Patents Represented by Attorney James A. Lucas
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Patent number: 7281676Abstract: A shredding apparatus includes a shredding drum capable of quickly and effectively clearing large tracts of land. Several cutter blocks are positioned in axial rows across the periphery of the drum and are secured to the drum by welding. The blocks in each row are evenly spaced from one another and may be offset from the axial direction of the drum by angle of between about 4°°and about 10°. Each of the blocks includes a cutter tooth. Each tooth includes a shank that is removably anchored in a hole in each block. The teeth are typically reinforced with an extension projecting back from the face. The blocks are placed around the drum to enable the teeth collectively to fully sweep the ground surface during each revolution of the drum.Type: GrantFiled: August 19, 2005Date of Patent: October 16, 2007Inventor: John T. Bennington
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Patent number: 7160433Abstract: The cathodic protection system of a concrete structure (22) uses sacrificial anodes such as zinc, aluminum and alloys thereof embedded in mortar. A humectant is employed to impart high ionic conductivity to the mortar in which the anode is encapsulated. Lithium nitrate and lithium bromide and combinations thereof are preferred as the humectant. The anode (10) is surrounded by a compressive, conductive matrix (12) incorporating a void volume between 15% and 50% to accommodate the sacrificial corrosion products of the anode. A void space of at least 5% of the total volume of the anode (12) may be provided opposite to the active face of the anode. Synthetic fibers such as polypropylene, polyethylene, cellulose, nylon and fiberglass have been found to be useful for forming the matrix. A tie wire is used to electrically connect the anode to the reinforcing bar.Type: GrantFiled: September 20, 2002Date of Patent: January 9, 2007Inventor: John E. Bennett
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Patent number: 6831252Abstract: An electric soldering iron useful for heavy duty applications, such as sheet metal lamination, comprises a soldering tip held between two carbon electrodes which are electrically connected through busses to a source of low voltage, variable amperage current. The carbon electrodes are preferably graphite. An additional feature allows the tip to pivot to various angles with respect to the handle to provide optimum comfort and soldering efficiency. The body of the soldering tip is provided with longitudinal grooves into which the shaped carbon electrodes are slid and are secured in place with suitable fasteners, such as bolts. Alternatively, the electrodes may have a contour corresponding to the surface of the body of the soldering tip and are then clamped or otherwise secured to the body. Another option is to use electrodes that are shaped as cylindrical plugs seated in blind recesses in the body of the soldering tip.Type: GrantFiled: January 22, 2004Date of Patent: December 14, 2004Inventor: Dennis M. Crookshanks
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Patent number: 6829697Abstract: An embedded processor complex contains multiple protocol processor units (PPUs). Each unit includes at least one, and preferably two independently functioning core language processors (CLPs). Each CLP supports dual threads thread which interact through logical coprocessor execution or data interfaces with a plurality of special purpose coprocessors that serve each PPU. Operating instructions enable the PPU to identify long and short latency events and to control and shift priority for thread execution based on this identification. The instructions also enable the conditional execution of specific coprocessor operations upon the occurrence or non occurrence of certain specified events.Type: GrantFiled: September 6, 2000Date of Patent: December 7, 2004Assignee: International Business Machines CorporationInventors: Gordon Taylor Davis, Marco C. Heddes, Ross Boyd Leavens, Mark Anthony Rinaldi
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Patent number: 6815126Abstract: A PWB or multilayer board with circuit traces is treated by a process that serves to reduce the incident of failure of the board. The process includes the steps of applying a thin commoning layer of copper onto a catalyzed surface of the board substrate and the circuit lines. A photoresist is then applied over the commoning layer after which the photoresist is removed only from the commoning material over the circuit lines. A thin layer of a more noble metal, such as nickel, is electrodeposited over the exposed conductive layer. This is followed by a gold layer electrodeposited over the nickel in close registry therewith. The process provides the traces with a conforming nickel/gold layer that extends down the side of the traces. This reduces the tendency of a subsequent copper etch step from undercutting the nickel/gold, thereby causing slivers that could cause short circuiting between adjacent circuit patterns.Type: GrantFiled: April 9, 2002Date of Patent: November 9, 2004Assignee: International Business Machines CorporationInventors: Edmond Otto Fey, Raymond Thomas Galasco, Thomas Richard Miller, Anita Sargent
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Patent number: 6815085Abstract: A capacitive element for a circuit board or chip carrier is formed from a pair of conductive sheets having a dielectric component laminated therebetween. The dielectric component is formed of two or more dielectric sheets, at least one of which can be partially cured followed by being fully cured. The partially cured sheet is laminated to at least one other sheet of dielectric material and one of the sheets of conductive material. The total thickness of the two sheets of the dielectric component does not exceed about 4 mils and preferably does not exceed about 3 mils. The use of two or more sheets of dielectric material makes it very unlikely that two or more defects in the sheets of dielectric material will align, thus greatly reducing the probability of a defect causing a failure in test or field use.Type: GrantFiled: May 12, 2003Date of Patent: November 9, 2004Assignee: International Business Machines CorporationInventors: Bernd K. Appelt, John M. Lauffer
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Patent number: 6806033Abstract: Photoimagable polymers, as well as dielectric materials and their manufacture and use in the production of printed circuit boards and printed wiring boards are described. The polymers comprise between about 30 and about 70 parts of a polyfunctional resin and between about 70 and about 30 parts of the condensation product of an epihalohydrin and a bisphenol based on 100 parts by weight of resin. The polymer is cured by a photocationic initiator. It is characterized by a glass transition temperature of at least about 140° C. and a flex fatigue life of at least about 10,000 cycles at a 3% strain. Optionally, less than 10 parts of a third specified epoxy resin may be added to the mixture to improve flexibility without decreasing the glass transition temperature of the polymer.Type: GrantFiled: January 8, 2002Date of Patent: October 19, 2004Assignee: International Business Machines CorporationInventors: Vladimir Jakubek, Heike Appelt, David John Russell, Cory J. Ruud
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Patent number: 6786239Abstract: A storage hub is described for the temporary storage of a cap of the type typically threaded onto the outlet of a spigot to prevent leakage. The hub comprises a generally U-shaped body that can be mounted on the valve stem of a spigot, on top of the handle. Alternatively, it can be mounted on the wall of the structure on which the spigot is mounted. The hub has a generally cylindrical body provided with external threads onto which the cap is threaded. Several means are described for securing the hub to the spigot or to the adjoining wall structure. Among them is the use of magnetic attraction, a suitable adhesive, a nail, or a threaded fastener. An alternative is for the hub and the valve handle to be a unitary structure. The hub can be made from a polymer, an elastomer or metal.Type: GrantFiled: June 27, 2003Date of Patent: September 7, 2004Inventor: Charles A. Welsh
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Patent number: 6739046Abstract: A method is provided for connecting two conductive surfaces in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive surface, applying a dielectric insulation material over the first conductive surface such that the dendrites are exposed through the insulation material to leave a substantially planar surface of exposed dendrites, and placing a second conductive surface on top of the exposed dendrites. The second conductive surface may be a surface metal, a chip bump array, or a ball grid array. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection and planarization manufactured in accordance with the present invention.Type: GrantFiled: May 22, 2000Date of Patent: May 25, 2004Assignee: International Business Machines CorporationInventors: Bernd K. Appelt, Saswati Datta, Michael A. Gaynes, John M. Lauffer, James R. Wilcox
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Patent number: 6739027Abstract: A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil, and layering the coated foil with a second conductor foil on top of the coating of dielectric material. Also claimed is an electronic circuit package incorporating at least one embedded capacitor manufactured in accordance with the present invention.Type: GrantFiled: April 20, 2000Date of Patent: May 25, 2004Assignee: International Business Machines CorporationInventors: John M. Lauffer, Konstantinos Papathomas
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Patent number: 6738509Abstract: A system and method for generating bounded-loss color transformations employed in the compression and decompression of multi-spectral images is provided. The bounded-loss color space transformations provide transformations from a first color space to a second color space and back to the first color space with bounded loss or error. The bounded loss or error allows for the near lossless compression and reconstruction of multi-spectral images transformed from a first color space to a second color space and ultimately back to the first color space.Type: GrantFiled: March 28, 2002Date of Patent: May 18, 2004Assignee: International Business Machines CorporationInventors: Boon-Lock Yeo, Joan LaVerne Mitchell
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Patent number: 6721187Abstract: A multi-layer electronic structure includes an increased capacity for the attachment of active or passive devices thereto. This is achieved by creating a three-dimensional grid of connection points to electrically couple active or passive surface mounted devices to edge mounted devices. The grid pattern is useful with any laminate including circuit cards, ceramic modules and flexible circuits. The variety of electrical devices that may be connected to the cross-sectional substrate includes, but is not limited to, chips such as semiconductor chips, diodes, resistors, capacitors and printed wiring boards. The structure can be used to more rapidly pass data, such as optical data that is transmitted from a spectroscope through a VCSEL laser and the electronic structure to a computer for diagnostics and analysis. A stepped arrangement of circuitized laminates is described for this purpose.Type: GrantFiled: March 16, 2001Date of Patent: April 13, 2004Assignee: International Business Machines CorporationInventors: Richard Ronald Hall, How Tzu Lin, Christopher John Majka, Norman Corey Seastrand, Matthew Francis Seward, Ronald Verne Smith
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Patent number: 6698477Abstract: A stump grinding apparatus having a split cutting wheel includes several replaceable cutter blocks secured to the periphery of the wheel. One or more replacement teeth are removably anchored in holes in each block and may also be mounted on holes in the side of the split wheel as well. The teeth are typically provided with a hardened cutting face, and are reinforced with an extension projecting back from the face. Each tooth includes a shank which fits into one of the holes. The shank contains a groove which receives a spring clip or a spring pin for securing the tooth in the hole. The wheel periphery contains individual recesses that are shaped to receive the cutter blocks. Each block includes means for insuring alignment of the block in the corresponding recess. The block is wedged tightly into its recess to reduce the likelihood of accidental removal.Type: GrantFiled: December 31, 2001Date of Patent: March 2, 2004Inventor: John T. Bennington
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Patent number: 6665186Abstract: A heat dissipating system utilizes a thin layer of a high conductivity liquid metal to provide cooling for electronic sub-assemblies, such as semiconductor chips. The liquid metal preferably is gallium or its alloy which transfers heat from the chip to a heat sink or heat spreader. The system includes one or more vents that allow for filling and venting of the space occupied by the liquid. It also utilizes a flexible seal, such as an O-ring or a membrane held in place with a retainer ring, or a plug that seals the filling vent. The seal flexes to accommodate expansion and contraction of the liquid, as well as phase changes from the liquid phase to the solid phase.Type: GrantFiled: October 24, 2002Date of Patent: December 16, 2003Assignee: International Business Machines CorporationInventors: Varaprasad V. Calmidi, Eric A. Johnson, Randall J. Stutzman
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Patent number: 6658729Abstract: An electronic subassembly comprises a printed circuit board and an electronic module, particularly a ceramic module, electrically connected to one another through a planar interposer. The interposer comprises an insulator sheet and electrical spring elements joining contact sites on the module with contact pads on the PCB. The invention includes modifications that improve the integrity of electrical connections between the printed circuit board and the electronic module. This is achieved by compensating for non-planarity between the surfaces of the interposer and the module, particularly resulting from a convex curvature of the module, by minimizing relative movement, such as rocking in the x-z and y-z planes. It also includes modifications to the suspension of the module within the interposer housing to reduce the effects caused by any sliding that may occur between the interposer and the module in the x-y plane.Type: GrantFiled: January 29, 2002Date of Patent: December 9, 2003Assignee: International Business Machines CorporationInventor: William Louis Brodsky
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Patent number: D486183Type: GrantFiled: January 9, 2002Date of Patent: February 3, 2004Inventor: Alan Lee DeMaison
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Patent number: PP14750Abstract: Rutzan is a new and distinct variety of evergreen holly distinguished in that it combines from three species (Ilex aquifolium, Ilex rugosa, and Ilex pernyi), desirable landscape and production traits which distinguish it from all other forms of Ilex. Plants of the new variety exhibit a moderate rate of growth, develop a densely branched narrow to moderately broad conical form of compact size, possess small to medium sized dark green spiny leaves, produce an abundance of bright red fruit well displayed on wood of the previous season's growth, and are outstanding for their exceptionally high level of winter hardiness.Type: GrantFiled: July 11, 2002Date of Patent: May 4, 2004Assignee: Rutgers, The State UniversityInventors: Elwin R. Orton, David A. Gant
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Patent number: PP14752Abstract: A new and distinct strain of apple, designated Weaver cultivar, originated as a limb sport on a ‘Fulford Gala’ tree. The fruit are 1.5 to 2.5 cm larger than parent tree fruit, which will greatly improve fresh fruit packout over the existing ‘Gala’ strains. The tree is easier to manage than other ‘Gala’ strains, as tree height, trunk diameter and terminal shoot length are reduced.Type: GrantFiled: January 7, 2003Date of Patent: May 4, 2004Assignee: Adams County Nursery, Inc.Inventor: Edgar A. Weaver
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Patent number: PP15219Abstract: A cultivar of dogwood tree is characterized by a unique combination of red floral bracts and a dwarf rounded shape.Type: GrantFiled: December 11, 2002Date of Patent: October 12, 2004Assignee: Rutgers, The State UniversityInventors: Elwin R. Orton, David A. Gant
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Patent number: PP15295Abstract: A new and distinct variety of peach tree, named ‘Weiser’, originated as a limb sport on a ‘Bellaire’ tree. It is a midseason variety maturing five days after Loring and seven to 10 days after ‘Bellaire’. The fruit has an attractive bright yellow-flesh, and is freestone, large sized, and flavorful. The surface of the fruit is uniformly attractive orange-red over a yellow background.Type: GrantFiled: October 29, 2003Date of Patent: November 2, 2004Inventor: M. Everett Weiser