Abstract: A method of making a circuitized substrate for use in an electronic package wherein the substrate, e.g., ceramic, includes more than one conductive layer, e.g., copper, thereon separated by a suitable dielectric material, e.g., polyimide. Each layer includes its own conductive location(s) which are designed for being directly electrically connected, e.g. using solder, to respective contact sites on a semiconductor chip to form part of the final package. Significantly, the resulting package does not include interconnections between the conductive layers at the desired contact locations; these locations, as mentioned, instead being directly connected to the chip.

Abstract: A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a “through via.

Abstract: The invention aims to implement the Load Balancing/Backup function in a Multi-Users environment and to allow a remote station to have an alternate route through another Token Ring DLC to backup. By directing the connection to another route, it postpones the connection from a remote station to a Token Ring user through a first selected Token Ring DLC for a predetermined delay. For that purpose, each Token Ring DLC stores parameters of the remote station that has an unsuccessful connection in its own Connection Cache Table. In this way, when a Test frame is received in each DLC, this latter checks in the Connection Cache Table before responding to the Test frame. The Test frame is ignored and no Test response is sent back to the remote station when the remote station is identified in the table so as to allow the remote station to detect an alternate route with a backup DLC if it exists.

Abstract: Infections of toe nails and finger nails caused by fungi and yeast are treated topically by applying a liquid mixture of natural ingredients to the infected area. The mixture includes the essential oils of between about 10 and about 17 ml. of tea tree; between about 10 and about 17 ml. of lavender oil, and between about 1 and about 3.5 ml. of eucalyptus oil in a total of 30 ml. of liquid. All of the ingredients preferably are pharmaceutical grade for the best results. The liquid mixture is typically applied to the affected area once or twice a day for a period of at least two months until the infection is cured. A few drops of the composition can also be placed into the toe box of shoes and the toe portion of slippers when not being worn to prevent re-infection.

Abstract: A probe system for electrical contact testing of a row of densely spaced wire bonding pads is provided comprising a plurality of probes, with each probe having a tip offset from the probe center axis. The probes may be mounted in a housing having an upper die and a lower die, and the lower die may be offset from the upper die. The probes are pivotally mounted in the holes of the upper die, and the probe bodies are convexly curved and extend down into the holes of the lower die. The bevel tipped probes may be arranged in two staggered and parallel rows of probes, with the tip of each probe oriented along the centerline formed between the two row of probes. The probes may be closely spaced in each row. The tips of the probes in one row are oriented 180 degrees with respect to the probes in the opposite row. The tips of each probe may also comprise a tip located along the center axis or a double bevel surface forming a tip at the apex of the two bevel surfaces.

Abstract: An electronic subassembly includes a printed circuit board and an electronic module, particularly a ceramic module, electrically connected to one another through a planar interposer. The interposer includes an insulator sheet and electrical spring elements joining contact sites on the module with contact pads on the PCB. The invention includes modifications that improve the integrity of electrical connections between the printed circuit board and the electronic module. This is achieved by compensating for non-planarity between the surfaces of the interposer and the module, particularly resulting from a convex curvature of the module, by minimizing relative movement, such as rocking in the x-z and y-z planes. It also includes modifications to the suspension of the module within the interposer housing to reduce the effects caused by any sliding that may occur between the interposer and the module in the x-y plane.

Abstract: A method of forming a capacitive core structure and of forming a circuitized printed wiring board from the core structure and the resulting structures are provided. The capacitive core structure is formed by providing a central conducting plane of a sheet of conductive material and forming at least one clearance hole in the central conducting plane. First and second external conducting planes are laminated to opposite sides of the ground plane with a film of dielectric material between each of the first and second external planes and the central conducting plane. At least one clearance hole is formed in each of the first and second external planes. A circuitized wiring board structure can be formed by laminating a capacitive core structure between two circuitized structures. The invention also relates to the structures formed by these methods.

Abstract: A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a “through via.

Abstract: An apparatus and a method are described for dislodging and removing welding slag from the tip of an electric arc welder, particularly a robotically controlled welder. When a torch finishes its welding cycle, it is moved to a designated cleaning point where it is positioned between two positioning blocks. A double lobed cam on the output shaft of a reciprocating air motor turns against a cam follower. The cam causes the cam follower to compress a spring during the lift portion of the cam cycle, and allows the spring to drive the hammer into impact with the tip during the fall portion of the cycle The repeated impact with the tip serves to loosen the slag from the nozzle. The slag then falls and is collected in a basket located beneath the positioning blocks. The motor rotates at a speed of about 200-1000 rpm to move the hammer about {fraction (3/16)}″ for a cleaning cycle of about 5-10 seconds.

Abstract: The described invention provides a method and apparatus for coating uniform films on substrates and curing the coatings on the surface. Within an enclosed chamber the object to be coated is positioned and a sufficient amount of liquid material is provided into the chamber to cover the surface of the object to be coated. The excess liquid material is then evacuated from the chamber at a controlled rate to leave a coating of material on the surface of the object.

Abstract: A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a “through via.

Abstract: The present invention provides an organic chip carrier particularly useful with flip chips. The chip carrier comprises an organic dielectric layer, a first layer of circuitry disposed on the dielectric layer, an organic conformational coating disposed over the first layer of dielectric and the first layer of circuitry, and a layer of fine line circuitry. The fine line circuitry has a line width of about 2.0 mil or less, preferably about 1.0 mil or less, and more preferably about 0.7 mil, and a space between lines of about 1.5 mil or less, preferably about 1.1 mil or less. Preferably the dielectric layer is free of woven fiber glass. The conformational coating preferably has a dielectric constant of about 1.5 to about 3.5, and a percent planarization of greater than about 30%. The invention also relates to methods of making the dielectric coated chip carrier.

Abstract: A system and method for compressing and decompressing multi-spectral images in two color spaces is provided. The system and method employ the transformation, compression and reconstruction of color space components from which difference data between the original color space components and the reconstructed color space components may be derived. A compressed data stream including compressed color space data and compressed difference data in a another color space is generated. The difference data may be utilized to reconstruct a lossless or near lossless image of the original.

Abstract: A new and distinct cultivar of Dracaena fragrans stednarii characterized by its leaves having a richer dark green color, gently corrugated margins, and a broader width than those of its parent, and its cane having a color graduated from a brownish grey at the base to a green, partially smooth, surface at the tip.

Abstract: This species of Viburnum dentatum turns brilliant red in October and maintains its red color late into November in USDA hardiness zone 5. In early June, it produces dense, flat white clusters of flowers, which last for 3 weeks. The shrub is very cold hardy and can withstand temperatures of −20° F.(−28° C.) without damage.

Abstract: A new cultivar of Hamamelis virginiana characterized by its exceptionally large and abundant flowers borne on large, dense clusters closely spaced on slender twigs.

Abstract: A Bromelaid hybrid having intense red purple bracts and an appearance similar to that of of the European hybrid ‘Amaranth’ but lighter in color and smaller in size.

Abstract: A new cultivar of Hamamelis mollis plant is characterized by exceptionally large and abundant flowers with a rich fruity fragrance. It is also unique in that the leaves promptly drop in the fall, not persisting in an unsightly condition throughout the winter as in ordinary Hamamelis mollis seedlings.

Abstract: A new and distinct strain of apple, designated ‘Rankin Red’, originated as a limb sport on a ‘Yataka’ tree. It matures 5 days earlier than ‘Yataka’ and 5 weeks earlier than ‘Fuji.’ Other significant improvements over ‘Yataka’ and ‘Fuji’ include increased color intensity, a higher percentage of red color, greater color uniformity, less russet and a smoother finish.

Abstract: A Bromeliad hybrid comprising an improvement over its parent, Guzmania ‘Irene’. The foliage is denser and more compact than that of ‘Irene’, and the leaves are darker, thicker and wider. The plant is a tetraploid, and is faster growing than ‘Irene’, reaching marketability in 10-12 months. The primary bracts are wider and closer together making the spike fuller and more compact. The bract color is darker and clearer than that of ‘Irene’.