From Carboxylic Acid Having Three Or More Carboxylic Acid Groups Or Derivatives Thereof, And An Organic Amine, Or From An Organic Amine Salt Of A Tri-or Higher Carboxylic Acid Patents (Class 528/350)
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Patent number: 6919418Abstract: Methods of reducing the amount of undesirable cyclic oligomer by-products in the production of polyetherimides are disclosed. The resulting polyetherimides have enhanced thermomechanical properties.Type: GrantFiled: August 25, 2003Date of Patent: July 19, 2005Inventors: Farid Fouad Khouri, Daniel Joseph Brunelle, Donald Scott Johnson
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Patent number: 6919422Abstract: A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.Type: GrantFiled: September 22, 2003Date of Patent: July 19, 2005Assignee: General Electric CompanyInventors: Robert R Gallucci, Roy Ray Odle, William A. Kernick, III, Mark Alan Sanner
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Patent number: 6916898Abstract: A process of preparing a polyimide of the present invention comprises effecting an imidization reaction of a diamine and a tetracarboxylic dianhydride in a solvent containing 50 to 100% by weight of an equimolar composition of a nitrogen-containing cyclic compound indicated by chemical formula (1) below and a phenol indicated by chemical formula (2) below: in formula (1), X represents —CH2— or —N(CH3)—, and in formula (2), R1 and R2 may be the same as, or different from, each other and represent each any one of —H, —OH, —CH3, —C2H5, —C3H7, —C4H9, —C5H11, —C6H13, —C7H15, —C8H17, —C9H19, —C10H21, —OCH3, —O(C6H5), —NO2, —Cl, —Br and —F.Type: GrantFiled: March 13, 2001Date of Patent: July 12, 2005Assignee: Mitsui Chemicals, Inc.Inventors: Takashi Kuroki, Atsushi Shibuya, Shoji Tamai
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Patent number: 6911519Abstract: A series of low melting and low viscosity phenylethynyl end-capped polyimides (PETIs) possessed of long term thermal and mechanical stability useful as films, melt coatings, adhesives, matrix and RTM resins and particular as coatings for optical fibers and phenylethynyl end-capped bismides blended with PETIs are disclosed. Processes for their production including: 1) modification of PETI-5 oligomer by molecular weight adjustments by blending with reactive low melting phenylethynyl end-capped imide monomers, 2) modification of the PETI-5 backbone structure with other diamine components, and 3) modification of the PETI-5 backbone with bulky fluorinated groups are also disclosed.Type: GrantFiled: March 25, 2003Date of Patent: June 28, 2005Assignee: University of ConnecticutInventors: Daniel A. Scola, Christopher D. Simone
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Patent number: 6908685Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4?-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.Type: GrantFiled: August 23, 2001Date of Patent: June 21, 2005Assignees: E. I. du Pont de Nemours and Company, DuPont-Toray Co. Ltd.Inventors: Kenji Uhara, Kouichi Sawasaki, Naofumi Yasuda, Brian C. Auman, John D. Summers
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Patent number: 6891067Abstract: The present invention provides an optical polyimide precursor for use in making a polyimide. The precursor is defined by the following formula: wherein X is Cl, Br, oxo-halide, or fully halogenated alkyl, and A is a divalent aromatic or halogenated aromatic moiety. The present invention provides a method of preparing a diamine compound for use as an optical polyimide precursor. The method includes the steps of dissolving 2-chloro-5-nitrobenzotrifluoride and a diol in N,N-dimethylacetamide to form a solution, adding potassium carbonate, tert-butylammonium chloride and copper powder to said solution and heating the resulting mixture, removing the copper, precipitating and recrystallizing a dinitro-compound resulting from heating the mixture, and dissolving the dinitro-compound and reducing the dinitro-compound to yield a diamine compound.Type: GrantFiled: October 8, 2002Date of Patent: May 10, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Kyung-Hee You, Kwan-Soo Han, Tae-Hyung Rhee, Eun-Ji Kim, Jung-Hee Kim, Woo-Hyeuk Jang
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Patent number: 6887580Abstract: An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250?C and a Young's modulus (storage modulus) at 250?C of 105 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270?C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.Type: GrantFiled: January 26, 2001Date of Patent: May 3, 2005Assignee: Nippon Steel Chemical Co., Ltd.Inventors: Kiwamu Tokuhisa, Akira Tokumitsu, Kazuaki Kaneko
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Patent number: 6881815Abstract: A method for the synthesis of poly(etherimide)s comprises the reaction of 4-halotetrahydrophthalic anhydride with an activating primary amine to yield an activated 4-halotetrahydrophthalimide. Activated 4-halotetrahydrophthalimide may then be aromatized and treated with the disodium salt of a bis(phenol) to yield an activated bisimide. The activated bisimide may then be directly treated with a diamine to yield poly(etherimide)s.Type: GrantFiled: September 25, 2002Date of Patent: April 19, 2005Assignee: General Electric CompanyInventors: Roy Ray Odle, Thomas Link Guggenheim
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Patent number: 6878800Abstract: Process for providing a binder for mineral fibers, comprising the steps of: mixing together under reactive conditions an amine and an anhydride whereby water is added thereto, once substantially all the anhydride is dissolved and/or reacted in the amine.Type: GrantFiled: July 3, 2001Date of Patent: April 12, 2005Assignee: Rockwool International A/SInventors: Thor Husemoen, Erling Lennart Hansen, Povl Nissen
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Patent number: 6867256Abstract: The invention concerns a thermoplastic copolyamide and composition comprising as matrix said thermoplastic copolyamide, and a method of making such thermoplastic copolyamide. More particularly it concerns a copolyamide of the statistical tree type resulting from the reaction between a plurifunctional monomer comprising at least three reactive functions to form an amide function, said functions being two different types, and bifunctional monomer conventionally used in making linear polyamides. The resulting copolyamide has a very low softness index in molten state compared to the linear polyamide and improved shock-resistant properties. The invention also concerns with methods for making these copolyamides and composition for molding, extruding or injecting parts. Said compositions comprise fillers and additives and said copolyamide as a matrix.Type: GrantFiled: June 24, 1998Date of Patent: March 15, 2005Assignee: Nyltech ItaliaInventors: Giuseppe Di Silvestro, Cesare Guaita, Franco Speroni, Cuiming Yuan, Haichun Zhang
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Patent number: 6861497Abstract: A polyimide is disclosed of the formula: CG1 and CG2 are independently electron-accepting and/or electron-donating groups; x is an integer from about 3 to about 3000; ODAH is any of a number of known dianhydride residues; ODAM is any of a number of known diamine residues; and m, n, o, and p cumulatively add to 1.0, with the sum of m and n ranging from about 0.05 to about 1.0, the sum of o and p ranging from about 0 to about 0.95, the sum of m and o being about 0.5 and the sum of n and p being about 0.5. In addition, a film structure comprising the polyimide and devices utilizing the film structure are disclosed.Type: GrantFiled: October 28, 2002Date of Patent: March 1, 2005Assignee: The United States of America as represented by the Secretary of the NavyInventors: Geoffrey A. Lindsay, Richard A. Hollins, Peter Zaras, Andrew J. Guenthner, Andrew P. Chafin, Mathew C. Davis, Stephen Fallis
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Patent number: 6858700Abstract: Higher diamondoid derivatives capable of taking part in polymerization reactions are disclosed as well as intermediates to these derivatives, polymers formed from these derivatives and methods for preparing the polymers.Type: GrantFiled: January 16, 2002Date of Patent: February 22, 2005Assignee: Chervon U.S.A. Inc.Inventors: Jeremy E. Dahl, Robert M. Carlson, Shenggao Liu
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Patent number: 6852826Abstract: In a step of polymerizing polyamic acid by mixing tetracarboxylic acid dianhydride and diamine and polycondensating the tetracarboxylic acid dianhydride and diamine under the presence of a polymerization-use solvent, a tetracarboxylic acid dianhydride slurry in which a tetracarboxylic acid dianhydride is dispersed in a dispersion medium is used. According to this, it is possible to directly manufacture a polyamic acid solution having a high concentration of polyamic acid more than or equal to 10% by weight. Especially, even if a tetracarboxylic acid dianhydride having low solubility in the polymerization-use solvent, it is possible to effectively manufacture a polyamic acid solution having high solids content, by a simple process and in a short time.Type: GrantFiled: December 19, 2002Date of Patent: February 8, 2005Assignee: Kanera CorporationInventors: Kan Fujihara, Kazuhiro Ono, Kiyokazu Akahori
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Patent number: 6849706Abstract: Copolyetherimides comprise phthalimide structural units comprising both 3- and 4-linkages, wherein the designations 3-linkage and 4-linkage refer to the isomeric positions on the phthalimide ring in the totality of phthalimide-comprising structural units in the copolymer. The products have excellent properties, including high glass transition and heat distortion temperatures, high ductility and good melt flow properties, and low polydispersity.Type: GrantFiled: August 25, 2003Date of Patent: February 1, 2005Assignee: General Electric CompanyInventors: Daniel Joseph Brunelle, Havva Yagci Acar, Farid Fouad Khouri, William David Richards
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Patent number: 6835442Abstract: A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.Type: GrantFiled: September 12, 2002Date of Patent: December 28, 2004Assignees: Sony Chemicals Corp., Circuit Foil Japan Co., Ltd.Inventors: Noriaki Kudo, Asaei Takabayashi, Akitoshi Suzuki, Shin Fukuda
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Patent number: 6828408Abstract: An aromatic polyimide ester having a small coefficient of linear expansion, small water absorbing property, and excellent heat resistance. The aromatic polyimide ester comprising: a repeating unit represented by a following formula (I), a repeating unit represented by a following formula (II), (n represents 0 or 1) a repeating unit represented by a following formula (III), and a repeating unit represented by a following formula (IV), (-A- represents —O— or —CO—, and is located in para-position or meta position to imido group, and X represents direct coupling, —O—, —S—, or —SO2—) and the repeating units are mutually bonded with each other through ester-bonds.Type: GrantFiled: September 5, 2002Date of Patent: December 7, 2004Assignee: Sumitomo Chemical Company, LimitedInventors: Satoshi Okamoto, Manabu Hirakawa
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Patent number: 6809127Abstract: A radiation-curable composition is comprised of the reaction product of an amine-terminated (poly)aminoamide and a mono-(meth)acrylate or a poly-(meth)acrylate. The radiation-curable composition is a liquid at room temperature and does not undergo substantial volume contraction upon curing and exhibit excellent adhesion to porous and non porous substrates alike.Type: GrantFiled: September 13, 2002Date of Patent: October 26, 2004Assignee: Cognis CorporationInventors: Miguel A. Dones, Anbazhagan Natesh, Daniel Haile, Ramesh L. Narayan
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Patent number: 6808818Abstract: A fusible polyimide showing a fusion endothermic peak in a differential scanning calorimeter has a recurring unit of the following formula (1): in which Ar1 is a mixture of residues of tetracarboxylic dianhydrides composed of 12-25 mol. & of a residue of pyromellitic dianhydride, 5-15 mol. % of a residue of 3,3′4,4′-benzophenonetetracarboxylic dianhydride, and a remaining mol. % of a residue of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and Ar2 is an aromatic diamine residue composed of 1,3-bis(4-aminophenoxy)benzene.Type: GrantFiled: October 11, 2002Date of Patent: October 26, 2004Assignee: Ube Industries, Ltd.Inventors: Hideki Ozawa, Shigeru Yamamoto
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Patent number: 6790930Abstract: The present invention provides a method for easily producing a high-molecular weight polyimide resin at high yield by drying and heating a mixture mixed by material monomers of polyimide.Type: GrantFiled: April 4, 2002Date of Patent: September 14, 2004Assignee: Kaneka CorporationInventors: Takeshi Kikuchi, Hiroyuki Tsuji, Koji Okada, Hiroyuki Furutani, Koichiro Tanaka, Shoji Hara, Hitoshi Nojiri
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Patent number: 6784276Abstract: This invention is a highly concentrated stable solution of polyimide precursors (monomers) having a solids content ranging from about 80 to 98 percent by weight in lower aliphatic alcohols i.e. methyl and/or ethyl alcohol. The concentrated polyimide precursor solution comprises effective amounts of at least one aromatic diamine, at least one aromatic dianhydride or a lower molecular weight alkyl ester of said dianhydride, and a monofunctional endcap including monoamines, monoanhydrides and the lower alkyl esters of said monoanhydrides. These concentrated polyimide precursor solutions are particularly useful for the preparation of fibrous prepregs and composites for use in structural materials for military and civil applications.Type: GrantFiled: July 25, 2002Date of Patent: August 31, 2004Assignee: The United States of America as represented by the United States National Aeronautics and Space AdministrationInventor: Chun-Hua Chuang
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Publication number: 20040166311Abstract: The present invention is directed to a process for electrostatically spinning fibers of polyamic acid and the fibers thus produced as well as the nonwoven webs that may be formed from the fibers. According to the processes of the present invention, polyamic acid solutions may be electrostatically spun to form fibers of very small diameter, such as, for instance, less than about 5 &mgr;m in average diameter. The fibers may be formed into a nonwoven web having very high specific surface area and large porosity. The polyamic acid may be converted to polyimide to form a polyimide nonwoven web. The polyimide nonwoven web may then be activated through a carbonization process to enhance the electrochemical properties of the web. The nonwoven webs of the invention may be utilized in a variety of electrochemical applications including, for example, electrical double layer capacitors.Type: ApplicationFiled: February 25, 2003Publication date: August 26, 2004Applicant: Clemson UniversityInventors: Kap Seung Yang, Yeong Og Choi
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Patent number: 6780960Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.Type: GrantFiled: July 22, 2002Date of Patent: August 24, 2004Assignee: Sumitomo Bakelite Company LimitedInventors: Michael C. Hausladen, Jin-O Choi
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Patent number: 6777525Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.Type: GrantFiled: April 1, 2002Date of Patent: August 17, 2004Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventor: Ruth H. Pater
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Patent number: 6770733Abstract: A film-formable polyimide copolymer, which comprises two kinds of tetracarboxylic acid dianhydride consisting of (A) pyromellitic acid dianhydride and (B) 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride, and (C) 6-amino-2-(p-aminophenyl)benzimidazole has a heat-resistant dimensional stability without any deterioration of mechanical properties inherent in the polyimide resin when used as a film.Type: GrantFiled: January 3, 2003Date of Patent: August 3, 2004Assignee: Nippon Mektron, LimitedInventors: Min Zuo, Jenq-Tain Lin
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Patent number: 6740371Abstract: An alkyldiamine having excellent polymerization reactivity, a polyimide comprising it as a constituting element, and a liquid crystal alignment film excellent in uniformity of liquid crystal alignment, are presented. Namely, the present invention relates to a diaminobenzene derivative represented by the following general formula (1) and to a polyimide obtained by reacting a diamine containing at least 1 mol % of the diaminobenzene derivative represented by the general formula (1), with at least one compound selected from a tetracarboxylic. dianhydride and its derivatives, to obtain a polyimide. precursor having a reduced viscosity of from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., concentration: 0.5 g/dl) and ring-closing it, and having a repeating unit represented by the general formula (2). Further, the present invention relates to a liquid crystal alignment film containing at least 1 mol % of the above repeating unit.Type: GrantFiled: December 26, 2001Date of Patent: May 25, 2004Assignee: Nissan Chemical Industries, Ltd.Inventors: Kazuyoshi Hosaka, Hideyuki Nawata, Takayasu Nihira, Hideyuki Isogai, Hideyuki Endou, Hiroyoshi Fukuro
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Publication number: 20040097695Abstract: A proton-conducting polymer, a preparation method thereof, a polymer membrane manufactured from the proton-conducting polymer, and a fuel cell having the polymer membrane are provided. The proton-conducting polymer contains an acid-bearable aromatic group covalently bonded to its polyimide backbone and a proton-conducting acid group attached to the aromatic group. A polymer membrane manufactured from the proton-conducting polymer has greater mechanical strength and ionic (protonic) conductivity than existing sulfonated polyimide membranes and thus improves the performance of fuel cells. In addition, the proton-conducting polymer membrane is low cost, enabling automobile fuel cells to be commercialized. Since the proton-conducting polymer membrane is less permeable to methanol, it can be used effectively for DMFCs without causing cell performance degradation.Type: ApplicationFiled: July 2, 2003Publication date: May 20, 2004Applicant: Samsung SDI Co., Ltd.Inventor: Chong-Bok Yoon
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Patent number: 6737502Abstract: A solvent-free, catalyst-free and contamination-free method of synthesis of polyimides is disclosed. The method includes polymerizing a diamine with 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) at a pressure of 0.1-760 mm Hg, preferably a reduced pressure at about 36 mm Hg, and a temperature of 90-400° C., preferably 10-240° C.Type: GrantFiled: June 6, 2002Date of Patent: May 18, 2004Assignee: Chung-Shan Institute of Science & TechnologyInventor: Shean-Jeng Jong
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Patent number: 6734276Abstract: The invention is a polyimide, random copolymer having repeating units of the formula (1): wherein R1 and R2 each represent a divalent group selected from and R1 and R2 may be the same or different; and x=0.60 to 0.80, y+z=0.40 to 0.20, and x+y+z=1.00, and a linear expansion coefficient at 100 to 200° C. is in the range of from 10 to 20 ppm/K. This is a useful polyimide that can be a polyimide circuit substrate material capable of keeping flat, neither shrinking nor expanding in its laminate.Type: GrantFiled: April 11, 2002Date of Patent: May 11, 2004Assignee: Mitsui Chemicals, Inc.Inventors: Wataru Yamashita, Katsuji Watanabe, Takahisa Oguchi
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Patent number: 6713597Abstract: A process for the preparation of a reactive friable polyimide powder comprises dissolving an aromatic dianhydride and an organic diamine in a high-boiling, aprotic organic solvent to form a reaction solution; heating the reaction solution under imidization conditions to form an insoluble reactive polyimide and to effect substantially complete distillation of the water of reaction out of the reaction solution; and separating the insoluble reactive polyimide from the reaction solution to form a reactive friable polyimide powder.Type: GrantFiled: March 19, 2002Date of Patent: March 30, 2004Assignee: General Electric CompanyInventor: Martin John Lindway
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Patent number: 6710160Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): wherein the norbornane skeleton of comprises four components of and their contents satisfy the following: 1%≦2,5-[diexo]≦90%, 1%≦2,5-[exo,endo]≦90%, 1%≦2,6-[diexo]≦90%, 1% ≦2,6-[exo,endo]≦90%, provided that (2,5-[diexo])+(2,5-[exo,endo])+(2,6-[diexo])+(2,6-[exo,endo])=100%, R represents from 4 to 27 carbon atoms, and represents a tetravalent group selected from the group consisting of an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aliphatic or aromatic group which is composed of cycloaliphatic or aromatic groups mutually bonded to each other either directly or via a crosslinking member; and a polyimideType: GrantFiled: March 20, 2002Date of Patent: March 23, 2004Assignee: Mitsui Chemicals, Inc.Inventors: Wataru Yamashita, Katsuji Watanabe, Hideaki Oikawa, Hisato Ito
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Patent number: 6706853Abstract: Compound or salts thereof suitable for use as a binder for mineral fibers, for example glass or stone wool, said compound containing a carboxylic acid group and/or a &bgr;-hydroxyalkyl amide group.Type: GrantFiled: September 27, 2000Date of Patent: March 16, 2004Assignee: Rockwool International A/SInventors: Dirk Armand Wim Stanssens, Thor Husemoen, Erling Lennart Hansen
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Patent number: 6693162Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.Type: GrantFiled: October 9, 2001Date of Patent: February 17, 2004Assignee: Kaneka Japan CorporationInventors: Hiroyuki Tsuji, Hiroyuki Furutani, Koichiro Tanaka, Takeshi Kikuchi
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Patent number: 6680363Abstract: An acid dianhydride, together with a diamine, is heated in an organic polar solvent in the presence of &ggr;-caprolactone or &bgr;-butyrolactone as an acid catalyst to prepare a polyimide having an average molecular weight of 10,000 to 300,000. This production process can realize the production of a polyimide which is soluble in a solvent and has high processability and stability.Type: GrantFiled: January 23, 2002Date of Patent: January 20, 2004Assignee: Hitachi Cable, Ltd.Inventors: Katsumoto Hosokawa, Yuuki Honda, Seiji Kamimura, Yoshiyuki Ando, Kenji Asano
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Patent number: 6653433Abstract: A polyimide film that exhibits improved peel strength when clad with a metal layer is prepared by reacting a polyamic acid polymer and an esterified polyamic acid oligomer. The esterified oligomer has from two to twenty repeating units and at least two crosslinkable groups selected from the group consisting of carbonyl, cyano, hydroxy, alkyne, maleimide, norbornene and sulfonyl groups. The polyamic acid is dissolved in a solvent to form a polyamic acid solution, which has a minimum gel-film forming temperature, or a minimum green film forming temperature, associated therewith. The esterified polyamic acid oligomer has an imidization temperature, which is higher than the minimum gel-film forming temperature, or the minimum green film forming temperature, of the polyamic acid solution.Type: GrantFiled: May 4, 2001Date of Patent: November 25, 2003Assignee: E. I. du Pont de Nemours and CompanyInventors: James Richard Edman, Meredith Lynn White
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Patent number: 6642348Abstract: The present invention provides PMR-type polyimides that exhibit lower melt viscosities than PMR-type polyimides of the prior art. These PMR-type polyimides are created by incorporating flexible linkages, such as kinked structures and twisted or non-coplanar moietes into the backbone structure of the PMR. Specifically, the present invention provides for the production of PMR-type polyimides having 2,2′-disubstituted biaryls in the polymer backbone.Type: GrantFiled: March 2, 2001Date of Patent: November 4, 2003Assignee: The University of AkronInventors: Ronald Eby, Michael Meador, Christopher Gariepy
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Patent number: 6596838Abstract: The invention relates to a semi-permeable membrane separation process and device in which the said membranes comprise sulphonated polyimides. The present invention also relates to the use of sulphonated polyimide membranes in separation processes and devices using semi-permeable membranes.Type: GrantFiled: August 17, 2001Date of Patent: July 22, 2003Assignees: Commissariat A l'Energie Atomique, Centre National de la RechercheInventors: Michel Pinery, Gérald Pourcelly, Régis Mercier
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Patent number: 6586561Abstract: Sulfonated polyimide polymers incorporating bulky monomers are disclosed. The polymers have a liquid crystalline structure and exhibit high conductivity, high water uptake and water stability over a range of relative humidities and temperatures. The polymers are particularly adapted for use as a polymer electrolyte membrane in fuel cells.Type: GrantFiled: February 18, 2000Date of Patent: July 1, 2003Assignee: Case Western Reserve UniversityInventors: Morton H. Litt, Robert F. Savinell, Jesse S. Wainright, Yue Zhang
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Patent number: 6586555Abstract: This invention provides processes of the preparation of polyamides, polyimides, and polyamideimides, which are easy to purify after reactions, from polycarboxylic acids and polyamines in high yield without side reactions such as a change of color to black by direct polycondensation reaction with heat, especially processes of preparing aromatic polyamides (aramids), aromatic polyimides, and aromatic polyamideimides, which are difficult to synthesize in direct polycondensation reaction. Polyamides, polymides, and polyamideimides are prepared in high yield by the polycondensation of aromatic dicarboxylic acids, aromatic tetracarboxylic acids or aromatic tricarboxylic acids and aromatic diamines, using arylboric acids such as 3,4,5-trifluorophenylboric acids as polycondensation catalysts, in a mixed solvent of pentamethylbenzene and N-methylpyrrolidinone or a mixed solvent of m-terphenyl and N-butylpyrrolidinone.Type: GrantFiled: September 12, 2001Date of Patent: July 1, 2003Assignee: Japan Science and Technology CorporationInventors: Kazuaki Ishihara, Hisashi Yamamoto
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Patent number: 6569984Abstract: The invention is directed to method for making a polyimide by converting the dianhydride to the ester acid and reacting the ester acid with a diamine. The invention allows for the controlled addition of aliphatic diamines resulting in control of the polyimide properties such as the glass transition temperature, solubility, and melt processability.Type: GrantFiled: April 27, 2001Date of Patent: May 27, 2003Assignee: Virginia Tech Intellectual Properties, Inc.Inventors: James E. McGrath, Sue J. Mecham
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Patent number: 6548621Abstract: The invention provides a poly(imide-benzoxazole) (PIBO) copolymer prepared from a trimellitic anhydride halide monomer and a bis(o-diaminophenol) monomer. The PIBO copolymer is characterized by the following recurring unit: wherein X is —O—, —S—, —C(CF3)2—, —C(CH3)2—, —CO—, —CH2—, —SO2—, —SO—, or deleted; and n is an integer. The PIBO copolymers of this invention are particularly useful as dielectric layers in semiconductor devices because they possess hydroxyl groups which create better adhesion to semiconductor substrates.Type: GrantFiled: November 8, 2001Date of Patent: April 15, 2003Assignee: Industrial Technology Research InstituteInventors: Shih-Jung Tsai, Steve Lien-Chung Hsu, Yuan-Pin Huang
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Patent number: 6538097Abstract: A process for production of polyimide powder, which comprises reacting a biphenyltetracarboxylic dianhydride and an aromatic diamine in an amide-based solvent optionally containing a water-soluble ketone, in the presence of an imidazole at 1-100 equivalent percent based on the carboxylic acid content of the polyimide precursor, separating and collecting the produced polyimide precursor powder from a water-soluble ketone solvent containing 3-30 wt % of an amide-based solvent, and heating the polyimide precursor powder to an imidation rate of 90% or greater, as well as polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.Type: GrantFiled: October 29, 2001Date of Patent: March 25, 2003Assignee: UBE Industries, Ltd.Inventors: Hiroaki Yamaguchi, Fumio Aoki
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Patent number: 6538100Abstract: The object of the present invention is to provide a method capable of producing polyimide resins having excellent heat resistance, which can utilize inexpensive monomers and does not use solvents. The method comprises mixing, in the absence of a solvent, a diamine and at least one tetracarboxylic acid component selected from the group consisting of a tetracarboxylic acid, a tetracarboxylic acid monoanhydride and a tetracarboxylic acid dianhydride capable of forming two imide rings upon cyclization, and then heat-treating the mixture.Type: GrantFiled: February 14, 2000Date of Patent: March 25, 2003Assignee: Sumitomo Bakelite Company LimitedInventors: Yoshiyuki Yamamori, Hiroyuki Yasuda
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Patent number: 6534622Abstract: A process for production of polyimide powder, which comprises reacting an aromatic diamine with a partial ester of a biphenyltetracarboxylic dianhydride, which is a partial ester of a biphenyltetracarboxylic dianhydride with a primary alcohol of 1-5 carbon atoms of which at least 30 mole percent is a 2,3,3′,4′-biphenyltetracarboxylic acid component, in the presence of the primary alcohol, separating out and collecting the resulting solid polyimide precursor and heating for dehydrating ring closure, polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.Type: GrantFiled: October 29, 2001Date of Patent: March 18, 2003Assignee: Ube Industries, Ltd.Inventors: Hiroaki Yamaguchi, Fumio Aoki
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Patent number: 6531568Abstract: This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.Type: GrantFiled: April 9, 2001Date of Patent: March 11, 2003Assignee: Mitsui Chemicals, Inc.Inventors: Atsushi Shibuya, Tomomi Okumura, Hideaki Oikawa, Yoshihiro Sakata, Takashi Kuroki, Yuichi Okawa, Shoji Tamai
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Patent number: 6518392Abstract: A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynyl)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.Type: GrantFiled: March 8, 2001Date of Patent: February 11, 2003Assignee: International Business Machines CorporationInventors: Kenneth R. Carter, James L. Hedrick, Victor Yee-Way Lee, Dale C. McHerron, Robert D. Miller
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Patent number: 6500913Abstract: The present invention relates to a novel polyimide of the general formula (1) and a process for the preparation thereof.Type: GrantFiled: March 13, 2001Date of Patent: December 31, 2002Assignees: Council of Scientific and Industrial Research, Laboratoire des Materiaux Organiques a Proprietes SpeciquesInventors: Jinu Suju Mathew, Subhash Pundlik Vernekar, Reges Mercier, Rachid Kerboua
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Patent number: 6500904Abstract: A method for the synthesis of high molecular weight poly(imide)s comprising coupling poly(imide) precursors having complementary functional groups and a weight average molecular weight of less than about 50,000 Daltons to form high molecular weight poly (imides)s having a weight average molecular weight greater than 50,000 Daltons.Type: GrantFiled: November 2, 2001Date of Patent: December 31, 2002Assignee: General Electric CompanyInventor: Robert F. Hayes
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Publication number: 20020198358Abstract: The present invention provides a polymer in which coumarin, a photo-reactive molecule, is grafted onto a polyimide for preparing liquid crystal alignment layer which has a superior alignment property and an excellent thermal stability in photo-alignment, a process for preparing the said grafted polymer, a process for preparing liquid crystal alignment layer by employing the said grafted polymer, and a liquid crystal alignment layer prepared by the process. The polymer of the invention is prepared by mixing a coumarin compound with a polyimide, dissolving the mixture in an organic solvent, adding a catalyst, and stirring under an environment of N2 gas. The polymer of the invention is superior in terms of the thermal stability, which makes possible its universal application for the development of a novel liquid crystal display(LCD).Type: ApplicationFiled: March 8, 2002Publication date: December 26, 2002Inventors: Jung-Ki Park, Shi-joon Sung, Jong-Woo Lee
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Patent number: 6498224Abstract: A new method for the synthesis of poly(etherimide)s comprises transimidation of bis(imide) (IV) in the presence of a substituted phthalic anhydride or 4-substituted tetrahydrophthalic anhydride to yield dianhydride (V) which may then be reacted with a diamine to produce poly(etherimide)s. By-product substituted N-alkylphthalimide or 4-substituted N-alkyltetrahydrophthalic anhydride may be recycled or converted to 4-substituted N-alkylphthalimide for use in the formation bisimide (IV), obviating the need for a nitration step.Type: GrantFiled: December 5, 2001Date of Patent: December 24, 2002Assignee: General Electric CompanyInventors: Roy Ray Odle, Thomas Link Guggenheim, William James Swatos, Michael J. Vollmer
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Patent number: 6498226Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.Type: GrantFiled: May 3, 2001Date of Patent: December 24, 2002Assignee: Industrial Technology Research InstituteInventors: Kung-Lung Cheng, Shu-Chen Lin, Wen-Ling Lui, Chih-Hsiang Lin, Wei-Ling Lin, Woan-Shiow Tzeng