Abstract: A method and apparatus is disclosed for mapping the relevant material properties of a log, such as knot location and extent. The outer shape of the log under bark is also revealed using this method, and the boundary between the heartwood and sapwood is accurately mapped. The apparatus includes three x-ray sources and arrays of x-ray detectors, for measuring the attenuation of the wood in the log. Deviations in attenuation are related to changes in density, which are indicative of knots and other defects. Accurate estimates of shape, density and knot location render improved sawing decisions at the headrig of a sawmill, which improve the yield of high quality lumber from a given log. The techniques may also be used in a system for sorting logs according to quality.

Abstract: Semiconductor packages including at least two semiconductor dies are disclosed. A first die is mounted on a substrate, which may be a metallized laminate or a leadframe. A rigid support structure is mounted on the substrate over the first die. The support structure may be thermally coupled to the substrate, and also may be electrically coupled to the substrate. A second die is mounted on the support structure, which spaces the second die away from the first die. Encapsulant fills the volume within the support structure, including the vertical space between the pair of dies. In an alternative package embodiment, a heat spreader formed of a flexible metal sheet may be thermally coupled between the two stacked dies. The heat spreader transfers heat from the first and second dies to a heat sink of the substrate. The support structure and the heat spreader mitigate the transfer of heat between the first and second dies.

Abstract: Base ballast resistors used to control thermal runaway are each bypassed with a series-resonant inductor and capacitor pair. In some embodiments each inductor and capacitor pair is unique. In other embodiments a common inductor is used for each inductor and capacitor pair.

Abstract: Semiconductor devices and methods of forming such devices are disclosed. The devices include a package allowing for increased thermal dissipation. In one embodiment, the device includes a power MOSFET die that is electrically connected to a portion of the substrate with a metal strap. The die and at least portions of the strap and substrate are encapsulated in an insulative encapsulant, such as molded plastic. A top surface of the strap is exposed to the environment through the encapsulant. The exposed surface may have grooves formed therein, or fins formed thereon, to facilitate heat transfer.

Abstract: There is provided a semiconductor package and method for fabricating the same.

Abstract: Programmable semiconductor elements, such as zener diodes, are used in an optical array. In one embodiment, an array of zener diodes is formed on a substrate surface and selectively zapped (programmed) to create a reflective filament between anode and cathode contacts of the selected zener diodes. Light is then applied to the surface. The reflected (or transmitted) light pattern may be used for conveying optical information or exposing a photoresist layer. In one use of the array to selectively expose a photoresist layer, the array helps to determine which genes have been expressed in a BioChip. Devices other than zener diodes may also be programmed to create a reflective filament for optically conveying information, such as bipolar transistors, MOSFETS, and non-semiconductor devices. The reflective filament can be a portion of a fuse or anti-fuse.

Abstract: A low dropout voltage regulator circuit with non-Miller frequency compensation is provided. The circuit includes an input voltage terminal; an output voltage terminal; an error amplifier having a first input coupled to a reference voltage; a voltage follower coupled to an output of the error amplifier; a pass device; and a feedback network. An input terminal of the pass device is coupled to the input voltage terminal. A control terminal of the pass device is coupled to an output of the voltage follower. An output terminal of the pass device is the output voltage terminal. The feedback network includes two resistors in series between the output voltage terminal and ground. A node between the resistors is coupled to a second input of the error amplifier. A frequency compensation capacitor also is coupled between the output voltage terminal and the node.

Abstract: A semiconductor chip package is disclosed. The package includes a substrate, a metallization layer formed on one side of the substrate and a semiconductor die mounted on the substrate. The semiconductor die is electrically connected to a portion of the metallization layer. A shield element is mounted on the substrate and electrically connected to a portion of the metallization layer.

Abstract: A semiconductor device is disclosed that includes a semiconductor die, a metal leadframe, and a metal strap. A bottom surface of the semiconductor device is on and electrically coupled to a first portion of the leadframe. A first end portion of the metal strap is on and electrically coupled to a top surface of the semiconductor die. An opposite, second end portion of the metal strap is on and electrically coupled to a second portion of the leadframe within a recess of the second portion of the leadframe.

Abstract: Embodiments of a bipolar transistor are disclosed, along with methods for making the transistor. An exemplary transistor includes a collector region in a semiconductor substrate, a base layer overlying the collector region and bound by a field oxide layer, a dielectric isolation layer overlying the base layer, and an emitter structure overlying the dielectric isolation layer and contacting the base layer through a central aperture in the dielectric layer. The transistor may be a heterojunction bipolar transistor with the base layer formed of a selectively grown silicon germanium alloy. A dielectric spacer may be formed adjacent the emitter structure and over a portion of the base layer.

Abstract: A controlled material transport system (MTS) for carrying materials to and from workstations, test equipment, and processing and assembly tools in a common facility. The present invention includes a rigid robot vehicle mountable to a passive track system, which can be routed to service all processing tools on the factory floor. The robot vehicle includes a hoist assembly and gripper assembly, which together perform such functions as picking up magazines, placing magazines, and loading magazines into the processing tools. The hoist assembly is capable of functioning in an operational envelope, which includes any target location within a 3-axis Cartesian coordinate system, to the extent of the range of motion of the hoist assembly. The hoist assembly also provides rigid and controlled z-axis travel, while being compact when retracted. The gripper assembly facilitates loading of the magazines, especially chute style magazines, which are commonly found on many existing processing tools.

Abstract: A light-emitting device includes a GaAs substrate, a light-emitting structure disposed above the substrate and capable of emitting light having a wavelength of about 1.3 microns to about 1.55 microns, and a buffer layer disposed between the substrate and the light-emitting structure. The composition of the buffer layer varies through the buffer layer such that a lattice constant of the buffer layer grades from a lattice constant approximately equal to a lattice constant of the substrate to a lattice constant approximately equal to a lattice constant of the light-emitting structure. The light-emitting device exhibits improved mechanical, electrical, thermal, and optical properties compared to similar light-emitting devices grown on InP substrates.

Abstract: A leadframe and a package including the leadframe are disclosed. At least one lead includes a nonconductive layer on the inner end segment of the lead set back from its inner end. An electrically conductive layer is on a surface of the nonconductive layer. The nonconductive layer electrically isolates the electrically conductive layer from the lead upon which the nonconductive layer is positioned. The lead itself and the electrically conductive layer thereon are separately available for electrical connection to a semiconductor chip. The electrically conductive layer in turn may be electrically coupled to a second lead, with the electrically conductive layer serving as a bridge for an electrical connection between the chip and the second lead.

Abstract: A monolithic AM transmitter is disclosed. An external antenna forms part of a resonance network so that the antenna resonance point is automatically tuned to the transmit frequency. This provides flexibility with no added cost to the transmitter.

Abstract: A multiple chip package and method of making the package allow multiple same size or different size chips to be stacked over each other, thereby creating a thin profile multi-chip package. Chips are attached to one surface of a continuous flexible substrate. The substrate has a metallization layer, which is electrically connected to the chips, such as via bond wires attached to center bond pads of the chips and to bond fingers on the metallization layer. Interconnections, such as solder balls, are attached to the other surface of the substrate and only at the portion opposite to the first chip. The substrate is folded to bring the first chip toward a second chip, which are then attached, such as with an insulative adhesive spacer. If any additional chips remain on the substrate, the substrate is folded to sequentially bring each additional chip toward the surface of the substrate opposite to the preceding chip and is secured thereto.

Abstract: A method and apparatus for connecting optical fibers to waveguides and other optical elements are disclosed. In one embodiment, an optical fiber is modified so as to have opposing orthogonal tapered sidewalls that taper toward a tip of the fiber. An optical connector for the fiber includes a base having a receiving section and a waveguide formed therein. The receiving section is a flared channel having opposing orthogonal tapered sidewalls and a horizontal bottom surface perpendicular to the sidewalls. The waveguide is optically accessible at a narrow inner end of the channel. The angle of taper of the sidewalls of the channel matches the angle of taper of the sidewalls of the optical fiber. When the optical fiber is inserted into the open end of the channel and is moved toward the narrow inner end of the channel, the sidewalls of the fiber and channel come into contact with each other. In addition, a bottom surface of the fiber rests on the horizontal bottom surface of the channel.

Abstract: Embodiments of stackable packages for an electronic device, such as an integrated circuit chip or a micro-machine, are disclosed. The packages may be stacked and electrically interconnected without soldering. The package includes a molded plastic body. Stacking clips are molded into the package body. Leads formed of spring metal are embedded at the bottom of the package so that a surface of the lead is exposed through the mold compound. The leads extend upwards adjacent to the sides of the package body, and extend over the top surface of the package body. A spring member, such as a crook spring, is bent into the leads. The spring member, along with the inherent spring of the spring metal, causes the leads to press against juxtaposed lead portions of a package stacked therewith, which forces the leads of the two packages against each other, thereby forming a secure electrical connection between the packages. A tool for disengaging the interconnected clips of stacked packages also is described.

Abstract: A single chip superhetrodyne AM receiver is disclosed herein. To compensate for process variations in the implementation of the IC, bias currents setting the operating conditions for various amplifiers and other components in the system are adjusted based on frequency control signals in a PLL circuit in the local oscillator. Since the magnitude of the control signal reflects the process variations, the bias currents are adjusted based on the control signal to offset these variations in other portions of the receiver. To further improve the signal to noise ratio of the receiver, the IF filter is tuned within a range so as not to include any integer multiple or integer divisor of the timing reference frequency. Various techniques are described for enabling a complete superhetrodyne AM receiver to be implemented on a single chip which receives an antenna input signal and outputs a digital data signal.

Abstract: A chip carrier package is made by using a laser-ablatable solder mask to cover areas of conductive traces on the surface of a substrate that were left uncovered during conventional processes using photoresist. These areas of the conductive traces are uncovered by using a laser to remove overlying portions of the solder mask. If a YAG laser is used, the conductive traces are removed at the same time the solder mask ablated. However, is a CO2 laser is used, a conventional etching process removes the exposed portions of the traces after the solder mask is ablated.

Abstract: A package for an integrated circuit chip is disclosed, along with structures and methods for making and mounting the package. An exemplary embodiment of the package includes a molded body having leads embedded therein with an aperture adjacent each of the leads. A portion of each lead that is internal to the periphery of the package body is exposed through the corresponding aperture. Electrical connection to the leads is made within the respective corresponding apertures.