Patents Represented by Attorney, Agent or Law Firm Jane E. Gennaro
  • Patent number: 8338550
    Abstract: A ring-opening metathesis polymerization (ROMP) reaction is disclosed in which a cyclic alkene compound is subjected to ROMP using a ruthenium ROMP catalyst having heterocyclic ligands in the presence of a compound from which such ligands may be derived. The process includes the step of adding sufficient of an acyclic alkene having a carbon-carbon double bond capable of reacting with the catalytic metal moieties attached to the living end of each of the polymer chains generated in the ROMP reaction to end cap the polymer chains and to generate a olefin metathesis catalyst. The process includes reiterating the polymerization steps by adding further amounts of a cyclic alkene compound. The catalyst may be generated in situ from a precursor compound by the addition of a compound from which heterocyclic ligands may be derived by interaction with the precursor compound.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: December 25, 2012
    Assignee: Henkel AG & Co. KGaA
    Inventors: Ezat Khosravi, Alan M. Kenwright, Zhanru Yu, David M. Haigh, Lois Hobson
  • Patent number: 8324319
    Abstract: A cationically polymerizable composition comprising (i) a cationically polymerizable resin, (ii) an onium salt, (iii) an azo or peroxide initiator, exhibits a lower cure temperature upon the addition of (iv) a catalytic or substoichiometric amount of an electron-rich vinyl resin to the reaction.
    Type: Grant
    Filed: May 11, 2010
    Date of Patent: December 4, 2012
    Inventors: Laxmisha M. Sridhar, Osama M. Musa
  • Patent number: 8286465
    Abstract: A composition that will automatically flow (auto-flow) and form a fillet (self-fillet) will have a yield stress within the range of 1.8 Pa to 10 Pa (20 dynes/cm2 to 100 dynes/cm2). Such a composition can be designed by using an appropriate choice of filler, regardless of the resin system used in the composition.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: October 16, 2012
    Assignee: Henkel AG & Co. KGaA
    Inventor: Minghai Wang
  • Patent number: 8278396
    Abstract: A curing agent for epoxy resin has one or more five- or six-membered aromatic rings, and substituted on the one or more five- or six-membered rings at least two functionalities reactive with the epoxy selected from the group consisting of hydroxyl, amine, imidazole, azine, hydrazide, anhydride, and Lewis acid groups. Choice of functionality can provide a mixed polymer network, one with a more densely cross-linked polymer structure having a high Tg, and the other with a more linear polymer structure to contribute to stress reduction.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: October 2, 2012
    Assignee: Henkel Corporation
    Inventors: Pukun Zhu, Puwei Liu
  • Patent number: 8278401
    Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: October 2, 2012
    Assignee: Henkel AG & Co. KGaA
    Inventors: Shengqian Kong, Sarah E. Grieshaber
  • Patent number: 8278449
    Abstract: This invention relates to ruthenium initiators for the ring-opening metathesis polymerization (ROMP) of cyclic olefins that are inactive at room temperature but activatable at elevated temperature (referred to as (“thermally switchable”). In general, these are compounds of ruthenium metal to which are bonded four or five ligands, in which one ligand is a pyridine ring in which the nitrogen is chelated to the ruthenium, or a five or six membered ring incorporating nitrogen and the ruthenium in which the nitrogen is chelated to the ruthenium.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: October 2, 2012
    Assignee: Henkel Corporation
    Inventors: Ezat Khosravi, Osama M. Musa
  • Patent number: 8212369
    Abstract: This invention is a semiconductor wafer having an active side and a back side opposite the active side, which back side is coated with a filled, spin-coatable coating, wherein the coating comprises a resin and a spherical filler characterized by an average particle diameter of greater than 2 ?m and a single peak particle size distribution. In another embodiment the invention is a method for producing a spin-coatable, B-stageable coating with a thixotropic index of 1.2 or less. In a third embodiment the invention is a method for producing a coated semiconductor wafer.
    Type: Grant
    Filed: July 30, 2009
    Date of Patent: July 3, 2012
    Assignee: Henkel AG & Co. KGaA
    Inventor: Eunsook Chae
  • Patent number: 7928245
    Abstract: This invention relates to oligomeric compounds that are prepared by the reaction of a dianhydride with an amino-alcohol to yield an imide-diol intermediate, which is then esterified with a carboxylic acid to form a reactive oligomer.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: April 19, 2011
    Assignee: Henkel AG & Co. KGaA
    Inventors: Osama M. Musa, Brian Marr
  • Patent number: 7902305
    Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an oxetane compound and a cationic initiator.
    Type: Grant
    Filed: June 26, 2008
    Date of Patent: March 8, 2011
    Assignee: Henkel AG & Co. KGaA
    Inventor: Shengqian Kong
  • Patent number: 7887716
    Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: February 15, 2011
    Assignee: Henkel AG & Co. KGaA
    Inventors: Shengqian Kong, Stijn Gillissen
  • Patent number: 7722786
    Abstract: A material for producing a conductive composition comprising polymer particles, conductive particles, and a liquid medium. The material is in a liquid/dispersion form until it is cured at which time it forms an electrically conductive composition. The composition contains larger sized polymer particles along with smaller metal conductive filler particles such as nanoparticle-sized filler particles. The larger polymer particles create excluded volume in the material matrix and reduce the percolation threshold of the conductive filler particles to provide a conductive material with a reduced volume fraction of electrically conductive filler. The electrical conductivity of the material is further increased after heat treatment which causes the conductive filler particles to sinter together to form a highly conductive network.
    Type: Grant
    Filed: February 23, 2007
    Date of Patent: May 25, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Lirong Bao, Allison Xiao, Bin Wei
  • Patent number: 7687119
    Abstract: A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: March 30, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Jie Cao, Donald E. Herr
  • Patent number: 7645637
    Abstract: The invention is based on the discovery that certain self-filleting die attach adhesives are useful in semiconductor die assemblies containing thin die. As used herein, the term “self-filleting” refers to any adhesive that when dispensed and then subjected to suitable cure conditions, will flow and fill up the area between two die or between a die and a substrate while not forming a bulky fillet that can overflow onto the top of the die. In addition, the invention is useful for tight tolerance semiconductor die assemblies, since the fillet from the die-attach adhesives employed in the methods of the invention does not cover bond fingers, thereby causing wire bond yield loss.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: January 12, 2010
    Assignee: Henkel Corporation
    Inventor: Deborah Forray
  • Patent number: 7528404
    Abstract: An assembly of a semiconductor die attached to a substrate is made with a composition comprising compounds that contain an oxazoline functionality and an electron acceptor or an electron donor functionality. Electron donor functionalities include styrenic, cinnamyl, and vinyl ether groups. Electron acceptor functionalities include maleimide, acrylate, fumarate, and maleate groups. An exemplary compound has the structure: formula (I).
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: May 5, 2009
    Assignee: Henkel AG & Co. KGaA
    Inventors: Osama M. Musa, Ruzhi Zhang
  • Patent number: 7468407
    Abstract: Curable compositions exhibit improved adhesion and conductivity by the addition of a metal salt of 8-quinolinol or of an 8-quinolinol derivative as an adhesion and/or conductivity promoter. The metal salt of 8-quinolinol or of an 8-quinolinol derivative is formed by coordination with a metal selected from the group consisting of Cu, Be, Mg, Ca, Sr, Ba, Zn, Cd, Al, Ga, In, TI, Yt, La, Pb, Sb, Bi, Cr, Mo, Mn, Fe, Co, Ni, Pd, Ce, and Pr.
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: December 23, 2008
    Assignee: National Starch and Chemical Investment Holding Copporation
    Inventors: Osama M. Musa, Harry Richard Kuder
  • Patent number: 7462651
    Abstract: A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: December 9, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Jie Cao, Donald E. Herr
  • Patent number: 7456280
    Abstract: Isocyanurate compounds or resins have the structure (I) in which Y is an hydroxyl group —OH or a maleimide group Formula (II) provided that at least one maleimide group is present, and Q is any divalent organic moiety, aliphatic or aromatic.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: November 25, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Osama M. Musa
  • Patent number: 7452943
    Abstract: Polymeric compounds containing an oxetane functionality and a styrenic functionality have the structure in which polymer is a polymeric backbone from which depend the oxetane and styrenic functionalities; m and n are integers from 2 to 500; R1 is a methyl or ethyl group; R2 and R3 are H or a methyl or ethyl group; R4 is a direct bond or a divalent hydrocarbon; W and Z independently are an ether, ester, amide, or carbamate group; and G is hydrogen, or —OR1, —SR1, or —N(R2)(R3), in which R1, R2 and R3 are as described above.
    Type: Grant
    Filed: May 3, 2005
    Date of Patent: November 18, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Osama M. Musa
  • Patent number: 7414103
    Abstract: A linear or cyclic siloxane compound contains pendant carbon to carbon double bonds, Si—H bonds, and pendant oxetane functionality. These compounds have two curing temperatures, one associated with a hydrosilation reaction between the carbon to carbon double bond and the Si—H entity, and the other associated with the ring opening of the oxetane.
    Type: Grant
    Filed: August 16, 2006
    Date of Patent: August 19, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Osama M. Musa
  • Patent number: 7390430
    Abstract: Difunctional oxazoline resins, which may be produced in a convenient one-step reaction from an arylalkylene dinitrile by reaction with an amino alcohol, are used in compositions with an additional curable compound or resin containing one or more carbon to carbon double bonds. The composition can be cured to a thermoset material, the curing mechanism occurring by the zwitterion polymerization of the bisoxazoline resin with the resin containing the one or more carbon to carbon double bonds. The reaction occurs without the need for curing initiators.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: June 24, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Osama M. Musa, Ruzhi Zhang