Abstract: On a wiring board 21, first and second semiconductor detection device arrays 22a and 22b are arranged along a depth direction (Y-axial direction). Each of the first and the second semiconductor detection device arrays 22a and 22b is composed by arranging six semiconductor detection devices 231 through 236 in one line in an arrangement direction (X-axial direction). Guard members 28a and 28b are arranged one on each end in the arrangement direction. In the semiconductor detection devices 231 through 236 of the first and the second semiconductor detection device arrays 22a and 22b, a kth (k is one of the number from 1 to 6) semiconductor detection device 23k from a reference line Xa is arranged by being shifted from others by ½ of a gap PT of the semiconductor detecting devices 231 through 236 in the arrangement direction.

Abstract: According to the present invention, a makeup simulation system applying makeup to a video having an image of the face of a user captured thereon is characterized by image capturing means for capturing the image of the face of the user and outputting the video, control means for receiving the video output from the image capturing means, performing image processing on the video, and outputting the video; and display means for displaying the video output from the control means, wherein the control means includes face recognition means for recognizing the face of the user from the video based on predetermined tracking points; and makeup processing means for applying a predetermined makeup on the face of the user included in the video based on the tracking points and outputting the video to the display means.

Abstract: A heater controlling apparatus for controlling supply of alternating current power to at least one heater that heats a heating object includes a detection unit configured to detect a temperature of the heating object, a determining unit configured to determine a proportion of lighting time for lighting the heater based on the detected temperature and a preset target temperature of the heating object, and a control unit configured to control the supply of alternating current power to the heater based on both a control cycle and one or more lighting patterns, the heater being lit according to the one or more lighting patterns defined for each control cycle, and both the control cycle and the lighting pattern varying in response to the determined proportion of lighting time.

Abstract: A connector includes a ground contact formed by a plate-shaped conductor member extending in a longitudinal direction of the connector, and a plurality of signal contact pairs arranged on both sides of the ground contact, with two signal contacts forming each signal contact pair arranged side by side along the longitudinal direction. The ground contact may include a plurality of first lead parts alternately extending towards mutually opposite sides of the plate-shaped conductor member.

Abstract: A socket includes a first relay board mounted on a mounting board, a second relay board detachably mounted on the first relay board, and a frame part fixed to the first relay board. The frame part positions and holds the first and second relay boards, and positions detachably and holds an object of connection on the second relay board. The first relay board includes first and second conductor layers on its first and second surfaces, respectively. The second conductor layer is electrically connected to the mounting board. The second relay board includes third and fourth conductor layers on its first and second surfaces, respectively; and first and second connection terminals with a spring characteristic on the third and fourth conductor layers, respectively. The first and second connection terminals contact the object of connection and the first conductor layer, respectively, to electrically connect the object of connection and the mounting board.

Abstract: An image forming apparatus includes a latent image forming part configured to form a latent image on an image carrier; a developing part configured to form a toner image by developing the latent image on the image carrier; a first transferring part configured to transfer the toner image on the image carrier to a surface of a transferring medium or a first intermediate transferring part; a second transferring part configured to transfer the toner image on the first intermediate transferring part onto a second intermediate transferring part; a third transferring part configured to transfer the toner image on the second intermediate transferring part onto a third intermediate transferring part; and a fourth transferring part configured to transfer the toner image on the third intermediate transferring part onto a rear surface of the transferring medium.

Abstract: A connector includes first and second connector parts to be connected to each other. A plate-like terminal provided in the first connector part is maintained at a power supply voltage or a ground potential. A plug connected to a signal line is supported by a first insulation part provided on the plate like terminal. The plug includes a protrusion part protruding from the first insulation part. A first terminal is configured by a plate spring supported by a second insulation part provided in the second connector part. The first terminal has an extreme end part to be engaged with a side surface of the protrusion part when the first and second connector parts are connected to each other. A second terminal for power supply or ground is supported by the second insulation part to contact with the plate-like terminal when the first and second connector parts are connected to each other.

Abstract: A manufacturing method of a wiring board includes a sticking layer forming step; a resist film forming step of forming a resist film on an upper surface of the sticking layer, the resist film having an opening exposing the upper surface of the sticking layer; a metal layer forming step of forming a metal layer, so as to cover an upper surface of the resist film and cover a side surface of the resist film and the upper surface of the sticking layer forming the opening for forming the wiring; a plating film forming step of filling with a plating film the opening for forming the wiring; a metal layer and plating film removing step; a resist film removing step; and a sticking layer removing step of removing the sticking layer of an unnecessary part not covered with the metal layer, after the resist film removing step.

Abstract: An antenna apparatus is disclosed that includes an antenna element having a teardrop shape and configured to be fed with electrical power from an external power source; and a ground element coupled to the antenna element, wherein the antenna element includes one or more nonconductive portions.

Abstract: A connector for a first wiring board of a first module type apparatus and a second wiring board of a second module type apparatus, the connector providing electrical connection between the first wiring board of the first module type apparatus and the second wiring board of the second module type apparatus when the first module type apparatus and the second module type apparatus are engaged with each other, the connector includes a housing; a first terminal; and a second terminal.

Abstract: In an image forming device including a first rotary member arranged to drive an intermediate transfer belt, a first motor arranged to rotate the first rotary member, and a second rotary member arranged to transfer a toner image formed on the intermediate transfer belt to a recording sheet, a torque command value detecting unit detects a torque command value to the first motor. A setting unit sets up a lower limit of the torque command value. A judgment unit determines whether a detected torque command value exceeds the lower limit. A control unit controls driving of the second rotary member when the detected torque command value exceeds the lower limits so that a difference between a surface speed of the intermediate transfer belt and a peripheral speed of the second rotary member falls within a predetermined range.

Abstract: A semiconductor chip laminated body includes a wiring board having a connecting terminal; a plurality of semiconductor chips laminated on the wiring board, each of the semiconductor chips having a pad; conductive connecting members having first end parts connected to the pads of the corresponding semiconductor chips and second end parts projecting from side surfaces of the corresponding semiconductor chips; and a conductive member configured to connect the connecting terminal of the wiring board and the second end parts of the conductive connecting members; wherein conductive materials are exposed at the side surfaces of the semiconductor chips; and a gap is provided between the side surfaces of the semiconductor chips and the conductive member.

Abstract: An image forming part performs an image forming operation. A higher-order component sends an image forming request to perform the image forming operation of said image forming part. A control part controls the image forming part based on the image forming request received from the higher-order component. The control part controls the image forming part to perform a deactivation standby operation to stand by for a predetermined time while the image forming part is continuously set in an operating state after the image forming part completes the image forming operation, without querying the higher-order component about an image forming operation to be performed subsequently.

Abstract: A wiring board includes a plate-shaped resin member; chip connection pads provided in the resin member, the chip connection pads having connection surfaces electrically connected to electrode pads provided on a semiconductor chip, the connection surfaces being situated in substantially the same plane as a first surface of the resin member, the first surface being a side where the semiconductor chip is mounted; pads provided in a portion of the resin member, the portion being situated outside an area where the chip connection pads are formed; lead wirings connected to the pads; and conductive wires sealed by the resin member, the conductive wires electrically connecting the chip connection pads and the pads to each other.

Abstract: A semiconductor package includes a wiring board and a semiconductor device mounted on the wiring board. At least one penetration hole extends from one surface of the semiconductor chip to an opposite surface of the semiconductor chip. A penetration electrode is situated inside the penetration hole without contacting a wall of the penetration hole. The penetration electrode has one end fixed to the one surface of the semiconductor chip and an opposite end protruding from the opposite surface of the semiconductor chip. A connection terminal is formed on the opposite end of the penetration electrode and electrically connected to the wiring board.

Abstract: A system for assisting a collaborative activity includes a plurality of work interfaces, a role management unit, a workflow management unit, a collaborative activity registration unit, and an activity context management unit situated between the plurality of work interfaces and the collaborative activity registration unit to receive entered information from one of the work interfaces, to associate shared information contained in the entered information with user information provided by the role management unit and an activity content provided by the workflow management unit to create collaborative activity information, and to cause the collaborative activity registration unit to register the collaborative activity information.

Abstract: An ultraviolet radiation detector 10, detecting an ultraviolet radiation transmitted through or reflected from a measurement sample 15 from a light beam including at least the ultraviolet radiation, is characterized by spectral means 19 for spectrally splitting the ultraviolet radiation from the light beam and photodetection means 20 for detecting the ultraviolet radiation spectrally split by the spectral means 19, the photodetection means 20 including a photoelectric surface detecting only the ultraviolet radiation and formed of an element selected from In, Ga, N, Al, O and Cs.

Abstract: A jack connector includes pairs of jack signal contacts and jack ground contacts arranged alternately, and a plug connector includes pairs of plug signal contacts and plug ground contacts arranged alternately. Respective contacts of each pair of jack signal contacts come into contact with respective contacts of each pair of plug signal contacts, and each jack ground contact comes into contact with each plug ground contact. In a first contact structure, each jack ground contact comes into contact with each plug ground contact at a first position, and in a second contact structure each jack ground contact comes into contact with each plug ground contact at a second position apart from the first position along an extending direction of the plug ground contact.

Abstract: Plural detection boards are stacked and fixed. The detection board has a wiring board, a semiconductor detection device fixed on an upper surface of the wiring board and configured to detect radiation, and a spacer fixed on the upper surface of the wiring board. Each of the detection boards is provided so that the semiconductor detection device and the spacer have a designated positional relationship. In addition, the spacers are stacked and matched in an X-Y plane surface with each other so that the detection boards are fixed by fixing members.

Abstract: A film deposition apparatus for depositing a film on a substrate by performing a cycle of alternately supplying at least two kinds of reaction gases that react with each other on the substrate to produce a layer of a reaction product in a vacuum chamber is disclosed. The film deposition apparatus includes a ring-shaped locking member that may be provided in or around a wafer receiving portion of a turntable in which the substrate is placed, in order to keep the substrate in the substrate receiving portion.