Patents Represented by Attorney Dicke, Billig & Czaja, PLLC
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Patent number: 8351496Abstract: An integrated circuit having a filter apparatus for filtering a first symbol sequence is disclosed. The first symbol sequence has a predetermined symbol duration. The apparatus includes at least one delay device which is clocked in accordance with a clock, and configured to delay the first symbol sequence by a delay time. A relationship between the delay time of the delay device and a clock duration of the clocked delay device has a predetermined value which is not equal to the one.Type: GrantFiled: June 8, 2007Date of Patent: January 8, 2013Assignee: Qimonda AGInventors: Daniel Kehrer, Franz Weiss
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Patent number: 8348950Abstract: An undercutting system for preparing a region between ilium and sacrum for sacroiliac fusion. The undercutting system includes an insertion apparatus and a cutting assembly. The cutting assembly is operably attached to the insertion apparatus. The cutting assembly is movable with respect to the insertion apparatus between a retracted configuration and an extended configuration.Type: GrantFiled: November 3, 2010Date of Patent: January 8, 2013Assignee: Zyga Technology, Inc.Inventors: Robert L. Assell, Jeremy Thomas Carr, Eugene Arthur Dickhudt, Thomas Godfrey Berg, Brian P. Beaubien
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Patent number: 8350382Abstract: A semiconductor package includes a substrate, at least one chip including a first side and a backside opposite of the first side, the first side electrically coupled to the substrate, a conductive layer coupled to the backside of the at least one chip, and at least one electronic component coupled to the conductive layer and in electrical communication with the substrate.Type: GrantFiled: September 21, 2007Date of Patent: January 8, 2013Assignee: Infineon Technologies AGInventors: Edward Fürgut, Joachim Mahler, Michael Bauer
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Patent number: 8349646Abstract: A semiconductor wafer for semiconductor components and to a method for its production is disclosed. In one embodiment, the semiconductor wafer includes a front side with an adjoining near-surface active zone as basic material for semiconductor component structures. The rear side of the semiconductor wafer is adjoined by a getter zone for gettering impurity atoms in the semiconductor wafer. The getter zone contains oxygen precipitates. In the near-surface active zone, atoms of doping material are located on lattice vacancies. The atoms of doping material have a higher diffusion coefficient that the oxygen atoms.Type: GrantFiled: November 18, 2010Date of Patent: January 8, 2013Assignee: Infineon Technologies Austria AGInventor: Hans-Joachim Schulze
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Patent number: 8348221Abstract: A formwork system is provided for constructing a structural concrete floor, said formwork systems constitutes a main frame (100) forming a concrete slab structure, a plurality of side frames (110) each movably mounted at the edge of the main frame (100) for forming a concrete beam formwork structure, and a plurality of retainers mounted at the edge of the main frame (100) for supporting below the side frames (110) and jacking means for raising and lowering the formwork system. The side frame (110) being movable enables the formwork system to be effectively detached from a casted structural floor having concrete beams extended therefrom. The formwork system is also extricable on site after fabrication of the concrete ceiling slab floor and concrete beam.Type: GrantFiled: February 14, 2008Date of Patent: January 8, 2013Inventors: Tang Hang Seng, Tang Hang Tow, Tang Hang Chyan
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Patent number: 8350403Abstract: A power generation system (20) including an airborne electricity generator (30), a tether assembly (40) configured to carry electricity from the generator to land, the tether assembly having a first end portion (42) coupled to the generator, and a winch assembly (50) configured to reel the tether assembly onto a drum (52), wherein the winch assembly is configured to apply a reel tension to the tether assembly reeled onto the drum that is lower than a tension in the first end portion of the tether assembly.Type: GrantFiled: July 17, 2009Date of Patent: January 8, 2013Assignee: Baseload Energy, Inc.Inventor: Joseph A. Carroll
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Patent number: 8344640Abstract: A method for operating a fluorescent lamp which is connected to a series resonant circuit with a resonant circuit inductance and a resonant circuit capacitance. The method includes applying an excitation AC voltage at an excitation frequency to the series resonant circuit using a half bridge circuit, which has an output to which the series resonant circuit is coupled, and which has a first and a second switch which are alternately switched on and off on the basis of a frequency signal. A current flowing through the resonant circuit is monitored for the presence of a critical operating state. The switched-on times of the first and second switches are shortened in comparison to switched-on times which are predetermined by the frequency signal, upon detection of a critical operating state.Type: GrantFiled: May 13, 2011Date of Patent: January 1, 2013Assignee: Infineon Technologies Austria AGInventor: Martin Feldtkeller
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Patent number: 8343138Abstract: A subdural evacuation port aspiration device including a subdural evacuation portion and a port aspiration portion. The subdural evacuation portion includes a rigid tubular portion having a central axis, a threaded exterior surface, and a pair of wings extending outwardly in substantially opposite directions from the tubular portion. The port aspiration portion includes a first segment and a second segment extending in separate directions from the subdural evacuation portion, the first segment configured to receive an aspiration device and the second segment configured to connect to a negative pressure source. The subdural evacuation portion and the port aspiration portion are uniformly formed as a single rigid unit.Type: GrantFiled: September 15, 2011Date of Patent: January 1, 2013Assignee: Medtronic XOMED, Inc.Inventor: Wilson T. Asfora
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Patent number: 8344764Abstract: A circuit arrangement comprising a first semiconductor switching element, which has a load path and a drive terminal. A voltage supply circuit, is provided including an inductance connected in series with the load path of the first semiconductor switching element, and a capacitive charge storage arrangement, which is connected in parallel with the inductance and which has a first and a second output terminal for providing a supply voltage.Type: GrantFiled: January 26, 2012Date of Patent: January 1, 2013Assignee: Infineon Technologies AGInventors: Reinhold Bayerer, Peter Kanschat, Uwe Jansen
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Patent number: 8344415Abstract: A semiconductor component is disclosed. One embodiment provides a semiconductor body having a cell region with at least one zone of a first conduction type and at least one zone of a second conduction type in a rear side. A drift zone of the first conduction type in the cell region is provided. The drift zone contains at least one region through which charge carriers flow in an operating mode of the semiconductor component in one polarity and charge carriers do not flow in an operating mode of the semiconductor component in an opposite polarity.Type: GrantFiled: October 25, 2007Date of Patent: January 1, 2013Assignee: Infineon Technologies Austria AGInventors: Holger Ruething, Frank Pfirsch, Armin Willmeroth, Frank Hille, Hans-Joachim Schulze
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Patent number: 8343189Abstract: A device for treating a facet joint of a patient, the facet joint including opposing, superior and inferior faces. The device includes a superior component and an inferior component each defining an anchoring surface configured to engage bone at a face of the facet joint and an articulating surface. The device is configured for percutaneous insertion into the facet joint, with the articulating surfaces abutting one another in a sliding interface. One or more instruments are included with the device as part of a percutaneous implantation kit, such as a dilator, a guide wire, and a sheath.Type: GrantFiled: September 25, 2008Date of Patent: January 1, 2013Assignee: Zyga Technology, Inc.Inventors: Robert L. Assell, Eugene A. Dickhudt
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Patent number: 8343811Abstract: A module including a carrier and a semiconductor chip applied to the carrier. An external contact element is provided having a first portion and a second portion extending perpendicular to the first portion, wherein a thickness of the second portion is smaller than a thickness of the carrier.Type: GrantFiled: January 4, 2011Date of Patent: January 1, 2013Assignee: Infineon Technologies AGInventor: Ralf Otremba
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Patent number: 8343834Abstract: A semiconductor device with a charge carrier compensation structure in a semiconductor body and to a method for its production. The semiconductor body includes drift zones of a first conduction type and charge compensation zones of a second conduction type complementing the first conduction type. The drift zones include a semiconductor material applied in epitaxial growth zones, wherein the epitaxial growth zones include an epitaxially grown semiconductor material which is non-doped to lightly doped. Towards the substrate, the epitaxial growth zones are provided with a first conduction type incorporated by ion implantation over the entire surface and with selectively introduced doping material zones of a second, complementary conduction type. Towards the front side, the epitaxial growth zones are provided with a second, complementary conduction type incorporated by ion implantation over the entire surface and with selectively introduced doping material zones of the first conduction type.Type: GrantFiled: December 16, 2011Date of Patent: January 1, 2013Assignee: Infineon Technologies Austria AGInventors: Armin Willmeroth, Michael Rueb
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Patent number: 8338936Abstract: A semiconductor device and manufacturing method. One embodiment provides a semiconductor chip. An encapsulating material covers the semiconductor chip. A metal layer is over the semiconductor chip and the encapsulating material. At least one of a voltage generating unit and a display unit are rigidly attached to at least one of the encapsulating material and the metal layer.Type: GrantFiled: July 24, 2008Date of Patent: December 25, 2012Assignee: Infineon Technologies AGInventors: Klaus Pressel, Gottfried Beer
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Patent number: 8340785Abstract: An expandable electrode cuff of an implantable stimulation system that includes a base member, a first flange member extending from a proximal end along a first side wall of the base member to a first distal end, and a second flange member extending from a proximal end along a second side wall of the base member to a second distal end. The first flange member extends over both a top wall of the base member and the second flange member, and the second flange member extends over the top wall to form a lumen. The electrode cuff is capable of being advanced between a first position corresponding to both flange members extending over the top wall, a second position corresponding to the first flange member not extending over the top wall and the second flange member extending over the top wall, and a third position corresponding to both of the flange members not extending over the top wall.Type: GrantFiled: May 2, 2008Date of Patent: December 25, 2012Assignee: Medtronic, Inc.Inventors: Eric H. Bonde, Roy L. Testerman, Timothy P. Herbert, Mark A. Christopherson, Jesse D. Geroy
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Patent number: 8339248Abstract: A body-mounted electronic audio device playing prerecorded audio statements automatically issued as directed by wirelessly connected stationary computer decision-making using input from wearers and devices within the workplace environment to support to improve operational efficiency and effectiveness especially those in fast food stores.Type: GrantFiled: April 28, 2008Date of Patent: December 25, 2012Inventor: David W. Carroll
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Patent number: 8336795Abstract: A silage pile defacer includes a frame having a rear end and a front end. A transverse beam carrying a plurality of downwardly projecting tines is coupled to the front end of the frame. A quick connect coupler is mounted to the rear end of the frame for mounting the defacer to a quick hitch coupler on the lift arm mechanism of a tractor. The tines are oriented at an angle relative to the frame, allowing the tines to be generally vertically oriented relative to the ground when the defacer is elevated above a silage pile. The tines of the defacer are configured to contact the silage pile and to skive off a face layer of the silage pile when the defacer is lowered to the ground by the tractor lift arm mechanism.Type: GrantFiled: September 6, 2011Date of Patent: December 25, 2012Assignee: Riverview, LLPInventor: Gary Fehr
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Patent number: 8336553Abstract: Systems and methods for detecting and treating an obstructive sleep apnea event are disclosed herein. The systems and methods may use an electrical output generating ionic polymer metal composite sensor attached to a region in an airway passage in an oral cavity. The electrical output may be wirelessly transmitted as a signal for indication of an obstructive sleep apnea event. The signal may be further analyzed by a positive airway pressure system for treatment of the obstructive sleep apnea event.Type: GrantFiled: September 22, 2008Date of Patent: December 25, 2012Assignee: Medtronic Xomed, Inc.Inventors: Nikhil D. Bhat, Anant V. Hegde, Charisse M. Yung, George Y. Choi
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Patent number: 8334202Abstract: A method for fabricating a device includes providing a substrate including at least one contact and applying a dielectric layer over the substrate. The method includes applying a first seed layer over the dielectric layer, applying an inert layer over the seed layer, and structuring the inert layer, the first seed layer, and the dielectric layer to expose at least a portion of the contact. The method includes applying a second seed layer over exposed portions of the structured dielectric layer and the contact such that the second seed layer makes electrical contact with the structured first seed layer. The method includes electroplating a metal on the second seed layer.Type: GrantFiled: November 3, 2009Date of Patent: December 18, 2012Assignee: Infineon Technologies AGInventors: Jens Pohl, Hans-Joachim Barth, Gottfried Beer, Rainer Steiner, Werner Robl, Mathias Vaupel
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Patent number: D674008Type: GrantFiled: December 24, 2010Date of Patent: January 8, 2013Assignee: Engage Technologies CorporationInventors: Cris R. Miller, Yanhua Li