Spring clip for retaining thermal contact between an electronic device package and a heat sink

- Thermalloy, Inc.
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Description

FIG. 1 is a front perspective view of a spring clip for retaining thermal contact between an electronic device package and a heat sink showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a side elevational view thereof, the opposite side view being a mirror image of the view of FIG. 5; and,

FIG. 6 is a bottom plan view of my spring clip for retaining thermal contact between an electronic device package and a heat sink.

Referenced Cited
U.S. Patent Documents
D275178 August 21, 1984 Yeater
D301334 May 30, 1989 Dupasquier et al.
D307540 May 1, 1990 McCarthy
2724882 November 1955 Poupitch
4964198 October 23, 1990 McCarthy
5068764 November 26, 1991 Bland et al.
5138524 August 11, 1992 Smithers
Patent History
Patent number: D357227
Type: Grant
Filed: Sep 24, 1993
Date of Patent: Apr 11, 1995
Assignee: Thermalloy, Inc. (Dallas, TX)
Inventor: Matthew C. Smithers (Lewisville, TX)
Primary Examiner: Joel Sincavage
Attorney: Jack A. Kanz
Application Number: 0/13,459
Classifications
Current U.S. Class: Heat Sink (D13/179); D/8395