Abstract: A subscriber identity model (SIM) card holder for fixing and connecting a SIM card with a circuit board is disclosed. The SIM card holder comprises a tray, a terminal rack, and electrically conductive terminals. A bottom surface of the tray defines a first card slot. A bottom surface of the first card slot defines a second card slot. The second slot penetrates the first card slot as well as a top surface of the tray. When the SIM card is contained in the first card slot and/or a micro-SIM card is contained in the second card slot, metal contacting parts of the SIM card are positioned directly under metal contacting parts of the micro-SIM card. The SIM card holder of the present invention is capable of containing the SIM card and the micro-SIM card.

Abstract: A headset includes a housing having a first wall with at least one sound hole formed thereon, a loudspeaker unit disposed in the housing and adjacent to the sound hole, a blocking component mounted in the housing and capable of slidably moving towards and backwards the first wall to form an adjunctive chamber therebetween, and an adjustive component rotatably mounted to the housing. The adjustive component is connected with the blocking component in a way of screw link in order to drive the blocking component to move towards and backwards the first wall when the adjustive component is driven to rotate.

Abstract: A connector assembly includes a socket connector, and a plug connector including a plug housing and plug terminals disposed in the plug housing and each having a contact portion projected sideward out of the plug housing. The socket connector includes a socket housing defining an insertion space, plug terminals disposed in the socket housing and contact pads embedded in two opposite inner sidewalls of the insertion space to connect with the plug terminals and exposed in the insertion space. Two end edges of the inner sidewalls of the insertion space are designed with two arc-shaped guiding surfaces. A bottom of each contact pad is bent and embedded in the inner sidewall to realize a smooth connection of the contact pad and the guiding surface so as to guide the contact portions to be inserted into the insertion space along the guiding surfaces and electrically contact with the contact pads.

Abstract: A bandoleer of article carriers includes a carrier band, and a plurality of carrier racks connected with a bottom edge of the carrier band each by means of a connecting plate and arranged at regular intervals. Each carrier rack shows a substantially inverted-V shape and has a pair of elastic arms extending downward from two ends of a bottom edge of the connecting plate and gradually inclined away from each other. Two distal ends of the elastic arms protrude oppositely to each other to form a pair of hook portions. Upper portions of two opposite side edges of the connecting plate oppositely protrude sideward to form two blocking portions. Lower portions of the two opposite side edges of the connecting plate oppositely protrude sideward and then are bent towards two opposite directions perpendicular to the plane of the connecting plate to form two lying-L shaped resisting portions.

Abstract: A vertical thin film transistor and a method for manufacturing the same and a display device including the vertical thin film transistor and a method for manufacturing the same are disclosed. The vertical thin film transistor is applied to a substrate. In the present invention, a gate layer of the vertical thin film transistor is formed to have a plurality of concentric annular structures and the adjacent concentric annular structures are linked. By the concentric annular structures of the gate electrode layer, resistance to stress and an on-state current of the vertical thin film transistor can be increased.

Abstract: A two-in-one connector includes an insulating housing, a plurality of first and second terminals, and a shielding shell. The insulating housing has a first base body and a second base body. Each first terminal has a first soldering portion projecting under the first base body to be mounted on a printed circuit board, and a first contact portion projecting beyond a top of the first base body. Each second terminal has a second soldering portion projecting under the second base body to be mounted on the printed circuit board, and a second contact portion projecting beyond a front of the second base body. The shielding shell is mounted on the first base body to define an insertion space therebetween for receiving a SIM card therein to contact with the first contact portions. A battery can be mounted on the shielding shell to contact with the second contact portions.

Abstract: A flash memory device includes a Chip-On-Board (COB) type circuit board and a number of first and second contacts electrically connected to the circuit board. Each first contact includes a stiff first contact portion formed on an upper surface of the circuit board. Each second contact includes a cantilevered planar second contact portion extending along the front-to-rear direction. When the flash memory device is inserted into a USB 3.0 receptacle connector, the first and the second contact portions jointly electrically connect with the USB 3.0 receptacle connector. The planar second contact portions provide larger contacting area for mating with the corresponding contacts of the USB 3.0 receptacle connector.

Abstract: An organic light emitting diode device is disclosed. The organic light emitting diode device includes a substrate, a first electrode layer, a first insulating layer, at least one controlling electrode layer, a second insulating layer, at least one light emitting layer, a third insulating layer, and a second electrode layer. The first electrode layer is formed on the substrate and includes a first area and a second area adjacent to the first area. The first insulating layer, the controlling electrode layer, and the second insulating layer are sequentially formed on the first area. The light emitting layer is formed on the second area. The second electrode layer is formed on the light emitting layer. In the present invention, the controlling electrode layer controls a recombination region of electron-hole pair so as to achieve an objective of adjusting a color temperature.