Patents Represented by Attorney IPUSA, PLLC
  • Patent number: 8177321
    Abstract: An image forming apparatus includes a voltage applying unit to apply a voltage to and charge a surface of transport belt, a leak judging unit to judge a charge leak on the surface of the transport belt, and a recovery operation unit to perform a charge leak recovery operation in which the transport belt is driven in a state where the voltage applying unit applies no voltage to the transport belt, if the leak judging unit judges that the charge leak is generated on the surface of the transport belt. The leak judging unit again judges whether the charge leak is generated on the surface of the transport belt after the recovery operation unit performs the charge leak recovery operation.
    Type: Grant
    Filed: January 25, 2010
    Date of Patent: May 15, 2012
    Assignee: Ricoh Company, Ltd.
    Inventors: Tomokazu Tsuchiya, Takafumi Shimizu
  • Patent number: 8177320
    Abstract: In a carriage of a liquid drop discharging device, an encoder sensor is arranged to read slits on a linear scale at a slit reading position. The carriage includes a stain detection part that detects a stain on the linear scale based on position information output from the encoder sensor. An encoder sensor moving part moves the encoder sensor from the slit reading position in a width direction of the linear scale. An encoder sensor movement control part controls movement of the encoder sensor from the slit read position by the encoder sensor moving part based on stain information output from the stain detection part.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: May 15, 2012
    Assignee: Ricoh Company, Ltd.
    Inventor: Takumi Hagiwara
  • Patent number: 8179689
    Abstract: A printed circuit board has capacitors, a grounding wiring pattern having a bonding surface on which a semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to first electrodes of the capacitors, and a power supply wiring pattern having a bonding surface on which the semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to second electrodes of the capacitors. The grounding and power supply wiring patterns are alternately arranged in a predetermined direction, and the capacitors are coupled in parallel with respect to the grounding and power supply wiring patterns.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: May 15, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Naohiro Mashino
  • Patent number: 8176025
    Abstract: An information processing apparatus includes a partial image extracting unit configured to extract partial images from input documents, a meta information setting unit configured to associate a given one of the input documents with the partial images of the given one of the input documents to generate meta information indicative of the association regarding the given one of the input documents, and a search unit configured to search for and retrieve one of the input documents as a first document from the document storage unit to display the first document on a display unit, wherein the meta information setting unit adds copy-source information indicative of the partial image of the first document to the meta information regarding a second document of the input documents when the partial image of the first document is copied and pasted onto the second document.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: May 8, 2012
    Assignee: Ricoh Company, Ltd.
    Inventors: Hiroshi Ota, Seiji Takahashi, Masaki Tasaka, Yuichiro Sakuta
  • Patent number: 8174109
    Abstract: An electronic device includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first electronic component, a first sealing resin, and a first multilayer interconnection structure including a first interconnection pattern directly connected to a first electrode pad of the first electronic component. The second semiconductor device includes a second electronic component, a second sealing resin, and a second multilayer interconnection structure including a second interconnection pattern directly connected to a second electrode pad of the second electronic component. The first semiconductor device is stacked on and bonded to the second semiconductor device through an adhesive layer with the first multilayer interconnection structure of the first semiconductor device facing toward the second sealing resin of the second semiconductor device.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: May 8, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Kenta Uchiyama
  • Patent number: 8173022
    Abstract: A method for manufacturing a packing material includes a first step of reacting an inorganic particle having a hydroxyl group with a silane coupling agent including a silane coupling agent having an alkenyl group with a carbon number of 2 or more and 8 or less and/or an alkynyl group with a carbon number of 2 or more and 7 or less and a second step of reacting the inorganic particle having reacted with the silane coupling agent, with a compound represented by a general formula of: (in the formula, R1 is an alkyl group with a carbon number of 4 or more and 50 or less or an aryl group with a carbon number of 6 or more and 30 or less and each of R2 and R3 is independently a hydrogen atom, a chloro group, or an alkyl group with a carbon number of 1 or more and 4 or less.).
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: May 8, 2012
    Assignee: Shiseido Company, Ltd.
    Inventor: Yoshihisa Hiroe
  • Patent number: 8168946
    Abstract: A charged particle separation apparatus that separates ionized gas clusters is disclosed. The charged particle separation apparatus includes an electric field applying part including two electrodes across which electric voltage is applied in order to generate electric field between the two electrodes thereby deflecting a trajectory of the ionized gas cluster, the electrodes including one of an opening and a void; and a plate opening that allows the ionized gas cluster whose trajectory is deflected by the electric field applying part to go therethrough.
    Type: Grant
    Filed: June 16, 2010
    Date of Patent: May 1, 2012
    Assignees: Tokyo Electron Limited, Hyogo Prefecture
    Inventors: Masaki Narushima, Koichi Mori, Isao Yamada, Noriaki Toyoda
  • Patent number: 8169072
    Abstract: A disclosed semiconductor device includes a reinforcing board having first and second faces, an electronic part accommodating portion penetrating the reinforcing board, a through hole, an electronic part having a front face on which an electrode pad is formed and a back face, a through electrode installed inside the through hole, a first sealing resin filling a gap between the through electrode and an inner wall of the through hole, a second sealing resin filled into the electronic part accommodating portion while causing the bonding face of the electrode pad of the electronic part accommodating portion to be exposed to an outside, and a multi-layered wiring structure configured to include insulating layers laminated on the first face of the reinforcing board and an interconnection pattern, wherein the interconnection pattern is directly connected to the electrode pad of the electronic part and the through electrode.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: May 1, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Kenta Uchiyama, Akihiko Tateiwa
  • Patent number: 8168452
    Abstract: A method for manufacturing a semiconductor device, the semiconductor device including an integrated circuit having plural connection terminals arranged on a predetermined local region of the integrated circuit, plural metal bumps, and a wiring layer connected to at least a portion of the connection terminals via the plural metal bumps, the method includes the steps of a) measuring an impedance value of the predetermined local region of the integrated circuit, b) determining whether the measured impedance value matches a predetermined impedance value, c) determining positions of the plural metal bumps in accordance with the determination result of step b), d) forming the plural metal bumps on the positions determined in step c), and e) forming the wiring layer on the plural metal bumps.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: May 1, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Keigo Maki, Daisuke Ito
  • Patent number: 8160468
    Abstract: An image forming apparatus includes a storage area used as a work area of programs for implementing functions, the programs including a basic function program configured to implement a basic function and an extension function program configured to implement an extension function, wherein the entire storage area is used in the event that the basic function program is executed to implement a specified maximum function of the basic function; a detecting unit configured to detect a usage state of the storage area; a storage unit configured to store information indicating an allocation mode defining a method of allocating the work area to the programs; and an allocation unit configured to allocate the work area to each of the programs that is to be executed, according to the usage state of the storage area detected by the detecting unit and the allocation mode stored in the storage unit.
    Type: Grant
    Filed: July 20, 2009
    Date of Patent: April 17, 2012
    Assignee: Ricoh Company, Ltd.
    Inventor: Takao Okamura
  • Patent number: 8157590
    Abstract: A jack side connector configured to be connected to a plug side connector, the plug side connector including a plug side signal contact and a plug side ground contact extending from a holding part, the jack side connector includes a jack side signal contact and a jack side ground contact configured to come in contact with the plug side signal contact and the plug side ground contact, respectively, so that electric conduction between the plug side connector and the jack side connector is made when the plug side connector is connected to the jack side connector, wherein the jack side ground contact includes a first contact part and a second contact part, and when the plug side connector is connected to the jack side connector, the electric conduction between the plug side connector and the jack side connector is made by the first contact part and the second contact part.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: April 17, 2012
    Assignee: Fujitsu Component Limited
    Inventors: Toru Yamakami, Takeshi Okuyama, Tadashi Kumamoto
  • Patent number: 8159656
    Abstract: A first step of measuring a change over time in the spectral transmission spectrum of a measurement sample by its exposure to the light of a light source including an ultraviolet radiation for a preset light exposure time, a second step of performing a correction according to the change over time in the spectral transmission spectrum of the measurement sample based on the result of the measurement obtained by the first step, and a third step of calculating the final in vitro predicted SPF of the measurement sample using the result of the correction obtained by the second step are included.
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: April 17, 2012
    Assignee: Shiseido Company, Ltd.
    Inventors: Yoshimasa Miura, Masayuki Shirao, Takashi Ohmori, Takuya Saiwaki
  • Patent number: 8159653
    Abstract: A method is disclosed for adjusting an arrangement of coordinates in an imaging area of an imaging component in a substrate imaging plane in a substrate position detection apparatus that detects a position of a substrate in accordance with an image taken of a circumferential portion of the substrate by the imaging component, the apparatus being arranged near a rotatable susceptor on which the substrate is placed and a substrate transferring apparatus prepared separately from the susceptor and configured to horizontally drive a supporting pin for transferring the substrate to and/or from the susceptor.
    Type: Grant
    Filed: February 12, 2008
    Date of Patent: April 17, 2012
    Assignee: Tokyo Electron Limited
    Inventor: Takehiro Shindo
  • Patent number: 8157592
    Abstract: A connector includes a first connector member configured to arrange a plurality of plane first boards with gaps in a thickness direction of the first boards, the first board including a conductive layer and an insulation layer, the insulation layer having a surface where a first signal pattern is formed; and a second connector member configured to arrange a plurality of plane second boards with gaps in a thickness direction of the second boards, the second board including a conductive layer and an insulation layer, the insulation layer having a surface where a second signal pattern is formed.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: April 17, 2012
    Assignee: Fujitsu Component Limited
    Inventors: Kazuhiro Mizukami, Toshihiro Kusagaya
  • Patent number: 8152548
    Abstract: A connector apparatus includes first and second connectors that can be engaged with each other. The first connector includes a first contact and a first main body that supports the first contact. The first connector is conductive. The first main body is insulative. The second connector includes a second contact and a second main body that supports the second contact. The second contact is conductive. The second main body is insulative. The first contact includes a first connection part that can contact the second contact. The second contact includes a second connection part that can contact the first connection part at plural portions of the first connection part. The first and second connection parts substantially have the same shape and size.
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: April 10, 2012
    Assignee: Fujitsu Component Limited
    Inventors: Yasushi Masuda, Manabu Shimizu
  • Patent number: 8152535
    Abstract: A socket includes a first relay board provided above a mounting board; a second relay board detachably provided above the first relay board; and a frame part provided at side parts of the first relay board and the second relay board, wherein the frame part is configured to hold the first relay board and the second relay board and detachably configured to hold an electronic device being mounted above the second relay board; and the first connecting part comes in contact with the first relay board and the second connecting part comes in contact with a pad of the electronic device, so that the electronic device and the mounting board are electrically connected to each other.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: April 10, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Yoshihiro Ihara
  • Patent number: 8154759
    Abstract: An image forming apparatus transfers plot data stored in a first storing part of a side of a controller to a side of a writing engine. A second storing part temporarily stores the plot data from said first storing part. When data stored in the second storing part reaches a data amount to be previously stored in order that continuous transfer of the plot data to the side of the writing engine from the second storing part is available at a predetermined transfer rate, even when a predetermined delay occurs in a transfer operation of the plot data from the first storing part to the second storing part, reading of the plot data from the second storing part is started for starting image forming operation.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: April 10, 2012
    Assignee: Ricoh Company, Ltd.
    Inventor: Sugitaka Oteki
  • Patent number: 8149019
    Abstract: A chopper type comparator including a first power supply line to which a first power source is supplied, a second power supply line to which a second power source having lower voltage than the first power source is supplied, a reference voltage input part to which a reference voltage is input, a target comparison voltage input part to which a target comparison voltage is input, a comparing part configured to compare the size between the reference voltage input from the reference voltage input part and the target comparison voltage input from the target comparison voltage input part, an output part configured to output a comparison result of the comparing part, and a resistance value setting part configured to set resistance values of the first power supply line and/or the second power supply line.
    Type: Grant
    Filed: June 6, 2008
    Date of Patent: April 3, 2012
    Assignee: Mitsumi Electric Co., Ltd.
    Inventor: Fumihiro Inoue
  • Patent number: 8148946
    Abstract: A battery pack has first through third external terminals connected to positive and negative power supply terminals and a voltage detection terminal, respectively. A secondary battery is connected between the first external terminal and the third external terminal. A protection circuit controls ON/OFF of first and second switching elements provided on a wiring between the secondary battery and a load or a charge device by detecting an overcharge, an overdischarge and an overcurrent of the secondary battery. A first thermistor is connected between the second external terminal and the third external terminal. A series circuit containing a second thermistor and a resistor is provided in parallel to the secondary battery. A third switching element is connected between the second external terminal and the third external terminal.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: April 3, 2012
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Takashi Takeda, Junji Takeshita
  • Patent number: 8149451
    Abstract: In an information processing device which embeds a number of partial information items produced from predetermined information in an image, an image dividing unit divides an image into a number of division images in a lattice formation to generate the division images. An information assigning unit assigns the partial information items to the division images generated by the image dividing unit. An information embedding unit embeds the partial information items assigned by the information assigning unit, in the division images. The information assigning unit assigns all the partial information items to a set of division images located in a predetermined direction.
    Type: Grant
    Filed: July 7, 2008
    Date of Patent: April 3, 2012
    Assignee: Ricoh Company, Ltd.
    Inventors: Takayuki Hara, Takahiro Yagishita