Patents Represented by Attorney, Agent or Law Firm Gregory S. Rosenblatt
  • Electronic package with stress relief channel
    Patent number: 5315155
    Abstract: There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the pedestal is less than that of the buffer, such that the at least a portion of the buffer overhangs the pedestal.
    Type: Grant
    Filed: July 13, 1992
    Date of Patent: May 24, 1994
    Assignee: Olin Corporation
    Inventors: Brian E. O'Donnelly, Brian Mravic, Jacob Crane, Deepak Mahulikar
  • Copper alloy having high strength and high electrical conductivity
    Patent number: 5306465
    Abstract: There is disclosed a copper base alloy which contains specified additions of chromium, zirconium, cobalt and/or iron, and titanium as well as methods for the processing of the copper alloy. One method of processing results in a copper alloy having high strength and high electrical conductivity. A second method of processing results in a copper alloy with even higher strength and a minimal reduction in electrical conductivity.
    Type: Grant
    Filed: November 4, 1992
    Date of Patent: April 26, 1994
    Assignee: Olin Corporation
    Inventors: Ronald N. Caron, John F. Breedis
  • Protective coating having adhesion improving characteristics
    Patent number: 5300158
    Abstract: There is provided a method of treating a copper or copper alloy substrate to provide improved resistance to both oxidation and to chemical attack. The substrate is immersed in an aqueous solution containing both chromium (VI) ion and phosphate ions. The treatment is particularly effective for protecting imaged printed circuit boards during storage, handling and use.
    Type: Grant
    Filed: May 26, 1992
    Date of Patent: April 5, 1994
    Assignee: Olin Corporation
    Inventors: Szuchain Chen, Nina Yukov
  • Machinable copper alloys having reduced lead content
    Patent number: 5288458
    Abstract: Machinable alpha beta brass having a reduced lead concentration is claimed. The alloy contains bismuth to improve machinability. Either a portion of the zinc is replaced with aluminum, silicon or tin, or a portion of the copper is replaced with iron, nickel or manganese.
    Type: Grant
    Filed: July 1, 1992
    Date of Patent: February 22, 1994
    Assignee: Olin Corporation
    Inventors: David D. McDevitt, Jacob Crane, John F. Breedis, Ronald N. Caron, Frank N. Mandigo, Joseph Saleh
  • Sealing glass composite
    Patent number: 5284706
    Abstract: There is provided a sealing glass composite which has a desired coefficient of thermal expansion. The composite is made up of a glass matrix having a first coefficient of thermal expansion and a substantially spherical particulate additive with a second coefficient of thermal expansion dispersed within the matrix. Use of a substantially spherical particulate additive having a reduced surface area as compared to other shaped particulate additive minimizes the reaction between the additive and the glass matrix. The spherical particles also provide better flow at high loading factors and improved fracture toughness.
    Type: Grant
    Filed: December 23, 1991
    Date of Patent: February 8, 1994
    Assignee: Olin Corporation
    Inventor: Brien E. O'Donnelly
  • Process of using chloric acid to separate zinc oxide and manganese oxide
    Patent number: 5279743
    Abstract: A process for the separation of a mixture of zinc and manganese oxides by adding the mixture to a chloric acid solution whereby the chloric acid solution oxidizes solid manganese oxide to solid manganese dioxide and causes the zinc oxide to dissolve into soluble zinc ions. The solid manganese dioxide is then separated from the chloric acid solution containing zinc ions.
    Type: Grant
    Filed: December 7, 1992
    Date of Patent: January 18, 1994
    Assignee: Olin Corporation
    Inventors: Leslie R. O. Ward, David W. Cawlfield
  • Magnetic sensor wire
    Patent number: 5268043
    Abstract: There is provided a magnetic device having first and second portions with different magnetic coercivities. A magnetic field is induced in both the first and second portion. When exposed to a sufficiently high external magnetic field, the polarity of the first portion reverses generating a voltage pulse which may be detected by an external sensor. Either the first or second portion, or both, is formed from a copper alloy containing dispersed magnetic phase.
    Type: Grant
    Filed: August 2, 1991
    Date of Patent: December 7, 1993
    Assignee: Olin Corporation
    Inventor: Charles J. McCowen
  • Assembly of electronic packages by vacuum lamination
    Patent number: 5261157
    Abstract: A process for the assembly of a pin grid array electronic package by vacuum lamination is provided. A vacuum is applied to the package components at the same time the components are bonded with a dielectric sealant. The sealant flow into holes formed in the package base is improved thereby electrically isolating terminal pins which pass through the holes.
    Type: Grant
    Filed: January 22, 1991
    Date of Patent: November 16, 1993
    Assignee: Olin Corporation
    Inventor: Kin-Shiung Chang
  • Chromium-zinc anti-tarnish coating for copper foil having a dark color
    Patent number: 5250363
    Abstract: A technique for improving the tarnish and oxidation resistance of metallic substrate is disclosed. The substrate is immersed in an aqueous solution containing sodium hydroxide, zinc ions and chromium (VI) ions. Either the temperature of the aqueous solution or the current density is selected so that at least one surface of the substrate is coated with a nontransparent layer. A chromium-zinc coating is electrolytically applied. The coating provides tarnish resistance at temperatures in excess of 230.degree. C. The coating is removable by immersion in sulfuric acid. Improved results are obtained by rinsing deionized water containing a small amount of an alkaline or alkaline earth hydroxide.
    Type: Grant
    Filed: October 26, 1992
    Date of Patent: October 5, 1993
    Assignee: Olin Corporation
    Inventor: Szuchain F. Chen
  • Electronic package having controlled epoxy flow
    Patent number: 5239131
    Abstract: There is provided an electronic package assembly having a die attach paddle bonded to the package base by a compliant adhesive. A recessed channel formed in the base is partially overlapped by the die attach paddle. During package sealing, excess adhesive accumulates in the recessed channel, eliminating bridging of the adhesive to the leadframe.
    Type: Grant
    Filed: July 13, 1992
    Date of Patent: August 24, 1993
    Assignee: Olin Corporation
    Inventors: Paul R. Hoffman, Linda E. Strauman, Dexin Liang, Sonny S. Pareno, German J. Ramirez
  • Palladium alloys having utility in electrical applications
    Patent number: 5236789
    Abstract: A palladium alloy of the form Pd.sub.x M.sub.y M'.sub.z where M is at least one element selected from the group consisting of silicon, iron, nickel, copper, chromium, cobalt, boron and aluminum and M' is at least one element selected from the group consisting of titanium, vanadium, chromium, zirconium, niobium, molybdenum, hafnium, tantalum and tungsten is provided. The alloys exhibit oxidation resistance and low electrical contact resistance and are particularly suited for electrical applications such as coatings for electrical contacts or connectors. In a preferred embodiment, the alloy is palladium/niobium containing from about 5 to about 10 atomic percent niobium.
    Type: Grant
    Filed: June 1, 1992
    Date of Patent: August 17, 1993
    Assignee: Olin Corporation
    Inventors: John G. Cowie, Jacob Crane, Julius C. Fister
  • Process for the manufacture of an interconnect circuit
    Patent number: 5234536
    Abstract: A method for the manufacture of an electronic circuit is provided. A substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to be laminated to a metallic foil. The foil is bonded to the nonconductive substrate and patterned into a plurality of circuit traces. These steps may be repeated a plurality of time for a multi-metal layer structure.
    Type: Grant
    Filed: April 1, 1992
    Date of Patent: August 10, 1993
    Assignee: Olin Corporation
    Inventors: Arvind Parthasarathi, Jeffrey S. Braden
  • Chromium-zinc anti-tarnish coating for copper foil
    Patent number: 5230932
    Abstract: A technique for improving the tarnish and oxidation resistance of copper and copper based ally material is disclosed. The material is electrolytically coated by immersion in an aqueous electrolyte containing sodium hydroxide, zinc ions and chromium (VI) ions. The deposited coating is a codeposited layer of zinc and chromium with a zinc to chromium ratio of from about 5:1 to about 12:1. The coating provides tarnish resistance at temperatures in excess of 190.degree. C. and is removable by immersion in sulfuric acid.
    Type: Grant
    Filed: March 20, 1992
    Date of Patent: July 27, 1993
    Assignee: Olin Corporation
    Inventors: Szuchain F. Chen, Nina Yukov, Lifun Lin, Chung-Yao Chao
  • Surface modified copper alloys
    Patent number: 5213638
    Abstract: There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.
    Type: Grant
    Filed: January 30, 1992
    Date of Patent: May 25, 1993
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Brian Mravic
  • Surface modification of copper alloys
    Patent number: 5209787
    Abstract: A composite copper alloy having a modified surface is provided. An element or combination of elements both soluble in copper and reactive with nitrogen are cast with copper or a copper alloy forming a solid state solution. The alloy is reacted with a nitride former to modify the surface. A continuous surface film is formed by heating in a nitrogen containing gas. A dispersion of nitride precipitate in a copper matrix is formed by implanting nitrogen ions.
    Type: Grant
    Filed: December 23, 1991
    Date of Patent: May 11, 1993
    Assignee: Olin Corporation
    Inventors: John F. Breedis, George J. Muench
  • Surface mount device with high thermal conductivity
    Patent number: 5188985
    Abstract: A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across each of the apertures. The metallic components may include a flange for bonding and a pedestal extending into each aperture.
    Type: Grant
    Filed: April 21, 1992
    Date of Patent: February 23, 1993
    Assignee: Aegis, Inc.
    Inventors: Manuel Medeiros, III, Jay S. Greenspan
  • Surface topography optimization through control of chloride concentration in electroformed copper foil
    Patent number: 5181770
    Abstract: An electrolyte solution for the electroforming of metal foil, such as copper, is provided. The electrolyte contains an effective concentration of chloride ions to promote the formation of a uniformly matte surface finish. Foil so formed forms a strong mechanical bond with a dielectric substrate during a subsequent lamination process.
    Type: Grant
    Filed: June 11, 1990
    Date of Patent: January 26, 1993
    Assignee: Olin Corporation
    Inventors: Andrew J. Brock, Lifun Lin, Paul Menkin, Ned W. Polan
  • Process for the manufacture of a three layer tape for tape automated bonding
    Patent number: 5156716
    Abstract: A method for the manufacture of an electronic circuit is provided. A non-conductive substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to be laminated to a metallic foil. The foil is bonded to the non-conductive substrate and patterned into a plurality of circuit traces. Mechanical stamping of the substrate is not required providing a means to inexpensively manufacture small quantities of a desired circuit configuration.
    Type: Grant
    Filed: April 26, 1991
    Date of Patent: October 20, 1992
    Assignee: Olin Corporation
    Inventor: Arvind Parthasarathi
  • Aluminum alloy semiconductor packages
    Patent number: 5155299
    Abstract: The present invention relates to a packagae adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than cooper based packages and better thermal conductivity than plastic based packages.
    Type: Grant
    Filed: June 10, 1991
    Date of Patent: October 13, 1992
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, James M. Popplewell
  • Process for manufacturing plastic pin grid arrays and the product produced thereby
    Patent number: 5144412
    Abstract: A pin grid array package is provided. An array of terminal pins pass through apertures formed in an interconnect tape. The terminal pins are electrically connected to circuit traces formed on interconnect tape. The electrically conductive bond between the terminal pins and circuit traces is either by a mechanical cinch by soldering. In one embodiment, at least a portion of the interconnect tape, terminal pins and a heat sink are embedded in a molding polymer resin.
    Type: Grant
    Filed: August 2, 1990
    Date of Patent: September 1, 1992
    Assignee: Olin Corporation
    Inventors: Kin-Shiung Chang, Thomas A. Armer, William G. Bridges