Abstract: An apparatus for generating a seismic signal in a wellbore includes an elongated housing configured to be disposed in the wellbore; a piston slidably disposed in an internal bore in the elongated housing; a strike plate fixed on the elongated housing proximate one end of the internal bore; and an energizing mechanism configured to move the piston to hit the strike plate. A downhole system for seismic survey of a formation penetrated by a wellbore includes at least one seismic receiver; a seismic source; and at least one inflatable packer configured to separate the seismic source and the at least one seismic receiver in different compartments in the wellbore when inflated.

Abstract: An electromagnetic logging tool includes a support configured for disposal in a well; at least one antenna mounted on the support; and a plurality of coils mounted on the support proximate the at least one antenna, wherein the plurality of the coils are configured for selective connection with the at least one antenna. A method for balancing an induction array on an electromagnetic logging tool includes measuring a mutual coupling between a transmitter and a receiver on the electromagnetic logging tool; and selectively connecting a subset of a plurality of coils on the electromagnetic logging tool to the transmitter or the receiver based on the measured mutual coupling.

Abstract: Conventional formation evaluation with dual inflatable packers includes the steps of pressurizing the packers so as to isolate an annular portion of the borehole wall, collecting one or more samples of formation fluid via the isolated portion of the borehole wall, and depressurizing the packers so as to permit movement of the mandrel within the borehole. A sampling method and apparatus that utilize one or more of the following to advantage is provided: restricting deformation of the packers during inflation using an annular bracing assembly; actively retracting the packers using ambient borehole pressure; and substantially centralizing the mandrel intermediate the packers so as to resist buckling of the mandrel.

Abstract: A method is described for treating a subterranean formation with a low viscosity fluid system that contains a viscoelastic surfactant at a concentration too low to viscosify the fluid, but that is concentrated in the formation so that the fluid system gels. The fluid optionally contains a formation-dissolving agent. The fluid is used in matrix acidizing, acid fracturing, and diversion.

Abstract: A flexible circuit having a polyimide substrate containing at least one chemically etched feature, wherein such etched feature has sidewalls having a predetermined slope angle. It is possible to create etched features having predetermined slopes of from about 10 to about 70 degrees. Preferably, the flexible circuit was formed from a polyamic acid containing multiple ester groups in its main polymer chain.

Abstract: A printed circuit assembly includes an interposer circuit having a flexible dielectric core with an array of contact members attached thereto. Each contact member includes a first interconnect surface accessible from a first side of the dielectric core and a second interconnect surface accessible from a second side of the dielectric core. A conductive element is attached to the first interconnect surface of each contact member. A flip chip semiconductor die includes an array of bond pads on a mounting surface thereof. Each bonding pad of the semiconductor die is substantially aligned with a respective one of the first interconnect surfaces of the interposer circuit. Each bonding pad is electrically connected to the corresponding conductive element. The electronic device defines a perimeter edge that circumscribes the array of bonding pads and the array of contact members of the interposer circuit. A solder ball is attached to the second interconnect surface of each contact member.

Abstract: An electronic circuit device comprising at least one substrate having a photoimageable covercoat, comprising at least 95 weight percent of at least one epoxy-modified aromatic vinyl-conjugated diene block copolymer and a catalyst comprising an onium salt selected from a triarylsulfonium salt and a diaryliodonium salt, wherein the covercoat is formed by solvent coating or extrusion and then heat laminated onto at least a portion of the substrate.

Abstract: A mechanical fastener is provided which is lightweight, thin, flexible, and strong, and whose holding power is as great as, or greater than, the holding power of conventional hook and loop type fasteners.

Abstract: A disk drive suspension assembly including an elongated polymeric base member having a plurality of traces formed directly on a first surface thereof and a reference voltage layer formed on a second surface thereof. A support member is formed directly on at least a portion of the reference voltage layer. The plurality of traces overlay at least a portion of the reference voltage layer. The reference voltage layer is formed from a first electrically conductive material and the support member is formed from a second electrically conductive material. The first electrically conductive material providing substantially greater electrical conductivity and substantially less tensile strength than the second electrically conductive material. The support member includes a head gimbal portion having a first thickness and a load beam portion having a second thickness. The second thickness is substantially greater than the first thickness.

Abstract: A method of fabricating a package for a micro-electromechanical systems (MEMS) device. A flex circuit interconnect subassembly for the package is made by placing a flex circuit on a pad insert, attaching a carrier insert to the pad insert to deflect the lead portions of the flex circuit, and applying a cover insert to the pad insert, after the attachment of the carrier insert, to re-deflect the lead portions of the flex circuit toward the device bond sites. The flex circuit interconnect subassembly may be combined with an electronic device die/carrier subassembly to form a completed electronic device package. The flex circuit interconnect subassembly and the die/carrier subassembly are joined using mechanical interlocking layers. The invention is particularly suited for making such an electronic device die/carrier subassembly which has a MEMS die permanently affixed to a carrier.

Abstract: A flexible circuit incorporating electrostatic discharge (ESD) limiting features and being suitable for use in the fabrication of hard disk drives for computer applications. Conductive polymer strips are implemented to enhance the static dissipative characteristics of the flexible circuit and to protect magnetorestistive (MR) heads of a hard disk drive (HDD) from damage during the manufacture of the head gimbal assembly (HGA) of the HDD.

Abstract: A composition useful as a primer layer for a vinyl backed adhesive tape comprising at least one epoxidized conjugated diene polymer having a minimum concentration of epoxidized units of at least about 3% provides increased anchorage of an adhesive to the plasticized vinyl backing.

Abstract: An electronic circuit device comprises a resin composition including 90 to 100 weight percent of a curable epoxy-modified aromatic vinyl-conjugated diene block copolymer, optionally up to 10 weight percent of an epoxy resin, and an effective amount of an epoxy curative, the weight percent of the copolymer and epoxy resin being based on the weight of the epoxy bearing material exclusive of curative. The resin composition can be used as an electronic adhesive, covercoat, or encapsulant. The electronic circuit device exhibits superior heat and moisture insensitivity, including the absence of voiding and delamination of the cured resin compostion from its substrate under conditions of 85° C. and 85% relative humidity for 168 hours followed by a temperature of 220° C. for 10 to 40 seconds.

Abstract: A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.

Abstract: A flexible circuit system includes a flexible dielectric layer having a first conductive layer on a first side and a second conductive layer on a second side. A non-conductive, closed end passage extends through the dielectric layer from the first side to the second side. The first conductive layer is adjacent an open end of the passage at the first side, and the second conductive layer forms the closed end of the passage at the second side. A stiffener member is attached to the second conductive layer. A solder ball is connected to provide a conductive path between the first conductive layer and the second conductive layer.

Abstract: A method for simultaneously reading a serial number and/or other information from multiple colliding RF signals from RF identification tags requires minimal additional logic in the tag's processor and provides for a powerful and rapid sorting and identification scheme. This technique employs a primary communication channel and multiple secondary channels. A locator or reader unit interrogates the tags, which respond with an RF signal. Upon receiving multiple signals, the locator or reader unit commands the RFID tags and requires them to transmit another response, which is transmitted in one of the secondary channels based on a portion of their unique serial identification number, thereby forcing the tags to sort in the secondary channels. These secondary channels are assigned using a portion of the unique serial identification numbers for the tags. The reader then detects an acknowledgment in the occupied secondary channels and commands a tag in a particular channel to move to the primary channel.

Abstract: An insulation protection film useful in a comprise a two-phase thermoplastic elastomer blend comprising a continuous phase and a particulate phase, and a flame retardant wherein the film substrate has a storage modulus of at least about 107 Pascals up to about 150° C.

Abstract: A semi-interpenetrating polymer network including at least one epoxy monomer, at least one olefin monomer forming a co-monomer mixture with the epoxy monomer and a catalytic amount of at least one palladium compound uniformly distributed in said co-monomer mixture to promote formation of the semi-interpenetrating polymer network under ambient conditions.

Abstract: A test socket for integrated circuits includes a socket body for making electrical connection between leads or pads of an integrated circuit and a load board. A lid assembly is pivotally connected to the socket body by a hinge and is rotatable between a closed position and an open position. The lid assembly is removable from the socket body without tools. The lid assembly includes a frame member secured to the hinge, and a pressure plate and actuation member contained within the frame member. The bottom surface of the pressure plate includes a plurality of channels extending from an open central portion to the circumference of the pressure plate for permitting thermal air flow over the integrated circuit. A preferred embodiment of the lid assembly provides a visual indication to the user when an integrated circuit is undergoing testing.

Abstract: A communications cable terminal block switching mechanism employs a terminal block housing with a number of chambers and a number of openings for service wires to be inserted into the chambers. A cable stub enters the terminal block and contains feed-in pairs and feed-out pairs. Based on the condition of the switching mechanism, a wire pair may be expressed through the terminal block unterminated, or, a wire pair may be terminated to a service wire at the block. Specifically, a number of sets of electrical contact elements, corresponding to the number of openings, is provided, and one of each of the sets of contact elements is configured in one of each of the chambers.