Patents Represented by Attorney, Agent or Law Firm Gregory S. Rosenblatt
  • Method of making coated electrical connectors
    Patent number: 5141702
    Abstract: A method for depositing a composite coating on a substrate is provided. The coating contains a mixture of ductile metal particles and a uniformly dispersed polymer particles. The polymer is present in a concentration effective to reduce frictional forces. The coating mixture is compacted such as by isostatic pressing, formed into strips and then clad to the substrate. One preferred coating contains 0.5 weight percent polytetrafluoro-ethylene in a tin matrix.
    Type: Grant
    Filed: May 28, 1991
    Date of Patent: August 25, 1992
    Assignee: Olin Corporation
    Inventors: Bruce M. Guenin, Julius C. Fister
  • Silver-coated electrical components
    Patent number: 5139890
    Abstract: There has been provided an electrical component having resistance to oxidation and wear. The component has a copper or copper alloy substrate coated with a relatively thick layer of silver. A thin layer of gold may be deposited on the external surface of the silver coating layer to improve oxidation resistance, lubricity and to serve as a diffusion barrier.
    Type: Grant
    Filed: September 30, 1991
    Date of Patent: August 18, 1992
    Assignee: Olin Corporation
    Inventors: John G. Cowie, George J. Muench, Julius Fister
  • Palladium alloys having utility in electrical applications
    Patent number: 5139891
    Abstract: A palladium alloy of the form PdNbM where M is at least one element selected from the group consisting of silicon, iron, nickel, copper, cobalt, boron and aluminum is provided. The alloys exhibit oxidation resistance and electrical contact resistance and are particularly suited for electrical applications such as coatings for electrical contacts or connectors. In a preferred embodiment, the alloy contains from about 5 to about 10 atomic percent niobium.
    Type: Grant
    Filed: July 1, 1991
    Date of Patent: August 18, 1992
    Assignee: Olin Corporation
    Inventors: John G. Cowie, Jacob Crane, Julius C. Fister
  • Machinable copper alloys having reduced lead content
    Patent number: 5137685
    Abstract: Machinable copper alloys having a reduced lead concentration are disclosed. An additive to the alloy accumulates both at the grain boundaries and intragranularly. The additive facilitates chip fracture or lubricates the tool. One additive is a mixture of bismuth and lead with the lead concentration below about 2% by weight.
    Type: Grant
    Filed: March 1, 1991
    Date of Patent: August 11, 1992
    Assignee: Olin Corporation
    Inventors: David D. McDevitt, Jacob Crane, John F. Breedis, Ronald N. Caron, Frank N. Mandigo, Joseph Saleh
  • Carrier ring having first and second ring means with bonded surfaces
    Patent number: 5132773
    Abstract: A two-piece carrier ring is provided. First and second rings are affixed to opposing sides of the exterior portion of a leadframe and protect the leads from distortion. The rings are molded prior to bonding to the leadframe so that the rings may be formed from a wide variety of plastics. The premolded rings are polymerized prior to bonding preventing distortion of the leads by shrinking of the rings.
    Type: Grant
    Filed: February 6, 1991
    Date of Patent: July 21, 1992
    Assignee: Olin Corporation
    Inventors: Jeffrey S. Braden, Matthew D. Penry
  • Lead frame having polymer coated surface portions
    Patent number: 5122858
    Abstract: A composite leadframe for electronic packages is provided. A polymer layer coats a portion of the leadframe. The polymer layer increases the adhesive bond between the leadframe and a molding resin. Water vapor does not accumulate under the leads and die attach paddle minimizing the popcorn effect.
    Type: Grant
    Filed: September 10, 1990
    Date of Patent: June 16, 1992
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Julius C. Fister, Gerald N. Violette
  • Non-catalytic oxidation of propylene to propylene oxide
    Patent number: 5117011
    Abstract: There is provided a process for the non-catalytic oxidation of gaseous hydrocarbons, preferably propylene. A mixture of propylene, oxygen and a inert diluent are provided to a rector vessel capable of maintaining an isothermal reaction. Maintaining a temperature in the range of about 200.degree. C. to about 350.degree. C. and a propylene partial pressure of about 80 psia to about 300 psia provides the highest propylene oxide selectivity.
    Type: Grant
    Filed: August 7, 1991
    Date of Patent: May 26, 1992
    Assignee: Olin Corporation
    Inventors: Ruford T. Pennington, Michael C. Fullington
  • Semiconductor bridge (SCB) packaging system
    Patent number: 5113764
    Abstract: The present invention is direct to primer housings to secure a semiconductor bridge device in close proximity to an energetic charge. The primar housings are formed from an electrically conductive alloy and contain a dielectric medium disposed between components to maintain electrical isolation. The housings are characterized by high ductility to resist fracture during assembly or handling. In certain embodiments, one or both lead wires are removed to reduce the potential for lead wire breakage or separation.
    Type: Grant
    Filed: May 13, 1991
    Date of Patent: May 19, 1992
    Assignee: Olin Corporation
    Inventors: Frank N. Mandigo, George C. Mei, Julius C. Fister
  • Surface mount device with high thermal conductivity
    Patent number: 5111277
    Abstract: A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across each of the apertures. The metallic components may include a flange for bonding and a pedestal extending into each aperture.
    Type: Grant
    Filed: March 29, 1991
    Date of Patent: May 5, 1992
    Assignee: Aegis, Inc.
    Inventors: Manuel Medeiros, III, Jay S. Greenspan
  • G-tab manufacturing process and the product produced thereby
    Patent number: 5108553
    Abstract: A thin, preferably flexible circuit having multiple conductive planes separated by a non-conductive layer is provided. Conductive vias electrically interconnect the conductive planes. The conductive vias comprise carbon coated blind vias which are made conductive by the electrolytic deposition of a metal on the carbon. The invention is particularly suited for G-TAB wherein a first metal plane is patterned into signal plane circuit traces and a second metal plane is patterned into ground plane traces.
    Type: Grant
    Filed: September 25, 1989
    Date of Patent: April 28, 1992
    Assignee: Olin Corporation
    Inventors: Craig A. Foster, Randolfo Galvez, Kurt R. Raab
  • Fabrication of superconducting wire and product
    Patent number: 5106825
    Abstract: A method of fabricating a rugged, flexible, superconducting wire comprising: mixing a superconducting material, such as YBa.sub.2 Cu.sub.3 O.sub.x, with a metallic powder to form a metal/superconductor mixture; and loading a metal shell or tube with the metal/superconductor mixture to form a superconducting wire. The superconducting wire may also be cold drawn and annealed to form a very dense wire. The metallic powder is either copper, copper alloy, aluminum or other face centered cubic element. Additionally, a superconducting wire may be formed by encapsulating a superconducting filament within a metal shell.
    Type: Grant
    Filed: July 31, 1987
    Date of Patent: April 21, 1992
    Assignee: Olin Corporation
    Inventors: Frank N. Mandigo, Joseph Winter, Bruce M. Guenin, George J. Muench
  • Metal pin grid array package
    Patent number: 5103292
    Abstract: A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and extend through the ordered array of holes. A dielectric polymer sealant bonds a cover component to both the circuit and to the base component. During package assembly, the polymer sealant flows into the holes comprising the ordered array of holes electrically isolating the terminal pins from the base component.
    Type: Grant
    Filed: November 29, 1989
    Date of Patent: April 7, 1992
    Assignee: Olin Corporation
    Inventor: Deepak Mahulikar
  • Copper alloys with dispersed metal nitrides and method of manufacture
    Patent number: 5102620
    Abstract: Spray cast alloys having reduced porosity and increased ductility are provided as well as a process for the manufacture of the alloys. An effective amount of a reactive metal which reacts with the spray casting atmosphere but not with the desired alloy is dissolved into the alloy prior to spray casting. Preferred reactive metals readily form a nitride which is finely dispersed throughout the spray cast alloy.
    Type: Grant
    Filed: June 1, 1990
    Date of Patent: April 7, 1992
    Assignee: Olin Corporation
    Inventors: William G. Watson, Sankaranarayanan Ashok, Harvey P. Cheskis
  • Copper alloys for shaped charge liners
    Patent number: 5098487
    Abstract: A metal liner for a shaped charge device having a ductile metal matrix and a discrete second phase is provided. The allow composition is selected so the second phase is molten when the liner is accelerated following detonation. The molten phase reduces the tensile strength of the matrix so that the liner slug is pulverized on striking a well casing. The slug does not penetrate the hole perforated in the well casing by the liner jet and oil flow into the well bore is not impeded. The liner is formed by directly casting the desired alloy to the desired shape.
    Type: Grant
    Filed: November 28, 1990
    Date of Patent: March 24, 1992
    Assignee: Olin Corporation
    Inventors: Dennis R. Brauer, Frank N. Mandigo, Derek E. Tyler
  • Process for separating acid from nitro substituted aromatics using a molten nitrate salt
    Patent number: 5099079
    Abstract: Described herein is a process for separating an acid impurity from a solution containing acid and a nitro substituted aromatic compound by contacting the solution with at least one molten nitrate salt.
    Type: Grant
    Filed: July 26, 1990
    Date of Patent: March 24, 1992
    Assignee: Olin Corporation
    Inventor: Allen B. Quakenbush
  • Process for manufacturing a metal pin grid array package
    Patent number: 5098864
    Abstract: A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and extend through the ordered array of holes. A dielectric polymer sealant bonds a cover component to both the circuit and to the base component. During package assembly, the polymer sealant flows into the holes comprising the ordered array of holes electrically isolating the terminal pins from the base component.
    Type: Grant
    Filed: January 14, 1991
    Date of Patent: March 24, 1992
    Assignee: Olin Corporation
    Inventor: Deepak Mahulikar
  • Chromium-zinc anti-tarnish coating on copper foil
    Patent number: 5098796
    Abstract: A technique for improving the tarnish and oxidation resistance of copper and copper based alloy materials is disclosed. Copper or a copper alloy is immersed in an aqueous solution containing sodium hydroxide, zinc ions and chromium (VI) ions. While the compositional ranges may vary, the concentration of either zinc ions or chromium (VI) ions, or both, is less than 1.0 gm/1. A chromium-zinc coating is electrolytically applied. The coating provides tarnish resistance at temperatures in excess of 190.degree. C. The coating is removable by immerison in sulfuric acid. Improved results are obtained by rinsing deionized water containing a small amount of an alkaline or alkaline earth hydroxide.
    Type: Grant
    Filed: March 25, 1991
    Date of Patent: March 24, 1992
    Assignee: Olin Corporation
    Inventors: Lifun Lin, Chung-Yao Chao
  • Surface modified copper alloys
    Patent number: 5096508
    Abstract: A composite copper alloy having a modified surface is provided. An element or combination of elements both soluble in copper and reactive with nitrogen are cast with copper or a copper alloy forming a solid state solution. The alloy is reacted with a nitride former to modify the surface. A continuous surface film is formed by heating in a nitrogen containing gas. A dispersion of nitride precipitate in a copper matrix is formed by implanting nitrogen ions.
    Type: Grant
    Filed: July 27, 1990
    Date of Patent: March 17, 1992
    Assignee: Olin Corporation
    Inventors: John F. Breedis, George J. Muench, Deepak Mahulikar
  • Copper-nickel-tin-silicon alloys having improved processability
    Patent number: 5074933
    Abstract: The invention provides a process for the manufacture of copper alloys having improved processability. The alloys are melted and atomized into droplets which are spray cast into a coherent deposit. The spray cast alloys are characterized by a finer dispersion of intermetallic than is possible by conventional casting. The alloys are capable of being cold rolled to a reduction of up to 70%. The spray cast alloys exhibit good electrical conductivity and a high yield strength. They are particularly suited for electrical spring contacts.
    Type: Grant
    Filed: July 25, 1989
    Date of Patent: December 24, 1991
    Assignee: Olin Corporation
    Inventors: Sankaranarayanan Ashok, John F. Breedis
  • Method for housing a tape-bonded electronic device and the package employed
    Patent number: 5073521
    Abstract: A method for the assembly of an adhesively sealed tape package having base and cover components is provided. An electronic device is first bonded to the inner leads of a tape leadframe. The chip on tape is then disposed between the base component and the cover component and adhesively sealed to both. The electronic device and a portion of the inner leads are thereby encapsulated. In one embodiment the base and cover components are an aluminum base alloy having an anodization layer over at least those surfaces exposed to the external environment of the adhesive.
    Type: Grant
    Filed: November 15, 1989
    Date of Patent: December 17, 1991
    Assignee: Olin Corporation
    Inventor: Jeffrey S. Braden