Abstract: A method for the polymerization of free radically polymerizable vinyl monomers involves polymerizing free radically (co)polymerizable vinyl monomers in a batch reaction under essentially adiabatic conditions, and utilizing scavenger monomer to reduce undesirable residual monomer.

Abstract: Methods of forming patterned coatings are disclosed. The methods include the steps of disposing a composition onto a substrate to form a liquid coating on the substrate and removing or providing energy through a first pattern of areas on the liquid coating to form a topographically patterned coating, the topographical pattern corresponding to the first pattern of areas.

Abstract: An electromagnetic wave shielding material and a sheet using the same are described. Also described is a gel state electromagnetic wave shielding material including an ionic liquid, and fine particles capable of reflecting, suppressing or absorbing an electromagnetic wave suspended in the ionic liquid. The electromagnetic wave shielding material may provide both high electromagnetic interference shielding ability and flexibility when used in sheet form, and in some applications, may provide flame and heat resistance.

Abstract: The disclosure pertains to compositions and methods for modifying or refining the surface of a wafer suited for semiconductor fabrication. The compositions include working liquids useful in modifying a surface of a wafer suited for fabrication of a semiconductor device. In some embodiments, the working liquids are aqueous solutions of initial components substantially free of loose abrasive particles, the components including water, a surfactant, and a pH buffer exhibiting at least one pKa greater than 7. In certain embodiments, the pH buffer includes a basic pH adjusting agent and an acidic complexing agent, and the working liquid exhibits a pH from about 7 to about 12. In further embodiments, the disclosure provides a fixed abrasive article comprising a surfactant suitable for modifying the surface of a wafer, and a method of making the fixed abrasive article. Additional embodiments describe methods that may be used to modify a wafer surface.

Abstract: Structured fixed abrasive articles including a multiplicity of three-dimensional abrasive composites fixed to the abrasive article, the abrasive composites further including a multiplicity of ceria abrasive particles having a volume mean diameter from 100 to 500 nanometers (nm) in a matrix material, the matrix material further including a polymeric binder and a multiplicity of surface treated ceria filler particles having a volume mean diameter less than 100 nm. Also provided are methods of making and using structured fixed abrasive articles according to the disclosure.

Abstract: Provided are several polishing compositions useful for modifying a surface, such as a semiconductor wafer suitable for fabrication of a semiconductor device, especially when used in fixed abrasive planarization techniques. The polishing compositions include a synergistic mixture of water, an oxidizing agent, a complexing agent, and metal ions. Also provided are various methods of surface planarization.

Abstract: Provided are several polishing compositions useful for modifying a surface, such as a semiconductor wafer suitable for fabrication of a semiconductor device, especially when used in fixed abrasive planarization techniques. The polishing compositions include a synergistic mixture of water, an oxidizing agent, a complexing agent, and metal ions. Also provided are various methods of surface planarization.

Abstract: Provides a non-white construction surface comprising a substrate, a first reflective coating on at least a portion of an outer surface of the substrate, the coated substrate exhibiting a minimum direct solar reflectance value of at least about 25%, and a second reflective coating on at least a portion of the first reflective coating, wherein the combination of the first reflective coating and the second reflective coating provide the substrate with a CIELAB L* lightness value of less than about 69, and at least one of (i) a reflectivity of at least about 20% at substantially all points in the wavelength range between 770 and 2500 nm; and (ii) a summed reflectance value of at least 7000 as measured in the range between 770 and 2500 nm inclusive. Also provided are various substrates having the coatings described as well as methods of providing the described construction surfaces.

Abstract: The disclosure relates to abrasive articles useful in chemical-mechanical polishing (CMP), the articles including a substrate with opposite major surfaces, an abrasive material overlaying at least a portion of at least one of the major surfaces, and at least one of a radio frequency identification (RFID) tag, a RFID tag reader, or a sensor for providing CMP information to a transmitter positioned near the substrate, the transmitter positioned near the substrate and adapted to wirelessly receive CMP information and wirelessly transmit the CMP information to a remote receiver. The disclosure also relates to a CMP pad conditioner for wirelessly communicating CMP information to a remote receiver, a CMP process monitoring system for wirelessly communicating CMP information to a remote receiver, and a method for conditioning a CMP pad using a CMP process monitoring system for wireless communicating CMP information to a remote receiver.

Abstract: Multilayer articles having acoustical absorbance properties are disclosed. Methods of making and using the multilayer articles are also disclosed.

Abstract: In one aspect, the invention provides a foam thermal interface material comprising a foamed film, the film comprising a blend of polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000 and at least 25 percent by weight of thermally conductive filler, said film having a void volume of at least 5 percent of the volume of said foamed film.

Abstract: An acoustic system for applying vibratory energy including a horn connected to an ultrasonic energy source. The horn defines an overall length and wavelength, and at least a leading section thereof is comprised of a ceramic material. The leading section has a length of at least ? the horn wavelength. In one preferred embodiment, an entirety of the horn is a ceramic material, and is mounted to a separate component, such as a waveguide, via an interference fit. Regardless, by utilizing a ceramic material for at least a significant portion of the horn, the ultrasonic system of the present invention facilitates long-term operation in extreme environments such as high temperature and/or corrosive fluid mediums. The present invention is useful for fabrication of metal matrix composite wires.

Abstract: There is provided a multi-layered thermally conductive sheet having superior thermal conductivity and flame retardancy as well as superior handleability and adhesion even without using any of a halogen-containing flame retardant, red phosphorous, and silicone resin. The sheet includes a first acrylic thermally conductive sheet layer, and a second acrylic thermally conductive sheet layer disposed on one or both surfaces of the first layer. The first layer has an Asker C hardness of 60 or more and is obtained by curing a composition containing a metal hydrate at a content of 10% by volume or more, and the second layer has an Asker C hardness of 50 or less and is obtained by curing a composition containing a metal hydrate at a content of 5% by volume or more. The first layer has half or less thickness with respect to thickness of the whole sheet.

Abstract: The invention is a die comprising a die body. The die body defines an internal cavity and an applicator slot. The cavity is in fluid communication with the applicator slot. A plurality of gas relief passages are in fluid communication with the internal cavity.

Abstract: The disclosure relates to a method for forming a die having an applicator slot for translating an applicator liquid through the die. The slot is in fluid communication with a die cavity. An expansible chamber device is disposed within the die cavity and changes volume in response to changes in fluid pressure within the expansible chamber device, which may be regulated by a means for controlling the volume of the expansible chamber device. In some embodiments, the die has a single rectangular applicator slot, and the expansible chamber device is an expandable cylindrical tube disposed within the die cavity. In other embodiments, the fluid within the expansible chamber device may be selected to be a compressible gas. In further embodiments, the fluid within the expansible chamber device may be selected to be an incompressible liquid.

Abstract: Techniques are described for estimating the propagation velocity through a surface acoustic wave sensor. In particular, techniques which measure and exploit a proper segment of phase frequency response of the surface acoustic wave sensor are described for use as a basis of bacterial detection by the sensor. As described, use of velocity estimation based on a proper segment of phase frequency response has advantages over conventional techniques that use phase shift as the basis for detection.

Abstract: A heat resistant masking tape, comprising (1) a heat resistant backing film layer; and (2) a pressure-sensitive adhesive layer disposed on the heat resistant backing film layer, wherein the pressure-sensitive adhesive layer comprises a polymer resulting from polymerizing and cross-linking a monomer mixture comprising an alkyl (meth)acrylate with an alkyl group having 4 to 15 carbon atoms, glycidyl (meth)acrylate and (meth)acrylic acid, the glycidyl (meth)acrylate being present in an amount of 2 to 13% by weight of the total weight of monomers and the (meth)acrylic acid being present in an amount of 1 to 7% by weight of the total weight of monomers.

Abstract: The invention relates to thermally conductive greases that may contain carrier oil(s), dispersant(s), and thermally conductive particles, wherein the thermally conductive particles are a mixture of at least three distributions of thermally conductive particles, each of the at least three distributions of thermally conductive particles having an average (D50) particle size which differs from the other average particle sizes by at least a factor of 5.

Abstract: An apparatus for dispensing a fluid onto a moving substrate is disclosed. In one embodiment, the apparatus is a die comprising a die body having a cavity therein, wherein the cavity is in fluid communication with an applicator slot. The die is then oriented such that the applicator slot is positioned so as to dispense the fluid onto the moving substrate. The fluid is introduced into the die cavity such that the fluid is dispensed onto the moving substrate through the applicator slot. At least one end of the slot includes means for preventing lateral widening of the dispensed fluid. In another embodiment, means are disposed at both ends of the applicator slot. The apparatus is particularly useful when the capillary number characteristic for dispensing the fluid onto the moving substrate is less than 0.5.

Abstract: A die assembly includes a die housing having a multiplicity of inner wall sections defining a die cavity, an inlet passageway passing through the die housing in fluid communication with the die cavity, and an outlet passageway passing through the die housing in fluid communication with the die cavity at a position distal from the inlet passageway. The die assembly also includes an insert removably received in the die cavity. The insert includes a body portion having a multiplicity of outer wall sections, and at least one flow channel is formed between at least one inner wall section of the die housing and each opposite outer wall section of the body portion of the insert; fluid communicates between the external supply and each of the flow channels and the outlet passageway. Also provided is a die insert and a method of purging gas from a die having an insert.