Patents Represented by Attorney John A. Stemwedel
  • Patent number: 5380621
    Abstract: An antireflective coating composition (ARC) for use with chemically amplified photoresist compositions comprising a polymer composition which is highly absorbent to mid and deep UV radiation, which is substantially inert to contact reactions with a chemically amplified photoresist composition, and which is insoluble in the developer for the chemically amplified photoresist composition.
    Type: Grant
    Filed: May 3, 1993
    Date of Patent: January 10, 1995
    Assignee: International Business Machines Corporation
    Inventors: Robert R. Dichiara, Christopher F. Lyons, Ratnasabapathy Sooriyakumaran, Gary T. Spinillo, Kevin M. Welsh, Robert L. Wood
  • Patent number: 5322765
    Abstract: Dry developable top surface imageable photoresist compositions which comprise, in admixture, a film-forming aromatic polymer resin activated to electrophilic substitution, an acid catalyzable agent capable of being inserted into the aromatic polymer resin, and a radiation degradable acid generating compound and processes for generating positive tone resist images on substrates therewith.
    Type: Grant
    Filed: November 22, 1991
    Date of Patent: June 21, 1994
    Assignee: International Business Machines Corporation
    Inventors: Nicholas J. Clecak, Willard E. Conley, Ranee W.-L. Kwong, Leo L. Linehan, Scott A. MacDonald, Harbans S. Sachdev, Hubert Schlosser, Carlton G. Willson
  • Patent number: 5296332
    Abstract: High sensitivity, high contrast, heat-stable resist compositions for use in deep UV, i-line e-beam and x-ray lithography. These compositions comprise a film-forming polymer having aromatic rings activated for electrophilic substitution, an acid catalyzable crosslinking agent which forms a hydroxy-stabilized carbonium ion, and a photoacid generator. The compositions are aqueous base developable.
    Type: Grant
    Filed: November 22, 1991
    Date of Patent: March 22, 1994
    Assignee: International Business Machines Corporation
    Inventors: Harbans S. Sachdev, Willard E. Conley, Premlatha Jagannathan, Ahmad D. Katnani, Ranee W. Kwong, Leo L. Linehan, Steve S. Muira, Randolph J. Smith
  • Patent number: 5273856
    Abstract: Positive photoresist compositions which comprise an alkali soluble resin material, a diazoquinone dissolution inhibitor which decompose on exposure to mid and near UV radiation, and a sulfonic acid ester of an imide or oxime which does not absorb such mid or near UV radiation. Resist images of high contrast are formed.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: December 28, 1993
    Assignee: International Business Machines Corporation
    Inventors: Christopher F. Lyons, Stanley E. Perreault, Gary T. Spinillo, Robert L. Wood
  • Patent number: 5227280
    Abstract: A PMGI bilayer resist for integrated circuit fabrication having increased sensitivity to light and formed by the addition of cyclic anhydrides to the resist and the formation of an accompanying bilayer resist structure of a portable conforming mask having a desirable undercut profile for lift-off of patterned metallic circuitry.
    Type: Grant
    Filed: September 4, 1991
    Date of Patent: July 13, 1993
    Assignee: International Business Machines Corporation
    Inventors: James A. Jubinsky, Steven M. Katz, Christopher F. Lyons, Wayne M. Moreau
  • Patent number: 5220044
    Abstract: Chemical vapor deposition precursors for depositing copper, silver, rhodium and iridium metals on substrates comprise ligand stabilized +1 metal beta-diketonate coordination complexes of said metals. Uses of such precursors in CVD processes are also provided.
    Type: Grant
    Filed: March 16, 1992
    Date of Patent: June 15, 1993
    Assignee: International Business Machines Corporation
    Inventors: Thomas H. Baum, Carl E. Larson, Scott K. Reynolds
  • Patent number: 5164278
    Abstract: Acid sensitized photoresists with enhanced photospeed are provided. The photoresist compositions include a polymer binder and/or a polymerizable compound and an acid sensitive group which enables patterning of the resist composition, and acid generating photoinitiator, and an hydroxy aromatic compound which enhances the speed of the resist composition under imaging radiation.
    Type: Grant
    Filed: March 1, 1990
    Date of Patent: November 17, 1992
    Assignee: International Business Machines Corporation
    Inventors: William R. Brunsvold, Christopher J. Knors, Melvin W. Montgomery, Wayne M. Moreau, Kevin M. Welsh
  • Patent number: 5143103
    Abstract: An apparatus for cleaning and drying workpieces which comprises a closable chamber, means for introducing a cleaning solvent to the chamber, means for removing the solvent from the chamber, means for introducing an inert gas to the chamber, means for receiving workpieces and for moving the workpieces with respect to the level of the solvent, and means for transmitting megasonic energy with respect to the solvent.
    Type: Grant
    Filed: January 4, 1991
    Date of Patent: September 1, 1992
    Assignee: International Business Machines Corporation
    Inventors: James E. Basso, Parmesh K. Bhalla, John J. Chahine, Daro Diddell, Gregory J. Earle, Edward P. Gabriel, Farrokh Yaghmaie
  • Patent number: 5114826
    Abstract: New photosensitive polyimide compositions and processes of using the same in the fabrication of electronic components are provided. These compositions are comprised of ##STR1## containing polyamic acids and/or the corresponding hydroxy-polyamic esters, or hydroxypolyimides and a photoactive component as an additive or as covalently bonded functionality on the polymer chain. These compositions provide positive or negative patterning options and may be used as conventional resist materials, as imageable dielectric or passivating layers, as high Tg ion implant masks or as imageable lift-off layers in the fabrication of multilevel metal structures.
    Type: Grant
    Filed: December 28, 1989
    Date of Patent: May 19, 1992
    Assignee: IBM Corporation
    Inventors: Ranee W. Kwong, Harbans S. Sachdev, Krishna G. Sachdev
  • Patent number: 5115090
    Abstract: Viscosity stable, essentially gel-free linear polyamic acids are provided by a process utilizing offset stoichiometry. Polyimides formed from such polyamic acids have low TCE and low dielectric constants.Methods for improved adhesion of polyimides are also disclosed.
    Type: Grant
    Filed: March 30, 1990
    Date of Patent: May 19, 1992
    Inventors: Krishna G. Sachdev, John P. Hummel, Ranee W. Kwong, Robert N. Lang, Leo L. Linehan, Harbans S. Sachdev
  • Patent number: 5096737
    Abstract: Chemical vapor deposition precursors for depositing copper, silver, rhodium and iridium metals on substrates comprise ligand stabilized +1 metal beta-diketonate coordination complexes of said metals. Uses of such precursors in CVD processes are also provided.
    Type: Grant
    Filed: October 24, 1990
    Date of Patent: March 17, 1992
    Assignee: International Business Machines Corporation
    Inventors: Thomas H. Baum, Carl E. Larson, Scott K. Reynolds
  • Patent number: 5091103
    Abstract: Photo resist stripper compositions comprising N-alkyl-2-pyrrolidone, 1,2-propanediol and tetraalkylammonium hydroxide. The photoresist strippers are useful at high stripping temperatures (105.degree. C.-125.degree. C.) to remove hard baked photoresist without damaging semiconductor substrates or metallurgy.
    Type: Grant
    Filed: May 1, 1990
    Date of Patent: February 25, 1992
    Inventors: Alicia Dean, John A. Fitzsimmons, Janos Havas, Barry C. McCormick, Prabodh R. Shah
  • Patent number: 5023164
    Abstract: Highly sensitive, highly absorbing deep ultraviolet and vacuum ultraviolet resists which comprise a novolak resin protected with an acid labile group and a photoinitiator which generates a strong acid upon exposure to deep ultraviolet or vacuum ultraviolet radiation. The exposed resists are reacted with organometallic compounds to form reactive ion etch resistant patterns.
    Type: Grant
    Filed: October 23, 1989
    Date of Patent: June 11, 1991
    Assignee: International Business Machines Corporation
    Inventors: William R. Brunsvold, Philip Chiu, Willard E. Conley, Jr., Dale M. Crockatt, Melvin W. Montgomery, Wayne M. Moreau
  • Patent number: 5023360
    Abstract: Dialkyl gold(III) .beta.-diketonates are synthesized in a two-step, one-pot process using a gold trihalide, an alkyl lithium compound and a .beta.-diketone.
    Type: Grant
    Filed: May 1, 1990
    Date of Patent: June 11, 1991
    Assignee: International Business Machines Corporation
    Inventors: Thomas H. Baum, Phillip J. Brock, Daniel J. Dawson
  • Patent number: 4944836
    Abstract: A method is disclosed for producing coplanar metal/insulator films on a substrate according to a chem-mech polishing technique. In one example, a substrate having a patterned insulating layer of dielectric material thereon, is coated with a layer of metal. The substrate is then placed in a parallel polisher and the metal is removed elsewhere except in the holes where it is left intact. This is made possible through the use of an improved selective slurry which removes the metal much faster than the dielectric material. The insulating layer may then be used as an automatic etch stop barrier.In a second example a substrate having a patterned metallic layer is coated with an insulating layer and then subjected to chem-mech polishing. The structure is coplanarized by the chem-mech removal of the insulating material from the high points of the structure at a faster rate than from the lower points. Optional etch stop layers also may be used.
    Type: Grant
    Filed: October 28, 1985
    Date of Patent: July 31, 1990
    Assignee: International Business Machines Corporation
    Inventors: Klaus D. Beyer, William L. Guthrie, Stanley R. Makarewicz, Eric Mendel, William J. Patrick, Kathleen A. Perry, William A. Pliskin, Jacob Riseman, Paul M. Schaible, Charles L. Standley
  • Patent number: 4939070
    Abstract: The present invention discloses particular lithographic polymeric materials and methods of using these materials, wherein the polymeric materials have acid labile or photolabile groups pendant to the polymer backbone. The polymeric materials are sufficiently transparent to deep UV radiation to permit deep UV imaging, can be used to produce resist structures having thermal stability at temperatures greater than about 160.degree. C., and are sufficiently resistant to excessive crosslinking when heated to temperatures ranging from about 160.degree. C. to about 250.degree. C. that they remain soluble in common lithographic developers and strippers.The present invention also discloses resists comprising substituted polyvinyl benzoates which, after imaging, exhibit unexpectedly high thermal stability, in terms of plastic flow.
    Type: Grant
    Filed: July 7, 1988
    Date of Patent: July 3, 1990
    Inventors: William R. Brunsvold, Ming-Fea Chow, Willard E. Conley, Dale M. Crockatt, Jean M. J. Frechet, George J. Hefferon, Hiroshi Ito, Nancy E. Iwamoto, Carlton G. Willson
  • Patent number: 4931379
    Abstract: The present invention relates to increasing the autodecomposition temperature of particular resists. The resists are comprised of structures having recurrent acid labile groups which are typically pendant to the polymeric backbone. The autodecomposition temperature of a resist is increased by selecting substituent sidechains on the acid labile group which exhibit increased stability. Sidechain structures which provide increased autodecomposition stability include secondary structures capable of forming secondary carbonium ion intermediates and having an available proton adjacent to the carbonium ion formed during cleavage. Moieties which can be used as the secondary sidechain structures include secondary alkyl, including both cyclic and alicyclic alkyl, substituted deactivated secondary benzyl, and 1-(deactivated heterocyclic) secondary alkyl.
    Type: Grant
    Filed: November 3, 1988
    Date of Patent: June 5, 1990
    Assignee: International Business Machines Corporation
    Inventors: William R. Brunsvold, Willard E. Conley, Dale M. Crockatt, Nancy E. Iwamoto
  • Patent number: 4908298
    Abstract: A method is provided for creating multilayer patterned films wherein at least one layer is an etch-resistant patterned layer, and wherein either positive or negative tone patterns can be obtained.The etch-resistant patterned layer is obtained by reacting a patterned polymeric film containing reactive functional groups with an organometallic reagent such as a silicon-containing compound. The pattern is subsequently transferred through adjacent polymeric layers using an oxygen plasma or equivalent dry-etch method.
    Type: Grant
    Filed: October 30, 1987
    Date of Patent: March 13, 1990
    Assignee: International Business Machines Corporation
    Inventors: George J. Hefferon, Hiroshi Ito, Scott A. MacDonald, Carlton G. Willson
  • Patent number: 4871619
    Abstract: An electronic component is formed by in situ curing a polymerizable oligomer which is end capped with vinyl and/or acetylenic end groups. The polymerizable oligomer is selected from the group consisting of polyamic acids, polyamic esters, polyisoimides, and mixtures thereof.
    Type: Grant
    Filed: November 20, 1986
    Date of Patent: October 3, 1989
    Assignee: International Business Machines Corporation
    Inventors: Constance J. Araps, Steven M. Kandetzke, Mark A. Takacs
  • Patent number: 4853315
    Abstract: Esters of 1-oxo-2-diazo-naphthalene sulfonic acid wherein the sulfonic acid group is at either the 4 or the 5 position of a hydroxymethyl-tricyclo [5.2.1.0.sup.2,6 ] decane wherein the hydroxy group is either at the 3 or 4 position and useful as sensitizers for positive resists, particularly relatively thick resists at 365 nm.
    Type: Grant
    Filed: January 15, 1988
    Date of Patent: August 1, 1989
    Assignee: International Business Machines Corporation
    Inventors: Dennis R. McKean, Robert D. Miller, Joseph G. Walsh, Carlton G. Willson