Patents Represented by Attorney Henry Powers
  • Patent number: 3993018
    Abstract: A chuck for a workpiece, rotatable in spaced relation to and about an axis of rotation, and having a clamp jaw radially movable under centrifugal force to engage the workpiece against fixed mating clamp members. The structure can also have optional means enabling the chuck to tilt, with the workpiece, from a home position to a preselected angle under the rotation thereof about a pivot axis perpendicular to and spaced from the axis of rotation with return of the chuck to the home position under gravitational force when rotation thereof is stopped.
    Type: Grant
    Filed: November 12, 1975
    Date of Patent: November 23, 1976
    Assignee: International Business Machines Corporation
    Inventors: John R. Kranik, Wolfgang F. Mueller
  • Patent number: 3968193
    Abstract: A process for forming a glass interconnection package for semiconductor chips including the steps of depositing a first layer of glass material on a supporting substrate and then heating the layer in a first gaseous ambient which is soluble in the glass material. Immediately thereafter, the first gaseous ambient is replaced by a second gaseous ambient which is insoluble in the glass material and the glass layer is heated and then cooled down to ambient atmosphere.
    Type: Grant
    Filed: August 27, 1971
    Date of Patent: July 6, 1976
    Assignee: International Business Machines Corporation
    Inventors: Perry Robert Langston, Jr., Melvin Norris Turetzky
  • Patent number: 3957376
    Abstract: A spot of collimated monochromatic radiation is applied to a semiconductor wafer to obtain a diffraction pattern from two edges within an area, which is the size of the spot, on the wafer. The diffraction pattern is reflected to a photodiode array wherein the light intensity of the diffraction pattern at each of a plurality of positions is obtained. Each of the photodiodes is scanned separately for the same period of time to determine the light intensity at its location. The distance between the zero intensity positions on the photodiode array is determined very precisely and utilized with the wavelength of a laser, which supplies the spot of collimated monochromatic radiation, and the effective focal length of the lens system, which images the diffraction pattern to the photodiode array, to calculate the linear distance between the edges.
    Type: Grant
    Filed: January 25, 1974
    Date of Patent: May 18, 1976
    Assignee: International Business Machines Corporation
    Inventors: Ronald S. Charsky, Gilbert E. Conn, Alexander L. Flamholz, Harold J. Young
  • Patent number: 3951710
    Abstract: Copper contaminants are removed from silicon with a solution containing copper (II) complexes. The solution may be recycled after use by bubbling oxygen through it.
    Type: Grant
    Filed: September 13, 1974
    Date of Patent: April 20, 1976
    Assignee: International Business Machines Corporation
    Inventor: Jagtar S. Basi
  • Patent number: 3946484
    Abstract: A manufacturing system utilizing a plurality of satellite functional processing stations or sectors, each capable of stand-alone operation. The stations are interconnected by a handler or conveyor, which will transport individual ones of work-pieces from one processing station to the next in accordance with a prescribed sequence corresponding to the processing requirements for the workpiece.
    Type: Grant
    Filed: May 1, 1975
    Date of Patent: March 30, 1976
    Assignee: International Business Machines Corporation
    Inventors: Jesse Aronstein, William E. Harding
  • Patent number: 3943015
    Abstract: A method for high temperature processing in device fabrication wherein multi-processing steps are performed in the absence of subjecting the unit to ambient conditions.
    Type: Grant
    Filed: July 8, 1974
    Date of Patent: March 9, 1976
    Assignee: International Business Machines Corporation
    Inventor: Paul W. Ing
  • Patent number: 3932026
    Abstract: A display assembly in which a nematic liquid crystal is sandwiched between two supporting substrates. Each substrate has a layer of a conductive coating on the inside surface, at least one of which is overcoated with a dielectric film or layer to separate the conductive layer from the liquid crystal material. Embodiments include varied thicknesses of the dielectric in association with image and lead portions of the conductive coating.
    Type: Grant
    Filed: May 27, 1975
    Date of Patent: January 13, 1976
    Assignee: International Business Machines Corporation
    Inventor: Gerard J. Sprokel