Patents Represented by Attorney Dicke, Billig & Czaja, PLLC
  • Patent number: 8350382
    Abstract: A semiconductor package includes a substrate, at least one chip including a first side and a backside opposite of the first side, the first side electrically coupled to the substrate, a conductive layer coupled to the backside of the at least one chip, and at least one electronic component coupled to the conductive layer and in electrical communication with the substrate.
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: January 8, 2013
    Assignee: Infineon Technologies AG
    Inventors: Edward Fürgut, Joachim Mahler, Michael Bauer
  • Patent number: 8350403
    Abstract: A power generation system (20) including an airborne electricity generator (30), a tether assembly (40) configured to carry electricity from the generator to land, the tether assembly having a first end portion (42) coupled to the generator, and a winch assembly (50) configured to reel the tether assembly onto a drum (52), wherein the winch assembly is configured to apply a reel tension to the tether assembly reeled onto the drum that is lower than a tension in the first end portion of the tether assembly.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: January 8, 2013
    Assignee: Baseload Energy, Inc.
    Inventor: Joseph A. Carroll
  • Patent number: 8348950
    Abstract: An undercutting system for preparing a region between ilium and sacrum for sacroiliac fusion. The undercutting system includes an insertion apparatus and a cutting assembly. The cutting assembly is operably attached to the insertion apparatus. The cutting assembly is movable with respect to the insertion apparatus between a retracted configuration and an extended configuration.
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: January 8, 2013
    Assignee: Zyga Technology, Inc.
    Inventors: Robert L. Assell, Jeremy Thomas Carr, Eugene Arthur Dickhudt, Thomas Godfrey Berg, Brian P. Beaubien
  • Patent number: 8351496
    Abstract: An integrated circuit having a filter apparatus for filtering a first symbol sequence is disclosed. The first symbol sequence has a predetermined symbol duration. The apparatus includes at least one delay device which is clocked in accordance with a clock, and configured to delay the first symbol sequence by a delay time. A relationship between the delay time of the delay device and a clock duration of the clocked delay device has a predetermined value which is not equal to the one.
    Type: Grant
    Filed: June 8, 2007
    Date of Patent: January 8, 2013
    Assignee: Qimonda AG
    Inventors: Daniel Kehrer, Franz Weiss
  • Patent number: 8348221
    Abstract: A formwork system is provided for constructing a structural concrete floor, said formwork systems constitutes a main frame (100) forming a concrete slab structure, a plurality of side frames (110) each movably mounted at the edge of the main frame (100) for forming a concrete beam formwork structure, and a plurality of retainers mounted at the edge of the main frame (100) for supporting below the side frames (110) and jacking means for raising and lowering the formwork system. The side frame (110) being movable enables the formwork system to be effectively detached from a casted structural floor having concrete beams extended therefrom. The formwork system is also extricable on site after fabrication of the concrete ceiling slab floor and concrete beam.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: January 8, 2013
    Inventors: Tang Hang Seng, Tang Hang Tow, Tang Hang Chyan
  • Patent number: 8349646
    Abstract: A semiconductor wafer for semiconductor components and to a method for its production is disclosed. In one embodiment, the semiconductor wafer includes a front side with an adjoining near-surface active zone as basic material for semiconductor component structures. The rear side of the semiconductor wafer is adjoined by a getter zone for gettering impurity atoms in the semiconductor wafer. The getter zone contains oxygen precipitates. In the near-surface active zone, atoms of doping material are located on lattice vacancies. The atoms of doping material have a higher diffusion coefficient that the oxygen atoms.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: January 8, 2013
    Assignee: Infineon Technologies Austria AG
    Inventor: Hans-Joachim Schulze
  • Patent number: 8343811
    Abstract: A module including a carrier and a semiconductor chip applied to the carrier. An external contact element is provided having a first portion and a second portion extending perpendicular to the first portion, wherein a thickness of the second portion is smaller than a thickness of the carrier.
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: January 1, 2013
    Assignee: Infineon Technologies AG
    Inventor: Ralf Otremba
  • Patent number: 8343189
    Abstract: A device for treating a facet joint of a patient, the facet joint including opposing, superior and inferior faces. The device includes a superior component and an inferior component each defining an anchoring surface configured to engage bone at a face of the facet joint and an articulating surface. The device is configured for percutaneous insertion into the facet joint, with the articulating surfaces abutting one another in a sliding interface. One or more instruments are included with the device as part of a percutaneous implantation kit, such as a dilator, a guide wire, and a sheath.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: January 1, 2013
    Assignee: Zyga Technology, Inc.
    Inventors: Robert L. Assell, Eugene A. Dickhudt
  • Patent number: 8343138
    Abstract: A subdural evacuation port aspiration device including a subdural evacuation portion and a port aspiration portion. The subdural evacuation portion includes a rigid tubular portion having a central axis, a threaded exterior surface, and a pair of wings extending outwardly in substantially opposite directions from the tubular portion. The port aspiration portion includes a first segment and a second segment extending in separate directions from the subdural evacuation portion, the first segment configured to receive an aspiration device and the second segment configured to connect to a negative pressure source. The subdural evacuation portion and the port aspiration portion are uniformly formed as a single rigid unit.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: January 1, 2013
    Assignee: Medtronic XOMED, Inc.
    Inventor: Wilson T. Asfora
  • Patent number: 8343834
    Abstract: A semiconductor device with a charge carrier compensation structure in a semiconductor body and to a method for its production. The semiconductor body includes drift zones of a first conduction type and charge compensation zones of a second conduction type complementing the first conduction type. The drift zones include a semiconductor material applied in epitaxial growth zones, wherein the epitaxial growth zones include an epitaxially grown semiconductor material which is non-doped to lightly doped. Towards the substrate, the epitaxial growth zones are provided with a first conduction type incorporated by ion implantation over the entire surface and with selectively introduced doping material zones of a second, complementary conduction type. Towards the front side, the epitaxial growth zones are provided with a second, complementary conduction type incorporated by ion implantation over the entire surface and with selectively introduced doping material zones of the first conduction type.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: January 1, 2013
    Assignee: Infineon Technologies Austria AG
    Inventors: Armin Willmeroth, Michael Rueb
  • Patent number: 8344764
    Abstract: A circuit arrangement comprising a first semiconductor switching element, which has a load path and a drive terminal. A voltage supply circuit, is provided including an inductance connected in series with the load path of the first semiconductor switching element, and a capacitive charge storage arrangement, which is connected in parallel with the inductance and which has a first and a second output terminal for providing a supply voltage.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: January 1, 2013
    Assignee: Infineon Technologies AG
    Inventors: Reinhold Bayerer, Peter Kanschat, Uwe Jansen
  • Patent number: 8344640
    Abstract: A method for operating a fluorescent lamp which is connected to a series resonant circuit with a resonant circuit inductance and a resonant circuit capacitance. The method includes applying an excitation AC voltage at an excitation frequency to the series resonant circuit using a half bridge circuit, which has an output to which the series resonant circuit is coupled, and which has a first and a second switch which are alternately switched on and off on the basis of a frequency signal. A current flowing through the resonant circuit is monitored for the presence of a critical operating state. The switched-on times of the first and second switches are shortened in comparison to switched-on times which are predetermined by the frequency signal, upon detection of a critical operating state.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: January 1, 2013
    Assignee: Infineon Technologies Austria AG
    Inventor: Martin Feldtkeller
  • Patent number: 8344415
    Abstract: A semiconductor component is disclosed. One embodiment provides a semiconductor body having a cell region with at least one zone of a first conduction type and at least one zone of a second conduction type in a rear side. A drift zone of the first conduction type in the cell region is provided. The drift zone contains at least one region through which charge carriers flow in an operating mode of the semiconductor component in one polarity and charge carriers do not flow in an operating mode of the semiconductor component in an opposite polarity.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: January 1, 2013
    Assignee: Infineon Technologies Austria AG
    Inventors: Holger Ruething, Frank Pfirsch, Armin Willmeroth, Frank Hille, Hans-Joachim Schulze
  • Patent number: 8340785
    Abstract: An expandable electrode cuff of an implantable stimulation system that includes a base member, a first flange member extending from a proximal end along a first side wall of the base member to a first distal end, and a second flange member extending from a proximal end along a second side wall of the base member to a second distal end. The first flange member extends over both a top wall of the base member and the second flange member, and the second flange member extends over the top wall to form a lumen. The electrode cuff is capable of being advanced between a first position corresponding to both flange members extending over the top wall, a second position corresponding to the first flange member not extending over the top wall and the second flange member extending over the top wall, and a third position corresponding to both of the flange members not extending over the top wall.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: December 25, 2012
    Assignee: Medtronic, Inc.
    Inventors: Eric H. Bonde, Roy L. Testerman, Timothy P. Herbert, Mark A. Christopherson, Jesse D. Geroy
  • Patent number: 8338936
    Abstract: A semiconductor device and manufacturing method. One embodiment provides a semiconductor chip. An encapsulating material covers the semiconductor chip. A metal layer is over the semiconductor chip and the encapsulating material. At least one of a voltage generating unit and a display unit are rigidly attached to at least one of the encapsulating material and the metal layer.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: December 25, 2012
    Assignee: Infineon Technologies AG
    Inventors: Klaus Pressel, Gottfried Beer
  • Patent number: 8339248
    Abstract: A body-mounted electronic audio device playing prerecorded audio statements automatically issued as directed by wirelessly connected stationary computer decision-making using input from wearers and devices within the workplace environment to support to improve operational efficiency and effectiveness especially those in fast food stores.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: December 25, 2012
    Inventor: David W. Carroll
  • Patent number: 8336795
    Abstract: A silage pile defacer includes a frame having a rear end and a front end. A transverse beam carrying a plurality of downwardly projecting tines is coupled to the front end of the frame. A quick connect coupler is mounted to the rear end of the frame for mounting the defacer to a quick hitch coupler on the lift arm mechanism of a tractor. The tines are oriented at an angle relative to the frame, allowing the tines to be generally vertically oriented relative to the ground when the defacer is elevated above a silage pile. The tines of the defacer are configured to contact the silage pile and to skive off a face layer of the silage pile when the defacer is lowered to the ground by the tractor lift arm mechanism.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: December 25, 2012
    Assignee: Riverview, LLP
    Inventor: Gary Fehr
  • Patent number: 8336553
    Abstract: Systems and methods for detecting and treating an obstructive sleep apnea event are disclosed herein. The systems and methods may use an electrical output generating ionic polymer metal composite sensor attached to a region in an airway passage in an oral cavity. The electrical output may be wirelessly transmitted as a signal for indication of an obstructive sleep apnea event. The signal may be further analyzed by a positive airway pressure system for treatment of the obstructive sleep apnea event.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: December 25, 2012
    Assignee: Medtronic Xomed, Inc.
    Inventors: Nikhil D. Bhat, Anant V. Hegde, Charisse M. Yung, George Y. Choi
  • Patent number: 8334583
    Abstract: A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages.
    Type: Grant
    Filed: July 20, 2005
    Date of Patent: December 18, 2012
    Assignee: Infineon Technologies AG
    Inventors: Jeffrey Khai Huat Low, Kean Cheong Lee
  • Patent number: D674008
    Type: Grant
    Filed: December 24, 2010
    Date of Patent: January 8, 2013
    Assignee: Engage Technologies Corporation
    Inventors: Cris R. Miller, Yanhua Li