The invention also relates to modified synthetic polyamides obtainable by this process having improved properties due to the stabilization effect of the compound of the above formula (I).Type: GrantFiled: January 13, 1999Date of Patent: February 19, 2002Assignee: Clariant Finance (BVI) LimitedInventors: Bansi Lal Kaul, Jan Malik, Mohamed Sidqi
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Publication number: 20010051707Abstract: The polyamic acid of the invention can be obtained by the reaction of an acid anhydride component comprising pyromellitic anhydride and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane with 2,2′-di-substituted-4,4′-diaminobiphenyls as a first aromatic diamine and any aromatic diamine component, as a second aromatic diamine, of 2,2-bis(4-aminophenoxyphenyl)propanes, 1,1-bis(4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl)butane, 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane and &agr;,&agr;′-bis(4-aminophenyl)diisopropylbenzenes in an organic solvent. The polyimide resin of the invention can be obtained by heating such a polyamic acid solution. In the production of a circuit board, by using a photosensitive polyamic acid having a sensitizer incorporated in such a polyamic acid solution, a patterned polyimide resin layer can be provided as an insulation layer on a metal foil.Type: ApplicationFiled: December 11, 2000Publication date: December 13, 2001Inventors: Takahiro Fukuoka, Amane Mochizuki, Naoki Kurata, Naotaka Kinjo, Toshihiko Omote
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Patent number: 6327521Abstract: A method for controlling the properties of the product polymer of a polymerization process to improve the process productivity and product quality in both batch and continuous production of polyamides.Type: GrantFiled: May 28, 1998Date of Patent: December 4, 2001Assignee: E.I. du Pont de Nemours and CompanyInventor: James Merrill Prober
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Patent number: 6277948Abstract: Disclosed in the present invention is a process for modifying a polyamide polymer comprising contacting a reactive modifier with diamine/diacid salt and/or an amino-acid of a hydrolyzed lactam or lactam to form a modified polyamide. A second embodiment of the present invention is a process for modifying a polyamide polymer comprising contacting a reactive modifier with diamine then contacting the resulting modified diamine with diacid and/or lactam to form a modified polyamide.Type: GrantFiled: December 22, 1999Date of Patent: August 21, 2001Assignee: E. I. du Pont de Nemours and CompanyInventor: George Elias Zahr
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Patent number: 6258926Abstract: The invention concerns a process and device for producing high-viscosity or highly stabilized, reaction-stable polyamides, in particular polyamide 6, with reactive amino end groups of less than 50 &mgr;eq/g and for continuously demonomerizing polyamides. The object of the invention is to produce simply, reliably and economically a high-viscosity or highly stabilized reaction-stable polyamide, in particular polyamide 6, and if necessary to carry out continuous demonomerization. According to the invention, the molten polyamide is brought into intimate contact, or intimately mixed with preheated nitrogen in a reaction system in at least one stage and a specific dwell time is set for the melt in a liquid phase. During the production of polyamide 6, expelled lactam is processed and fed to a polymerization reactor.Type: GrantFiled: October 27, 1997Date of Patent: July 10, 2001Assignee: Polymer Engineering GmbHInventors: Karl-Heinz Wiltzer, Baldur Ebert, Hans Brutting, Peter Lausmann
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Patent number: 6204355Abstract: The invention relates to the use of polyamide moulding compounds, their alloys or blends, which contain at least one homopolyamide, which has been obtained from long-chained aliphatic monomer blocks with cycloaliphatic monomer blocks, in order to manufacture moulded members for optical or electro-optical applications.Type: GrantFiled: October 22, 1999Date of Patent: March 20, 2001Assignee: EMS-Inventa AGInventors: Hans Dalla Torre, Ralf Hala
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Patent number: 6169161Abstract: For producing a polyamide having an unreacted caprolactam content of from 0 to 0.5% by weight and an oligomer content of from 0 to 1.25% by weight and having a relative viscosity in a 0.01 g/ml solution of sulfuric acid at 25° C. of from 2.2 to 8.0, combined is a first step of polymerizing a starting material comprising caprolactam, under atmospheric pressure to prepare a polymerization product having an unreacted caprolactam content of not larger than 25% by weight and an oligomer content falling between 0 and 1.8% by weight, and a second step of heating the polymerization product prepared in the first step, at a temperature T satisfying the following formula (1) and under reduced pressure to thereby remove the unreacted caprolactam and the oligomer from it: Glass transition point of polyamide<T<melting point of polyamide+150° C.Type: GrantFiled: March 31, 1999Date of Patent: January 2, 2001Assignee: Toray Industries, Inc.Inventors: Yasuto Tachibana, Shigeru Okita, Koji Onishi
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Patent number: 6169162Abstract: A process for producing a polyamide from dicarboxylic acid monomer and diamine monomer comprises the steps of: (a) mixing molten dicarboxylic acid monomer and molten diamine monomer in equimolar amounts, thereby producing a molten reaction mixture; (b) flowing the reaction mixture through at least one unvented reaction vessel, the residence time of the reaction mixture in the at least one unvented reaction vessel being between about 0.01 minutes and about 30 minutes, thereby forming a first product stream that comprises polyamide and water of polymerization; and (c) flowing the first product stream through at least one vented vessel, whereby water of polymerization is removed, thereby forming a second product stream that comprises polyamide. The process can operate continuously, and there is no need to add water to the dicarboxylic acid, to the diamine, or to the reaction mixture.Type: GrantFiled: May 24, 1999Date of Patent: January 2, 2001Assignee: Solutia Inc.Inventors: Gregory E. Bush, Chris E. Schwier, Robert M. Lembcke, Steven W. Cook
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Patent number: 6156869Abstract: A method for producing polyamides, and to a method for producing primary polycondensates which are intermediates for polyamide production. More precisely, the invention relates to a method for producing primary polycondensates, which comprises a step of polycondensing a dicarboxylic acid component having a terephthalic acid content of from 60 to 100 mol % and a diamine component in which the amount of 1,9-nonanediamine and/or 2-methyl-1,8-octanediamine falls between 60 and 100 mol %, in the presence of water of being from 15 to 35% by weight, at a reaction temperature falling between 250.degree. C. and 280.degree. C. and under a reaction pressure (P) that satisfies the following formula (1):P.sub.0 .gtoreq.P.gtoreq.0.7 P.sub.0 (1)where P.sub.Type: GrantFiled: July 29, 1999Date of Patent: December 5, 2000Assignee: Kuraray Co., Ltd.Inventors: Kozo Tamura, Hideaki Oka, Kazunori Watanabe, Susumu Matsunaga
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Patent number: 6140459Abstract: This invention relates to high temperature, semi-crystalline, semi-aromatic nylon copolymers with improved shrinkage and blistering resistance, made from terephthalic acid (TA), hexamethylene diamine (HMD) and another aliphatic dicarboxylic acid as monomers. These polymers display superior % TD (Transverse Direction) annealing shrinkage, superior resistance to blistering when formulated with flame retardant additives and reinforcement under infrared (IR) reflow soldering conditions for electronic conectors, as well as a very good balance of mechanical performance as high temperature nylons.Type: GrantFiled: July 17, 1997Date of Patent: October 31, 2000Assignee: E. I. du Pont de Nemours and CompanyInventors: Christian Leboeuf, Ryuichi Hayashi
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Patent number: 6075082Abstract: A method for binding ceramic materials in aqueous media is disclosed. The method utilizes water-soluble cross-linked polyamides prepared by condensation polymerization for binding various classes of ceramic materials.Type: GrantFiled: September 29, 1998Date of Patent: June 13, 2000Assignee: Nalco Chemical CompanyInventors: David P. Workman, Kristy M. Bailey, Kevin J. Moeggenborg
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Patent number: 6028163Abstract: A process for making a high molecular weight poly(phosphoester) comprising the recurring monomeric units: ##STR1## wherein X is --O-- or --NR"--, where R" is H or alkyl; L is a divalent organic moiety, with the proviso that L cannot have the formula ##STR2## R' is H, alkyl, alkoxy, aryl, aryloxy, heterocyclic, or heterocycloxy; and n is from about 25 to 2000,is described. The process comprises the steps of:(a) substantially dissolving p moles of a di-XH compound in a solvent comprising more than 75% toluene at a first temperature between about -75.degree. C. and 60.degree. C. to form a reaction mixture;(b) while maintaining the reaction mixture at the first temperature, adding q moles, where p.apprxeq.q, of a phosphorodihalo compound;(c) gradually increasing said first temperature at a rate of less than about 2.degree. C. per minute as necessary to achieve a second temperature between about 0.degree. C. and 110.degree. C.Type: GrantFiled: June 27, 1997Date of Patent: February 22, 2000Assignee: Guilford Pharmaceuticals Inc.Inventor: Zhong Zhao
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Patent number: 5990270Abstract: A polyamide composition which is amorphous and transparent, which has reduced flammability, and which has reduced migration of flame-retardant additive so that it is film-free, includes at least one polyamide which contains cycloaliphatic monomer units and which is amorphous and transparent; and a flame-retardant additive which is present in an amount effective to reduced flammability of the polyamide composition, which is dissolved in the at least one polyamide, and which is at least one alkyl phosphonic acid compound having a general formula: ##STR1## wherein R and R' each represent, independent of each other, an alkyl group having from 1 to 4 carbon atoms, and x=0 or 1. An article molded from this composition is transparent, has reduced flammability, and has reduced migration of flame-retardant additive so that it is film-free.Type: GrantFiled: October 30, 1998Date of Patent: November 23, 1999Assignee: Ems- Inventa AGInventors: Hans Dalla Torre, Manfred Hewel
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Patent number: 5981692Abstract: This invention relates to high temperature, semi-crystalline, semi-aromatic nylon terpolymers with improved shrinkage resistance, made from terephthalic acid (TA), hexamethylene diamine (HMD) and/or 2-methyl pentamethylene diamine (2-MPMD) and another aliphatic dicarboxylic acid as monomers. These polymers display superior % TD (Transverse Direction) annealing shrinkage, as well as very good balance of mechanical performance as high temperature nylons.Type: GrantFiled: May 15, 1997Date of Patent: November 9, 1999Assignee: Du Pont Canada Inc.Inventor: Christian Leboeuf
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Patent number: 5962628Abstract: Improved high temperature polyamides, and particularly partially-aromatic polyamides, containing less than about 40 .mu.eq/g carboxylic acid endgroups. When stabilized with a copper-containing thermal stabilizer, the polyamides exhibit improved thermal oxidative stability.Type: GrantFiled: December 17, 1997Date of Patent: October 5, 1999Assignee: BP Amoco CorporationInventor: Robert G. Keske
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Patent number: 5959069Abstract: Polyamides are built up from, as fundamental building blocks (a), lactams or aminocarboxylic acids or mixtures of these,as fundamental building blocks (b), from 1 to 50 .mu.mol of at least tribasic amines or carboxylic acids per gram of polyamide,as fundamental building blocks (c), dibasic carboxylic acids or amines andas fundamental building blocks (d), monobasic carboxylic acids or amines,where (c) and (d) are carboxylic acids if (b) are amines, and (c) and (d) are amines if (b) are carboxylic acids,the equivalents ratio of the functional groups of (b) to the functional groups of (c) and (d) together is from 60:40 to 40:60 andthe equivalents ratio of the functional groups of (c) to the functional groups of (d) is from 15:85 to 60:40.Type: GrantFiled: December 23, 1997Date of Patent: September 28, 1999Assignee: BASF AktiengesellschaftInventors: Alexander Gluck, Walter Gotz, Stefan Grutke, Martin Laun, Volker Warzelhan
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Patent number: 5948880Abstract: A process is provided for preparing a dispersion of a polyamide in water, said process comprising:forming a solution of a polyamide having an acid value of greater than about 2 in an organic solvent to form a solution of said polyamide in said solvent, said polyamide and said solvent being at a temperature below the softening point of said polyamide during said dissolving, said solution further comprising a surfactant, wherein at least a portion of the acid value of said polyamide is neutralized,adding sufficient water to said solution with mixing to form an oil-in-water dispersion, the temperature of said solution and said water being below the softening point of said polyamide during said adding, andremoving at least a major amount of said organic solvent from said oil-in-water dispersion. The resulting dispersion is useful in preparing a coating of the polyamide, which coating is useful as an adhesive.Type: GrantFiled: May 8, 1997Date of Patent: September 7, 1999Assignee: Henkel CorporationInventors: Stephen A. Fischer, Chase J. Boudreaux, Michael S. Wiggins
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Patent number: 5948881Abstract: Curative compositions of amine terminated polyamide resins blended with a deaminated bis-(p-aminocyclohexyl)methane composition (DeAms) are useful for curing adhesive epoxy resin compositions. The polyamides comprise combinations of fatty mono-acids, dimer acids, polyethyleneamines, and piperazine ring containing polyamines which are piperazine or N-aminoalkylpiperazine, where the alkyl chain is a C2 to C6 alkyl chain, wherein the ratio of equivalents of fatty mono-acid to dimer acid can range from about 0.001:1 to about 1:1, the ratio of moles of piperazine ring containing polyamine to polyethylene amine can range from about 0.1:1 to about 1:1, and the ratio of moles of polyamine to equivalents of acid can range from about 0.6:1 to about 1.2:1. DeAms is blended at 2 to 40 wt % based on polyamide. Adhesive compositions comprising these curatives are also disclosed.Type: GrantFiled: December 4, 1997Date of Patent: September 7, 1999Assignee: Air Products and Chemicals, Inc.Inventors: Dilipkumar Nandlal Shah, William Edward Starner
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Patent number: 5922167Abstract: Disclosed is a method of bonding integrated circuit chips to lead frames where the leads are later soldered. A solution of an adhesive polyimide is used. The polyimide is the reaction product of an aromatic dianhydride and a mixture of an aromatic diamine and an aliphatic diamine.Type: GrantFiled: January 16, 1997Date of Patent: July 13, 1999Assignee: Occidential Chemical CorporationInventor: Gerald C. Rosenfeld
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Patent number: 5922801Abstract: A method for binding ceramic materials in aqueous media is disclosed. The method utilizes water-soluble polyamides prepared by condensation polymerization for binding various classes of ceramic materials.Type: GrantFiled: December 3, 1997Date of Patent: July 13, 1999Assignee: Nalco Chemical CompanyInventors: Kristy M. Bailey, Christopher P. Howland, Kevin J. Moeggenborg
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Patent number: 5917001Abstract: An uncoated lens, especially for use as the lens of a fog light or a headlight for an automobile, and having particularly good resistance against the environmental effects which are inherent in this environment, is formed of a colorless, transparent copolyamide having a glass transition temperature of at least a 170.degree. C., blended with a homopolyamide, and wherein the copolyamide is formed from at least one cycloaliphatic diamine with two cyclohexane rings, and at least one aromatic dicarboxylic acid which is predominantly isophthalic acid. The copolyamide may optionally contain up to 20 mol % of a further polyamide forming monomer of at least one lactam or an omega-aminocarboxylic acid. The homopolyamide is preferably one of PA6, PA11, PA12, PA66, PA69, PA610 or PA612. The cycloaliphatic diamine of the copolyamide is preferably bis(3-methyl-4-aminocyclohexyl)-methane.Type: GrantFiled: September 6, 1996Date of Patent: June 29, 1999Assignee: EMS-Inventa AGInventors: Susanne Laederach, Hans Dalla Torre
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Patent number: 5908889Abstract: A method for binding ceramic materials in aqueous media is disclose. The method utilizes water-soluble polyamides prepared by condensation polymerization for binding various classes of ceramic materials.Type: GrantFiled: March 16, 1998Date of Patent: June 1, 1999Assignee: Nalco Chemical CompanyInventors: Kristy M. Bailey, Kevin J. Moeggenborg
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Patent number: 5891987Abstract: A copolyamide composition prepared from hexamethylene diamine and either mixtures of adipic acid and terephthalic acid, or mixtures of adipic acid, terephthalic acid and isophthalic acid, has a melting point below 320.degree. C., a glass transition temperature between 100.degree. C. and 120.degree. C. and physical properties similar to nylon 66.Type: GrantFiled: November 15, 1995Date of Patent: April 6, 1999Assignee: Industrial Technology Research InstituteInventors: Wu-Bin Yuo, Chien-Shiun Liao, Wen-Jeng Lin, Li-Kuei Lin, Tien-San Lee, Szu-Yuan Chan
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Patent number: 5886135Abstract: A process is provided for preparing a dispersion of a polyamide in water, said process comprising:dissolving a polyamide having an amine value of greater than about 2 in an organic solvent to form a solution of said polyamide in said solvent, said polyamide and said solvent being at a temperature below the softening point of said polyamide during said dissolving, said solution further comprising a surfactant and an inorganic alkaline material,adding sufficient water containing an acid to said solution with mixing to form an oil-in-water dispersion, the temperature of said solution and said water being below the softening point of said polyamide during said adding, the amount of said acid being sufficient to neutralize a portion of said inorganic alkaline material, but insufficient to coagulate said polyamide from the resulting oil-in-water dispersion, andremoving at least a major amount of said organic solvent from said oil-in-water dispersion.Type: GrantFiled: May 8, 1997Date of Patent: March 23, 1999Assignee: Henkel CorporationInventors: Stephen A. Fischer, Michael S. Wiggins, Chase J. Boudreaux
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Patent number: 5877270Abstract: A water solvent extraction degreasing method capable of reducing degreasing time without consideration of abrupt decomposition/vaporization and swelling caused by heat. An organic binder is removed from a molded product that is produced by a powder material mixed with the organic binder and this organic binder contains at least one water-soluble organic compound and at least one water-insoluble thermoplastic resin. The degreasing step of this method includes a water solvent extraction step for extracting the water-soluble organic compound from the organic binder contained in the molded product, using water as a solvent.Type: GrantFiled: January 2, 1997Date of Patent: March 2, 1999Assignee: Kabushiki Kaisha Komatsu SeisakushoInventors: Takemori Takayama, Yoshitaka Ohyama, Masato Miyake, Katsuyoshi Saito, Hiroshi Ono
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Patent number: 5869596Abstract: This invention relates to a nonwoven web and fibers comprising a water soluble polyamide and articles constructed therefrom. The water soluble polyamide may be used alone or in combination with conventional thermoplastic web and fiber forming materials such as water insoluble polyethylene, polypropylene, polyester and polyamide. The water soluble polyamide may also be combined with biodegradable or selectively dispersible material to form nonwoven webs and fibers having various combinations of properties. Such water soluble webs and fibers have utility in the manufacture of disposable absorbent articles such as disposable diapers, feminine napkins, incontinent products and cellulosic articles such as tissues and towels, as well as for water soluble heat fusible webs for the textile industry.Type: GrantFiled: May 14, 1998Date of Patent: February 9, 1999Assignee: H. B. Fuller Licensing & Financing, Inc.Inventors: Sharf U. Ahmed, Greg J. Van Lith
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Patent number: 5866675Abstract: This invention relates to a nonwoven web comprising a water soluble polyamide and articles constructed therefrom. The water soluble polyamide may be used alone or in combination with conventional thermoplastic web forming materials such as water insoluble polyethylene, polypropylene, polyester and polyamide. The water soluble polyamide may also be combined with biodegradable or selectively dispersible material to form nonwoven webs having various combinations of properties. Such water soluble webs have utility in the manufacture of disposable absorbent articles such as disposable diapers, feminine napkins, incontinent products and cellulosic articles such as tissues and towels, as well as for water soluble heat fusible webs for the textile industry.Type: GrantFiled: August 29, 1997Date of Patent: February 2, 1999Assignee: H. B. Fuller Licensing & Financing, Inc.Inventors: Sharf U. Ahmed, Greg J. Van Lith
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Patent number: 5863979Abstract: A method of making paper in which dry chemical additives are incorporated into the pulp mixture by addition of an entire bag containing the additive directly to the mixture, the improvement being that the bag is sealed with an adhesive closure, the adhesive being a hot melt consisting essentially of a water dispersable polyamide prepared from a diacid component comprising in major portion an aliphatic diacid of 6 or fewer carbon atoms and a diamine component consisting of one or more compounds of the formula :H.sub.2 N--C.sub.y H.sub.2y --(OC.sub.2 H.sub.4).sub.x --O--C.sub.y H.sub.2y --NH.sub.2where y is 2 or 3 and x is 1-50 and a wax. Such bags will not leak in shipping and handling, and yet can be added directly to paper batches at ambient temperature in the manner of the unsealable bags employed in the prior art.Type: GrantFiled: October 11, 1996Date of Patent: January 26, 1999Assignee: H. B. Fuller Licensing and Finance, Inc.Inventor: Sharf U. Ahmed
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Patent number: 5859177Abstract: The process for single-stage postcondensation of a polycondensate in a fluidized bed reactor (1) includes feeding the polycondensate through the fluidized bed reactor (1); circulating a main stream of nitrogen carrier gas through the fluidized bed reactor; withdrawing a fractional stream at a temperature of from 20.degree. to 230.degree. C. from the main stream of the nitrogen carrier gas; passing the fractional stream through a water-filled gas scrubber column (15) so as to form a conditioned stream of the nitrogen carrier gas with a predetermined dew point between 10.degree. to 80.degree. C.; and returning the conditioned stream to the main stream. In preferred embodiments the polycondensate is allowed to cool during a cool-down stage at an end of the postcondensation and the withdrawal of the fractional stream from the main stream is halted, but the circulating of the main stream through the fluidized bed reactor is continued during the cool-down stage.Type: GrantFiled: August 26, 1997Date of Patent: January 12, 1999Assignee: Rhodia Filtec AGInventors: Luzius Berger, Hans Stehr, Niklaus Zemp
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Patent number: 5856428Abstract: An aromatic polyamide resin composition composed of two types of aromatic polyamide (A) and (B), where (A) is an aromatic polyamide wherein the molar ratio of aromatic polyamide with respect to the monomer components that constitute the polyamide is 0.4 or greater, and (B) is an aromatic polyamide containing an aromatic monomer as the monomer component that constitutes the polyamide and has a recrystallization temperature that is lower than that of the aromatic polyamide (A), where said aromatic polyamide resin composition has a recrystallization temperature that is 10.degree. C. or more lower than the recrystallization temperature of the aromatic polyamide (A).Merit:The aromatic polyamide composition of the present invention has the high heat resistance characteristic of aromatic polyamides, superior dimensional stability with respect to water absorption, and maintenance of physical stability and chemical resistance, while providing improved molding characteristics.Type: GrantFiled: October 1, 1996Date of Patent: January 5, 1999Assignee: E. I. du Pont de Nemours and CompanyInventors: Ryuichi Hayashi, Reiko Koshida
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Patent number: 5854379Abstract: A low-cost thermal decomposition degreasing method capable of drastically reducing the time required for a degreasing process which involves heating, vaporization and thermal decomposition, while assuring the shape retention property of an injection molded product during degreasing. The degreasing process comprises: (i) a first step wherein a molded product placed under a reduced pressure less than or equal to atmospheric pressure is heated at a temperature lower than the melting point of a thermoplastic binder so that the thermoplastic binder partially evaporates by 5 wt % or more, and then the molded product is further heated at a temperature lower than higher one of the melting points of a more volatile organic compound and a thermoplastic resin whereby the thermoplastic binder further evaporates by 10 wt % or more, and wherein the final temperature is set to 200.degree. C.Type: GrantFiled: January 2, 1997Date of Patent: December 29, 1998Assignee: Kabushiki Kaisha Komatsu SeisakushoInventors: Takemori Takayama, Yoshitaka Ohyama, Kazuo Okamura, Masato Miyake, Katsuyoshi Saito, Hiroshi Ono
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Patent number: 5830975Abstract: The invention relates to a mixture in powder form and comprising (i) at least one polyamide and (ii) at least one polymer (A) containing hydroxyl functional groups and compatible with the polyamide. The polymer (A) may be an ethylene/vinyl alcohol copolymer. The mixture may be used to coat metal substrates.Type: GrantFiled: May 31, 1996Date of Patent: November 3, 1998Assignee: Elf Atochem S.A.Inventors: Eric Perraud, Arnaud Tedoldi, Jean Marc Sage
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Patent number: 5807968Abstract: A polyamide resin comprising the reaction product obtained by the reaction of an acid component comprised of a major concentration of a dimer acid and minor concentration of a monobasic acid and an amine component comprised of a major concentration of a short-chain alkylenediamine, a first minor concentration of a medium-chain alkylenediamine and second minor concentration of a polyoxyalkylene diamine having a molecular weight greater than about 500 is provided. The polyamide resin is used to form a blend of containing the polyamide in a major amount by weight and a first minor amount by weight of a polar wax and a second minor amount by weight of a polyolefin elastomer. The composition is used to reinforce a footwear upper, e.g. as a print on box toe material.Type: GrantFiled: April 4, 1996Date of Patent: September 15, 1998Assignee: Henkel CorporationInventors: Dwight D. Heinrich, Reimar Heucher, Sandra Drahos
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Patent number: 5780576Abstract: Thermoplastic molding materials containA) from 1 to 99% by weight of a partly aromatic copolyamide composed ofa.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,a.sub.2) from 6 to 25 mol % of units which are derived from isophthalic acid,a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine anda.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms,the molar percentages of components a.sub.1) to a.sub.4) together giving 100%,B) from 1 to 99% by weight of a polyetherimide,C) from 0 to 30% by weight of a polymeric component having OH groups,D) from 0 to 60% by weight of fibrous or particulate fillers or mixtures thereof,E) from 0 to 40% by weight of rubber impact modifiers andF) from 0 to 40% by weight of conventional additives and processing assistants.Type: GrantFiled: April 12, 1996Date of Patent: July 14, 1998Assignee: BASF AktiengesellschaftInventors: Martin Weber, Herbert Fisch, Gunter Pipper, Axel Gottschalk
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Patent number: 5770680Abstract: A process is provided for preparing a dispersion of a polyamide in water, said process comprising:dissolving a polyamide having an amine value of greater than about 2 in an organic solvent to form a solution of said polyamide in said solvent, said polyamide and said solvent being at a temperature below the softening point of, said polyamide during said dissolving, said solution further comprising a surfactant and an inorganic alkaline material,adding sufficient water containing an acid to said solution with mixing to form an oil-in-water dispersion, the temperature of said solution and said water being below the softening point of said polyamide during said adding, the amount of said acid being sufficient to neutralize a portion of said inorganic alkaline material, but insufficient to coagulate said polyamide from the resulting oil-in-water dispersion, andremoving at least a major amount of said organic solvent from said oil-in-water dispersion.Type: GrantFiled: October 25, 1996Date of Patent: June 23, 1998Inventors: Stephen A. Fischer, David I. Devore, Kartar S. Arora, Reimar Heucher
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Patent number: 5763561Abstract: Improved high temperature polyamides, and particularly partially aromatic polyamides, containing less than about 40 .mu.eq/g carboxylic acid endgroups, when stabilized with a copper-containing thermal stabilizer, the polyamides exhibit improved thermal oxidative stability.Type: GrantFiled: May 27, 1997Date of Patent: June 9, 1998Assignee: Amoco CorporationInventor: Robert G. Keske
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Patent number: 5760167Abstract: A copolyamide composition prepared from hexamethylene diamine and mixtures of adipic acid, terephthalic acid and isophthalic acid, has a melting point below 300.degree. C., a glass transition temperature between 100.degree. C. and 130.degree. C. and physical properties similar to nylon 66.Type: GrantFiled: November 15, 1995Date of Patent: June 2, 1998Assignee: Industrial Technology Research InstituteInventors: Wu-Bin Yuo, Chien-Shiun Liao, Wen-Jeng Lin, Li-Kuei Lin, Tien-San Lee, Szu-Yuan Chan
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Patent number: 5756647Abstract: A process for the activated anionic lactam polymerization is proposed, wherein a liquid system is employed, which simultaneously contains activator and anionic catalyst for the polymerization of the lactam.Type: GrantFiled: January 21, 1997Date of Patent: May 26, 1998Assignee: EMS-Inventa AGInventors: Eduard Schmid, Roman Eder
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Patent number: 5750639Abstract: A polyamide resin composition having good molding fluidity, heat and chemical resistance and dimensional stability is provided containing: (A) 30-90 weight percent, based on components (A) and (B), of a polyamide resin containing (i) 10-99 weight percent, based on components (i) and (ii) of an aromatic polyamide containing a carboxylic acid component derived from terephthalic acid or a mixture of terephthalic and isophthalic acid in which the isophthalic acid constitutes 40 mole percent or less of the mixture, and an aliphatic diamine component derived from a mixture of hexamethylene diamine and 2-methylpentamethylene diamine; and (ii) 1-90 weight percent, based on components (i) and (ii), of at least one polyamide selected from the group consisting of polyamides containing repeat units derived from alipathic dicarboxylic acids and alipathic diamines and polyamides containing repeat units derived from aliphatic aminocarboxylic acids; and (B) 10-70 weight percent, based on components (A) and (B), of an inorganType: GrantFiled: July 24, 1996Date of Patent: May 12, 1998Assignee: E. I. du Pont de Nemours and CompanyInventor: Ryuichi Hayashi
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Patent number: 5731403Abstract: This invention concerns a low temperature process for the manufacture of nylon.Type: GrantFiled: July 30, 1996Date of Patent: March 24, 1998Assignee: E. I. du Pont de Nemours and CompanyInventor: James Joseph Lang
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Patent number: 5723567Abstract: A partially aromatic copolyamide is formed of:(a) 5 to 30 weight-% of hexamethylene diamine(b) 10 to 40 weight-% of metaxylylene diamine(c) 15 to 50 weight-% of adipic acid(d) 5 to 45 weight-% of at least one aliphatic dicarboxylic add with 7 to 10 carbon atoms, preferably sebacic acid and/or acelaic acid, wherein the components (a) to (d) add up to 100 weight-%, and the add groups and the amine groups are essentially present in equimolar portions. These novel copolyamides are used for producing barrier layers for mono- or multi-layered composites, such as foils or containers, infusion- or ostomy bags, shrink wraps for meat, fish and cheese packagings or sausage skins, wherein the copolyamides can be present in the pure form or as a mixture with other polymers, in particular in combination with further polymer layers.Type: GrantFiled: September 28, 1995Date of Patent: March 3, 1998Assignee: EMS-INVENTA AGInventors: Manfred Hewel, Ulrich Presenz
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Patent number: 5723569Abstract: A random copolymerized polyamide resin is prepared by reacting a lactam of the formula (I): ##STR1## wherein R.sup.1 is a C.sub.2-11 alkylene group optionally substituted with a substituent having 1 to 6 carbon atoms, with a hexamethylenediamine-adipic acid salt while concentrating the aqueous solution of the salt to a concentration of at least 70% by weight and while maintaining a uniform reaction phase at all times by controlling the pressure over and the temperature of the reaction medium such that the hexamethylenediamine-adipic acid salt does not precipitate, said pressure being up to not greater than 2 kg/cm.sup.2 .multidot.G and said temperature being up to not greater than 150.degree. C., and then mixing in the solution of the lactam of formula (I) thereby effecting copolymerization and forming a polyamide resin having a relative viscosity measured by the sulfuric acid solution method (1% at 25.degree. C.) of 1.5 to 8.0.Type: GrantFiled: September 13, 1996Date of Patent: March 3, 1998Assignee: Mitsubishi Chemical CorporationInventors: Shin-ichi Sato, Masaaki Miyamoto, Kenji Tsuruhara, Yoshiaki Ohtani
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Patent number: 5719255Abstract: A composition of matter useful as a hotmelt adhesive is provided. The adhesive comprises a polyamide based on dimerized fatty acid, preferably having an amine value of less than 2, and at least one heat stabilizer for polyvinyl chloride, preferably selected from the group consisting of alkyl tin carboxylate compounds and epoxy compounds. The heat stabilizer is preferably present in an amount of 0.2% to 10.0% by weight of the composition. Also provided is a method of using the composition as a hotmelt adhesive for polyvinyl chloride.Type: GrantFiled: September 11, 1996Date of Patent: February 17, 1998Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Reimar Heucher, Bettina Becker, Angela Rossini
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Patent number: 5688901Abstract: Partly aromatic semicrystalline thermoplastic polyamide molding compositions containA) from 40 to 100% by weight of a copolyamide composed ofa.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,a.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid,a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine anda.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms,the molar percentages of components a.sub.1) to a.sub.4) together giving 100%, andB) from 0 to 50% by weight of a fibrous or particulate filler,C) from 0 to 30% by weight of an elastomeric polymer andD) from 0 to 30% by weight of conventional additives and processing assistants,the percentages by weight of components A) to D) together giving 100%.Type: GrantFiled: February 6, 1995Date of Patent: November 18, 1997Assignee: BASF AktiengesellschaftInventors: Herbert Fisch, Gunter Pipper, Klaus Muhlbach, Heiner Gorrissen
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Patent number: 5684119Abstract: Directly shapeable clear solutions of polyamide imides and a method for preparing same are provided. The solutions are obtained by polycondensation in .gamma.-butyrolactone (.gamma.BL) in substantially stoichiometric proportions between toluylene diisocyanate and an aromatic acid anhydride, and by dilution in (.gamma.BL) to give a solution allowing them to be processed at a later stage. Yarns and fibers made from said solutions are also described.Type: GrantFiled: June 10, 1994Date of Patent: November 4, 1997Assignee: Rhone-Poulenc FibresInventors: Philippe Michaud, Jean Russo
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Patent number: 5684120Abstract: Colorless, transparent copolyamides, made up of monomers based on cycloaliphatic diamines and aromatic dicarboxylic acids and a maximum of 20 mol % of further polyamide-forming aliphatic monomers, which have glass transition temperatures of at least 175.degree. C., their blends and alloys, along with the molded articles that can be produced from them and a process for their preparation are proposed.Type: GrantFiled: November 9, 1995Date of Patent: November 4, 1997Assignee: EMS-Inventa AGInventor: Phil Hans Dallas Torre
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Patent number: 5674974Abstract: The invention provides a continuous process for the preparation of polyamides, equipment in which the polymerization process can be conducted, and process control methods for said polymerization process.Type: GrantFiled: November 23, 1994Date of Patent: October 7, 1997Assignee: E. I. Du Pont de Nemours and CompanyInventors: Ann Marion Brearley, James Joseph Lang, Ernest Keith Andrew Marchildon
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Patent number: 5674973Abstract: A process for the continuous production of polyamides from a mixture of at least one lactam and water and, if required, other monomer units and/or conventional additives and fillers under polyamide-forming conditions, where the mixture of the starting materials is heated in liquid phase in a first reaction zone until a conversion of at least 70% is reached, and undergoes adiabatic decompression and further polymerization in another reaction zone, wherein, in the first reaction zone, 0.5-7% by weight of water are employed, the temperature is increased to the range from 220.degree. to 310.degree. C., and polymerization is carried out until a conversion of at least 85% is reached and, in the second reaction zone, after the decompression further polymerization is carried out in the range from 215.degree. to 300.degree. C. without heat input.Type: GrantFiled: December 28, 1995Date of Patent: October 7, 1997Assignee: BASF AktiengesellschaftInventors: Gunter Pipper, Andreas Kleinke, Peter Hildenbrand
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Patent number: 5670608Abstract: A polyamide (9-T polyamide) comprising (a) 60 to 100 mole of terephthalic acid and (b) a diamine component comprising 60 to 100 mole % of 1,9-nonanediamine, said polyamide having an intrinsic viscosity ?.eta.! as determined by measurement in concentrated sulfuric acid at 30.degree. C. of 0.6 to 2.0 dl/g and having at least 10% of terminal groups thereof blocked. Another polyamide (9M-T polyamide) comprises a dicarboxylic acid component (a) comprising 60 to 100 mole % of terephthalic acid and a diamine component (b) comprising 60 to 100 mole % of 1,9-nonanediamine and 2-methyl-1,8octanediamine, the molar ratio between said 1,9 nonanediamine and said 2-methyl-1,8-octanediamine being in a range of 60:40 to 99:1, said polyamide having an intrinsic viscosity ?.eta.! as determined by measurement in concentrated sulfuric acid at 30.degree. C. of 0.4 to 3.0 dl/g.Type: GrantFiled: December 22, 1994Date of Patent: September 23, 1997Assignee: Kuraray Co., Ltd.Inventors: Hideaki Oka, Tsugunori Kashimura, Shinichi Yokota, Hiroshi Hayashihara