Abstract: A water-based adhesive that is delivered in a stable one-part system comprises (i) an emulsion of a vinyl and/or acrylic polymer; (ii) a water-dispersed ionic or nonionic polyurethane; (iii) a polyethylenimine; and (iv) a carbodiimide.

Abstract: For use in microelectronics applications, an improvement to an epoxy resin composition to reduce bleeding of the composition when it is applied to a silicon or metal substrate consists in the addition to the composition of a polyhydroxyl compound having two or three hydroxyl groups, or of a monohydroxyl compound that also contains one or more phenyl groups. The hydroxyl compound is present in the composition in a ratio by weight to the flexibilizing compound of from 1:3 to 1:10.

Abstract: This invention relates to flexible epoxy resins characterized by a low ionic contamination, total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkylene or alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities.

Abstract: This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin and 80-20 parts by weight of an aromatic O-glycidyl ether (to a total 100 parts), a curing catalyst, and optionally one or more fillers.

Abstract: A process for the epoxidation of olefins comprises contacting the olefin with urea-hydrogen peroxide in the presence of a rhenium oxide catalyst in an organic solvent.

Abstract: A process for preparing aqueous dispersions of polyurethanes comprises dispersing polyurethane prepolymer containing unreacted --NCO functionality in water with moderate agitation at a temperature at or below 65.degree. C., preferably at or below 38.degree. C., and more preferably within the range 38.degree.-25.degree. C.; simultaneously reducing the agitation to a mild rate and maintaining the temperature within the range 38.degree.-85.degree. C., preferably, 60.degree.-65.degree. C., until the reaction of --NCO with water levels off; adding an effective amount of a quenching agent to react with sufficient --NCO functionality to reduce the number of available --NCO groups that can react with water so that the evolution of CO.sub.2 is reduced or eliminated during storage of the polyurethane dispersion; and at any of the previous sequential steps adding an effective amount of a deaerating agent to reduce or eliminate CO.sub.2 foaming or to liberate any dissolved CO.sub.2 gas.

Abstract: A dissipative waterborne laminating adhesive composition containing no conductive filler and comprising 90 to 99.5% by weight of an adhesive polymer prepared from vinyl or acrylic esters, blends thereof or blends thereof copolymerized with up to 30% ethylene and 0.5 to 10% by weight of a quaternary ammonium salts containing 1 to 7 carbon atoms.

Abstract: This invention relates to flexible epoxy resins that have a structural composition comprising an oligomeric backbone of alkylene or alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities.

Abstract: This invention relates to flexible epoxy resins characterized by a low ionic contamination, total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkylene repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities. The flexible epoxy resins are used in adhesives for microelectronic applications.

Abstract: A nonwoven disposable article is constructed using adhesive compositions containing 1 to 25% of a surfactant, which causes the adhesive composition to exhibit a contact angle of 90.degree. or less and a reduction in surface tension of less than or equal to about 35-40 dynes/cm, giving improved wicking capabilities to the nonwoven.

Abstract: A system of two thick film pastes containing gold, in which the first paste is deposited directly onto a substrate, and the second is deposited directly onto the first, contain Cr.sub.2 O.sub.3 and Bi.sub.2 O.sub.3, which enhance the adhesion to the substrate of the first deposited paste and the solderability of the second deposited paste.

Abstract: A biodegradable binder for nonwoven stock is prepared as an emulsion of 5-200% solids of poly(hydroxybutyrate/hydroxyvalerate) copolymer in water in which the copolymer comprises 70-100 mole percent of 3-hydroxybutyrate and 0-30 percent of 3-hydroxyvalerate.

Abstract: This invention relates to flexible epoxy resins characterized by a low ionic contamination total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities.

Abstract: A process for the epoxidation of olefins comprises contacting the olefin with bis(trimethylsilyl)peroxide in the presence of a rhenium catalyst in an organic solvent.

Abstract: A polyurethane, soluble or dispersible in water, prepared from an organic diisocyante, a diol, and a 2,2-hydroxymethyl-substituted carboxylic acid is neutralized with a cosmetically acceptable organic or inorganic base and formulated into a hair fixative composition containing low amounts of volatile organic solvent.

Abstract: A vehicle system for thick film electrically functional inks comprises esters of tall oil fatty acids substituted for 1-90% of the typical organic solvent.

Abstract: Glycidyl esters are prepared to have low chlorine, chloride, sodium and potassium contamination and a thixotropic index greater than 3.0 by a process that comprises reacting carboxylic mono- or dimer acids with glycidyl alcohols in a molar ratio of 1 to (0.9-4.0) using carbodiimide as the acylating agent and a pyridine-type catalyst. The pyridine-type catalyst is removed by strongly acidic ion exchange resin.