Abstract: A connector to be connected to a counterpart connector includes a circuit board having a ground layer, an insulating layer, and a first conductive layer successively stacked, the first conductive layer including a signal circuit and a ground circuit; and a second conductive layer electrically connecting the ground circuit and the ground layer, the second conductive layer being provided on a side of the counterpart connector in the ground circuit.

Abstract: A touch panel includes a lower conductive film, four electrodes disposed in edge portions of four sides of the lower conductive film, and an upper conductive film disposed over the lower conductive film so that the upper and lower conductive films are opposed to each other, to detect an electric potential in the lower conductive film when the upper conductive film is in contact with the lower conductive film. The upper conductive film includes split portions containing no transparent conductive material and split conductive portions divided by the split portions. The touch panel is arranged to detect an electric potential of each of contact points in the split conductive portions when the upper and lower conductive films are brought in contact with each other at the contact points, and detect respective coordinates of the contact points based on the electrical potentials.

Abstract: A data processing apparatus having a device driver part for controlling a device includes a storing part configured to store device capability data, a receiving part configured to receive a designation of a PrintTicket having setting data indicating control settings used for controlling the device, a determining part configured to determine whether the designated PrintTicket has been fabricated by the device driver part or another device driver part, a first controlling part configured to apply all of the setting data to the control settings in a case where the designated PrintTicket is determined to be fabricated by the device driver part, and a second controlling part configured to compare the device capability data with the setting data and apply at least a part of the setting data to the control settings in a case where the designated PrintTicket is determined to be fabricated by the other device driver part.

Abstract: A manufacturing method of a semiconductor device includes a film state underfill resin adhering step wherein film state underfill resin in a semi-cured state is adhered on the first surface of the board main body without forming a gap between the first surface of the board main body and the pad; a flattening step wherein an upper surface of the film state underfill resin is flattened; a chip connecting step wherein the semiconductor chip is pressed onto the upper surface of the film state underfill resin after the flattening step so that the semiconductor chip is flip chip connected to the pad; and an underfill resin forming step wherein the film state underfill resin is cured so that the underfill resin is formed between the semiconductor chip and the wiring board.

Abstract: In a semiconductor device, a substrate includes a plurality of line conductors which penetrate the substrate from a top surface to a bottom surface of the substrate. A semiconductor chip is secured in a hole of the substrate. A first insulating layer is formed on the top surfaces of the substrate and the semiconductor chip. A first wiring layer is formed on the first insulating layer and electrically connected via through holes of the first insulating layer to the semiconductor chip and some line conductors exposed to one of the through holes. A second insulating layer is formed on the bottom surfaces of the substrate and the semiconductor chip. A second wiring layer is formed on the second insulating layer and electrically connected via a through hole of the second insulating layer to some line conductors exposed to the through hole.

Abstract: A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film is disclosed that includes the steps of (a) applying a photoresist onto the resistive film formed on a substrate formed of an insulator; (b) forming a resist pattern on the resistive film by exposing the applied photoresist to light through a predetermined mask and subsequently developing the applied photoresist; (c) forming a resistive film removal region by removing a portion of the resistive film without the resist pattern; (d) removing the resist pattern after step (c); and (e) forming the common electrode over the resistive film removal region after step (d).

Abstract: A connector apparatus includes a receiving connector connected to a power source and including first and second power jack terminals, a control jack terminal, a control switch including first and second contact points, and an insulative spring positioned below the control switch, and an inserting connector connected to an electronic device and including first and second power plug terminals connected in correspondence with the first and second power jack terminals for receiving power from the power source, and a control plug terminal that extends towards the control switch and applies pressure to the insulative spring for causing the first and second contact points to connect and enabling the power from the power source to be supplied to the electronic device. A part of the insulative spring is configured to melt when an electric arc is generated by disconnecting the connection between the first and second contact points.

Abstract: An inductor includes a core substrate including minute column-like electrical conductors extending between a front surface and a back surface of the core substrate. Each column-like electrical conductor is insulated from adjacent column-like electrical conductors by being surrounded by an insulating material. Insulation layers are formed on the front surface and the back surface of the core substrate, respectively. At least two connection electrical conductors extend through each of the insulation layers. Each connection electrical conductor is electrically connected to a plurality of the column-like electrical conductors. Wirings are formed on each of the insulation layers to connect said connection electrical conductors to each other electrically. The wirings, the connection electrical conductors and the column-like electrical conductors are connected to form a coil in a three-dimensional manner.

Abstract: A finger contact detecting apparatus, which detects a finger being swept on a fingerprint sensor of the finger contact detecting apparatus, the finger contact detecting apparatus including, a pixel data averaging unit calculating an average value of pixel data collected by the fingerprint sensor; a deviation adding unit calculating, based on the average value and respective pixel data of predetermined pixels obtained by the fingerprint sensor, a summation of deviations of the respective pixel data of the predetermined pixels; and a finger contact detecting unit determining whether the finger is separated from the fingerprint sensor based on the summation of deviations and a predetermined threshold value.

Abstract: A disclosed device includes a manufacturing method of semiconductor device including preparing a semiconductor substrate including semiconductor chip forming regions, scribing regions surrounding these regions, and cutting regions formed in the scribing regions and narrower than the scribing regions, forming check patterns and semiconductor chips, forming a resist film, forming through grooves narrower than the scribing regions and wider than the check patterns and the cutting regions, removing the check patterns with a wet blast process using the resist film and collectively forming grooves at portions of a protection film and the semiconductor substrate facing the through grooves, removing the resist film, forming internal connection terminals on the contacting faces, forming an insulating resin layer, forming a wiring forming face by removing until connecting faces are exposed, forming wiring patterns, and cutting the semiconductor substrate, the insulating resin layer, and a solder resist layer to separat

Abstract: An antenna apparatus is disclosed that includes an antenna element having an inverted teardrop shape and configured to be fed with electrical power from an external power source; a ground element coupled to the antenna element; and a holding member configured to hold at least the top portion of the antenna element or a surface of a conical portion of the antenna element against the ground element.

Abstract: An antenna apparatus is disclosed that includes a feeding portion; a looped antenna element connected to the feeding portion; and a resistor inserted into the looped antenna element.

Abstract: A thermal conductive member includes linear high thermal conductivity materials; a first solder layer provided at first end sides of the linear high thermal conductivity materials; and a second solder layer provided at second end sides of the linear high thermal conductivity materials; wherein at least one of the first end sides and the second end sides of the linear high thermal conductivity materials are connected to the first solder layer or the second solder layer.

Abstract: A method for fabricating a semiconductor device includes the steps of (a) forming a plasma of a gas having carbon and fluorine, and forming an internal insulation film provided with a fluorine-doped carbon film formed on a substrate using the plasma; (b) forming a metal film on the internal insulation film; (c) etching the metal film according to a pattern to form a hard mask; (d) forming a concave part in the fluorine-doped carbon film by etching the fluorine-doped carbon film using the hard mask; (e) forming a film formation of a wiring material on the substrate for filling the concave part with the wiring material; (f) removing an excess part of the wiring material and the hard mask on the fluorine-doped carbon film for exposing a surface of the fluorine-doped carbon film; and (g) removing an oxide formed on the surface of the fluorine-doped film.

Abstract: A disclosed on-off valve includes a valve body having two openings that may place a process chamber and an evacuation apparatus in pressure communication with each other; a closure element located inside the valve body and adapted to close one of the two openings; a seal member provided in the closure element and adapted to seal the one of the two openings when the closure element closes the one of the two openings; a linear motion driver that linearly moves the closure element; a retreat portion located away from the two openings; and a pivotal motion driver adapted to pivot the closure element between a first position corresponding to the one of the two openings and a second position corresponding to the retreat portion; wherein the closure element is moved to the retreat portion by the linear motion driver and the pivotal motion driver in order to stay at the retreat portion when the closure element is away from the one of the two openings.

Abstract: A female connector for supplying received power has a recess, terminals including power terminals for supplying the power, a locking mechanism to lock a male connector that is inserted into the recess in a mated state in response to insertion of the male connector into the recess, and a switching mechanism to supply the received power to the power terminals in an ON state and to insulate the power terminals from the received power in an OFF state. The switching mechanism is permitted to make a transition to the ON state only when the locking mechanism is locking the male connector in the mated state.

Abstract: An inserting connector includes a plurality of plug electrodes where plug connecting terminals are provided at first ends of the plug electrodes and plug terminals are provided at second ends of the plug electrodes, the plug connecting terminals being configured to be connected to a board, the plug terminals being configured to be connected to jack terminals; wherein the plug connecting terminals extend in a direction perpendicular to a surface of the board; the plug terminals extend in a movable direction where the plug terminals are attached to or detached from the jack terminals; the plug electrodes are bent at an angle ? in longitudinal directions of the plug electrodes, the angle ? being greater than 0 degrees and less than 90 degrees.

Abstract: A method for manufacturing a coordinate detector having a resistive film formed on a substrate formed of an insulating material and a common electrode for applying a voltage to the resistive film. The substrate includes a quadrangular shape. The method includes the steps of a) forming first resistive film removal regions by removing predetermined first regions of the resistive film provided along a peripheral edge of the substrate, b) forming the common electrode on the first resistive film removal regions, c) applying voltage to the resistive film, d) measuring an electric potential of the resistive film, e) calculating second resistive film removal region data according to the measured electric potential, and f) forming second resistive film removal regions by irradiating a laser beam to predetermined second regions of the resistive film according to the calculated second resistive film removal region data.

Abstract: An image processing apparatus includes an input part to input data which is a target of an image processing, an output part to output a result of the image processing, a first filter to control an input process of data from the input part depending on the input part, and a second filter to control an output of data to the output part depending on the output part. A marking type information which is to be added to a predetermined image is specified with respect to the second filter, a marking image is created based on the marking type information, and the marking image is synthesized with respect to an image which is output from the output service. The second filter instructs output of an image with respect to the output service. An application is formed by connecting the first filter and the second filter.

Abstract: A disclosed transfer apparatus includes an endless belt to transfer a recording member by attaching the recording member on a surface thereof by an electrostatic force; a driving device to rotate the endless belt; and a holding device to temporarily hold the recording member to hinder a movement thereof caused by a movement of the endless belt rotated by the driving device so that a part of the recording member slides on the surface of the endless belt.