Abstract: A manufacturing method for a shaped light metal article includes the steps of forming a plastic worked article by plastic working an article for plastic working made of light metal material, and subjecting the plastic worked article to a post-plastic working heat treatment for between 20 minutes and 10 hours at a temperature in a range of 250 to 400° C. As a result, a shaped light metal article is produced with sufficient ductility.

Abstract: An image processing apparatus corrects degradation of an image of a pair of spread pages of a bound book placed on a document table. The image processing apparatus includes a height obtaining unit which obtains a plurality of heights, above the document table, of a plurality of points of the pair of spread pages, based on a contour of the pair of spread pages which appears in the image, and an image correcting unit which corrects the degradation of the image based on the plurality of heights obtained by the height obtaining unit. The degradation may be unevenness of lightness, deformation, a blur, or the like.

Abstract: Shift conversion of hydrogen-rich reformed gas produced by reaction including partial oxidation of feed gas in a reforming reaction section (6) is made by its water gas shift reaction with shift conversion catalyst in a shift reaction section (10) in order to reduce CO contained in the reformed gas and enhance the yield of hydrogen. In this case, for the purpose of enabling high-temperature reformed gas from the reforming reaction section (6) to undergo the shift conversion as it is and thereby simplifying the construction of a shift conversion unit, the reformed gas from the reforming reaction section (6) is introduced directly into a reformed gas passage (11) of the shift reaction section (10) and thereby undergoes the shift reaction while heat-exchanging with the feed gas.

Abstract: The laser beam ablatable film of the invention includes an ablatable metallic layer arranged below a translucent protective layer that is dyed through-out. The metallic layer is connected to a contrastive colored layer by a transparent connecting layer, and the contrastive colored layer is connected to a plastic film. The entire assemblage of laminated layers can also include a self-adhesive film applied to the plastic film and the self-adhesive layer is then covered by a removable carrier material. This laminated assembly can be stamped into individual labels that can be detached from the carrier material and placed onto objects. When the ablatable foil of the invention is subjected to a laser beam surface areas of the laminated assembly appear as a mixture of colors of letters or symbols resulting from the color filter effect of the protective film.

Abstract: A semiconductor device includes a first semiconductor chip provided with a first electrode on a first main surface and a second semiconductor chip provided with a second electrode on a second main surface. The first and the second semiconductor chips are integrated so that the first and second main surfaces are opposed to one another and the first and second electrodes are electrically connected. The second semiconductor chip is polished from the opposite side of the second main surface so that the second semiconductor chip has a thickness smaller than the thickness of the first semiconductor chip.

Abstract: A rotatively oscillating separator comprising separating vessels 4 each having cone-shaped separating plate 5 disposed in the vessel, and drive means 6 for rotatively oscillating said separating vessels 4, mixed rice consisting of unhulled rice and unpolished rice being fed onto the separating plates in the separating vessels at a given location to separate the unhulled rice and the unpolished rice from each other, the unpolished rice being discharged through raised peripheral portions of the vessels, and the unhulled rice being discharged through the central bottoms of the separating vessels.

Abstract: An insulating film is formed of a carbon-containing silicon dioxide film on a semiconductor substrate. In the insulating film, an interconnect groove is formed. A silicon dioxide layer with a density high enough to allow almost no oxygen to pass therethrough is formed on the bottom and side faces of the interconnect groove. And a metal interconnect is formed on the silicon dioxide layer inside the interconnect groove.

Abstract: A vacuum heat-treatment apparatus for heat-treating a workpiece in a treating cell includes a hermetic chamber disposed at the center. A plurality of treating cells are disposed along the periphery of the hermetic chamber, and a workpiece transfer mechanism is disposed inside the hermetic chamber and transfers the workpiece from one of the treating cells to the hermetic chamber and from the hermetic chamber to one of the treating cells.

Abstract: An image signal read out from an original is binary-coded on the basis of a binary-coding threshold value. The binary-coding threshold value is calculated by making a histogram representing a frequency distribution of tones of the image signal, calculating the value of a peak tone at which the frequency is maximized, calculating as a first tone at which the frequency becomes equal to a predetermined level on the lower tone side of the peak tone, calculating a reference binary-coding threshold value by adding to the peak tone the difference between the first tone and the peak tone, and determining the binary-coding threshold value on the basis of the reference binary-coding threshold value.

Abstract: An etching control layer with a composition different from that of a compound semiconductor substrate is deposited over the surface of the substrate. Then, a first multilayer structure, made up of multiple semiconductor layers including a first active layer with a composition different from that of the etching control layer, is defined over the etching control layer. A first semiconductor laser structure is formed out of the first multilayer structure on a first region of the substrate by selectively etching and patterning the first multilayer structure. A second multilayer structure, made up of multiple semiconductor layers including a second active layer, is defined over the surface of the substrate as well as over the first semiconductor laser structure. A second semiconductor laser structure is formed out of the second multilayer structure on a second region of the substrate by selectively etching and patterning the second multilayer structure.

Abstract: The invention makes it possible to efficiently and accurately supply parts to a work in an assembling production line structured as a mixed assembly line, and to improve a flexibility of changing the line.

Abstract: A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).

Abstract: A seat cushion comprises a cushion body portion including a storage recess and a cushion bottom portion covering the storage recess so as to selectively open or close it. A supplementary seat comprises a supplementary seat back which is pivotally supported so as to rotate in the longitudinal direction and a supplementary seat cushion formed separately from the supplementary seat back. The supplementary seat cushion is configured so as to selectively take a sitting position, where it is located at the side of the seat cushion, and a stored position, where it is stored in the storage recess. Accordingly, since only the supplementary seat cushion is stored in the storage recess, the deterioration of comfortable ride caused by the high-sitting point can be suppressed. Also, the supplementary seat back can be used as a armrest or the like.

Abstract: A method for integrating a compound semiconductor with a substrate of high thermal conductivity is provided. The present invention employs a metal of low melting point, which is in the liquid state at low temperature (about 200° C.), to form a bonding layer. The method includes the step of providing a compound semiconductor structure, which includes a compound semiconductor substrate and an epitaxial layer thereon. Then, a first bonding layer is formed on the epitaxial layer. A substrate of thermal conductivity greater than that of the compound semiconductor substrate is selected. Then, a second bonding layer is formed on the substrate. The first bonding layer and the second bonding layer are pressed to form an alloy layer at low temperature.

Abstract: A stencil printing ink container comprises a cylinder, an area of one end of the cylinder, which area is other than an ink discharge opening section, being closed with an end wall, the other end of the cylinder being open, and a piston, which undergoes a sliding movement in an axial direction of the cylinder and along its inner circumferential surface. The ink container is filled with ink having a viscosity of at most 7.5 Pa·s with respect to a shear rate of 100 sec−1 and at 23° C. and satisfies a specific relationship among an inside radius of the cylinder, an inside radius of the ink discharge opening section, a length of the ink discharge opening section, a weight of the ink filled in the ink container, a sliding movement starting load of the piston, and the viscosity of the ink.

Abstract: The semiconductor device of the present invention includes: a gallium nitride (GaN) compound semiconductor layer; and a Schottky electrode formed on the GaN compound semiconductor layer, wherein the Schottky electrode contains silicon.

Abstract: A target system provides a unified target solution where a plurality of targets are fixed to a base member. This base member allows, for example, easy portability of the plurality of targets as well as provides a mechanism for allowing multiple targets systems to be interconnected and interchanged.

Abstract: A double door structure which has front and rear doors opening outward to form an uninterrupted opening to front and rear seats has an impact load carrying assembly for forming a side body reinforcing structure for protecting passengers against a side collision. The impact load carrying assembly includes an impact bar extending to and overlapping a side sill of a vehicle body, an upper bracket fixedly mounted to the impact bar and located to overlap a roof side rail of the vehicle body and a lower bracket fixedly mounted to the impact bar. The upper bracket mounts a latch and a belt anchor of a seatbelt system thereon and the lower bracket mounts catch pins forming part of a door catch mechanism operative to prevent movement of the door upon an occurrence of a side collision.

Abstract: A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut so that the quotient obtained by dividing a maximum diameter of a perforation at the time at which supply of energy to the heat source is cut by the energizing time is not smaller than 0.015 m/s and not larger than 0.23 m/s.

Abstract: This invention concerns an electromagnetic induction actuator to be mounted in small equipment such as portable telephones and pagers; also concerns such portable telecommunications equipment. The electromagnetic induction actuator, as well as the portable telecommunications equipment in which it is mounted, can be assembled in a thin and small package even though there are tabs as shock resistance stoppers, and has good acoustical characteristics. In the electromagnetic induction actuator there is a yoke that has tabs as stoppers to provide shock resistance, and there are springs that have inner rings, outer rings, bridge arms that connect the inner and outer rings and recesses that correspond to the tabs of the yoke.