Patents Represented by Attorney James A. Lucas
  • Patent number: 6224711
    Abstract: A method for assembling a flip-chip package having a low stress chip comprises providing a laminate chip carrier having a chip electrically connected thereon, applying the underfill material between the chip and the laminate chip carrier, providing a cover plate and applying an adhesive to the cover plate or chip or both, placing the cover plate adjacent to the chip such that the adhesive contacts the chip and the cover plate, and curing the underfill material together with the adhesive. The resultant flip-chip package has low internal stress and experiences enhanced fatigue life during thermal cycling.
    Type: Grant
    Filed: August 25, 1998
    Date of Patent: May 1, 2001
    Assignee: International Business Machines Corporation
    Inventors: Timothy F. Carden, Aleksander Zubelewicz
  • Patent number: 6222884
    Abstract: A system and method for compressing and decompressing multi-spectral images in two color spaces is provided. The system and method employ the transformation, compression and reconstruction of color space components from which difference data between the original color space components and the reconstructed color space components may be derived. A compressed data stream including compressed color space data and compressed difference data in a another color space is generated. The difference data may be utilized to reconstruct a lossless or near lossless image of the original.
    Type: Grant
    Filed: March 10, 2000
    Date of Patent: April 24, 2001
    Assignee: International Business Machines Corporation
    Inventors: Joan LaVerne Mitchell, Boon-Lock Yeo
  • Patent number: 6215649
    Abstract: A capacitive element for a circuit board or chip carrier having improved capacitance and method of manufacturing the same is provided. The structure is formed from a pair of conductive sheets having a dielectric component laminated therebetween. The dielectric component is formed of two or more dielectric sheets at least one of which can be partially cured or softened followed by being fully cured or hardened. The lamination takes place by laminating a partially cured or softened sheet to at least one other sheet of dielectric material and one of the sheets of conductive material. The total thickness of the two sheets of the dielectric component does not exceed about 4 mils and preferably does not exceed about 3 mils; thus the single dielectric sheets does not exceed about 2 mils and preferably does not exceed about 1.5 mils in thickness.
    Type: Grant
    Filed: November 5, 1998
    Date of Patent: April 10, 2001
    Assignee: International Business Machines Corporation
    Inventors: Bernd K. Appelt, John M. Lauffer
  • Patent number: 6196866
    Abstract: A vertical probe for use in testing multiple chips carried on a wafer comprises a body of dielectric material having a testing surface and an output surface spaced from the testing surface. The dielectric body includes at least one chamber defining an opening in the output surface, and the rim of the opening is formed by a lip of the dielectric material. The device also includes multiple contacts which pass through the testing surface and which are snap fit in holes in the rim. A unibody construction for the dielectric body is described.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: March 6, 2001
    Assignee: International Business Machines Corporation
    Inventor: Paul M. Gaschke
  • Patent number: 6198842
    Abstract: A system and method for generating bounded-loss color transformations employed in the compression and decompression of multi-spectral images is provided. The bounded-loss color space transformations provide transformations from a first color space to a second color space and back to the first color space with bounded loss or error. The bounded loss or error allows for the near lossless compression and reconstruction of multi-spectral images transformed from a first color space to a second color space and ultimately back to the first color space.
    Type: Grant
    Filed: June 19, 1997
    Date of Patent: March 6, 2001
    Assignee: International Business Machines Corporation
    Inventors: Boon-Lock Yeo, Joan LaVerne Mitchell
  • Patent number: 6191952
    Abstract: Flip-chip electronic packages are provided with a compliant surface layer, normally positioned between an underfill layer and a substrate such as a chip carrier or a printed circuit board or card, which reduces stress and strain resulting from differences in coefficients of thermal expansion between the chip and substrate. The compliant layer, which should have a storage modulus of less than ½ the modulus of the substrate, preferably between about 50,000 psi and about 20,000 psi, may comprise rubbery materials such as silicone, virco-plastic polymers such as polytetrafluoroethylene or interpenetrating polymer networks (IPNs). Photosensitive IPNs used for solder marks are preferred.
    Type: Grant
    Filed: April 28, 1998
    Date of Patent: February 20, 2001
    Assignee: International Business Machines Corporation
    Inventors: Miquel A. Jimarez, Eric A. Johnson, Li Li, Jan Obrzut
  • Patent number: 6186521
    Abstract: A child restraint system for use with shopping carts and the like equipped with a child carrier utilizes a pair of shoulder straps joined at one end to a crotch strap which passes between the legs of a child and attaches to the rear of the cart at the front of the child carrier. The shoulder straps can be quickly and easily adjusted vertically to accommodate children of different sizes in the carrier. The restraint system can be retrofitted onto an existing carrier-equipped cart, or can be integrated into the design of the cart.
    Type: Grant
    Filed: March 22, 1999
    Date of Patent: February 13, 2001
    Inventors: David J. Divoky, Donna Divoky, Nicholas M. Divoky
  • Patent number: 5977642
    Abstract: A method is provided for connecting two conductive surfaces in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive surface, applying a dielectric insulation material over the first conductive surface such that the dendrites are exposed through the insulation material to leave a substantially planar surface of exposed dendrites, and placing a second conductive surface on top of the exposed dendrites. The second conductive surface may be a surface metal, a chip bump array, or a ball grid array. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection and planarization manufactured in accordance with the present invention.
    Type: Grant
    Filed: August 25, 1997
    Date of Patent: November 2, 1999
    Assignee: International Business Machines Corporation
    Inventors: Bernd K. Appelt, Saswati Datta, Michael A. Gaynes, John M. Lauffer, James R. Wilcox
  • Patent number: 5939786
    Abstract: The present invention provides uniform dendrites, on circuit features instead of large, elongated dendrites along the edges of the circuit features. The dendrites are formed by a method comprising the following steps: providing a substrate having circuitry disposed thereon; applying a photoresist to the substrate at a thickness which is preferably about the height of the intended dendrite height; imaging the photoresist to expose all or a portion of the top surface of the circuitry; forming the dendrites; and removing the photoresist. The photoresist which is employed to control the dendrite height is applied so that the photoresist either: abuts the edge of the circuitry leaving the top surface of the circuitry exposed; or abuts the edge of the circuitry and extend over the top edge of the circuitry so that a portion of the top surface of the circuitry is exposed; or does not touch the circuitry nor an area surrounding the base of the circuitry.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: August 17, 1999
    Assignee: International Business Machines Corporation
    Inventors: Francis Joseph Downes, Jr., Raymond Thomas Galasco, Jaynal Abedin Molla
  • Patent number: 5934160
    Abstract: A device for removing a cork from a stoppered bottle utilizes a lever and a cam to drive a helical corkscrew into a cork, to withdraw the cork, and then to strip the cork from the corkscrew. The device comprises a housing having a bell-shaped opening to be placed over the mouth of the bottle. A lever has a semi-circular gear at one end which is pivotally joined to the housing. The gear engages a reciprocating, and preferably a rotatable gear rack whereby pivotal movement of the lever causes the gear rack to move linearly up and down through the housing. The lower end of the gear rack is joined to the corkscrew the free end of which extends through a cam collar and engages a cam follower therein. The cam collar is movable vertically within the housing from a lower position to a raised position, but is restricted against rotation relative to the housing. Two or more flexible fingers have notches therein which engage and disengage corresponding projections on the cam collar.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: August 10, 1999
    Assignee: Faye Fong Chen
    Inventor: Jeremy H. Gibson
  • Patent number: 5931996
    Abstract: The invention concerns colored aluminum pigments comprising flake-form aluminum substrates which are coated with a metal oxide layer. The pigments are produced by a process which involves the steps of mixing a ground color pigment with a flake-form aluminum in the presence of a solvent. A metal acid ester is then added to the mixture and is then hydrolyzed to form a metal oxide layer on the aluminum substrate, followed by removal of the solvent and drying of the pigment. The pigments are useful as special-effect pigments in paints, lacquers, coatings, plastic materials, printing inks and cosmetic preparation.
    Type: Grant
    Filed: September 2, 1997
    Date of Patent: August 3, 1999
    Assignee: Eckart-Werke Standard
    Inventors: Wolfgang Reisser, Denise Mebarek
  • Patent number: PP11892
    Abstract: A new cultivar of Guzmania named ‘GUZ 224 ’ characterized by having rich red-purple floral bracts, longitudinally variegated leaves and a compact arrangement of scape and floral bracts.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: May 29, 2001
    Inventor: Jeffrey C. Kent
  • Patent number: PP11894
    Abstract: A new cultivar of Guzmania named ‘Guz 222’ characterized by a plant form that is vase shaped; plant height of about 22-24 inches and leaves measuring 16¾ inches in length and 2½ inches in width.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: May 29, 2001
    Assignee: Kent's Bromeliad Nursery, Inc.
    Inventor: Jeffrey C. Kent
  • Patent number: PP11895
    Abstract: A new cultivar of Guzmania named ‘GUZ 201’ characterized by a plant form that is vase shaped; plant height of about 20-22 inches, and leaves measuring 21 inches in length a 1½ inches in width.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: May 29, 2001
    Inventor: Jeffrey C. Kent
  • Patent number: D411082
    Type: Grant
    Filed: November 3, 1997
    Date of Patent: June 15, 1999
    Assignee: Faye Fong Chen
    Inventor: Jeremy H. Gibson
  • Patent number: PP10989
    Abstract: A new and distinct Prunus plant characterized by having a very vigorous growth, being one third larger than sibling seedlings in the same row, and for its very abundant, large white flowers, unusual in the species which normally bears pink flowers. The autumn foliage turns a brilliant red color in late October. It is the most cold hardy of the white Japanese cherry trees.
    Type: Grant
    Filed: August 22, 1997
    Date of Patent: June 29, 1999
    Assignee: Treesearch
    Inventor: William Flemer, III
  • Patent number: PP11055
    Abstract: A new and distinct Forsythia variety characterized by the very large size of the flowers which have a rich golden color and with much broader petals than any other Forysthia variety known to me. The flowers are very dense on the twigs so that the shrub is a solid mass of gold when in bloom. It forms a dense, rounded shrub, broader than tall. The flower buds survive cold winter in USDA hardiness zone 5-A when the flower buds of Forsythia intermedia varieties have been killed.
    Type: Grant
    Filed: August 22, 1997
    Date of Patent: September 7, 1999
    Assignee: Treesearch
    Inventor: William Flemer, III
  • Patent number: PP11071
    Abstract: A new and distinct sport of apple tree, named AS510, originated as a limb mutation on a `201 Stayman` tree. It matures earlier than `Stayman` and develops red color ten days earlier than the parent sport. Other significant improvements over standard sports include increased color intensity, a higher percentage of red color and smaller levels of russet and scarf skin.
    Type: Grant
    Filed: July 11, 1997
    Date of Patent: September 28, 1999
    Assignee: Adams County Nursery, Inc.
    Inventor: Alfred L. Snapp, Jr.
  • Patent number: PP11097
    Abstract: A new Southern Live Oak of the virginiana species distinguished by its large dark green leaves, fast rate of growth, a central leader supported by strong secondary branching and thicker stem and twig caliper than that of the parent.
    Type: Grant
    Filed: January 2, 1998
    Date of Patent: October 19, 1999
    Assignee: Cherry Lake Tree Farms, Inc.
    Inventor: Michel Sallin
  • Patent number: PP11591
    Abstract: A new and distinct variety of peach tree, designated `R1-T2`, originated as a seedling in a block of `John Boy`. It is a midseason variety maturing 5 to 7 days after `John Boy` and 5 to 7 days before `Loring`. The fruit is yellow-fleshed, freestone, large sized, and flavorful. The surface of the fruit is 70 to 80% attractive orange-red over a yellow-orange background.
    Type: Grant
    Filed: December 22, 1998
    Date of Patent: October 24, 2000
    Assignee: Adams County Nursery, Inc.
    Inventor: Phillip D. Baugher