Patents Represented by Attorney Gunnison, McKay & Hodgson
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Patent number: 7899750Abstract: A method and apparatus for goal orientated computing system implemented financial management using projected balances includes a process for goal orientated financial management using projected balances whereby a user defines financial goals and then automatic payment rules based on projected account balance data are created to help accomplish those goals.Type: GrantFiled: October 31, 2006Date of Patent: March 1, 2011Assignee: Intuit Inc.Inventors: Michael S. Klieman, Tara Feldmeier
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Patent number: 7900200Abstract: A persistence management system facilitates porting servlet-based applications, such as Web applications, to an extremely mobile/nomadic system such as a resource-constrained device platform, e.g., a smart card, where sessions on a card acceptance device are intermittent by nature. Persistence management system (i) minimizes the startup time, and (ii) restores applications in a consistent state. The persistent management system supports: a) selective persistence of servlet model objects: both container-managed objects and application-managed objects; b) optional persistence of threads; and c) optional persistence of connection objects.Type: GrantFiled: June 16, 2006Date of Patent: March 1, 2011Assignee: Oracle America, Inc.Inventors: Thierry Violleau, Tanjore S. Ravishankar, Sebastian Jürgen Hans, Matthew R. Hill
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Patent number: 7898093Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.Type: GrantFiled: November 2, 2006Date of Patent: March 1, 2011Assignee: Amkor Technology, Inc.Inventors: Robert Francis Darveaux, Michael Barrow, Miguel Angel Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee, Ju Hoon Yoon
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Patent number: 7895227Abstract: Various embodiments of a system and method for detecting trends in network-based content, such as trends within the content of various network locations, are described. The system and method for detecting trends in network-based content may include a network-based trend service that enables a user to create a trend profile. The trend profile may include, a search target, a sampling frequency or schedule, and/or one or more thresholds. To determine the level of network-based activity for a search target, the network-based trend service may determine which network locations of a search domain contain the search target. The network-based trend service may determine the number of instances of the search target found within each search result. The network-based trend service may capture data samples that may include the total number of search results and/or the total instance count and may determine one or more trends from the data samples.Type: GrantFiled: April 27, 2007Date of Patent: February 22, 2011Assignee: Intuit Inc.Inventor: Kenneth Henderson
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Patent number: 7878946Abstract: An exercise bicycle includes a flywheel, a drive train coupled to the flywheel, and pedals coupled to the drive train. A user of the exercise bicycle expends power by exerting force on the pedals to spin the flywheel. The exercise bicycle further includes a power meter. The power meter includes a friction pad comprising a flywheel contact surface in contact with the flywheel and a temperature sensor located within the friction pad. The temperature sensor measures the temperature of the flywheel contact surface. The power meter further includes an output meter coupled to the temperature sensor, the output meter converting a temperature change of the flywheel contact surface as measured by the temperature sensor into a calculated power expended by the user.Type: GrantFiled: September 10, 2008Date of Patent: February 1, 2011Assignee: NanoScale Surface Systems, Inc.Inventor: John T. Felts
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Patent number: 7877402Abstract: A method and system for providing relevant search results using financial data includes a process for providing relevant search results using financial data whereby a user's financial transaction data is obtained from one or more sources. A user then initiates a network search using one or more network search parameters such as one or more keywords and/or phrases. The scope of the one or more network search parameters, and therefore the scope of the network search, are then determined and/or modified based, at least in part, on the user's financial data.Type: GrantFiled: January 15, 2008Date of Patent: January 25, 2011Assignee: Intuit Inc.Inventors: Benjamin Weiss, Lisa Cohen Gevelber, Todd M. Fitch, James Robert Del Favero
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Patent number: 7877793Abstract: A method and apparatus for digital content access control comprises receiving an authenticated digital content request based at least in part on a digital content request comprising a request for digital content, validating the authenticated digital content request and providing the digital content if the authenticated digital content request is valid. The validating comprises indicating the authenticated digital content request is valid if the authenticated digital content request is validly associated with the digital content and if the authenticated digital content request authenticates the digital content request, and indicating the authenticated digital content request is invalid if the authenticated digital content request is not validly associated with the digital content.Type: GrantFiled: March 12, 2007Date of Patent: January 25, 2011Assignee: Oracle America, Inc.Inventors: Eduard de Jong, Aaron Cooley, Jon Bostrom
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Patent number: 7877807Abstract: A system for processing emails incorporates means for dealing with previously unknown viruses. The system monitors email traffic patterns to identify patterns characteristic of a virus outbreak and takes corrective action when an outbreak is detected. Individual emails are analysed and, if any one of the constituent parts contains content in which it is possible to contain a virus, characteristic data derived from the email is logged to a database which is scanned for outbreak-indicating traffic patterns.Type: GrantFiled: July 6, 2001Date of Patent: January 25, 2011Assignee: Symantec CorporationInventor: Alexander Shipp
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Patent number: 7872341Abstract: A semiconductor package comprises a plurality of stacked semiconductor chips having the same structure. Therefore, the semiconductor chips can be produced using masks of the same design, resulting in a reduction in production cost and an improvement in productivity. Each of the semiconductor chips includes a plurality of through-silicon vias penetrating therethrough. The through-silicon vias of each semiconductor chip include at least one signal pad through which a common signal is delivered to the semiconductor chip and at least one chip enable pad connected to at least one chip enable pin to select the semiconductor chip. The chip enable pin may be connected to or disconnected from the chip enable pad through a conductive line to select the semiconductor chip. The conductive line is sawn to disconnect the chip enable pin from the chip enable pad before stacking of the semiconductor chip.Type: GrantFiled: March 3, 2009Date of Patent: January 18, 2011Assignee: Amkor Technology, Inc.Inventors: Sang Jae Jang, Ki Wook Lee, Jae Dong Kim
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Patent number: 7870491Abstract: In various embodiments, user support in computer software applications may be provided on the basis of user interaction histories. Critical points may be defined throughout the applications and the user interaction histories at these critical points may be stored and indexed for future retrieval. User interaction histories at these critical points may also be scored to determine, for example, whether the system should intervene. In some embodiments, when providing user support, an entity may access the user interaction history (e.g., using the index). The user interaction history may assist the entity in determining how to assist the system user at their current point in the application. In some embodiments, user support may be not limited to assisting the system user with a problem. For example, user support may include presenting a promotion or advertisement to the system user based on the user interaction history.Type: GrantFiled: April 27, 2007Date of Patent: January 11, 2011Assignee: Intuit Inc.Inventors: Kenneth Henderson, Terry F. LeClair
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Patent number: 7865837Abstract: A software application displays user interfaces for functionality of the software application. A user interface element is displayed on a user interface for the software application. A configuration screen for user configuration of the software application is displayed in response to a user command indicating selection of said user interface element. The configuration screen includes content corresponding to a state of the software application when the user command is received. The configuration screen may include content based on entered data in the user interface or on a data entry point of the user at the time of selecting the user interface element. The user interface element is displayed in a location on a plurality of user interface screens that is substantially identical for each screen. The configuration screen may include user preferences.Type: GrantFiled: July 28, 2006Date of Patent: January 4, 2011Assignee: Intuit Inc.Inventors: Gerald B. Huff, Roy Goldman, Craig Carlson
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Patent number: 7863723Abstract: A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.Type: GrantFiled: December 23, 2008Date of Patent: January 4, 2011Assignee: Amkor Technology, Inc.Inventors: Kwang Seok Oh, Jong Wook Park, Young Kuk Park, Byoung Youl Min
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Patent number: 7859119Abstract: A stack of semiconductor dies is disclosed. A first stack level includes a first semiconductor die and at least one first support that are attached to a substrate surface. A second level includes a second semiconductor die and at least one second support that are attached to the active surface of the first semiconductor die and to a coplanar surface of the first support(s). A third level includes a third semiconductor die attached to the active surface of the second semiconductor die and to a coplanar surface of the second support(s). The second and third semiconductor dies do not overlap bond pads of the first and second semiconductor dies, respectively. An adhesive film overlies the entire inactive surface of the second and third semiconductor dies, and attaches the second and third semiconductor dies to the immediately underlying active surface and support(s).Type: GrantFiled: November 12, 2008Date of Patent: December 28, 2010Assignee: Amkor Technology, Inc.Inventors: Roger D. St. Amand, Vladimir Perelman
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Patent number: 7859107Abstract: A solder attach film includes a first cover film, a flux layer, a solder layer, and a second cover film, and it can be treated or kept in a roll shape. A solder ball forming method using the solder attach film includes preparing a semiconductor package or a semiconductor die, adhering the solder attach film, gridding, and reflowing. In the solder attach film adhering operation, the first cover film and the second cover film are removed, and the flux layer is adhered to electrically conductive pads of the semiconductor package or the semiconductor die. Subsequently, in the reflowing operation, the flux layer is volatilized and removed, and the solder layer is fused and fixed to the electrically conductive pads, so that solder balls are formed.Type: GrantFiled: April 2, 2010Date of Patent: December 28, 2010Assignee: Amkor Technology, Inc.Inventors: Min Yoo, Tae Seong Kim, Ji Young Chung
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Patent number: 7849397Abstract: A system and method for providing electronic data entry forms with trainable data field sequencing includes a computing system implemented process for providing electronic data entry forms with trainable data field sequencing whereby as data fields are accessed in a specific sequence by a user to enter data associated with a first item, the specific sequence in which the data entry fields are accessed is learned/stored. Then the data fields are accessed in the same specific sequence for data entry associated with all subsequent items until the trainable data field sequencing feature is deactivated.Type: GrantFiled: April 12, 2007Date of Patent: December 7, 2010Assignee: Intuit Inc.Inventor: Shahid Ahmed
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Patent number: 7843052Abstract: Semiconductor devices are disclosed. In an embodiment, a plurality of second semiconductor dies formed with through-silicon vias are stacked on a first semiconductor die. The stack of the second semiconductor dies is encapsulated by an encapsulant. Redistribution layers are formed on one surface of the stack and are connected to the through-silicon vias. Solder balls are attached to the respective redistribution layers. In another embodiment, a plurality of second semiconductor dies formed with through-silicon vias are stacked on a first semiconductor die formed with through-silicon vias. Redistribution layers are formed on the back surface of the first semiconductor die. Solder balls are attached to the respective redistribution layers. Further disclosed are methods for fabricating the semiconductor devices.Type: GrantFiled: November 13, 2008Date of Patent: November 30, 2010Assignee: Amkor Technology, Inc.Inventors: Min Yoo, Ki Wook Lee, Min Jae Lee
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Patent number: 7844520Abstract: A method and apparatus for monitoring credit reports using a computing system implemented financial management system includes a process for monitoring credit reports whereby data representing various credit accounts is obtained and categorized by a computing system implemented financial management system. This computing system implemented financial management system data is then stored. A credit report is then obtained and credit report data representing the various credit account information contained in the credit report is obtained and stored. Then, the computing system implemented financial management system data and credit report data are compared and any discrepancies between the two credit data sources is brought to the attention of the user and/or included in a credit discrepancy report which is then provided to the user.Type: GrantFiled: May 31, 2006Date of Patent: November 30, 2010Assignee: Intuit Inc.Inventor: Martin Franklin
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Patent number: 7844521Abstract: A method and system for identifying business managing consumers includes a process for identifying business managing consumers whereby financial transaction data for various consumers is obtained from one or more sources using a computing system implemented financial management system. The consumers' financial transaction data is then analyzed to identify financial transactions typically associated with ownership and/or management of a business, i.e., business management related transactions. If more than a defined threshold number of business management related transactions associated with a given consumer are identified, that consumer is categorized as a business managing consumer. Sellers of business related products and/or service are then given access to the identified business managing consumers for promoting their various business related products and services.Type: GrantFiled: October 5, 2007Date of Patent: November 30, 2010Assignee: Intuit Inc.Inventors: Didrik Hoag, James Robert Del Favero, Benjamin Weiss
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Patent number: 7844642Abstract: A method for importing data from an XML document containing a plurality of elements and a plurality of attributes into a relational database includes: creating an element table for storing data of the plurality of elements and creating an attribute table for storing data of the plurality of attributes. In the element table, element records, each containing a unique element ID, are stored, one record for every one of the plurality of elements is stored. In the attribute table, an attribute record for every one of the plurality of attributes is stored. Each attribute record includes an attribute name, an attribute value and the element ID of the element to which the attribute is assigned. The method provides a fixed database model for different XML documents; allows a simple creation of a database; and allows simple data import and export into/from the database.Type: GrantFiled: January 18, 2002Date of Patent: November 30, 2010Assignee: Oracle America, Inc.Inventors: Joerg Jahnke, Dietmar Cordes
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Patent number: 7842541Abstract: A method includes forming a substrate layer, the substrate layer including a circuit pattern having terminals and bump pads. A stiffener is formed, the stiffener including via apertures having electrically conductive via aperture sidewalls and an electronic component opening. The stiffener is attached to the substrate layer. The electrically conductive via aperture sidewalls are electrically connected to the terminals. An electronic component is mounted to the bump pads and within the electronic component opening thus minimizing the height of the package. Further, the stiffener minimizing undesirable bending of the package and acts as an internal heat sink.Type: GrantFiled: September 24, 2008Date of Patent: November 30, 2010Assignee: Amkor Technology, Inc.Inventors: Sukianto Rusli, Ronald Patrick Huemoeller, Bob Shih-Wei Kuo, Lee John Smith