Abstract: A method for preventing unwanted continued polymerization with aging of a lymer, e.g., a silicone gel, which was catalytically cured comprises treating the cured polymer with a catalytic deactivating agent or stabilization of cured resin.

Abstract: A telephone cord employs as an insulator for the conductors therein an extrudable blend of a styrene-ethylenebutylene-styrene copolymer with polypropylene.

Abstract: A water soluble solder flux particularly suitable for use as a fusing fluid in condensation soldering operations has been developed. The invention involves the use of such flux in condensation soldering as well as the flux, per se. The novel flux comprises a water soluble flux vehicle comprising a resinated polyethylene oxide (polyene), together with at least one flux activator selected from a water soluble organic acid activator and a water soluble halide containing activator, and a solvent which is water soluble.

Abstract: A carrier sheet has affixed thereto a multiplicity of separable, double-blind, multisection labels comprising a blind section, an open section and a record keeping section, the carrier sheet may be adapted for use in a computer printer to print information on the labels. The sections are designed to be used in double-blind drug tests.

Abstract: A diverter and coextrusion diverter are described which include means for adjusting the cavity of the diverter so as to control the uniformity of extrudate exiting the diverter.

Abstract: A method which is particularly suitable to the manufacture of printed circuit boards of high resolution comprises the steps of forming a photoresist pattern having an ink coating over a substrate and subsequently depositing a species catalytic to electroless plating on the exposed substrate surface and then forming a flash electroless deposit thereon. The ink coating is then removed together with any overlying deposit leaving the photoresist intact so as to prevent spreading of the deposited flash metal pattern during the subsequent step of full buildup electroless and/or electrolytic plating.

Abstract: A solder flux comprises rosin, an activator, an optional surfactant and the dimer of linoleic acid.

Abstract: A coating material is applied to drawn lightguide fiber in a manner which substantially prevents the inclusion of bubbles and which causes the fiber to be disposed substantially concentrically within the coating layer. The lightguide fiber is advanced through a continuum of coating material, which extends from a free surface of a reservoir and through two dies that are arranged in tandem, at a velocity which causes air to be entrained in the coating material. A pressure gradient is established between portions of the first die adjacent to its exit orifice. A first one of the dies communicates with the reservoir and the second die and further communicates at the interface of the dies with a pressurized supply of the coating material.

Abstract: A method for growing single crystal semiconductor compounds by the gradient freeze technique includes the process of reducing radiant heat flow while enhancing axial heat flow in the region of a seed crystal so as to give rise to an inverted solid-liquid interface together with a desired temperature profile.

Abstract: A method for electroplating a nickel-antimony alloy comprising from 1-70 weight percent antimony and the balance nickel comprises electroplating the alloy from a solution containing a soluble nickel salt and a soluble mixed antimony alkali metal salt of a polybasic organic acid at a pH in the range of about from 1 to 6. The substrate to be plated is made the cathode and an inert anode is employed.

Abstract: An educational toy and method is disclosed for teaching young children arithmetic using pattern recognition. The toy comprises unit size (square) indicia representing `ones` and multiple size indicia (rectangles) representing a multiple of the one digit. The indicia are placed in an organizer which allows the unit indicia to enter in one direction and the multiple indicia to enter the organizer from the opposite direction so as to aid in creating the desired recognizable patterns representing different numbers.

Abstract: Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.

Abstract: A process for separating lead includes the steps of dissolving a water insoluble lead salt in an acetate solution and precipitating the lead by treating the acetate solution with a sulfite so as to form an insoluble lead sulfite. The acetate is recovered by concentrating the solution and precipitating the acetate therefrom, drying the acetate crystals and dissolving them in methanol. The methanol is then evaporated leaving purified acetate crystals. The process is shown as part of a precious metal recovery system in the treatment of tankhouse slime.

Abstract: In the manufacture of encapsulated hybrid circuits from a substrate having a plurality of such circuits contained thereon, individual devices are first mounted on the circuit, encapsulant having a yield point stress and viscosity so as not to creep or flow is applied around the periphery of each circuit on the substrate so as to form a wall or dam around each such circuit except for the bonding pads for external connection of each circuit, a second encapsulant is then flow coated over the circuit and devices contained thereon within the previously formed wall such that the second encapsulant is retained within the wall. The encapsulants are then cured or dried and the individual encapsulated circuit can then be further processed such as by separating the individual circuits on the substrate and applying external connectors to the bonding pads.

Abstract: A process of reacting a selective area of an article with a heated liquid, such as by immersion in a heated electroless plating bath, utilizes a holder which is particularly suitable for use in retaining a plurality of printed circuit boards to be immersed in an electroless plating bath. The holder comprises a rigid base and a heat expandable foam bed mounted to the base, the foam bed having slits therein into which the printed circuit board is placed and held. Upon immersion of the article, the foam bed thermally expands to mask the article from the bath in the areas covered by the bed.

Abstract: A solder flux comprises rosin, an activator, an optional surfactant and the dimer of linoleic acid.

Abstract: An apparatus 10 for growing single crystal semiconductor compounds by the gradient freeze method includes means 40 for reducing radiant heat flow while enhancing axial heat flow in the region of a seed crystal 39 so as to give rise to an inverted solid-liquid interface shape 36 and a desired temperature profile.

Abstract: A method of forming a colloidal wetting sensitizer is disclosed. The method comprises combining a stannous species and a cupric species in an aqueous medium maintained at a pH of between 0.4 and 1.5.

Abstract: A method of removing contaminants from the surface is disclosed. The method comprises coating the surface with a surface active agent having a first surface energy and into which the contaminants are combined, applying thereover a higher surface energy colloidal sol and then allowing sufficient time for the first surface energy material with the contaminants combined therewith to migrate through the colloidal sol so as to remove the contaminants from the immediate vicinity of the substrate surface. The surface may then be treated by exposing it to an acid or base to remove the migrated surfactant layer thus removing the trace of contaminants.

Abstract: A method of forming a flexible printed wiring board having a metal substrate includes the steps of etching through-holes in the metal substrate by means of an etch resistant ferro electric mask placed over the substrate and employing a viscous sealant such as polyethylene or polypropylene glycol between the mask and the substrate. The mask is held to the substrate with the sealant therebetween by means of a magnetic field. The substrate is then treated with a ferric chloride etch solution to etch away the desired through-holes in the metal substrate. Thereafter, the substrate may be coated with a polymeric coated by means of fluidized bed or electrostatic coating techniques as taught in the prior art.