Abstract: A system and method for encapsulating an integrated circuit package. More specifically, a system and method for encapsulating a board-on-chip package is described. A strip of material is disposed on one end of the slot in the substrate to control the flow of the molding compound during the encapsulation process.
Abstract: Stepped photoresist profiles provide various methods of forming profiles in an underlying substrate. The stepped photoresist profiles are formed in two layers of photoresist that are disposed over the substrate. The substrate is then etched twice using a respective opening in each photoresist layer to create a stepped profile in the substrate.
Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
Type:
Grant
Filed:
August 31, 2000
Date of Patent:
June 10, 2003
Assignee:
Micron Technology, Inc.
Inventors:
Brad D. Rumsey, Patrick W. Tandy, William J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
Abstract: A distributed multi-user system for real time data access during cardiology procedures. The system includes an interactive computer network which can be used to simultaneously display and manipulate data from a cardiology procedure on a plurality of devices and at a plurality of locations. The system is implemented through various replication topologies which allow the simultaneous access and annotation of a cardiology study during the procedure. The study can be displayed and annotated at any of the plurality of locations, which may be local or remote, during the procedure. Annotations made at one of the plurality of locations will be distributed to the other locations through a publisher.
Type:
Grant
Filed:
December 29, 2000
Date of Patent:
June 10, 2003
Assignee:
GE Medical Systems Information Technologies
Abstract: The invention provides a technique for acquiring subsequent image data in a medical diagnostic context based upon analysis of initial image data. The initial image data is processed via a computer aided diagnosis algorithm to determine whether additional image data acquisition is appropriate. Subsequent acquisition processes may be performed on the same imaging system from which the initial image data originated, or a different imaging system. The imaging systems may also be of different modalities. The subsequent acquisition of image data may be performed automatically without operator intervention, or the prescribed subsequent acquisition sequence may be outputted by the system for execution upon command of an operator.
Type:
Grant
Filed:
September 13, 2002
Date of Patent:
June 3, 2003
Assignee:
GE Medical Systems Global Technology Company, LLC
Inventors:
Jiang Hsieh, Gopal B. Avinash, Cherik Bulkes, John M. Sabol
Abstract: A multi-component layer is deposited on a semiconductor substrate in a semiconductor process. The multi-component layer may be a dielectric layer formed from a gaseous titanium organometallic precursor, reactive silane-based gas and a gaseous oxidant. The multi-component layer may be deposited in a cold wall or hot wall chemical vapor deposition (CVD) reactor, and in the presence or absence of plasma. The multi-component layer may also be deposited using other processes, such as radiant energy or rapid thermal CVD.
Abstract: A distributed multi-user system for real time data access during cardiology procedures. The system includes an interactive computer network which can be used to simultaneously display data from a cardiology procedure on a plurality of devices and at a plurality of locations. A catalog, including a list of studies, may be selected by a client workstation. If a user selects one of the studies, the client workstation is dynamically directed to the study. The study can be displayed at any of the plurality of locations, which may be local or remote, during the procedure. Any updates to the data during the procedure will be distributed to the plurality of locations for real-time viewing of the updated data.
Type:
Grant
Filed:
December 29, 2000
Date of Patent:
June 3, 2003
Assignee:
GE Medical Systems Information Technologies
Abstract: An electronic device system having a removable processor and a removable modular thermal unit. The electronic device enabling a first modular thermal and processor installed within the electronic device to be replaced by a second modular thermal unit and processor. The second processor producing a different amount of heat than the first processor and the second modular thermal unit providing a different amount of cooling than the first modular thermal unit.
Type:
Grant
Filed:
April 23, 2001
Date of Patent:
May 20, 2003
Assignee:
Hewlett-Packard Development Company, L.P.
Abstract: A core logic chip set is provided in a computer system to provide a bridge between host and memory buses and an accelerated graphics port (“AGP”) bus adapted for operation of two AGP devices, or one AGP device and one peripheral component interconnect (“PCI”) device. A common AGP bus having provisions for the PCI and AGP interface signals is connected to the core logic chip set and the AGP and/or PCI device(s). The core logic chip set has an AGP/PCI arbiter having Request (“REQ”) and Grant (“GNT”) signal lines for each AGP and/or PCI device connected to the AGP bus. Another embodiment has a plurality of AGP buses for a plurality of AGP devices. This allows concurrent operation for AGP devices connected to different AGP buses. Two of the AGP buses may be combined to connect to one 64 bit PCI device.
Type:
Grant
Filed:
March 28, 2002
Date of Patent:
May 20, 2003
Assignee:
Compaq Information Technologies Group, L.P.
Abstract: A technique for reducing acoustic noise emitted by a magnetic resonance imaging system includes providing energy dampening elements in the scanner, such as within the gradient coil assembly, between the gradient coil assembly and the primary magnet, and around the outer and inner peripheries of the primary magnet and RF coil. The elements may be formed to conform to the structures of the scanner, and may be tile-like elements which can be fitted to new scanners and retrofitted to existing equipment.
Type:
Grant
Filed:
November 22, 2000
Date of Patent:
May 20, 2003
Assignee:
GE Medical Systems Global Technology Company, LLC
Inventors:
David Dean, Robert Vavrek, Scott Mansell
Abstract: A processor of a system initiates memory read transactions on a bus and provides information regarding the speculative nature of the transaction. A bus device, such as a memory controller, then receives and processes the transaction, placing the request in a queue to be serviced in an order dependent upon the relative speculative nature of the request. In addition, the processor, upon receipt of an appropriate signal, cancels a speculative read that is no longer needed or upgrades a speculative read that has become non-speculative.
Type:
Grant
Filed:
February 29, 2000
Date of Patent:
May 20, 2003
Assignee:
Hewlett Packard Development Company, L.P.
Abstract: A viscosity handling system for facilitating the movement of certain fluids. The system utilizes kinetic energy in the form of a rapidly and repetitively moving component that imparts energy in the form of heat to surrounding fluid. The system is particularly useful in applications, such as downhole pumping systems, used to produce hydrocarbon-based fluids from beneath the surface of the earth.
Abstract: Annular, linear, and point contact structures are described which exhibit a greatly reduced susceptibility to process deviations caused by lithographic and deposition variations than does a conventional circular contact plug. In one embodiment, a standard conductive material such as carbon or titanium nitride is used to form the contact. In an alternative embodiment, a memory material itself is used to form the contact. These contact structures may be made by various processes, including chemical mechanical planarization and facet etching.
Abstract: A technique for deploying a liner within a wellbore. The technique utilizes a flush bore running tool that may be coupled to the interior of the liner during deployment of the liner. The mechanism for coupling the running tool and the liner permits the use of the full diameter of the liner after the running tool is released and removed from the liner.
Abstract: A memory device wherein a diode is serially connected to a programmable resistor and is in electrical communication with a buried digit line. An electrically conductive plug is electrically interposed between the digit line and a strapping layer, thereby creating a double metal scheme wherein the strapping layer is a second metal layer overlying metal wordlines. In a method of a first embodiment the strapping material is electrically connected to the digit line through a planar landing pad overlying the conductive plug. An insulative material is sloped to the planar landing pad in order to provide a surface conducive to the formation of the strapping material.
Type:
Grant
Filed:
February 1, 2002
Date of Patent:
May 13, 2003
Assignee:
Micron Technology, Inc.
Inventors:
Fernando Gonzalez, Gurtej S. Sandhu, Mike P. Violette
Abstract: A method and apparatus for thermally attaching web-based polishing pads in a chemical-mechanical planarization (CMP) system. Specifically, one end of a first web-based polishing pad and an end of a second web-based polishing pad are inserted in a thermal sealing unit. The ends of the polishing pads are brought into contact with each other and secured in place within the thermal sealing unit. A heating element within thermal sealing unit is activated, thereby fusing the polishing pads.
Abstract: A full rail-to-rail CMOS comparator is provided. The comparator includes a gain stage and a bias stage. The bias stage is responsive to the common mode input voltage level to provide a bias signal that maintains the gain stage with an optimum operating range regardless of the level of the common mode input voltage, thus maintaining the comparator output responsive to the differential input voltage. Accordingly, when operating in the optimum operating range, duty cycle distortion of the signal at the comparator output is minimized. The comparator also offers improved performance due to a lower component count and fewer comparator stages, thus decreasing power consumption and improving propagation delays.
Abstract: A pressure regulator having a movable seat and a seat retainer. The seat retainer having a hollow interior with an interior surface. The seat is disposed within the hollow interior of the seat retainer to control fluid flow through the pressure regulator. The seat may be adapted to slidingly engage the interior surface of the seat retainer during movement of the seat to dampen the movement of the seat. The seat may be elastically deformed by the seating surface when seated against the seating surface. The pressure regulator may have a stem extending through the seat retainer orifice and affixed to the solid body of the seat to move the seat in response to movement of a diaphragm.
Abstract: A notebook computer base housing has operatively disposed therein a CD ROM drive, a hard disk drive and a floppy disk drive, an AC/DC electrical power converter, a modem, a PCMCIA card bay structure and a battery. This internal provision of three drive units in addition to the other equipment within the base housing is facilitated from a space standpoint by the vertical stacking of the hard disk drive atop the CD ROM drive within the base housing. To dissipate the operating heat from these components within the base housing, a heat spreader plate is interposed between the CD ROM drive and the overlying hard disk drive, and the high heat-generating components—namely, the modem, the AC/DC converter, the PCMCIA card bay structure, and the computer processor—are closely grouped together, with the AC/DC converter in thermal communication with a second heat spreader plate. The processor is disposed above the other high heat-generating components on a horizontally oriented main system circuit board.
Type:
Grant
Filed:
March 11, 2002
Date of Patent:
April 29, 2003
Assignee:
Hewlett-Packard Development Company, L.P.
Inventors:
Pasha S. Mohi, Chris F. Felcman, Neil L. Condra, Gregory J. Mora, Stacy L. Wolff, Chi-Tsong Chu
Abstract: A densely packaged processor-based device, such as a server. The server includes a server chassis divided into two different cooling zones, a first pressure zone and a second pressure zone. A high output fan directs air across tightly packaged, heat producing components disposed in the higher pressure zone. The higher pressure permits sufficient airflow to adequately cool the components. This zone is separated from the second zone by a baffle to prevent the high pressure air from interfering with the cooling of components in the lower pressure zone.
Type:
Grant
Filed:
October 18, 2000
Date of Patent:
April 29, 2003
Assignee:
Compaq Information Technologies Group LLP
Inventors:
David F. Bolognia, Gregory L. Gibson, John R. Grady