Abstract: Tungsten anode targets are joined to graphite substrates by a brazing method employing a controlled atmosphere and a suitable braze material such as platinum and an alloy of platinum and chromium.
Abstract: Ceramic mold and core materials of magnesia doped alumina are removed from castings by a solution of either KOH or NaOH at elevated temperatures and pressures in an autoclave.
Abstract: An array of columnar structures are provided in a body of semiconductor material. The material of each columnar structure is recrystallized material of the body having solid solubility of dopant metal therein. Means are provided for connecting the columnar structures into two series electrical circuit arrangements to function respectively as the primary and secondary windings of a deep diode solid state transformer.
Abstract: A semiconductor body holder includes a rigid refractory base having a plurality of flexible refractory arms extending from one end thereof. Each arm includes a finger extending therefrom, the fingers in cooperation with the arms, serving to resiliently hold a body of semiconductor material during processing. The holder of the present invention is particularly useful in the practice of temperature gradient zone melting on the semiconductor body.
Abstract: An array of vapor deposited metal wires is migrated by TGZM through a body of semiconductor material to divide the body into a plurality of individual regions electrically isolated from each other. The preferred crystal orientations of the surface on which migration is initiated, directions of wire alignment on that surface, wire sizes and preferred axes of migration are disclosed herein.
Abstract: A process for forming aluminum doped silicon semiconductor material for large area semiconductor devices embodies thermal gradient zone melting processing and migration of a molten zone of a predetermined thickness to assure stability of the molten zone while migrating.
Abstract: An improved high dielectric constant ink useful in making thick film capacitors is disclosed in which a dielectric material is combined with a glass bonding agent having at least one electropositive element therein which is common with the powdered, high dielectric material which is one selected from the group consisting of chemically pure barium titanate and chemically pure barium titanate modified with from about 0.125% to about 5.0% by weight of a metal oxide additive. The glass bonding agent is an alkali-free binder comprising from 3 percent to 7 percent by total weight of the dielectric and binder materials.
Abstract: A semiconductor switch is a lamellar body of semiconductor material having two major opposed surfaces and at least one group of four regions of alternate type conductivity. At least three of the four regions have recrystallized semiconductor material having a solid solubility of metal therein to impart the type conductivity thereto. Each of the first and third regions have the same type conductivity but different levels of impurity concentration. Each of the second and fourth regions have the same type conductivity but different levels of impurity concentration.
Abstract: An improved method of initiating the moving of a molten zone of a metal-rich semiconductor material through a solid body of the same semiconductor material to form a planar region embodies the alloying of the metal to the semiconductor material of the surface of the body in contact therewith. The alloying process enables one to migrate two or more intersecting "wires" simultaneously, as well as three "wires" intersecting at a common point of origin, through the body.
Type:
Grant
Filed:
March 9, 1976
Date of Patent:
August 9, 1977
Assignee:
General Electric Company
Inventors:
Mike F. Chang, Harvey E. Cline, Thomas R. Anthony
Abstract: A deep diode zener has a lamellar structured body of single crystal semiconductor material. The lamellar structure is produced by a thermal gradient zone melting process embodying the thermal migration of metal "wires" through the body to form a region of conductivity opposite to that of the body. The material of the region is recrystallized semiconductor material of the body with solid solubility of the metal "wire" to impart the desired type conductivity and resistivity to the region.
Abstract: A multilayer passivation-encapsulation for a semiconductor element is provided by a suitable polymer layer disposed on the device and overcoated with a glass layer for hermeticity.
Abstract: The practice of thermal gradient zone melting in processing a body of semiconductor material is enhanced by providing a radiation coating on selected surface areas of the body.
Abstract: Optical coatings are employed on selected surface areas of a semiconductor element to enhance processing of semiconductor materials by temperature gradient zone melting.
Abstract: A varistor has a lamellar structured body of semiconductor material. The lamellar structure is produced by migrating "wires" of a metal by a temperature gradient zone melting process through the solid material of the body to form a plurality of alternate regions of opposite type conductivity. A P-N junction is formed at the contiguous surfaces of the material of each pair of regions of opposite type conductivity. The material of the regions formed by the migrated wires is recrystallized semiconductor material of the body suitably doped with metal of the wire migrated therethrough to impart a predetermined type conductivity and a predetermined level of resistivity thereto.
Abstract: A semiconductor controlled rectifier has a lamellar body of semiconductor material of at least one group of four alternate first and second regions of opposite type conductivity. The second regions are made from recrystallized semiconductor material of the first regions and contain a sufficient level of concentration of a dopant impurity to impart thereto the opposite type conductivity. It is recrystallized material with solid solubility of the impurity therein. The controlled rectifier is turned on and off by either a control electrode or a source of illumination.
Abstract: A deep diode transistor includes at least one of the emitter, the collector and the base regions comprising recrystallized material of the semiconductor substrate embodying the transistor. Each region of recrystallized material is formed in situ by the migration of a melt of a metal-rich semiconductor material through the material of the substrate at a predetermined elevated temperature along a thermal gradient established in the substrate.
Abstract: An anistropic resistor for electrical feed throughs embodies a body of semiconductor material having at least one channel region of recrystallized material of the body formed therein. The channel region extends entirely through, and terminates in two major opposed surfaces of, the body. The at least one region is formed by a temperature gradient zone melting process, has a substantially uniform level of resistivity throughout the region and is electrically conductive.
Abstract: A minority carrier isolation barrier in a body of semiconductor material is formed by the migration of a suitable metal-rich liquid zone of an impurity material through the semiconductor body. A thermal gradient zone melting process is practiced to produce a region of recrystallized semiconductor material of the body having solid solubility of an impurity therein to impart a level of minority carrier lifetime thereto which is different from that level of minority carrier lifetime of the body.
Type:
Grant
Filed:
April 29, 1976
Date of Patent:
June 28, 1977
Assignee:
General Electric Company
Inventors:
Harvey E. Cline, Thomas R. Anthony, Richard A. Kokosa, E. Duane Wolley
Abstract: Geometrical design criteria are disclosed for a Gate Modulated BiPolar Transistor, or GAMBIT, which is a three terminal variable negative resistance device. The GAMBIT is a planar, interdigited, integrated device whose electrical characteristics show a voltage controlled negative resistance between two of its terminals. The magnitude of the negative resistance is controlled by the variation of the applied bias to the third terminal.
Type:
Grant
Filed:
August 23, 1976
Date of Patent:
June 28, 1977
Assignee:
General Electric Company
Inventors:
B. Jayant Baliga, Douglas E. Houston, Surinder Krishna
Abstract: At least one element of a superalloy cast into a refractory oxide-silica investment mold is oxidized to form a metal oxide barrier layer at the mold-metal interface to permit directional solidification of the cast superalloy at elevated temperatures without metal-mold reaction.
Type:
Grant
Filed:
April 7, 1976
Date of Patent:
June 28, 1977
Assignee:
General Electric Company
Inventors:
Michael F. X. Gigliotti, Jr., Charles D. Greskovich