Abstract: A first stack of distributed Bragg mirrors having alternating layers of aluminum gallium arsenide differing in concentrations of an aluminum are disposed on a surface of a substrate with a first plurality of continuous gradient layers positioned between the alternating layers of differing aluminum concentrations to dynamically move the aluminum concentration from one of the alternating layer to another alternating layers. A first cladding region is disposed on the first stack of distributed Bragg mirrors. An active region is disposed on the first cladding region with a second cladding region being dispose on the active region.

Abstract: A substrate having a photonic device mounted thereon with a working portion that is operably connected to at least one electrical lead. A molded optical portion having a surface for light signal to enter and to exit is formed that encapsulates the substrate, the photonic device, and a portion of the first and second electrical lead. An optical connector is formed to plug into the molded optical portion to connect a fiber bundle thereto and the optical portion is electrically connected to an interconnect module.

Abstract: A molded optical interconnect is provided. A plurality of electrical tracings is disposed thereon. An optical module having an optical surface and a photonic device are operably coupled to an interconnect substrate. A molded optical portion having a core region with a first end and a cladding region is positioned with the first end of the core region being adjacent to the optical surface of the integrated circuit to operably couple the first end of the core region to the optical surface of the integrated circuit.

Abstract: A voltage controlled layer for a bi-directional device (106) is provided. A bi-directional device (106) having a working portion (110) and a surface (103) is operably coupled to substrate. An optically transparent layer (109) of elastic material is placed on the working portion (110) of the bi-directional device (106). A first and a second electrode (116, 117) are attached to the top and bottom surfaces (111, 112) of the optically transparent layer (109) to vary the thickness of the optically transparent layer (109) to accomodate the reception of transmission of light (130, 131) by the bi-directional device (106).

Abstract: An adjoining waveguide and optical connector is provided. A waveguide including a first end surface, a second end surface, and an adjoining surface is formed. The adjoining waveguide further includes a core region that extends from the first end surface to the second end surface and a cladding region that surrounds the core region. The first end surface and the second end surface of the waveguide exposes a portion of the core region that is used for optical coupling. The joining surface forms an interconnecting surface for another waveguide.

Abstract: A method for making an optical interconnect unit is disclosed. A mold (100) with surface (107) having a groove (112) is formed. An optical fiber (117) is placed into the groove (112) of the surface (107). A molding material is applied onto the surface (107) of the mold (100) and onto the optical fiber (117), thereby affixing the optical fiber (117) to the molding material.

Abstract: A substrate (102) having a surface (103) with a first stack of distributed Bragg reflectors (106), a first cladding region (107), an active region (108), a second cladding region (109), a second stack of distributed Bragg reflectors (110), and a contact region (111) is provided. A mesa (131) with a surface (133) and a trench (136) is formed. A first dielectric layer (122) is formed overlying substrate (102) and covering a portion of trench (136). A seed layer (126) having a pattern is formed, with the pattern of seed layer (126) having an opening on a portion of mesa (131). A metal is selectively plated on seed layer (126), thereby generating a layer (304) on seed layer (126) for removal of heat of VCSEL (101).

Abstract: A flexible circuit film (103) having a plurality of electrical tracings (118) is provided. A mold (102) having a cavity (112) capable of accepting the flexible circuit film (103) is provided. The flexible circuit film (103) is placed into the mold (102). A first optical portion (203) is molded with the flexible circuit film (103) in the cavity (112) of the mold (102) so as to join the flexible circuit film (103) to the first optical portion (203).

Abstract: A method for making an optical layer including, a first pattern projected onto a radiation sensitive surface having a first charge. Radiant energy is used to locally change the surface charge, thereby producing local areas having a second charge. The surface is exposed to an optical media having a charge that attracts the optical media to the surface. A substrate (123) with an associated charge is passed in proximity to the surface having the optical media attached. The optical media detaches from the surface and is deposited onto the substrate. The substrate (124) is heated, thereby fusing the optical media to make an optical layer (202).

Abstract: A substrate with a surface, the surface having disposed thereon a first stack of distributed Bragg reflectors, an active area, a second stack of distributed Bragg reflectors, a contact region, and a dielectric layer is provided. A first isolation trench is formed that extends through the dielectric layer, the contact region, and into a portion of the second stack of distributed Bragg reflectors. A dielectric layer is disposed on the substrate. A second isolation trench is formed through the nitride layer, the contact region, the second stack of distributed Bragg reflectors, the active region and a portion of the first stack of distributed Bragg reflectors, wherein the second isolation trench encircles the first isolation trench. A first electrical contact is formed on the second stack of distributed Bragg reflectors and a second electrical contact is formed on the contact region.

Abstract: An article and method for manufacturing an optical reading head (400,500) including an optically transparent substrate (100) with a first surface (103) and a second surface (116), wherein the first surface (103) and the second surface (116) are .joined at an angle. Depositing a plurality of layers having an upper portion (114), a middle portion 111, 112, 113), and a lower portion (101) that are optically active on the first and second surfaces (103, 116) of the optically transparent substrate (100). Forming light emitting devices (406, 407) in the plurality of layers on the second surface (116), thereby generating light emitting devices (406, 407) on the angle in the plurality of layers on the second surface (116). Positioning a detection device (402) in a normal plane to the first surface (103).

Abstract: A method is provided for reducing corrosion of metal surfaces that are comprised of at least aluminum and copper. An organic mask is exposed with a pattern. The organic mask is then subsequently developed, thereby producing open areas in the organic mask that expose portions of the metal surfaces. Applying a solution of hydrogen peroxide to the exposed metal surface, thereby creating a protective film prior to rinsing the exposed metal surface in an aqueous solution.

Abstract: A coaxial optoelectronic mount is provided. A coax cable having an inner conductor, an outer conductor, and an insulating region therebetween, and an end is formed. The end of the coax cable exposes portions of the inner conductor, the outer conductor, and the insulating region. A photonic device having a working portion, a first contact, and a second contact is mounted on the end of the coaxial cable. An optical fiber having a core region with a refractive index, a cladding region with a refractive index, and a surface is aligned to the working portion of the photonic device. An optical gel having a refractive index is disposed on the surface of the optical fiber and on the working portion of the photonic device operatively coupling the core region of the optical fiber to the working portion of the photonic device.

Abstract: A method for forming a field emission device. A substrate is selectively patterned. An etch is performed to remove portions of the substrate to form protrusions. An oxidation is performed to the substrate that forms a first oxidized layer. A perpendicular etch is performed that removes portions of the first oxidized layer. A second oxidation is performed to the substrate that forms a second oxidized layer. A conductive or semiconductive layer is deposited onto the second oxidized layer. An etch is performed to remove a portion of the first oxidized layer and a portion of the second oxidized layer to expose the protuberance.

Abstract: A molded reflective optical waveguide module is provided. A molded first optical portion having a fist surface or a major surface is formed. A core region having a first end and a second end is disposed into the first surface of the molded first optical portion with the first end of the core region terminating in a surface having an angle. A second molded optical portion having electrical traces and photonic devices can be applied to the molded first optical portion.

Abstract: A method is provided for making a power device (54) and a small signal device (52) on a bonded silicon substrate (41). A first silicon substrate (10) provided. A first surface (17) is etched to form a plurality of cavities (11) with a depth (13). A dielectric layer (14) is created on the first surface (17), wherein the dielectric layer (14) is created with a thickness less than or equal to the depth of the plurality of cavities. The dielectric layer (14) is patterned so that a plurality of islands (22) of dielectric remain in the cavities. A second silicon substrate (42) is provided. The first and the second silicon substrates (10, 42) are bonded together in such a manner that the islands (22) are buried. A predetermined portion of the first silicon substrate (10) is removed, thereby creating a surface that is suitable for semiconductor device fabrication.

Abstract: A method for making an electron emissive film is provided. A substrate and a reaction chamber having a temperature and a pressure is provided. The temperature and the pressure are adjusted to a desired temperature and a desired pressure. A substrate is place into the reaction chamber with hydrocarbon gas being flowed into the chamber. A plasma is ignited in the reaction chamber so as to form a tetrahedral shaped compound in the reaction chamber which aids in deposition of an electron emissive material on the substrate.

Abstract: An article and a method for making contact areas (221, 222, 230) on an optical waveguide (100, 200) are provided. A waveguide (100, 200) having a first surface (112) and a second surface (113) with a first indent (101) located on the first surface (112) and a second indent (102) located on the second surface (113) and a groove (104) is made interconnecting the first and second indents (101, 102). A low temperature melting member (111) is placed in the first indent (101) on the first surface (112) and is melted, thereby flowing the low temperature melting member into the groove (104) and into the second indent (102) located on the second surface (113).

Abstract: An electron source including selectively impurity doped semiconductor diamond wherein regions of selectively impurity doped regions are inverted with respect to the charge carrier population to provide a conductive path traversed by electrons subsequently emitted into a free-space region from the electron emitter. An inversion mode electron emission device including a selectively impurity doped semiconductor diamond electron emitter, for emitting electrons; a control electrode; and an anode for collecting emitted electrons wherein operation of the device relies on the inducement of an inversion region to facilitate electron transit to an electron emitting surface of the electron emitter.

Abstract: An interconnect substrate (116) having a surface (105) with a plurality of electrical tracings (115) disposed thereon. A photonic device (114) having a working portion (118) and having a contact (106) electrically coupled to one of the plurality of electrical tracings (115) disposed on the interconnect substrate (116). A molded optical portion (112) that encapsulates the photonic device (114) is formed. The molded optical portion (112) forms a surface (120). The surface (120) passes light between the photonic device (114) and an optical fiber(103). Alignment of optical fiber 103 is achieved by an alignment apparatus (117) that is formed in the molded optical portion (112).