Abstract: A substrate (102) having a surface (103) with a plurality of electrical traces (106) disposed thereon is provided. A photonic device (111) is operably mounted on the electrical traces (106) of the substrate (102). An optical portion (121) having a reflective surface (118) that is embedded in the optical portion (121) for directing light to and from the working portion of the photonic device (111) is disposed on the surface (103) of the substrate (102), thereby encapsulating the photonic device (111) in the optical portion (121).

Abstract: A first molded optical portion having a major surface with a free space and a first and a second plurality of core regions are disposed on the major surface of the first optical portion. A first and a second plurality of ends of the first and the second plurality of core regions are located at a first and a second end surfaces of the molded optical portion. A free space area is located between the first and the second plurality of core regions.

Abstract: A method for manufacturing a molded waveguide (50) is provided. A first cladding layer (20) is provided. Channels (21) are formed in the first cladding layer (20). A second cladding layer (40) is subsequently provided. The channels (21) in the first cladding layer (20) are then filled with an optically transparent polymer. The second cladding layer (40) is subsequently affixed over the channels (21) of the first cladding layer (20), thereby enclosing the channels (21).

Abstract: A method is provided for making a power device (54) and a small signal device (52) on a bonded silicon substrate (41). A first silicon substrate (10) provided. A first surface (17) is etched to form a plurality of cavities (11) with a depth (13). A dielectric layer (14) is created on the first surface (17), wherein the dielectric layer (14) is created with a thickness less than or equal to the depth of the plurality of cavities. The dielectric layer (14) is patterned so that a plurality of islands (22) of dielectric remain in the cavities. A second silicon substrate (42) is provided. The first and the second silicon substrates (10, 42) are bonded together in such a manner that the islands (22) are buried. A predetermined portion of the first silicon substrate (10) is removed, thereby creating a surface that is suitable for semiconductor device fabrication.

Abstract: A plurality of electrical traces and a light emitting device having a working portion is disposed on an interconnect substrate. A first optical portion having a first surface, a second surface, and a tapered surface is disposed onto the interconnect substrate. The first surface of the optical portion covers the working portion of the light emitting device, a second surface of the first optical portion is positioned parallel to the working portion of the light emitting device, and the tapered surface extends from the second surface toward the working portion of the light emitting device for guiding light emitted from the working portion of the light emitting device to the second surface.

Abstract: An interconnect substrate with a surface having a plurality of electrical tracings is provided. A photonic device having a working portion and contact electrically coupled to one of the plurality of electrical tracings is disposed on the interconnect substrate. A molded optical portion is formed that encapsulates the photonic device, as well as forming a reflective surface that directs light between an external light communicating structure and the photonic device.

Abstract: An article and method for manufacturing an optical reading head (400,500) including an optically transparent substrate (100) with a first surface (103) and a second surface (116), wherein the first surface (103) and the second surface (116) are joined at an angle. Depositing a plurality of layers having an upper portion (114), a middle portion (111, 112, 113), and a lower portion (101) that are optically active on the first and second surfaces (103, 116) of the optically transparent substrate (100). Forming light emitting devices (406, 407) in the plurality of layers on the second surface (116), thereby generating light emitting devices (406, 407) on the angle in the plurality of layers of the second surface (116). Positioning a detection device (402) in a normal plane to the first surface (103).

Abstract: A method for manufacturing a molded waveguide (50) is provided. A first cladding layer (20) is provided. Channels (21) are formed in the first cladding layer (20). A second cladding layer (40) is subsequently provided. The channels (21) in the first cladding layer (20) are then filled with an optically transparent polymer. The second cladding layer (40) is subsequently affixed over the channels (21) of the first cladding layer (20), thereby enclosing the channels (21).

Abstract: An optoelectronic sub-module (100,200) having a major surface (103,203)and an edge surface (104) with electrical tracings (116) disposed on the major surface (103,203). A light transmitting device (114) having a working portion is mounted on the major surface (103,203) with the working portion of the light transmitting device (114) directed perpendicularly to the edge surface (104) of the sub-module (100,200), and wherein the light transmitting device (114) is connected to at least one of the electrical tracings (116). An angled reflective surface (109) is formed between the major and edge surfaces. A photodetector (118) having a working portion is positioned on the major surface (103,203) with the working portion of the photodetector (118) positioned over the angled surface (109).

Abstract: A core region (107) with an end (114) and a cladding region (108) is formed. The cladding region (108) surrounds the end (114) of the core region (107) forming a surface (119) having a lens device (102) therein. The end (114) of the core region (107) is positioned with a selected distance (118) from the lens device (102) to the end (114) of the core region (107) of the waveguide (101). A light emitting device (103) having a working portion (104) is mounted on the surface (119) of the cladding region (108) with the working portion (104) of the light emitting device (103) directed over the lens device (102) for collection and focusing of light (109) from the working portion (104) of the light emitting device (103) into the end (114) of the core region (107).

Abstract: A method for making a modular optical waveguide (100) including a plurality of optical modules (102, 103, 104, 105) with each optical module having at least a core region (101) that is surrounded by a cladding region (111, 112). A first groove 114 and a second groove 116 are disposed into cladding region (111, 112), thereby separating the optical modules (102, 103, 104, 105).

Abstract: An optical signal detector insensitive to variations in optical signal intensity and operably discriminable with respect to signal wavelength is provided. An incident optical signal comprised of wavelength dependent information is detected to provide electronic current information substantially insensitive to variations in incoming optical signal intensity.

Abstract: Field emission device apparatus employing an integrally formed capacitance and a switch serially connected between a conductive element and a current source to provide substantially continuous emitted electron current during selected charging periods and non-charging periods.

Abstract: A method for molding optical waveguides (600) wherein one or more optical cores (230) are molded first with an attached support structure (206). A unitary cladding layer (601) is then molded around the cores (230) and the support structure (206) is removed to provide optical inlet/outlets to the cores (230). The ends of the cores (605) where the support structure (206) is removed may require subsequent polishing.

Abstract: An optical electronic coupling device (100) including a molded waveguide (101, 301, 401) having a plurality of core regions (105) surrounded by a cladding region (103). Cross-sections of the core regions (105) are exposed in an opening (113, 213,313) at one end of the waveguide. An optical cable (102, 303) having a plurality of optical fibers (107, 108, 109, 300) with core regions (123, 124, 125) is inserted into the opening (113, 213, 313), thereby aligning the core regions (123, 124, 125) of the optical fibers (107, 108, 109, 300) with the exposed cross-sections (122) of the core regions (105) of the optical electronic device (100).

Abstract: A method is provided for fabricating a phase-shift mask (10, 30). A mask plate (11, 31) is provided. A semitransparent layer (12, 32) is deposited onto the mask plate (11,31). The semitransparent layer (12, 32) is then patterned into a predetermined geometric pattern. The patterning of the semitransparent layer (12, 32) is then continued into the mask plate (11, 31) for a predetermined distance (38), thus providing a phase-shift mask (10, 30).

Abstract: A planarized multi-layer metal bonding pad. A first metal bonding pad layer (13) that defines a metal bonding pad is provided. A first dielectric layer (14) is provided with a multitude of vias (17) that covers the first metal bonding pad layer (13), thereby exposing portions of the first metal bonding pad layer (13) through the multitude of vias (17) in the first dielectric (14). A second metal bonding pad layer (18) that further defines the metal bonding pad is deposited on the first dielectric layer (14) making electrical contact to the first metal bonding pad layer through the multitude of vias (17). Planarization of the second metal bonding pad layer (18) is achieved by having the second metal bonding pad layer (18) cover the first dielectric layer (14) and making contact through the vias (17).

Abstract: An article and a method for making contact areas (221, 222, 230) on an optical waveguide (100, 200) are provided. A waveguide (100, 200) having a first surface (112) and a second surface (113) with a first indent (101) located on the first surface (112) and a second indent (102) located on the second surface (113) and a groove (104) is made interconnecting the first and second indents (101, 102). A low temperature melting member (111) is placed in the first indent (101) on the first surface (112) and is melted, thereby flowing the low temperature melting member into the groove (104) and into the second indent (102) located on the second surface (113).

Abstract: An optical device (112, 212, 312) with first (118) and second contacts (119, 219, 319), a molded waveguide (101,201) with first (115) and second metal tracks (117) and electrical couplings from contact (118) to the first metal track (115, 315) and from the second contact (119, 219) to the second metal track (117, 217, 317) by reflowing first and second bump balls (126) positioned between the first (118) and second (119) contacts and the first (115) and second (117) metal tracks, respectively.

Abstract: A method is provided for forming a right angle (30) on a chromeless phase-shift mask (31). A first phase-shift element (32) and a second phase-shift element (33) are positioned at a ninety degree angle, on the chromeless phase-shift mask (31), wherein there is a predetermined space (34) between the first and second phase-shift elements (32,33). The space between the phase-shift elements eliminates hot spot formation that causes unintentional exposure of the semiconductor substrate.