Carboxylic Acid Contains At Least Four Carboxylic Acid Groups Or Is A Derivative Of A Carboxylic Acid Containing At Least Four Carboxylic Groups Patents (Class 528/353)
  • Patent number: 6891067
    Abstract: The present invention provides an optical polyimide precursor for use in making a polyimide. The precursor is defined by the following formula: wherein X is Cl, Br, oxo-halide, or fully halogenated alkyl, and A is a divalent aromatic or halogenated aromatic moiety. The present invention provides a method of preparing a diamine compound for use as an optical polyimide precursor. The method includes the steps of dissolving 2-chloro-5-nitrobenzotrifluoride and a diol in N,N-dimethylacetamide to form a solution, adding potassium carbonate, tert-butylammonium chloride and copper powder to said solution and heating the resulting mixture, removing the copper, precipitating and recrystallizing a dinitro-compound resulting from heating the mixture, and dissolving the dinitro-compound and reducing the dinitro-compound to yield a diamine compound.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: May 10, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-Hee You, Kwan-Soo Han, Tae-Hyung Rhee, Eun-Ji Kim, Jung-Hee Kim, Woo-Hyeuk Jang
  • Patent number: 6887534
    Abstract: A liquid crystal aligning agent which can provide liquid crystal aligning capability through exposure to polarized radiation without rubbing and which is used to form a liquid crystal alignment film, a method of forming a liquid crystal alignment film, and a liquid crystal display element having this liquid crystal alignment film. An alignment film is formed from a liquid crystal aligning agent containing a polymer having a polyamic acid ester structure with a conjugated enone structure in the side chain and applying radiation to it from a predetermined direction. Thereby, a liquid crystal display element having high thermal stability in the alignment of liquid crystals and excellent display characteristics can be manufactured.
    Type: Grant
    Filed: February 19, 2003
    Date of Patent: May 3, 2005
    Assignee: JSR Corporation
    Inventors: Shoichi Nakata, Masayuki Kimura
  • Patent number: 6887967
    Abstract: A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).
    Type: Grant
    Filed: January 23, 2003
    Date of Patent: May 3, 2005
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Eiju Ichinose, Yohzoh Yamashina, Hidenobu Ishikawa
  • Patent number: 6887580
    Abstract: An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250?C and a Young's modulus (storage modulus) at 250?C of 105 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270?C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: May 3, 2005
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Kiwamu Tokuhisa, Akira Tokumitsu, Kazuaki Kaneko
  • Patent number: 6881815
    Abstract: A method for the synthesis of poly(etherimide)s comprises the reaction of 4-halotetrahydrophthalic anhydride with an activating primary amine to yield an activated 4-halotetrahydrophthalimide. Activated 4-halotetrahydrophthalimide may then be aromatized and treated with the disodium salt of a bis(phenol) to yield an activated bisimide. The activated bisimide may then be directly treated with a diamine to yield poly(etherimide)s.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: April 19, 2005
    Assignee: General Electric Company
    Inventors: Roy Ray Odle, Thomas Link Guggenheim
  • Patent number: 6878800
    Abstract: Process for providing a binder for mineral fibers, comprising the steps of: mixing together under reactive conditions an amine and an anhydride whereby water is added thereto, once substantially all the anhydride is dissolved and/or reacted in the amine.
    Type: Grant
    Filed: July 3, 2001
    Date of Patent: April 12, 2005
    Assignee: Rockwool International A/S
    Inventors: Thor Husemoen, Erling Lennart Hansen, Povl Nissen
  • Patent number: 6861497
    Abstract: A polyimide is disclosed of the formula: CG1 and CG2 are independently electron-accepting and/or electron-donating groups; x is an integer from about 3 to about 3000; ODAH is any of a number of known dianhydride residues; ODAM is any of a number of known diamine residues; and m, n, o, and p cumulatively add to 1.0, with the sum of m and n ranging from about 0.05 to about 1.0, the sum of o and p ranging from about 0 to about 0.95, the sum of m and o being about 0.5 and the sum of n and p being about 0.5. In addition, a film structure comprising the polyimide and devices utilizing the film structure are disclosed.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: March 1, 2005
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Geoffrey A. Lindsay, Richard A. Hollins, Peter Zaras, Andrew J. Guenthner, Andrew P. Chafin, Mathew C. Davis, Stephen Fallis
  • Patent number: 6858700
    Abstract: Higher diamondoid derivatives capable of taking part in polymerization reactions are disclosed as well as intermediates to these derivatives, polymers formed from these derivatives and methods for preparing the polymers.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: February 22, 2005
    Assignee: Chervon U.S.A. Inc.
    Inventors: Jeremy E. Dahl, Robert M. Carlson, Shenggao Liu
  • Patent number: 6852826
    Abstract: In a step of polymerizing polyamic acid by mixing tetracarboxylic acid dianhydride and diamine and polycondensating the tetracarboxylic acid dianhydride and diamine under the presence of a polymerization-use solvent, a tetracarboxylic acid dianhydride slurry in which a tetracarboxylic acid dianhydride is dispersed in a dispersion medium is used. According to this, it is possible to directly manufacture a polyamic acid solution having a high concentration of polyamic acid more than or equal to 10% by weight. Especially, even if a tetracarboxylic acid dianhydride having low solubility in the polymerization-use solvent, it is possible to effectively manufacture a polyamic acid solution having high solids content, by a simple process and in a short time.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: February 8, 2005
    Assignee: Kanera Corporation
    Inventors: Kan Fujihara, Kazuhiro Ono, Kiyokazu Akahori
  • Patent number: 6838184
    Abstract: An aromatic polyimide film for producing an electro-conductive sealing element of a packaged semi-conductor device, has a thickness of 20 to 60 ?m, a moisture vapor transmission coefficient of 0.05 to 0.8 g/mm/m2ยท24 hrs, a water absorption ratio of 2.0% or less, and an elastic modulus in tension of 5,000 MPa or more, in which a surface of the polyimide film has been treated with reduced-pressure plasma discharge.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: January 4, 2005
    Assignee: Ube Industries, Ltd.
    Inventors: Takuji Takahashi, Toshihiko Anno, Kohji Narui, Shozo Katsuki
  • Publication number: 20040265601
    Abstract: A polyimide precursor resin solution composition sheet having a solvent content of 1-50% by weight and a thickness of 1-10 microns has improved adhesion, forms a heat resistant polyimide layer when cured, and is advantageously used in the bonding of conductors to plastic films.
    Type: Application
    Filed: June 24, 2004
    Publication date: December 30, 2004
    Inventors: Shigehiro Hoshida, Masahiro Usuki, Michio Aizawa, Tadashi Amano
  • Publication number: 20040266979
    Abstract: In the process of the present invention, a solvent-soluble polyimide is produced by polycondensing at least one tetracarboxylic acid component with at least one diamine component in a solvent in the presence of a tertiary amine.
    Type: Application
    Filed: June 25, 2004
    Publication date: December 30, 2004
    Applicant: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hiroki Oguro, Shuta Kihara, Tsuyoshi Bito
  • Publication number: 20040260055
    Abstract: A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.
    Type: Application
    Filed: September 22, 2003
    Publication date: December 23, 2004
    Applicant: General Electric Company
    Inventors: Robert R. Gallucci, Roy Ray Odle, William A. Kernick, Mark Alan Sanner
  • Publication number: 20040260053
    Abstract: A polyimide polymer made from a dianhydride of 3,3′,4,4′-Biphenyltetracarboxylic dianhydride and diamines of p-phenylenediamine and oxydianiline, having similar coefficient of thermal expansion, useful for producing polyimide cast-on-copper laminate, which having an excellent dimensional stability.
    Type: Application
    Filed: June 20, 2003
    Publication date: December 23, 2004
    Inventors: Hsu Yen-Huey, Huang Chuan-Yi
  • Patent number: 6831148
    Abstract: A photoactive polymer from the class of polyimides, polyamide acids and esters thereof comprises as a side-chain a photocrosslinkable group of the general formula (I) wherein the broken line indicates the point of linkage to the polyimide main chain and wherein: B is a straight-chain or branched alkyl residue which is optionally substituted, wherein one or more non-adjacent CH2 groups may independently be replaced by a group Q; D represents an oxygen atom or —NR1— wherein R1 represents a hydrogen atom or lower alkyl; and S3 represents a spacer unit. The polymers may be used as orientation layers for liquid crystals and in the construction of unstructured and structured optical elements and multi-layer systems.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: December 14, 2004
    Assignee: Rolic AG
    Inventors: Richard Buchecker, Guy Marck, Olivier Muller
  • Publication number: 20040249117
    Abstract: Disclosed herein are polyetherimide compositions comprising structural units of the formula: 1
    Type: Application
    Filed: June 3, 2003
    Publication date: December 9, 2004
    Applicant: General Electric Company
    Inventors: Havva Acar, Daniel Joseph Brunelle
  • Patent number: 6828409
    Abstract: A host-guest polymer system including a polymer with an isoimide group and an organic chromophore and capable of converting into a side-chain polymer system, a side-chain nonlinear optical polymer derived from the host-guest polymer system, and a method for synthesizing the side-chain nonlinear optical polymer are provided. The method for synthesizing the side-chain nonlinear optical polymer involves forming a nonlinear optical polymer film based on a host-guest system in which an organic chromophore having a reactive group capable of nucleophilic reaction with an isoimide group is dispersed in a matrix including a polymer with the isoimide group having the following formula: Next, the nonlinear optical film is poled at a first temperature in an electric field; and the organic chromophore is reacted with the polymer while poling at a second temperature which is higher than the first temperature, to synthesize the side-chain nonlinear optical polymer.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: December 7, 2004
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seung Koo Park, Jung Yun Do, Jung Jin Ju, Suntak Park, Myung-Hyun Lee
  • Patent number: 6828408
    Abstract: An aromatic polyimide ester having a small coefficient of linear expansion, small water absorbing property, and excellent heat resistance. The aromatic polyimide ester comprising: a repeating unit represented by a following formula (I), a repeating unit represented by a following formula (II), (n represents 0 or 1) a repeating unit represented by a following formula (III), and a repeating unit represented by a following formula (IV), (-A- represents —O— or —CO—, and is located in para-position or meta position to imido group, and X represents direct coupling, —O—, —S—, or —SO2—) and the repeating units are mutually bonded with each other through ester-bonds.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: December 7, 2004
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Satoshi Okamoto, Manabu Hirakawa
  • Publication number: 20040225026
    Abstract: The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are readily prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.
    Type: Application
    Filed: April 30, 2004
    Publication date: November 11, 2004
    Inventors: Farhad G. Mizori, Stephen M. Dershem
  • Publication number: 20040220379
    Abstract: The invention relates to a polymer material having electro optic and nonlinear optical properties suitable for manufacturing a device using the electro optic and nonlinear optical properties. More particularly, the present invention relates to a polymer material having excellent electro optic properties and optical nonlinearities, maintaining the properties under the manufacturing conditions of high temperature, and having physical, chemical, and optical stabilities by introducing an organic chromophore as a side chain of the polymer so that the polymer material can be suitable for manufacturing an electro optic and nonlinear optical device, to a film manufactured from the polymer material, and to a method of manufacturing the polymer material.
    Type: Application
    Filed: December 22, 2003
    Publication date: November 4, 2004
    Inventors: Seung Koo Park, Jung Yun Do, Jung Jin Ju, Suntak Park, Min-Su Kim, Myung-Hyun Lee
  • Patent number: 6808818
    Abstract: A fusible polyimide showing a fusion endothermic peak in a differential scanning calorimeter has a recurring unit of the following formula (1): in which Ar1 is a mixture of residues of tetracarboxylic dianhydrides composed of 12-25 mol. & of a residue of pyromellitic dianhydride, 5-15 mol. % of a residue of 3,3′4,4′-benzophenonetetracarboxylic dianhydride, and a remaining mol. % of a residue of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and Ar2 is an aromatic diamine residue composed of 1,3-bis(4-aminophenoxy)benzene.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: October 26, 2004
    Assignee: Ube Industries, Ltd.
    Inventors: Hideki Ozawa, Shigeru Yamamoto
  • Patent number: 6797801
    Abstract: An oriented polyimide film of high strength and a production process therefor. The process basically comprises stretching a gelled film and then imidating the film. The gelled film is formed by introducing a polyamic acid solution into a condensation agent solution. The gelled film is swollen with a solvent at the time of stretching.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: September 28, 2004
    Assignee: Teijin Limited
    Inventors: Jiro Sadanobu, Rei Nishio, Susumu Honda, Tsutomu Nakamura
  • Patent number: 6797392
    Abstract: A polyimide/metal composite sheet is composed of a metal film and a polyimide film polyimide which is prepared by reaction of asymmetric biphenyltetracarboxylic acid dianhydride and 1,3-bis(4-aminophenoxy)benzene. The polyimide film is firmly bonded to and hardly peelable from the metal film. The polyimide film can contain a solid filler.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: September 28, 2004
    Assignee: Ube Industries, Ltd.
    Inventors: Akinori Shiotani, Hiroaki Yamaguchi, Fumio Aoki, Katsutoshi Washio, Tatsuo Tsumiyama
  • Patent number: 6790930
    Abstract: The present invention provides a method for easily producing a high-molecular weight polyimide resin at high yield by drying and heating a mixture mixed by material monomers of polyimide.
    Type: Grant
    Filed: April 4, 2002
    Date of Patent: September 14, 2004
    Assignee: Kaneka Corporation
    Inventors: Takeshi Kikuchi, Hiroyuki Tsuji, Koji Okada, Hiroyuki Furutani, Koichiro Tanaka, Shoji Hara, Hitoshi Nojiri
  • Patent number: 6784276
    Abstract: This invention is a highly concentrated stable solution of polyimide precursors (monomers) having a solids content ranging from about 80 to 98 percent by weight in lower aliphatic alcohols i.e. methyl and/or ethyl alcohol. The concentrated polyimide precursor solution comprises effective amounts of at least one aromatic diamine, at least one aromatic dianhydride or a lower molecular weight alkyl ester of said dianhydride, and a monofunctional endcap including monoamines, monoanhydrides and the lower alkyl esters of said monoanhydrides. These concentrated polyimide precursor solutions are particularly useful for the preparation of fibrous prepregs and composites for use in structural materials for military and civil applications.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: August 31, 2004
    Assignee: The United States of America as represented by the United States National Aeronautics and Space Administration
    Inventor: Chun-Hua Chuang
  • Patent number: 6784275
    Abstract: Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: August 31, 2004
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Eiju Ichinose, Yohzoh Yamashina, Hidenobu Ishikawa
  • Publication number: 20040166311
    Abstract: The present invention is directed to a process for electrostatically spinning fibers of polyamic acid and the fibers thus produced as well as the nonwoven webs that may be formed from the fibers. According to the processes of the present invention, polyamic acid solutions may be electrostatically spun to form fibers of very small diameter, such as, for instance, less than about 5 &mgr;m in average diameter. The fibers may be formed into a nonwoven web having very high specific surface area and large porosity. The polyamic acid may be converted to polyimide to form a polyimide nonwoven web. The polyimide nonwoven web may then be activated through a carbonization process to enhance the electrochemical properties of the web. The nonwoven webs of the invention may be utilized in a variety of electrochemical applications including, for example, electrical double layer capacitors.
    Type: Application
    Filed: February 25, 2003
    Publication date: August 26, 2004
    Applicant: Clemson University
    Inventors: Kap Seung Yang, Yeong Og Choi
  • Publication number: 20040167314
    Abstract: A polyimide-containing liquid crystal alignment treating agent having a structure of the formula (I) incorporated therein, 1
    Type: Application
    Filed: December 12, 2003
    Publication date: August 26, 2004
    Inventors: Tomohisa Yamada, Hiroyoshi Fukuro, Hideyuki Endo
  • Patent number: 6780960
    Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: August 24, 2004
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Michael C. Hausladen, Jin-O Choi
  • Publication number: 20040161541
    Abstract: The present invention relates to novel polyimides derived from 6FDA and from 3,3-dihydroxy-4,4′-diaminobiphenyl and novel polyimides derived from PMDA and from Bis-AP-AF, having alkyl, arylalkyl, heteroarylalkyl, (cycloalkyl)alkyl, fluoroalkyl or siloxane side groups.
    Type: Application
    Filed: November 25, 2003
    Publication date: August 19, 2004
    Inventors: Sandrine Lamarque, Jean-Claude Dubois, Didier Gallaire
  • Patent number: 6777525
    Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: August 17, 2004
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Publication number: 20040158030
    Abstract: The present invention relates to a novel diamine, a novel acid dianhydride, and a novel composition containing a polyimide produced from such diamine and acid dianhydride. Specifically, the present invention relates to an acid dianhydride that has a photosensitive group bonded through the mediation of an alkylene group or a fluoroalkylene group, a diamine that has a reactive group bonded through the mediation of an alkylene group or a fluoroalkylene group, and a polyimide composition that contains a novel polyimide having at least one of such acid dianhydride residue and diamine residue in a molecule thereof.
    Type: Application
    Filed: October 9, 2003
    Publication date: August 12, 2004
    Inventor: Koji Okada
  • Publication number: 20040152863
    Abstract: The present invention relates to methods for the preparation of polyesters, poly(ester amide)s and poly(ester imide)s. The materials obtained by the methods of present invention are useful as fluid separation membranes and as high performance materials.
    Type: Application
    Filed: February 2, 2004
    Publication date: August 5, 2004
    Inventors: Yong Ding, Benjamin Bikson
  • Patent number: 6770733
    Abstract: A film-formable polyimide copolymer, which comprises two kinds of tetracarboxylic acid dianhydride consisting of (A) pyromellitic acid dianhydride and (B) 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride, and (C) 6-amino-2-(p-aminophenyl)benzimidazole has a heat-resistant dimensional stability without any deterioration of mechanical properties inherent in the polyimide resin when used as a film.
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: August 3, 2004
    Assignee: Nippon Mektron, Limited
    Inventors: Min Zuo, Jenq-Tain Lin
  • Publication number: 20040127679
    Abstract: A polyimide film according to the present invention satisfies Condition (1) in which a tear propagation resistance variation CH is not more than 1.0 g, and/or Condition (2) in which a swelling coefficient CR after being dipped in an alkaline solution is not more than 20.0. By satisfying these conditions, workability of the polyimide film can be improved and working defects can be effectively prevented, thereby improving productivity of each step.
    Type: Application
    Filed: December 15, 2003
    Publication date: July 1, 2004
    Inventors: Kazuhiro Ono, Kan Fujihara, Kiyokazu Akahori
  • Patent number: 6750320
    Abstract: A process for producing a polyimide platy object includes (a) providing a solution containing a solvent and a solute (i.e., a polyimide precursor or polyimide); (b) pouring the solution onto a supporting member; (c) removing a portion of the solvent from the solution at a first temperature lower than boiling point of the solvent, thereby forming a precursory platy object thereon, the precursory platy object having a self-supporting property and a first surface in contact with the supporting member and a second surface away therefrom and a first content of the solvent at the first surface and a second content (less than the first content by 2-10 wt %) of the solvent at the second surface; and (d) detaching the precursory platy object therefrom; and (e) heating the precursory platy object at a second temperature higher than boiling point of the solvent and is lower than decomposition temperature of the polyimide.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: June 15, 2004
    Assignee: Central Glass Company, Limited
    Inventors: Yoshihiro Moroi, Hidehisa Nanai, Yuji Yamamoto, Shigeki Sakaguchi
  • Publication number: 20040102603
    Abstract: New aromatic diamine derivatives and the preparations thereof are disclosed. The inventive diamine derivatives can be added to conventional polymerization reactions of tetracarboxylic acids and diamines to form new polyamic acids. After high-temperature baking, the polyamic acids are cyclized to form polyimides. These polyimides can be used as alignment film materials for liquid crystal display cell and have good alignment property and stability, and are effective in promoting pre-tilt angle.
    Type: Application
    Filed: September 10, 2003
    Publication date: May 27, 2004
    Inventors: Wen-Chung Chu, Shih-Chieh Yeh, Chia-Wen Chang
  • Patent number: 6740371
    Abstract: An alkyldiamine having excellent polymerization reactivity, a polyimide comprising it as a constituting element, and a liquid crystal alignment film excellent in uniformity of liquid crystal alignment, are presented. Namely, the present invention relates to a diaminobenzene derivative represented by the following general formula (1) and to a polyimide obtained by reacting a diamine containing at least 1 mol % of the diaminobenzene derivative represented by the general formula (1), with at least one compound selected from a tetracarboxylic. dianhydride and its derivatives, to obtain a polyimide. precursor having a reduced viscosity of from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., concentration: 0.5 g/dl) and ring-closing it, and having a repeating unit represented by the general formula (2). Further, the present invention relates to a liquid crystal alignment film containing at least 1 mol % of the above repeating unit.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: May 25, 2004
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Kazuyoshi Hosaka, Hideyuki Nawata, Takayasu Nihira, Hideyuki Isogai, Hideyuki Endou, Hiroyoshi Fukuro
  • Publication number: 20040097695
    Abstract: A proton-conducting polymer, a preparation method thereof, a polymer membrane manufactured from the proton-conducting polymer, and a fuel cell having the polymer membrane are provided. The proton-conducting polymer contains an acid-bearable aromatic group covalently bonded to its polyimide backbone and a proton-conducting acid group attached to the aromatic group. A polymer membrane manufactured from the proton-conducting polymer has greater mechanical strength and ionic (protonic) conductivity than existing sulfonated polyimide membranes and thus improves the performance of fuel cells. In addition, the proton-conducting polymer membrane is low cost, enabling automobile fuel cells to be commercialized. Since the proton-conducting polymer membrane is less permeable to methanol, it can be used effectively for DMFCs without causing cell performance degradation.
    Type: Application
    Filed: July 2, 2003
    Publication date: May 20, 2004
    Applicant: Samsung SDI Co., Ltd.
    Inventor: Chong-Bok Yoon
  • Patent number: 6737503
    Abstract: The aromatic diamine compound of the present invention is represented by the following formula (1), and from the aromatic diamine compound a polyimide having a repeating unit represented by the following formula (4), which has low-temperature adherability, can be obtained. In the formulas (1) and (4), n is an integer of 3 to 7, each R is independently an atom or a group selected from the group consisting of a hydrogen atom, a halogen atom and a hydrocarbon group, the same or different two hetero atoms selected from nitrogen atoms and oxygen atoms bonded to each benzene ring are at the ortho- or meta-positions to each other on at least one benzene ring, and when n is 3, the hetero atoms are at the ortho- or meta-positions to each other on all the benzene rings. In the formula (4), Y is a tetravalent organic group.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: May 18, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yoichi Kodama, Minehiro Mori, Naoshi Nagai, Masaru Kawaguchi
  • Patent number: 6737502
    Abstract: A solvent-free, catalyst-free and contamination-free method of synthesis of polyimides is disclosed. The method includes polymerizing a diamine with 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) at a pressure of 0.1-760 mm Hg, preferably a reduced pressure at about 36 mm Hg, and a temperature of 90-400° C., preferably 10-240° C.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: May 18, 2004
    Assignee: Chung-Shan Institute of Science & Technology
    Inventor: Shean-Jeng Jong
  • Patent number: 6734276
    Abstract: The invention is a polyimide, random copolymer having repeating units of the formula (1): wherein R1 and R2 each represent a divalent group selected from and R1 and R2 may be the same or different; and x=0.60 to 0.80, y+z=0.40 to 0.20, and x+y+z=1.00, and a linear expansion coefficient at 100 to 200° C. is in the range of from 10 to 20 ppm/K. This is a useful polyimide that can be a polyimide circuit substrate material capable of keeping flat, neither shrinking nor expanding in its laminate.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: May 11, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Wataru Yamashita, Katsuji Watanabe, Takahisa Oguchi
  • Publication number: 20040087757
    Abstract: To provide a polyimide film having an original film width of at least 500 mm, whose isotropy in a width direction is improved to have uniform properties, which polyimide film has been apt to cause property difference in the width direction by continuous molding.
    Type: Application
    Filed: October 17, 2003
    Publication date: May 6, 2004
    Inventors: Hidehito Nishimura, Kazuhiko Ono, Masaru Nishinaka, Kiyokazu Akahori
  • Publication number: 20040063899
    Abstract: To provide a coating composition of a soluble aromatic polyimide having good heat resistance and mechanical strength. As a soluble polyimide, a compound of the formula (I) in which R's represent independently from one another H, halogen, an alkyl group or an alkoxy group, or a substituted or unsubstituted phenyl group; A is a tetravalent aromatic group or a group of the formula (II) in which B is a covalent bond, a >C(R2)2 group, a carbonyl group, 0, S, a >SO2, group, a >Si (CH3)2 group, a >Si(C2H5)2 group, a >NR3 group or a bifunctional ether group in which R2 is a hydrogen atom or —C(R4)3, R3 is H, an alkyl group or an aryl group, and R4 is H, F or Cl; Ar is an aromatic nucleus or a group of the formula (III) in which Ar and B are the same as defined above, and each p is an integer of 0 to 10; m is an integer of 1 to 10 is used. The polyimide has a weight average molecular weight of 150,000 to 1,000,000.
    Type: Application
    Filed: May 29, 2003
    Publication date: April 1, 2004
    Inventors: Mitsuaki Kobayashi, Hiroshi Ayukawa
  • Publication number: 20040063900
    Abstract: A process includes the steps of: casting or coating a polyamic acid organic solvent solution on a support and drying the polyamic acid organic solvent solution thereon, so as to form a partially cured and/or partially dried polyamic acid film; dipping the polyamic acid film in tertiary amine or a solution of tertiary amine, or coating tertiary amine or a solution of tertiary amine on the polyamic acid film; and drying the film while imidizing the polyamic acid. In another process, a chemical converting agent and a catalyst are mixed in an organic solvent solution of polyamic acid. After casting and heating the mixture on a support, a partially cured and/or partially dried polyamic acid film is detached from the support. The film contains, with respect to the remaining volatile component, not less than 50 parts of catalyst, not more than 30 parts of solvent, and not more than 20 parts of chemical converting agent and/or a chemical converting agent derived component.
    Type: Application
    Filed: August 18, 2003
    Publication date: April 1, 2004
    Inventors: Hisayasu Kaneshiro, Toshihisa Itoh, Katsunori Yabuta, Kiyokazu Akahori
  • Patent number: 6713597
    Abstract: A process for the preparation of a reactive friable polyimide powder comprises dissolving an aromatic dianhydride and an organic diamine in a high-boiling, aprotic organic solvent to form a reaction solution; heating the reaction solution under imidization conditions to form an insoluble reactive polyimide and to effect substantially complete distillation of the water of reaction out of the reaction solution; and separating the insoluble reactive polyimide from the reaction solution to form a reactive friable polyimide powder.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: March 30, 2004
    Assignee: General Electric Company
    Inventor: Martin John Lindway
  • Patent number: 6713135
    Abstract: The present invention provides novel polyimides, poly(amic acids) and poly(amide esters) thereof, and optical alignment layers derived therefrom, for inducing alignment of liquid crystals and liquid crystal displays. The novel compositions comprise side-chain polymers of the general formula I —L1—D—L2—Cf wherein D comprises 1 to 4 carbon-carbon double bonds, Cf is a monovalent C4 to C20 fluorocarbon radical and L1 and L2 are linking groups. The invention further describes liquid crystal displays and other liquid crystal devices.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: March 30, 2004
    Assignee: Elsicon, Inc.
    Inventors: Wayne M. Gibbons, Patricia A. Rose, Paul J. Shannon, Hanxing Zheng
  • Patent number: 6709714
    Abstract: The present invention relates to a method of producing high-density polyidimide (HPI) films and its production equipment. The production equipment comprises a raw material supplying means, a vacuum cavity, an energy supplier, a clad laminator, and a baked solidified polymer. The foregoing components constitutes the production equipment, using the monomer with the CONH bond or copolymer as raw materials to extract the unsaturated C═N bond by heat, electrons, light, radiation rays or ions as energy under low-pressure environment, so that the H in vacuum can extract the non-solidified HPI film from the electronic radical covalent polymers and via heat or light to rearrange the structure into a solidified HPI film. By means of the method according to the present invention, the original HPI that is not easily to produce as a film can be easily made in form of a film of HPI polymer on the clad laminator.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: March 23, 2004
    Inventor: Tien Tsai Lin
  • Patent number: 6710160
    Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): wherein the norbornane skeleton of comprises four components of and their contents satisfy the following: 1%≦2,5-[diexo]≦90%, 1%≦2,5-[exo,endo]≦90%, 1%≦2,6-[diexo]≦90%, 1% ≦2,6-[exo,endo]≦90%, provided that (2,5-[diexo])+(2,5-[exo,endo])+(2,6-[diexo])+(2,6-[exo,endo])=100%, R represents from 4 to 27 carbon atoms, and represents a tetravalent group selected from the group consisting of an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aliphatic or aromatic group which is composed of cycloaliphatic or aromatic groups mutually bonded to each other either directly or via a crosslinking member; and a polyimide
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: March 23, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Wataru Yamashita, Katsuji Watanabe, Hideaki Oikawa, Hisato Ito
  • Patent number: 6706853
    Abstract: Compound or salts thereof suitable for use as a binder for mineral fibers, for example glass or stone wool, said compound containing a carboxylic acid group and/or a &bgr;-hydroxyalkyl amide group.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: March 16, 2004
    Assignee: Rockwool International A/S
    Inventors: Dirk Armand Wim Stanssens, Thor Husemoen, Erling Lennart Hansen