Abstract: An echo reduction method stores a received audio information stream. A sound detection flag is activated following detection of locally generated sound. Output based on the received audio information stream is muted in response to the activating the sound detection flag. Rendering status of the received audio information stream is saved, in response to the activating the sound detection flag, to reduce loss of audio information. At least a portion of the stored received audio information stream is rendered following inactivation of the sound detection flag.

Abstract: A method includes forming a patterned resist layer comprising a resist layer opening overlying a bond pad of a substrate. The resist layer opening is at least partially filled with a first solder component layer. A second solder component layer is formed on the first solder component layer. The patterned resist layer is removed. The first solder component layer and the second solder component layer are reflowed to form a lead free binary metal alloy solder bump electrically connected to the bond pad.

Abstract: A stackable semiconductor package includes a substrate with a first side surface that includes circuit patterns. Each circuit pattern includes a pad. A semiconductor die is electrically coupled to the circuit patterns. An encapsulant covers the semiconductor die and the first side surface of the substrate inward of the pads. A layer of a solder is fused to each of the pads. A lateral distance between immediately adjacent pads is selected to be greater than a lateral distance between sidewalls of the encapsulant and immediately adjacent pads, and a height of the solder layers relative to the first side surface is selected to be less than a height of the sidewalls of the encapsulant, so that misalignment of a semiconductor package stacked on the solder layers/pads is self-correcting when juxtaposed ones of the solder layers and respective solder balls of the second semiconductor package are reflowed and fused together.

Abstract: A computer processor and a method of using the computer processor take advantage of information in the event address register of the computer processor by saving information from the event address register to an event address register history buffer. Thus, the event address register history buffer includes a cluster of events associated with execution of a computer program. The cluster of events is analyzed and the computer program modified, either statically or dynamically, to eliminate or at least ameliorate the effects of such events in further execution of the computer program.

Abstract: A resource-constrained device comprises a processor configured to execute multiple instruction streams comprising multiple instructions having an opcode and zero or more operands. Each of the multiple instruction streams is associated with one of multiple instruction execution modes having an instruction set comprising multiple instruction implementations. At least one of the multiple instruction implementations is configured to change the processor from a first instruction execution mode to a second instruction execution mode. The processor comprises an instruction fetcher configured to fetch an instruction from one of the multiple instruction streams based at least in part upon a current instruction execution mode.

Abstract: A wafer level chip size package (WLCSP) and a method of manufacturing the same are disclosed. Lands are formed at the ends of redistribution layers. The redistribution layers excluding the lands and a first dielectric layer are covered with a second dielectric layer. After forming a first under bump metallurgy (UBM) layer on the land, a solder ball is reflowed to the first UBM layer. A second UBM layer is widely formed on the entire second dielectric layer that is the outer circumference of the first UBM layer and is connected to the redistribution layer through a via-hole. Therefore, the second UBM layer having a large area can be used as a ground plane or a power plane. In addition, the second UBM layer can electrically connect the redistribution layers physically separated from each other. Therefore, the plurality of redistribution layers can cross each other without being electrically shorted with each other.

Abstract: A method of forming an embedded electronic component package includes coupling a substrate to a first dielectric layer, strip, or panel, and forming first electrically conductive vias and traces in the first dielectric layer. A cavity is then formed in the first dielectric layer and an electronic component is attached in the cavity. A second dielectric layer, strip, or panel, is then applied to the first dielectric layer, thereby encasing the electronic component in dielectric. Second via apertures are then formed through the second dielectric layer to expose selected electronic component bond pads and/or selected first electrically conductive vias and traces. The second via apertures are then filled with an electrically conductive material to form second electrically conductive vias electrically coupled to selected bond pads and selected first electrically conductive vias and traces.

Abstract: Embodiments in accordance with the invention install a primary security browser extension first in the browser event notification order list and a secondary security browser extension last in the event notification order list. On receipt of a user data event including user confidential data at the primary security browser extension, the user confidential data is obfuscated by the primary security browser extension and the user data event including the obfuscated data is released to a next browser extension in the browser event notification order list. Upon receipt of the user data event at the secondary security browser extension, the obfuscated data is restored with the original user confidential data and the user data event is released for further processing.

Abstract: A method includes generating a list of shared and private memory regions of a debuggee. A thread is injected into the debuggee for generating the list and communicating with the debugger. Associated shared memory region handles are added to the list. The handles are used to map the shared memory regions of the debuggee to a debugger. New shared memory regions corresponding to the private memory regions of the debuggee are created and mapped to the debugger. Handles for the new shared memory regions are provided to map the new shared memory regions to the debuggee. The debuggee private memory regions are freed. The new shared memory regions are mapped to respective virtual addresses of the debuggee corresponding to the respective freed private memory regions. In this manner, content of debuggee memory regions is directly accessible by the debugger, and computer processing resources are conserved.

Abstract: In accordance with one embodiment, a system and method for providing consumers marketing devices based on their use of supplementary income includes obtaining consumer financial data associated with a given “consumer” from one or more sources. At least part of the consumer financial data is then analyzed to determine if the given consumer typically receives supplementary income and, if so, how the consumer typically treats any supplementary income received. A supplementary income profile is then created for the given consumer. Data representing the supplementary income profile for the given consumer is then stored and at least part of the data representing the supplementary income profile for the given consumer is provided to one or more product marketers. One or more product marketers then provide a marketing device to the given consumer.

Abstract: A thermal via heat spreader package includes an electronic component having an active surface including a nonfunctional region. A package body encloses the electronic component, the package body comprising a principal surface. Thermal vias extend from the principal surface through at least a portion of the package body and towards the nonfunctional region. A heat spreader is thermally connected to the thermal vias. Heat generated by the electronic component is dissipated to the thermal vias and to the heat spreader. The density of the thermal vias is increased in a hotspot of the electronic component thus maximizing heat transfer from the hotspot. In this manner, optimal heat transfer from the electronic component is achieved.

Abstract: A method of forming an embedded passive component network substrate includes providing a first carrier with a first dielectric layer and patterning the first dielectric layer to form a first patterned dielectric layer including circuit pattern artifacts. A first etch stop layer is plated within the circuit pattern artifacts. A first conductor layer is plated on the first etch stop layer and within the circuit pattern artifacts. The first etch stop layer and the first conductor layer form a first etch stop metal protected circuit pattern comprising a passive component embedded with the first patterned dielectric layer.

Abstract: A method of forming an electronic component package includes forming a patterned dielectric layer comprising circuit pattern artifacts and at least one electronic component opening. An etch stop metal protected circuit pattern is plated with the circuit pattern artifacts. An electronic component is mounted in the electronic component opening. The etch stop metal protected circuit pattern provide an etch stop for substrate formation etch processes. In this manner, etching of a patterned conductor layer is avoided insuring that impedance is controlled to within tight tolerance.

Abstract: A method and system for providing family health history data includes a process for providing family health history data whereby, all, or part of, a family member's health data is obtained from, but not limited to, any of the following sources: the family member and/or agents of the family member; one or more other family members, one or more healthcare providers; one or more healthcare insurance plan providers; one or more healthcare benefit program administrators; one or more financial institutions; and/or any other source of a family member's health data. All, or part of, the family member's health data is then provided to other family members, healthcare providers for family members, state and/or private agencies, and/or any other party as designated by the family member, and on a selective access basis, as designated by the family member, for use as family health history data by the designated parties.

Abstract: A method includes determining that a driver load address is in a system service dispatch table (SSDT) addressable area. The method further includes determining whether the driver is authorized to be in the SSDT addressable area. If the driver is authorized to be in the SSDT addressable area, the driver is loaded in the SSDT addressable area and is able to hook operating system functions. Conversely, if the driver is not authorized to be in the SSDT addressable area, the driver is loaded outside the SSDT addressable area and is not able to hook operating system functions. In this manner, only authorized drivers are allowed to hook operating system functions.

Abstract: A method and system detect buffer overflows and RLIBC attacks by determining if a critical call initiating function is a “potential threat”. In one embodiment, a critical call initiating function is considered a potential threat if the value of the return address of the critical call initiating function points to a location in memory between the location of the highest Thread Environment Block (TEB) or Process Environment Block (PEB) and the location of the lowest Thread Environment Block (TEB) or PEB. In another embodiment, a critical call initiating function making a call to a predefined critical operating system function is considered a potential threat if the value of the return address of the critical call initiating function points to the beginning of a new function with a zero offset.

Abstract: A system for loading application identifiers to a mobile device includes a mobile device, a card device insertable into the mobile device, and an application center. The card device is adapted to determine an effective mobile device identifier of the mobile device, and transmit the effective mobile device identifier to the application center. The effective mobile device identifier is based at least in part on the result of a process performed by the card device. The application center is adapted to (1) determine zero or more allotted application identifiers and zero or more application identifiers of applications loaded on the mobile device based at least in part on the effective mobile device identifier, (2) identify at least one application identifier of the zero or more allotted application identifiers which does not form part of the zero or more application identifiers of applications loaded on the mobile device, and (3) load the at least one application identifier to the mobile device.

Abstract: A method and apparatus for time incremented purchase price discounting includes a process for time incremented purchase price discounting whereby a seller offers a product for sale on a seller website at an initial purchase price and then the product purchase price is automatically discounted by a predetermined amount at predetermined increments of time until either, the product is sold, or a seller determined minimum product purchase price is reached.

Abstract: A method includes determining if an attempt to recreate a requested resource is made, and, if so, if the requested resource is a suspicious resource. If the requested resource is a suspicious resource, identification of an originating process is made. A determination is made if the originating process is a non-trusted originating process or a trusted originating process. If the originating process is the non-trusted originating process, a protective action is taken. In this manner, self-repairing and persistent malicious code is identified and removed with minimal adverse impact on system functionality.

Abstract: A method includes forming a patterned buildup layer on a first surface of a dielectric layer, the patterned buildup layer including a patterned buildup layer opening exposing a trace coupled to the dielectric layer. A conductor layer is flash plated on the patterned buildup layer and within the patterned buildup layer opening. The patterned buildup layer opening is filled with a blanket conductive filler layer. The blanket conductive filler layer and the conductor layer are planarized to form a flip chip bump.