Abstract: A contact is provided in a self-aligned manner to a doped region a semiconductor substrate by first forming a layer of a transition metal-boride compound over a selected region on the substrate. A layer of a transition metal-nitride compound is formed over the layer of transition metal-boride compound, and the structure is heated to drive dopant from the layer of transition metal-boride compound into the substrate. The transition metal-boride/transition metal nitride layers are patterned to leave a contact to the doped region.

Abstract: An electronic component package, including: a multilayer ceramic or glass-ceramic substrate formed of a stacked plurality of generally parallel signal and insulating layers, each of the signal layers comprising an electrically conductive pattern; a cavity in a surface of the substrate sized to accommodate an electronic component with a planar surface of the electronic component disposed substantially planar with the surface of the substrate; and a plurality of electrical conductors extending from the surface of the substrate to selected ones of the signal layers for connecting the electronic component to the signal layers. Thin film wiring is provided for connecting the electronic component to the substrate.

Abstract: A sputtered low copper concentration multilayered, device interconnect metallurgy structure is disclosed herein. The interconnect metallization structure comprises a sputtered aluminum-copper (<2) weight percent copper conductor. In the preferred embodiment, the AlCu conductor has formed on one or both of its surfaces a layer of an intermetallic compound formed from a Group IVA metal and aluminum. The Group IVA metal is deposited by sputtering. Optionally, onto said top intermetallic layer is further deposited a non-reflective, non-corrosive, etch-stop, capping layer.

Abstract: A reprogrammable logic fuse (RLF) based on a 6 device standard Static Random Access Memory (SRAM) cell includes a storage element comprised of four cross coupled FETs. A fifth FET is mounted in a transmission gate configuration between the bit line and a first common node of the storage element. Its gate electrode is connected to the word line. This FET is used to write the appropriate control data in the storage element for bit personality store. A sixth FET is also mounted in a transmission gate configuration between the second common node of the storage element and an output line. Its gate electrode is connected to the input line. This sixth FET ensures that a logical function, e.g. AND/NAND is achieved between the signals available at the second common node and on the input line. Other configurations of said sixth FET are allowed. These reprogrammable logic fuses may be disposed in matrixes to constitute reloadable logic arrays and Reloadable PLAs (RPLAs).

Abstract: A semiconductor structure including a doped semiconductor substrate defining a surface. A buffer layer of epitaxial semiconductor material overlies the substrate surface, the buffer layer having a relatively higher dopant concentration than the substrate and being virtually free from oxygen precipitation. A layer of intrinsic semiconductor material overlies the buffer layer, and a device layer of epitaxial semiconductor material is situated on the intrinsic layer. The device layer is formed to have a relatively lower dopant concentration than the first layer. Isolation regions extend from a surface of the device layer into the buffer layer for forming an electrically isolated device region in the device layer. At least one active device is formed in the isolated device region.

Abstract: In the course of the process for making masks with structures in the submicrometer range, initially structures of photoresist or polymer material with horizontal and substantially vertical sidewalls are produced on a silicon substrate covered with an oxide layer. This is followed by a layer of silicon nitride which is deposited by LPCVD. The resultant structure is planarized with a photoresist which is etched back until the start of the vertical edges of the sidewall coating formed by the nitride layer is bared on the photoresist structures. In a photolithographic step, a trimming mask is produced on the surface of the nitride layer and the planarizing resist. The bared regions of the nitride layer are then removed by isotropic etching. The dimensions A-B of the openings defined after removal of the nitride layer from the vertical surfaces of the photoresist structures are transferred to the oxide layer by anisotropic etching.

Abstract: A process of forming a lateral PNP transistor includes the steps of: providing a chip of semiconductor material including an isolated N- device region; implanting N dopant material at a relatively low power and low dosage into a selected implant region of the device region; implanting N dopant material at a relatively higher power and higher dosage into the implant region; and forming emitter and collector regions in the device region such that an intrinsic base region is defined between the collector and emitter regions in the implant region.

Abstract: A method of fabricating a lateral transistor is provided, including the steps of: providing a body of semiconductor material including a device region of a first conductivity type; patterning the surface of the device region to define a first transistor region; filling the patterned portion of the device region surrounding the first transistor region with an insulating material to a height generally equal to the surface of with first transistor region; removing portions of the insulating material so as to define a pair of trenches generally bounding opposite sides of the first transistor region; filling the pair of trenches with doped conductive material of opposite conductivity type to the first transistor region; and annealing the semiconductor body whereby to form second and third transistor regions of opposite conductivity type to the first transistor region in the opposing sides of the first transistor region.

Abstract: A memory cell responsive to a write enable signal for storing write signals present on a pair of write bit lines and responsive to a read enable signal for presenting stored data on a pair of read sense lines further includes a timed, active write load. The memory cell includes first and second NPN bipolar transistors having commonly connected emitters, and cross-coupled bases and collectors; and first and second PNP bipolar transistors configured as loads for the pair of NPN bipolar transistors. Write transistors are provided responsive to the write enable signal for draining current from a selected one of the first or second nodes. Transistors connected as diodes between the PNP bases and each of the cross-coupled NPN nodes are responsive to the current draining effected by the write transistors for biasing both of the first and second PNP transistors into an active mode of operation.

Abstract: A method, and devices produced therewith, for the epitaxial growth of sub-micron semiconductor structures with at least one crystal plane-dependently grown, buried active layer (24) consisting of a III-V compound. The active layer (24) and adjacent embedding layers (23, 25) form a heterostructure produced in a one-step growth process not requiring removal of the sample from the growth chamber in between layer depositions. The layers of the structure are grown on a semiconductor substrate (21) having a structured surface exposing regions of different crystal orientation providing growth and no-growth-planes for the selective growth process. The method allows the production of multiple, closely spaced active layers and of layers consisting of adjoining sections having different physical properties.

Abstract: A punching mechanism includes a permanent magnet and a pole-piece connected to one pole of the permanent magnet and spaced from the other pole by a gap. A movable coil is disposed at least partially within the gap. A punch actuator is connected to the movable coil, and conductors are provided for conducting an electrical current to the coil. Current is supplied to the coil to effect a punching action.

Abstract: A method of forming a bipolar transistor is provided, comprising the steps of: providing a semiconductor substrate including a first region of a first conductivity type; forming a layer of insulative material over a surface of the first region; forming a layer of conductive material over the layer of insulative material; patterning the first and second layers to form a generally vertical sidewall bounding an exposed portion of the first region surface; and epitaxially depositing a base region of a second conductivity type over the exposed portion of the first region surface and the sidewall such that the base region is in electrical contact with the second region.

Abstract: A memory cell responsive to a write enable signal for storing write signals present on a pair of write bit lines and responsive to a read enable signal for presenting stored data on a pair of read sense lines further includes a timed, active write load. The memory cell includes first and second NPN bipolar transistors having commonly connected emitters, and cross-coupled bases and collectors; and first and second PNP bipolar transistors configured as loads for the pair of NPN bipolar transistors. Write transistors are provided responsive to the write enable signal for draining current from a selected one of the first or second nodes. Transistors connected as diodes between the respective PNP bases and each of the cross-coupled NPN nodes are responsive to the current draining effected by the write transistors for biasing a selected one of the first or second PNP transistors into an active mode of operation.

Abstract: A method of forming a semiconductor device on a body of semiconductor material having a first doped region of a first conductivity type, comprising the steps of: forming a stud over the first doped region; using the stud as a mask to form a second doped region of a second conductivity type in the surface of the first doped region adjoining the stud; forming a sidewall of insulating material on the stud; forming a first device contact within the sidewall; and forming a second device contact over the second doped region adjoining the sidewall, such that the first and second electrical contacts are separated by the sidewall.In accordance with an embodiment of the present invention, the step of forming the second device contact includes the steps of forming a layer of conductive material generally conformally over the first doped region and the stud, and then planarizing the layer of conductive material to a height equal to or less than that of the sidewalls.

Abstract: A method of operating a delay circuit to impose a selected delay on an electronic signal the delay circuit comprising a plurality of delay stages and means for directing the electronic signal through selected ones of the delay stages, the method comprising the steps of: measuring the actual signal delay through each of the delay stages; and selecting, based on the signal delays obtained in the measuring step, the delay stages through which the electronic signal is directed.

Abstract: According to the present invention, a CMOS interface circuit (C2) similar to a latch made by two CMOS cross coupled inverters (INV1, INV2) is placed directly on the output node (14) of conventional BICMOS logic circuit (11) operating alone in a partial swing mode. This latch is made of four FETs P5, P6, N8, N9 cross-coupled in a conventional way with the feedback loop connected to said output node (14). The partial voltage swing (VBE to VH-VBE) naturally given by the output bipolar transistors (T1, T2) mounted in a push pull configuration is reinforced to full swing (GND to VH) by the latch at the end of each transition. The state of the output node if forced by the latch because of the high driving capability due to the presence of said output bipolar transistors (T1, T2). As a result, the improved BICMOS logic circuit (D2) has an output signal (S) that ranges within the desired full swing voltage at the output terminal (15).

Abstract: A method of forming semiconductor device contacts includes the steps of: providing a semiconductor substrate having at least two features thereon whereat it is desired to make electrical connections; forming a layer of etch stop material having a first etch characteristic over each of the features; forming a layer of dielectric material having a second etch characteristic over each of the features; simultaneously etching at least two vias through the layer of dielectric material using an etchant selective to the layer of dielectric material so as to substantially stop on the layer of etch stop material, the at least two vias including a via over each of the features; and extending the vias through the layer of etch stop material so as to expose the features for subsequent electrical connections.

Abstract: There is provided a method for use in the fabrication of a transistor, the method including the steps of: providing a substrate of semiconductor material including a region of first conductivity type; forming a first layer of second conductivity type epitaxial semiconductor material over the region; forming a second layer of second conductivity type epitaxial semiconductor material over the first layer, the second layer of a relatively higher dopant concentration than the first layer; oxidizing a portion of the second layer; and removing the oxidized portion of the second layer to expose a portion of the first layer, the exposed portion of the first layer forming an intrinsic base region. The steps of forming the first and second layers are preferably performed using low temperature, ultra-high vacuum, epitaxial deposition processes.

Abstract: A method of forming a complementary bipolar transistor device includes the steps of: providing a substrate of semiconductor material including at least two electrically isolated N-type device regions having a generally planar common surface; forming a P-type buried subcollar region in a first of the device regions; forming an N-type buried subcollector region in a second of the device regions; forming an N-type base region in the common surface of the first device region; forming a layer of P-doped polysilicon over the base region in the first device region and over the second device region; patterning the layer of P-doped polysilicon to form an emitter contact generally centered on the base region of the first device region and a generally annular base contact on the second device region; forming a layer of insulating material over the patterned layer of P-doped polysilicon; forming a layer of N-doped polysilicon generally conformally over the device; patterning the layer of N-doped polysilicon to form a bas

Abstract: A field effect transistor of asymmetrical structure comprises: a semiconductor substrate of first conductivity type; source and drain regions of second conductivity type disposed in a surface of the substrate and spaced apart by a channel region; and a single, lightly doped extension of the drain region into the channel, the extension being of the second conductivity type and of a lower dopant concentration than the drain region. The transistor can further beneficially comprise a halo region of the first conductivity type in the substrate generally surrounding only the source region.