Patents Represented by Attorney Jack A. Kanz
  • Patent number: 5466970
    Abstract: A spring clip having a flat base and a spring portion extending from the base portion intermediate its ends supporting a finger is used to hold an electronic device package in thermal contact with a heat sink by hooking one end of the base into a groove in the heat sink.
    Type: Grant
    Filed: August 24, 1992
    Date of Patent: November 14, 1995
    Assignee: Thermalloy, Inc.
    Inventor: Matthew C. Smithers
  • Patent number: 5458231
    Abstract: Display and handling packages for use in protecting delicate three-dimensional stickers during transportation and display are formed by a longitudinal rib having spaced patches of silicon on which the three-dimensional stickers are mounted and two folding sides having a reflective surface thereon extending from the rib which cover and protect the stickers mounted on the rib during transportation and which open for exhibit of the stickers when the package is on display.
    Type: Grant
    Filed: April 26, 1994
    Date of Patent: October 17, 1995
    Inventors: Paul Belokin, Martin P. Belokin, Norman P. Belokin
  • Patent number: 5428897
    Abstract: A mounting spring clamp for securing a heat sink to a device package is secured to the heat sink by positioning the central body portion of the spring clamp in an attachment clip. The clip is compressed and positioned in a groove of the heat sink. The clip comprises a semi-circular shaped seat with ears extending from both sides of the seat and is made from a flexible material. Compression of the ears reduces the seat diameter, thereby trapping the spring's central body, and also creates spring force in the ears, thereby trapping the clip between the fins of the heat sink. The mounting spring has an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: July 4, 1995
    Assignee: Thermalloy, Inc.
    Inventors: William D. Jordan, Matthew C. Smithers
  • Patent number: 5427764
    Abstract: High temperature reactions are conducted within a high pressure reaction vessel. The interior surfaces of the high pressure containment vessel are protected from the high temperature and corrosive effects of the reaction by causing the reactants to converge in a vortex which contains the highest reaction temperature within the central portions of the reactor. A toroidal reaction vessel is disclosed in which the reactants are directed into a vortex at the axis of origin of the torus by flow guides.
    Type: Grant
    Filed: March 31, 1994
    Date of Patent: June 27, 1995
    Assignee: RPC Waste Management Services, Inc.
    Inventor: John S. Barber
  • Patent number: 5422789
    Abstract: A sheet metal device for mounting a component on a circuit board is formed by stamping to defining a head portion and a base portion. The head portion is formed for insertion into a slot in a component such as a heat sink and the base portion is formed for insertion into a printed circuit board. The head portion has spade-form members which engage the walls of the slot and retain the head portion in the slot. The component is mounted on a printed circuit board by inserting the base portion into an aperture in the printed circuit board and soldering the base portion to the reverse surface of the board.
    Type: Grant
    Filed: November 2, 1993
    Date of Patent: June 6, 1995
    Assignee: Redpoint Thermalloy Limited
    Inventors: Francis E. Fisher, Robin D. Johnson, William D. Jordan
  • Patent number: 5419710
    Abstract: Ball grid array devices are mounted in a burn-in and test socket which has a top surface with windows for the ball terminals depending from the ball grid array device. Contact fingers mounted on the base of the socket extend through a cam plate and into the windows from the opposite side of the top surface. When the cam plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals. The ends of the contact members are curved to contact the ball terminals between the center of the ball terminal and the surface of the ball grid array device, thus retaining the device in the socket.
    Type: Grant
    Filed: June 10, 1994
    Date of Patent: May 30, 1995
    Inventor: Wayne K. Pfaff
  • Patent number: 5415679
    Abstract: Microdroplets of liquids at elevated temperatures are formed by transferring the liquid to an electrostrictive ejection device and applying an electric field which induces a second order elastic strain in the ejection device. The ejection device responds by ejecting generally spherically-shaped microdroplets. The ejection device comprises an electrostrictive transducer having an orifice through which the liquid is ejected. Drive electronics apply an excitation electric field to the electrostrictive transducer which causes a second order elastic strain in the electrostrictive transducer independent of the polarity of the electric field.
    Type: Grant
    Filed: June 20, 1994
    Date of Patent: May 16, 1995
    Assignee: MicroFab Technologies, Inc.
    Inventor: David B. Wallace
  • Patent number: 5411602
    Abstract: Spherical solder drops having precise and accurate shape are formed by an ejection device and solidified to form solder balls for making solder pastes. The diameters of the solidified solder balls are determined by an excitation signal applied to the ejection device and changes in the diameter of the orifice in the ejection device. A solder paste is produced by mixing solidified solder balls of a single diameter or a combination of several different diameters with a carrier.
    Type: Grant
    Filed: February 17, 1994
    Date of Patent: May 2, 1995
    Assignee: MicroFab Technologies, Inc.
    Inventor: Donald J. Hayes
  • Patent number: 5400711
    Abstract: Foreign particles are removed from the plate cylinder of an offset press by interconnecting two ink form rollers friction driven by the plate roller and/or a vibrating roller to rotate in unison at different surface velocities. The connection between the form rollers maintains a fixed ratio between the surface velocities of the rollers which is other than 1:1 and causes the surface of at least one of the form rollers to wipe the surface of the plate.
    Type: Grant
    Filed: June 6, 1994
    Date of Patent: March 28, 1995
    Assignee: Dahlgren USA, Inc.
    Inventor: Norman H. Kemp
  • Patent number: 5386338
    Abstract: A mounting spring clamp for securing a heat sink to a device package is secured to the heat sink by positioning the central body portion of the spring clamp in an attachment clip. The clip is compressed and positioned in a groove of the heat sink. The clip comprises a semi-circular shaped seat with ears extending from both sides of the seat and is made from a flexible material. Compression of the ears reduces the seat diameter, thereby trapping the spring's central body, and also creates spring force in the ears, thereby trapping the clip between the fins of the heat sink. The mounting spring has an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.
    Type: Grant
    Filed: December 20, 1993
    Date of Patent: January 31, 1995
    Assignee: Thermalloy, Inc.
    Inventors: William D. Jordan, Matthew C. Smithers
  • Patent number: 5381990
    Abstract: Releasable suction cup assemblies for use in supporting an object on a smooth surface are formed by a cup body which has a duct passing therethrough and a valve element for selectively opening the duct whereby the vacuum of the suction cup can be released for repositioning the suction cup. The valve extends through the duct and is threaded on one end to receive a threaded fastener which is used to move the valve element into a sealing position and to secure the suction cup to an object. The stem portion of the suction cup may have an annular slot therein and an expanded lip which is deformed outwardly by inserting a plug in the slot.
    Type: Grant
    Filed: November 5, 1993
    Date of Patent: January 17, 1995
    Inventors: Paul Belokin, Martin P. Belokin, Norman P. Belokin
  • Patent number: 5377902
    Abstract: Solder interconnection arrays for joining a plurality of metallic surfaces located on a first surface to a plurality of metallic surfaces located on a second surface are provided which reduce the amount of stress on particular areas of the interconnect array caused by shear forces between the surfaces.
    Type: Grant
    Filed: January 14, 1994
    Date of Patent: January 3, 1995
    Assignee: MicroFab Technologies, Inc.
    Inventor: Donald J. Hayes
  • Patent number: 5372935
    Abstract: An alkaline solution containing a complex of C.sub.30 H.sub.31 ClN.sub.6 is used as a specific indicator for detecting the presence of Candida spp. When Candida yeast bodies are introduced into the indicator solution, the yeast bodies are stained and form a blue or violet precipitate.
    Type: Grant
    Filed: June 29, 1993
    Date of Patent: December 13, 1994
    Assignee: Pearl Medical Science, Inc.
    Inventor: Charles L. Capps
  • Patent number: 5371652
    Abstract: A spring clamp and insulating shoe assembly is used to secure a finned heat sink to an electronic device package. The spring clamp body fits between or around fins or pins extending from one face of a heat sink and carries an insulating shoe which fits around the edge of the device package and has a lip which engages the opposite face of the device package to urge the device package and heat sink into mutual contact.
    Type: Grant
    Filed: April 5, 1994
    Date of Patent: December 6, 1994
    Assignee: Thermalloy, Inc.
    Inventors: Donald L. Clemens, Keith Mandell
  • Patent number: 5366594
    Abstract: Plant wastes such as rice hulls which are high in cellulose and silica are converted into a slurry of water and a silicate cross-linked cellulose poller by digestion under heat and pressure in the presence of sodium ions and a sulfite. The slurry is treated with conventional foaming agents to form a foamed product expanded in volume which may be formed into any desired shape or size by extrusion, molding or casting. The composition of the product of the conversion process is represented by the formula C.sub.7 H.sub.12 O.sub.7 (OCH.sub.3.2 NaHSiO.sub.3).
    Type: Grant
    Filed: May 4, 1992
    Date of Patent: November 22, 1994
    Assignee: Biofoam Industries, Inc.
    Inventor: Charles Capps
  • Patent number: 5365654
    Abstract: Two or more bodies of sheet-like material are secured together with a single rivet-like fastening device which has an expanded head, a shank extending from the expanded head and a chamfer at the junction of the expanded head and the shank having a radius which is larger adjacent the head and which has bosses extending radially therefrom. An aperture is formed in the first body of material which substantially conforms to the radial dimensions of the shank and the shank is inserted into the aperture. A shaped aperture having radial dimensions which cooperate with the shank to define voids adjacent the shank is formed in the second body of material and the shank inserted into the shaped aperture. The shank is then axially compressed to force the first body over the chamfer and deform part of the first body into the voids in the second body, thus locking the first and second bodies together.
    Type: Grant
    Filed: May 10, 1993
    Date of Patent: November 22, 1994
    Assignee: Thermalloy, Inc.
    Inventor: Keith R. Moulton
  • Patent number: 5362679
    Abstract: Solderable connections are formed in a grid array pattern on the surface of a plastic package by modifying conventional lead frame assemblies so that the outer ends of the leads terminate at the bottom surface of the package and forming solder pads or balls on the ends of the leads. Conventional lead frames are used and, after modification, are encapsulated using conventional plastic packaging techniques to form plastic packages with solderable terminal ends arranged in an interconnection array on one surface of the package.
    Type: Grant
    Filed: July 26, 1993
    Date of Patent: November 8, 1994
    Assignee: VLSI Packaging Corporation
    Inventor: Gene F. Wakefield
  • Patent number: 5358128
    Abstract: A display rack is mounted to an internal surface of transparent panel in refrigerated vault to support and display bottles through the transparent panel. The display rack has a back wall for mounting the rack and a ledge extending from the back wall which has a generally horizontal portion adjacent the back wall and a upwardly deflected portion distal from the back wall. A plurality of slots are formed in the ledge for receiving the neck portions of the bottles. Each slot is of a size adapted to receive the neck portion of a bottle but smaller than the top portion used sealing the bottle, whereby the edges of the slots in the ledge can support the bottle at its neck and the body portion of the body of the bottle can be easily grasped for selection and removal from the display rack.
    Type: Grant
    Filed: November 22, 1993
    Date of Patent: October 25, 1994
    Inventors: Paul Belokin, Martin P. Belokin, Norman P. Belokin
  • Patent number: D353294
    Type: Grant
    Filed: November 22, 1993
    Date of Patent: December 13, 1994
    Inventors: Paul Belokin, Martin P. Belokin, Norman P. Belokin
  • Patent number: D357227
    Type: Grant
    Filed: September 24, 1993
    Date of Patent: April 11, 1995
    Assignee: Thermalloy, Inc.
    Inventor: Matthew C. Smithers